CN112626595B - Modular continuous electroplating production line - Google Patents
Modular continuous electroplating production line Download PDFInfo
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- CN112626595B CN112626595B CN202011381729.XA CN202011381729A CN112626595B CN 112626595 B CN112626595 B CN 112626595B CN 202011381729 A CN202011381729 A CN 202011381729A CN 112626595 B CN112626595 B CN 112626595B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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Abstract
The invention relates to the technical field of electroplating, and discloses a modular continuous electroplating production line, which comprises: a tank body having an accommodation space for accommodating an electroplating solution and in which various mechanical components are mounted; at least one row of electroplating modules are uniformly arranged in the accommodating space of the tank body; the tank body is provided with a transverse pushing device which drives the electroplating module to be transported along the tank body. The invention provides an electroplating production line which is simple in structure, high in production efficiency, small in occupied area and low in production cost.
Description
Technical Field
The invention relates to the field of electroplating, in particular to a modular continuous electroplating production line.
Background
The electroplating production line is used for realizing electroplating on substrates such as plates, circuit boards and the like. Most of the existing electroplating production lines on the market are too long and even 90 meters long due to the structural design problem.
For example, patent document CN204550751U discloses a vertical continuous plating line transmission system, which comprises a power device, a dual-gear main transmission chain wheel, a dual-gear driven transmission chain wheel, a dual transmission chain and a plating conductive sliding block mechanism; the power device is matched with the double-gear main transmission chain wheel, the double-gear main transmission chain wheel is in transmission connection with the double-gear driven transmission chain wheel through the double transmission chain, and the electroplating conductive sliding block mechanisms are fixed on the double transmission chain at equal intervals. When the electroplating conductive sliding block mechanism works, the power device drives the double-gear main transmission chain wheel to rotate, the double-gear main transmission chain wheel drives the double-transmission chain to move through the gear, the double-transmission chain drives the double gear to rotate from the transmission chain wheel, and the electroplating conductive sliding block mechanism moves along with the double-transmission chain.
Like above-mentioned electroplating production line, huge electroplating production line needs the centre gripping base plate simultaneously, leads to its electroplating production line load too big, and electroplating production line installation cycle is long, and electroplating production line uses often to take place to damage and frequent maintenance after a period, need adopt a large amount of energy to drive electroplating production line and remove, and area is big, causes manufacturing cost too high, and production efficiency is low simultaneously.
Disclosure of Invention
In order to solve the above problems, the present invention provides a modular continuous electroplating line, which mainly aims to form an electroplating line by a modular design mode and a combination mode of a plurality of electroplating modules, wherein an individual electroplating module finishes an electroplating process on a substrate, so that the installation period of the electroplating line is shortened, the maintenance is convenient, the floor area is greatly reduced, the production cost is reduced, the energy consumption is reduced, and the production efficiency is improved.
Another objective of the present invention is to provide a modular continuous electroplating line, which realizes the switching among multiple rows of electroplating modules by designing a longitudinal pushing device, optimizes the layout of the production line, reduces the floor space, and reduces the production cost.
Another object of the present invention is to provide a modular continuous electroplating line, in which the modular electroplating modules can independently adjust the distance between the nozzle and the substrate, thereby greatly improving the electroplating quality of the substrate.
In order to achieve the purpose, the invention adopts the technical scheme that:
a modular continuous electroplating line, comprising: a tank body having an accommodation space for accommodating an electroplating solution and in which various mechanical components are mounted; at least one row of electroplating modules are uniformly arranged in the accommodating space of the tank body; and the transverse pushing device is arranged on the tank body and drives the electroplating module to move along the tank body.
Further, still include vertical thrust unit, be equipped with more than two rows in the cell body electroplate the module, vertical thrust unit sets up on the cell body, drive the rank of electroplating the module switches.
Further, the electroplating module is horizontally or vertically arranged in the tank body.
