CN114908401B - Automatic change electroplating device for circuit board processing - Google Patents
Automatic change electroplating device for circuit board processing Download PDFInfo
- Publication number
- CN114908401B CN114908401B CN202210593662.9A CN202210593662A CN114908401B CN 114908401 B CN114908401 B CN 114908401B CN 202210593662 A CN202210593662 A CN 202210593662A CN 114908401 B CN114908401 B CN 114908401B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- frame
- motor
- electroplating
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating device for processing an automatic circuit board, which comprises: the electrode frame, the electrode frame erects in the top left side of processing pond, and two lift grooves have been seted up on the right side of electrode frame, every all be equipped with the mounting panel in the lift groove, the mounting panel top is equipped with the lifter, two the rack is installed to one side that is close to each other of lifter, first motor is installed at the top of electrode frame, install the gear on the output shaft of first motor, and the both sides of gear respectively with two racks meshing, be provided with mounting panel, lifter, rack, gear and first motor, utilize first motor to drive the rotation effect of gear for the rack motion direction of both sides is opposite, and then makes the electrode bar of one side mounting panel bottom sink to in the electroplating pond in the back, and the electrode bar of the mounting panel bottom of opposite side is fixed rises from the electroplating pond, realizes seamless automatic switching electrode metal's effect, improves the efficiency of processing.
Description
Technical Field
The invention relates to the technical field of circuit board electroplating, in particular to electroplating equipment for automatic circuit board processing.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of certain metals by utilizing an electrolysis principle, and is a process of adhering a metal film on the surface of a metal or other material workpiece by utilizing electrolysis so as to play roles of preventing oxidation (such as corrosion) of the metal, improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate) and attractive appearance, and the like.
However, in the existing circuit board electroplating process, the electroplating needs to be stopped after the anode metal is used, and then the replacement process is performed, so that the processing process is stopped, and the circuit board assembly needs to be manually taken down after the circuit board is taken out from the electroplating pool, so that the circuit board assembly is not convenient enough, and the existing structure needs to be improved.
Disclosure of Invention
The invention aims to provide automatic circuit board processing electroplating equipment, which solves the problems that in the prior art, in the electroplating process of the circuit board, the anode metal needs to be stopped after being used and then replaced, so that the processing process is stopped, and a circuit board assembly needs to be manually taken down after the circuit board is taken out from an electroplating pool, which is not convenient enough.
In order to achieve the above purpose, the present invention provides the following technical solutions: an electroplating device for automatic circuit board processing, comprising:
the electrode frame is erected on the left side of the top of the processing pool, two lifting grooves are formed in the right side of the electrode frame, a mounting plate is arranged in each lifting groove, lifting rods are arranged at the top of the mounting plate, racks are arranged on one sides of the two lifting rods, which are close to each other, the top of the electrode frame is provided with a first motor, a gear is arranged on an output shaft of the first motor, and two sides of the gear are respectively meshed with the two racks;
the crane, crane movable mounting is at the top of processing pond, both sides bottom all is equipped with drive assembly around the crane, the internally mounted of crane has the gallows, the both sides of gallows are run through by lead screw and slide rod respectively, the bottom of gallows is equipped with circuit board and places the structure.
As a further scheme of the invention: the processing pond is including electroplating pond, washing pond, dry storehouse, baffle and electric heat drying device, the inside of processing pond is from left to right electroplating pond, washing pond and dry storehouse in proper order, still be equipped with the baffle in the dry storehouse, be equipped with the circuit board rack in the dry storehouse, install electric heat drying device on the inner wall of baffle, both sides are equipped with the extension around the top of processing pond.
By adopting the technical scheme, the effects of electroplating, cleaning and drying the circuit board are realized.
As a further scheme of the invention: the mounting plate comprises a fixed groove, clamping blocks, a screw and limiting blocks, the fixed groove is formed in the bottom of the mounting plate, the clamping blocks are arranged in the fixed groove, the screw is installed on the mounting plate in a penetrating mode, the screw is connected with the clamping blocks in a rotating mode, and the limiting blocks are arranged at positions, close to the rear, of the two sides of the mounting plate.
Through adopting above-mentioned technical scheme, conveniently utilize the removal of screw rod drive clamp splice, be convenient for the centre gripping object.
As a further scheme of the invention: the limiting block is inserted into a limiting groove on the side wall of the lifting groove, the mounting plate is connected with an external power supply assembly through a wire, and the bottom of the mounting plate is provided with an electrode rod.