Further, the electroplating module comprises a module frame for mounting various mechanical components; the clamping device is arranged on the module frame and is used for clamping the substrate; a linear moving assembly disposed on the module frame; and at least one set of jet devices, which are arranged on the linear moving assembly and move along with the linear moving assembly to jet the substrate.
Further, clamping device includes stores pylon and holder, the both ends of stores pylon respectively with the module frame cooperation, the one end of holder with the stores pylon is connected, the other end centre gripping base plate of holder.
Further, the linear moving assembly comprises a transmission rod piece and a transmission device, and the output end of the transmission device is connected with the transmission rod piece.
Further, the jet flow device comprises a pump body, a clamp assembly and a spray pipe, wherein the pump body is arranged on or externally arranged on the module frame, the clamp assembly is sleeved on the transmission rod piece, the spray pipe is arranged on the clamp assembly, and the pump body is connected with the spray pipe through a pipeline.
Further, the fixture assembly comprises a fixture base and a spray pipe fixture, the fixture base is sleeved on the transmission rod piece, an adjusting groove is formed in the spray pipe fixture, the spray pipe fixture is connected with the fixture base through the adjusting groove, and the spray pipe is movably mounted on the spray pipe fixture.
The solar cell further comprises a rectifier and an insoluble anode, wherein the anode of the rectifier is connected with the insoluble anode, and the cathode of the rectifier is connected with the substrate.
Further, the groove body is provided with a guide rail along the length direction, the upper portion and the lower portion of the module frame are respectively provided with a rolling component, and the rolling components are matched with the guide rail.
According to the invention, by adopting the modular electroplating modules, each electroplating module completes independent electroplating operation, and by adopting a flexible assembly mode, the installation period is greatly shortened, the maintenance operation is more convenient, the floor area is effectively reduced by the layout of the production line consisting of the modular electroplating modules, meanwhile, the production efficiency is improved, and the electroplating device is more suitable for practical use.
Furthermore, the distance between the spray pipe and the substrate in the electroplating module is adjustable and is adjusted according to actual production requirements, so that the electroplating effect on the substrate can be improved.
Drawings
FIG. 1 is a schematic view of a conventional electroplating line.
FIG. 2 is a schematic diagram of a transverse arrangement of electroplating modules according to the present invention.
FIG. 3 is a schematic structural diagram of the vertical placement layout of the electroplating module according to the present invention.
Fig. 4 is a schematic view of the structure of the tank body.
Fig. 5 is a schematic structural view of the lateral pushing device.
Fig. 6 is a schematic structural view of the longitudinal pushing device.
FIG. 7 is a schematic diagram of a plating module.
Fig. 8 is a schematic structural view of the clamping device.
Fig. 9 is a schematic structural view of the linear motion assembly.
Fig. 10 is a schematic view of the structure of the jet device.
FIG. 11 is a schematic view of the construction of the clamp assembly.
FIG. 12 is a schematic diagram of a vertically arranged electroplating module.
FIG. 13 is a schematic view of another angle of the electroplating module vertically arranged.
FIG. 14 is a schematic diagram of a horizontally mounted electroplating module.
FIG. 15 is a schematic view of another angle of a horizontally disposed electroplating module
The reference numbers illustrate: 1. a trough body; 2. electroplating the module; 3. a lateral pushing device; 4. a longitudinal pushing device; 5. a module frame; 6. a clamping device; 7. a substrate; 8. a linear moving assembly; 9. a jet flow device; 10. a hanger; 11. a clamping member; 12. a driving rod member; 13. a transmission device; 14. a pump body; 15. a clamp assembly; 16. a nozzle; 17. a clamp base; 18. a spray pipe clamp; 19. an adjustment groove; 20. a rectifier; 21. an insoluble anode; 22. a guide rail; 23. a rolling member.