Through adopting above-mentioned technical scheme, make things convenient for the installation and the dismantlement of electrode rod in the mounting panel bottom.
As a further scheme of the invention: the top of electrode frame still installs the support frame, the support frame is located between gear and the first motor, and the support frame is run through by first motor output shaft.
By adopting the technical scheme, the pressure born by the output shaft of the first motor is reduced by the support frame.
As a further scheme of the invention: the driving assembly comprises a second motor, a driving wheel and balls, the driving assembly is integrally L-shaped, the driving wheel is installed inside the driving assembly through the second motor, and the balls are arranged at the bottom of the driving assembly.
By adopting the technical scheme, the driving effect on the lifting frame is realized.
As a further scheme of the invention: the driving wheel is attached to the outer side of the extended edge of the top of the processing pool, and the balls are contacted with the top of the extended edge.
By adopting the technical scheme, the friction of the lifting frame is reduced conveniently.
As a further scheme of the invention: and a third motor is arranged at the top of the lifting frame, and an output shaft of the third motor is in butt joint with the screw rod.
Through adopting above-mentioned technical scheme, conveniently drive the lift process of gallows through third motor and lead screw.
As a further scheme of the invention: the bottom of gallows is installed the circuit board rack through the lifting hook arm, a plurality of circuit boards have been placed in the circuit board rack, the top of circuit board rack is equipped with the lifting handle.
Through adopting above-mentioned technical scheme, make things convenient for the lifting hook arm of gallows bottom to lift up or lift off the circuit board rack.
Compared with the prior art, the invention has the beneficial effects that: the electroplating equipment for the automatic circuit board processing,
(1) The electrode rod fixed at the bottom of the mounting plate at the other side is lifted from the electroplating pool after sinking into the electroplating pool, so that the effect of seamless automatic electrode metal switching is realized, and the processing efficiency is improved;
(2) The lifting frame is arranged, the lifting frame is driven to move left and right by utilizing the driving component in the lifting frame, lifting of the lifting hook arm is realized by utilizing the cooperation of the third motor and the screw rod, and the lifting hook at the tail end of the lifting hook arm can hook the circuit board placing frame in the drying bin easily by utilizing the cooperation of the two directions, or the circuit board placing frame is placed in the drying bin, so that an automatic downward circuit board effect is realized, and the contact between hands and electroplating liquid is avoided;
(3) The driving assembly is arranged, the second motor in the driving assembly is matched with the driving wheel to drive the transverse movement effect of the lifting frame, the driving wheel is prevented from being damaged due to the fact that the driving wheel is pressed by gravity in a side driving mode, the friction factor at the bottom of the lifting frame is reduced due to the design of the balls, and the friction force received by the lifting frame during movement is reduced conveniently;
(4) Be provided with wash pond and dry storehouse, after electroplating, the crane drives the circuit board rack and descends to wash in the pond, washs, places in the dry storehouse at last, utilizes electric heat drying device stoving circuit board, avoids moisture to remain.
Drawings
FIG. 1 is a schematic elevational view of the present invention;
FIG. 2 is a schematic top view of the processing tank of the present invention;
FIG. 3 is a schematic view of the right side cross-sectional structure of the processing tank of the present invention;
FIG. 4 is a schematic side view of the electrode holder of the present invention;
FIG. 5 is a schematic view of the mounting plate of the present invention in a bottom view;
FIG. 6 is a schematic side view of the processing tank and the lifting frame of the invention.