Detailed Description
Referring to fig. 1-7, a modular continuous electroplating line according to the present invention includes: a tank 1 having a housing space for housing plating solution and housing various mechanical components; the electroplating modules 2 are uniformly arranged in the accommodating space of the tank body 1; and the transverse pushing device 3 is arranged on the tank body 1 and drives the electroplating module 2 to transport along the tank body 1.
The electroplating production line on the basis of the existing market adopts a huge production line mode, in actual production, if the electroplating production line is designed to be overlong, the electroplating production line needs to clamp a substrate to be electroplated with corresponding length in production, so that the electroplating production line is overloaded (because the length is overlong, the precision problem is caused, and the related technology matched with the electroplating production line cannot meet the technical requirement), and when the electroplating production line is used for a long time, mechanical parts are easy to deform and damage, the installation process is complex during use, when the electroplating production line is maintained, the whole electroplating production line needs to be stopped, the maintenance is troublesome, the loss is caused, the occupied area is large, the energy consumption for driving the whole electroplating production line is large, and the production cost is increased.
For the technical problems of the existing electroplating production line on the market, the invention provides a modularized continuous electroplating production line with a novel structure, which is mainly an electroplating production line formed by assembling electroplating modules 2 in a modularized design, wherein each independent electroplating module 2 is installed outside before use, and then the electroplating module 2 is arranged in a tank body 1, so that the installation period is shortened. Because the substrate does not move and is fixed in the module, the technical requirements of relevant matching can be met to the utmost extent, and the electroplating effect is greatly improved. Meanwhile, when the electroplating module 2 breaks down, a single substrate is damaged, and a whole batch of substrates are damaged when a certain position of an existing electroplating production line on the market is damaged. Through nimble equipment mode, can effectively reduce area, the promotion of whole device is more convenient, reduces the energy consumption, reaches reduction in production cost.
The working principle and the process of the invention are as follows: a plurality of electroplating modules 2 are arranged in the tank body 1, electroplating liquid for electroplating is arranged in the tank body 1, the electroplating modules 2 are pushed along the length direction of the tank body 1 through the transverse pushing device 3, and the electroplating process of the base plate is completed by the electroplating modules 2 in the electroplating liquid. The transverse pushing device 3 can be realized in an electric mode, a pneumatic mode or a hydraulic mode, if the electric mode is adopted, the electroplating module 2 can be moved in a portal frame mode, the electroplating module 2 can be moved in a cylinder and rod piece combined mode, the electroplating module 2 can be moved in a hydraulic cylinder and hydraulic rod combined mode in the hydraulic mode, the moving mode is realized in multiple modes, and redundant description is omitted.
As shown in fig. 6, the electroplating device further comprises a longitudinal pushing device 4, wherein more than two rows of electroplating modules 2 are arranged in the tank body 1, and the longitudinal pushing device 4 is arranged on the tank body 1 and drives the arrangement switching of the electroplating modules 2. In operation, the longitudinal pushing device 4 can realize the conversion between the ranks by clamping the electroplating module 2.
Another embodiment of the invention is to adopt the electroplating modules 2 with multi-row layout, and the longitudinal pushing device 4 is designed between rows to perform the conversion between the rows, so that the layout design of the electroplating modules 2 can be performed in a more reasonable manner. If the electroplating module 2 in the first row moves to the tail end position, the longitudinal pushing device 4 clamps the electroplating module 2 in the first row and transfers the electroplating module to the second row, and when the electroplating module 2 in the second row moves to the tail end position, the longitudinal pushing device 4 in the tail end position clamps the electroplating module 2 in the second row and transfers the electroplating module to the third row or transfers the electroplating module back to the first row, and so on.
As shown in fig. 2 and 3, the electroplating module 2 is horizontally or vertically installed in the tank body 1.
In actual production, the electroplating modules 2 are placed in two ways, when the electroplating modules 2 are placed horizontally, because the electroplating modules 2 are frames formed by connecting rod pieces, the distance between the substrates in the horizontally placed electroplating modules 2 is short, the electrodes between the adjacent substrates are the same, and the plating layers can be placed on the two sides of the substrates to form, so that the electroplating quality is improved; when electroplating module 2 and adopting vertical the placing, electroplate putting between module 2 and the electroplating module 2 more inseparable, can save a large amount of spaces, reduction in production cost.
As shown in fig. 7, the plating module 2 includes a module frame 5 for mounting various mechanical parts; a clamping device 6 provided on the module frame 5 and clamping the substrate 7; a linear moving member 8 provided on the module frame 5; and at least one jet device 9 mounted on the linear moving means 8 and jetting a jet stream to the substrate 7 as the linear moving means 8 moves.
The invention specifically provides a structural arrangement mode of an electroplating module 2, a module frame 5 is an open frame formed by connecting rod pieces, a clamping device 6 clamps a substrate 7, and a linear moving assembly 8 is used for driving a jet flow device 9 to carry out jet flow electroplating on the substrate 7. The specific working process is as follows: because the whole electroplating module 2 is arranged in the tank body 1, the jet flow device 9 jets electroplating solution to the substrate 7 for electroplating, and the linear moving assembly 8 moves ceaselessly in the moving process of the electroplating module 2 to drive the jet flow device 9 to move. Through this mode, when electroplating module 2 wherein breaks down, bad electroplating base plate, only should electroplate module 2, and can not lead to the fact the influence to other base plates 7, simultaneously, before work, will electroplate module 2 assembly in the outside, can simply realize electroplating operation, greatly reduced the operation degree of difficulty, when damaging appearing, can maintain solitary electroplating module 2, and needn't stop whole production line, cause the loss.
As shown in fig. 8, the clamping device 6 includes a hanger 10 and a clamping member 11, two ends of the hanger 10 are respectively matched with the module frame 5, one end of the clamping member 11 is connected with the hanger 10, and the other end of the clamping member 11 clamps the substrate 7.
In actual operation, the rack 10 is attached to the module frame 5, and the weight of the substrate 7 is borne by the rack 10, and the substrate 7 is held by the holder 11. In the prior art, the substrate 7 needs to be clamped by the whole production line, so that heavy load is caused, and the production line is deformed and damaged.
As shown in fig. 9, the linear moving assembly 8 includes a driving rod 12 and a driving device 13, and an output end of the driving device 13 is connected to the driving rod 12.
In the prior production line, the jet flow electroplating is realized by a mode of moving the substrate 7 and fixing the jet flow device 9, and because the electroplating module 1 is adopted in the invention, an independent linear moving assembly 8 is required to be designed to drive the jet flow device 9 to move for jet flow electroplating. In the actual use process, the transmission device 13 can adopt an electric, hydraulic and pneumatic form, when the electric form is adopted, the transmission device 13 is a motor, the transmission rod 12 is a guide rod and a screw rod, and the jet flow device 9 is driven to move through the rotation of the motor; when the hydraulic form is adopted, the transmission device 13 is a hydraulic station, and the transmission rod 12 is driven by the hydraulic station to move the jet flow device 9; when the pneumatic form is adopted, the transmission device 13 is a pneumatic piston, and the transmission rod 12 is driven by the pneumatic piston to move the jet flow device 9.
As shown in fig. 10, the jet flow device 9 includes a pump body 14, a clamp assembly 15 and a nozzle 16, the pump body 14 is mounted or externally mounted on the module frame 5, the clamp assembly 15 is sleeved on the transmission rod 12, the nozzle 16 is disposed on the clamp assembly 15, and the pump body 14 is connected to the nozzle 16 through a pipe. (the pipe is not shown in the figure)
The invention also specifically provides a structural arrangement of the jet flow device 9, and the specific working process is as follows: when electroplating module 2 was arranged in the electroplating liquid inslot, pump body 14 passed through the pipeline with the plating solution and carried spray tube 16 (pump body 14 can adopt and install inside module frame 5 or install outside module frame 5, and concrete selection mode accessible practical implementation selects), spout to base plate 7 jet current by the spout that sets up on the spray tube 16, with the blind hole or the through-hole position on the base plate 7 of electroplating solution spout, improve the electroplating effect.