In the figure: 1. the device comprises a processing pool, 101, an electroplating pool, 102, a cleaning pool, 103, a drying bin, 104, a partition plate, 105, an electric heating drying device, 2, a spreading edge, 3, an electrode frame, 4, a lifting groove, 5, a mounting plate, 501, a fixing groove, 502, a clamping block, 503, a screw, 504, a limiting block, 6, a lifting rod, 7, a rack, 8, a gear, 9, an electrode rod, 10, a wire, 11, a supporting frame, 12, a first motor, 13, a lifting frame, 14, a driving component, 1401, a second motor, 1402, a driving wheel, 1403, a ball, 15, a third motor, 16, a screw, 17, a hanging frame, 18, a sliding rod, 19, a hanging hook arm, 20 and a circuit board placing frame.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-6, the present invention provides a technical solution: an electroplating device for automatic circuit board processing, comprising:
the electrode frame 3 is erected on the left side of the top of the processing pool 1, two lifting grooves 4 are formed in the right side of the electrode frame 3, a mounting plate 5 is arranged in each lifting groove 4, lifting rods 6 are arranged on the top of each mounting plate 5, racks 7 are arranged on the sides, close to each other, of the two lifting rods 6, a first motor 12 is arranged on the top of the electrode frame 3, a gear 8 is arranged on an output shaft of the first motor 12, and two sides of the gear 8 are meshed with the two racks 7 respectively;
the lifting frame 13 is movably arranged at the top of the processing pool 1, driving components 14 are arranged at the bottoms of the front side and the rear side of the lifting frame 13, a hanging frame 17 is arranged in the lifting frame 13, two sides of the hanging frame 17 are respectively penetrated by a screw rod 16 and a sliding rod 18, and a circuit board placement structure is arranged at the bottom of the hanging frame 17;
when in use, the driving component 14 drives the lifting frame 13 to transversely move, the lifting frame 17 and the circuit board placing structure are driven by the screw rod 16 to move to the top of the processing pool 1, the lifting frame 17 and the circuit board placing structure are driven by the screw rod 16 to descend into the electroplating pool 101 to carry out electroplating, after electroplating, the lifting frame 13 lifts the circuit board and then moves to the right side to finish the replacement of the circuit board, in the continuous electroplating process, the electrode rod 9 on one side of the electrode frame 3 can be continuously consumed, when more electrode rods 9 need to be replaced, the first motor 12 is started, the first motor 12 drives the gears 8 to rotate, so that the racks 7 on two sides and the lifting rod 6 are lifted and lowered respectively, the electrode rod 9 needing to be replaced is lifted, the electrifying object is replaced, the seamless replacement process is realized, the influence on the processing efficiency caused by overlong time of equipment is avoided, and the electrode rod 9 at the bottom of the lifted mounting plate 5 can be replaced after lifting is completed.
Referring to fig. 2 and 3, in one embodiment of the present invention, a processing tank 1 includes an electroplating tank 101, a cleaning tank 102, a drying bin 103, a partition board 104 and an electrothermal drying device 105, wherein the electroplating tank 101, the cleaning tank 102 and the drying bin 103 are sequentially arranged in the processing tank 1 from left to right, the partition board 104 is further arranged in the drying bin 103, a circuit board placing frame 20 is arranged in the drying bin 103, the electrothermal drying device 105 is mounted on the inner wall of the partition board 104, and extension edges 2 are arranged on the front side and the rear side of the top of the processing tank 1;
during electroplating, the workpiece is driven by the lifting frame 13 to sink into the electroplating pool 101, after electroplating, the workpiece enters into the cleaning pool 102 for cleaning through the lifting frame 13, and finally the workpiece is placed between the partition plates 104 of the drying bin 103 through the lifting frame 13, and then the other group of circuit board placing frames 20 are lifted for processing, so that the workpiece placed between the partition plates 104 is dried by heat generated by the electric heating drying device 105.
Referring to fig. 5, in one embodiment of the present invention, a mounting plate 5 includes a fixing groove 501, a clamping block 502, a screw 503 and a limiting block 504, the bottom of the mounting plate 5 is provided with the fixing groove 501, the clamping block 502 is arranged in the fixing groove 501, the screw 503 is installed on the mounting plate 5 in a penetrating manner, the screw 503 is rotationally connected with the clamping block 502, and the limiting block 504 is arranged at the rear positions of two sides of the mounting plate 5;
when the electrode rod 9 at the bottom of the mounting plate 5 is replaced, the clamping block 502 is driven to be separated from the top of the electrode rod 9 by the rotating screw 503, so that the electrode rod 9 is not fixed in the fixing groove 501 any more, and the replacement process is realized, so that the method is simple and efficient.
Referring to fig. 4, in one embodiment of the present invention, a limiting block 504 is inserted into a limiting groove on a side wall of the lifting groove 4, the mounting plate 5 is connected with an external power supply assembly through a wire 10, and an electrode rod 9 is mounted at the bottom of the mounting plate 5;
in the lifting process of the mounting plate 5, the limiting block 504 has the limiting effect, and the power supply of the electrode with the integral structure can be realized through the lead 10, so that the electroplating effect is convenient.
Referring to fig. 1, in one embodiment of the present invention, a supporting frame 11 is further installed on top of the electrode frame 3, the supporting frame 11 is located between the gear 8 and the first motor 12, and the supporting frame 11 is penetrated by an output shaft of the first motor 12;
in the whole lifting process of the mounting plate 5, the lifting rod 6 and the rack 7, the gravity center can be frequently changed, the output shaft of the first motor 12 can not be damaged when the gravity center is changed through the action of the supporting frame 11, and the stability of the first motor 12 during operation is improved.