As shown in fig. 11, the clamp assembly 15 includes a clamp base 17 and a nozzle clamp 18, the clamp base 17 is sleeved on the transmission rod 12, an adjusting groove 19 is provided on the nozzle clamp 18, the nozzle clamp 18 is connected with the clamp base 17 through the adjusting groove 19, and the nozzle 16 is movably mounted on the nozzle clamp 18.
In the conventional electroplating production line, because the length of the electroplating production line is too long, the jet flow device 9 is usually set to be in a fixed mode, and various accessories and precision thereof cause the jet flow device 9 to be too far away from the substrate 7 (generally, the distance is more than 30 mm), for the substrate 7 with a blind hole or a through hole, the jet flow distance between the jet flow device 9 and the substrate 7 influences the electroplating quality and efficiency, and meanwhile, the jet flow angle of the spray pipe 18 also influences the electroplating quality.
In the present invention, the nozzle 16 is designed to be movably adjusted, and the distance between the nozzle 18 and the substrate 7 is adjusted through the adjusting groove 19 formed on the nozzle holder 18. The nozzle 16 is held by the nozzle holder 18, and the nozzle 16 is rotated on the nozzle holder 18 to adjust the angle of the jet of the nozzle 16. Thereby, the whole electroplating effect is improved.
As shown in fig. 12, the solar cell further includes a rectifier 20 and an insoluble anode 21, wherein the anode of the rectifier 20 is connected to the insoluble anode 21, and the cathode of the rectifier 20 is connected to the substrate 7.
In a specific implementation, the rectifier 20 is used for converting alternating current into direct current, and the rectifier 20 can be mounted on the electroplating module 2, or the rectifier 20 can be separately mounted outside the electroplating module 2. In practice, each substrate 7 has two insoluble anodes 21 at its two ends, and the insoluble anodes 21 may be disposed on the inner wall of the tank 1 or mounted on the plating module 2.
As shown in fig. 4 and 12 to 15, the tank body 1 is provided with a guide rail 22 along the length direction thereof, the upper part and the lower part of the module frame 5 are respectively provided with a rolling member 23, and the rolling member 23 is matched with the guide rail 22.
In the invention, as the transverse pushing device 3 is adopted for pushing, in order to facilitate the electroplating module 2 to move in the tank body 1, the tank body 1 is provided with the guide rail 22 and the module frame 5 is provided with the rolling part 23 (specifically, a roller), and the rolling part 23 rolls along the guide rail 22 to realize the moving operation of the electroplating module 2.
The above embodiments are merely illustrative of the preferred embodiments of the present invention, and not restrictive, and various changes and modifications to the technical solutions of the present invention may be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are intended to fall within the scope of the present invention defined by the appended claims.
Claims (9)
1. A modular continuous electroplating line, comprising:
a tank body having an accommodation space for accommodating an electroplating solution and in which various mechanical components are mounted;
at least one row of electroplating modules are uniformly arranged in the accommodating space of the tank body;
the transverse pushing device is arranged on the tank body and drives the electroplating module to move along the tank body;
the electroplating module comprises a module frame for mounting various mechanical components; the clamping device is arranged on the module frame and is used for clamping the substrate; a linear moving assembly disposed on the module frame; and at least one set of jet devices, which are arranged on the linear moving assembly and move along with the linear moving assembly to jet the substrate.
2. The modular continuous plating line of claim 1, wherein: still include vertical thrust unit, be equipped with more than two rows in the cell body electroplate the module, vertical thrust unit sets up on the cell body, drive the rank of electroplating the module switches.
3. A modular continuous electroplating line according to claim 1 or 2, characterized in that: the electroplating module is horizontally or vertically arranged in the tank body.
4. The modular continuous plating line of claim 1, wherein: the clamping device comprises a hanging rack and a clamping piece, two ends of the hanging rack are respectively matched with the module frame, one end of the clamping piece is connected with the hanging rack, and the other end of the clamping piece clamps the substrate.
5. The modular continuous plating line of claim 4, wherein: the linear moving assembly comprises a transmission rod piece and a transmission device, and the output end of the transmission device is connected with the transmission rod piece.
6. The modular continuous plating line of claim 5, wherein: the jet flow device comprises a pump body, a clamp assembly and a spray pipe, wherein the pump body is arranged or externally arranged on the module frame, the clamp assembly is sleeved on the transmission rod piece, the spray pipe is arranged on the clamp assembly, and the pump body is connected with the spray pipe through a pipeline.
7. The modular continuous plating line of claim 6, wherein: the fixture assembly comprises a fixture base and a spray pipe fixture, the fixture base is sleeved on the transmission rod piece, an adjusting groove is formed in the spray pipe fixture, the spray pipe fixture passes through the adjusting groove and is connected with the fixture base, and the spray pipe is movably mounted on the spray pipe fixture.
8. The modular continuous plating line of claim 6, wherein: the solar cell further comprises a rectifier and an insoluble anode, wherein the anode of the rectifier is connected with the insoluble anode, and the cathode of the rectifier is connected with the substrate.
9. The modular continuous plating line of claim 6, wherein: the die set comprises a die set frame and a groove body, wherein the groove body is provided with a guide rail along the length direction of the groove body, the upper part and the lower part of the die set frame are respectively provided with a rolling part, and the rolling parts are matched with the guide rail.
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| JP2019522733A (en) * | 2016-12-28 | 2019-08-15 | ▲漢▼▲瑪▼科技股▲フン▼有限公司 | Electroplating equipment for small parts |
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| US4559122A (en) * | 1983-11-07 | 1985-12-17 | Luciano Folco | Continuous-cycle electroplating plant |
| JP2004091884A (en) * | 2002-09-02 | 2004-03-25 | Nippon Steel Corp | Continuous electroplating system |
| JP5304664B2 (en) * | 2010-01-21 | 2013-10-02 | 住友金属鉱山株式会社 | Continuous electrolytic plating apparatus, continuous electrolytic plating method and metallized resin film manufacturing method |
| KR101256604B1 (en) * | 2012-08-10 | 2013-04-19 | 주식회사 광성금속 | Rolling type continuous electroplating apparatus |
| CN103422143B (en) * | 2013-08-01 | 2016-03-30 | 黄海 | A kind of automatization electroplating assembly line |
| CN104480519B (en) * | 2014-11-21 | 2017-01-04 | 朱和平 | A kind of gold-plated equipment of vertical continuous PCB nickel plating |
| CH710741A2 (en) * | 2015-01-30 | 2016-08-15 | Acrom S A | Ecological procedure for continuous chrome plating of bars and relative equipment. |
| CN106319613B (en) * | 2015-06-23 | 2019-01-18 | 惠州市安泰普表面处理科技有限公司 | Horizontal continuity electroplating assembly line and its production technology |
| CN105648512B (en) * | 2016-03-11 | 2017-12-29 | 昆山东威电镀设备技术有限公司 | A kind of electroplanting device and continuous vertical plating production line |
| CN206015128U (en) * | 2016-08-25 | 2017-03-15 | 惠州威尔高电子有限公司 | Vertical continuous automatic electroplating production line |
| CN210176983U (en) * | 2019-03-22 | 2020-03-24 | Pyxis Cf私人有限公司 | Electroplating apparatus |
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| JP2019522733A (en) * | 2016-12-28 | 2019-08-15 | ▲漢▼▲瑪▼科技股▲フン▼有限公司 | Electroplating equipment for small parts |
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