Referring to fig. 6, in one embodiment of the present invention, the driving assembly 14 includes a second motor 1401, a driving wheel 1402 and balls 1403, the driving assembly 14 is generally L-shaped, the driving wheel 1402 is mounted inside the driving assembly 14 through the second motor 1401, and the balls 1403 are disposed at the bottom of the driving assembly 14;
in the embodiment of the invention, the driving wheel 1402 is attached to the outer side of the extension edge 2 at the top of the processing pool 1, the ball 1403 is contacted with the top of the extension edge 2, and the second motor 1401 drives the driving wheel 1402 to rotate during the movement of the lifting frame 13, so that the lifting frame 13 can move transversely, the ball 1403 has the effect of assisting sliding, and the running efficiency is improved.
Referring to fig. 6, in an embodiment of the present invention, a third motor 15 is installed on top of the lifting frame 13, and an output shaft of the third motor 15 is in butt joint with a screw rod 16;
when the lifting frame 17 in the lifting frame 13 needs to lift, the lifting effect of the lifting frame 17 is achieved by driving the screw rod 16 to rotate through the third motor 15, the sliding rod 18 has an auxiliary sliding effect, and a certain limiting effect is achieved.
Referring to fig. 6, in one embodiment of the present invention, a circuit board placement frame 20 is mounted at the bottom of a hanger 17 through a hanger arm 19, a plurality of circuit boards are placed in the circuit board placement frame 20, and a lifting handle is arranged at the top of the circuit board placement frame 20;
when the circuit board placing frame 20 is put down, the circuit board placing frame 20 is moved to the top of the drying bin 103 through the lifting frame 13, the lifting frame 17 and the circuit board placing frame 20 are put down through the third motor 15 and the screw rod 16, after the bottom of the circuit board placing frame 20 is contacted with the bottom of the drying bin 103, a distance is continuously put down, the lifting hook arm 19 is separated from the lifting handle at the top of the circuit board placing frame 20, the separation process can be completed through transversely moving the lifting frame 13, and the new circuit board placing frame 20 is hooked only by reverse running, so that an automatic feeding and discharging effect is realized.
The terms "center," "longitudinal," "transverse," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used for descriptive simplicity and convenience only and not as an indication or implying that the apparatus or element being referred to must have a particular orientation, be constructed and operated for a particular orientation, based on the orientation or positional relationship illustrated in the drawings, and thus should not be construed as limiting the scope of the present invention.
Although the present invention has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present invention.
Claims (6)
1. An electroplating device for automatic circuit board processing, characterized in that the electroplating device for automatic circuit board processing comprises:
the electrode frame (3), the electrode frame (3) erects in the top left side of processing pond (1), and two lift grooves (4) have been seted up on the right side of electrode frame (3), every all be equipped with mounting panel (5) in lift groove (4), mounting panel (5) top is equipped with lifter (6), two rack (7) are installed to the mutual side that is close to of lifter (6), first motor (12) are installed at the top of electrode frame (3), install gear (8) on the output shaft of first motor (12), and the both sides of gear (8) mesh with two racks (7) respectively;
the lifting frame (13), the lifting frame (13) is movably arranged at the top of the processing pool (1), driving components (14) are arranged at the bottoms of the front side and the rear side of the lifting frame (13), a hanging frame (17) is arranged in the lifting frame (13), two sides of the hanging frame (17) are respectively penetrated by a screw rod (16) and a sliding rod (18), and a circuit board placement structure is arranged at the bottom of the hanging frame (17);
the processing pool (1) comprises an electroplating pool (101), a cleaning pool (102), a drying bin (103), a partition board (104) and an electric heating drying device (105), wherein the electroplating pool (101), the cleaning pool (102) and the drying bin (103) are sequentially arranged in the processing pool (1) from left to right, the partition board (104) is further arranged in the drying bin (103), a circuit board placing rack (20) is arranged in the drying bin (103), the electric heating drying device (105) is arranged on the inner wall of the partition board (104), and extension edges (2) are arranged on the front side and the rear side of the top of the processing pool (1);
the mounting plate (5) comprises a fixing groove (501), clamping blocks (502), a screw rod (503) and limiting blocks (504), the fixing groove (501) is formed in the bottom of the mounting plate (5), the clamping blocks (502) are arranged in the fixing groove (501), the screw rod (503) is installed on the mounting plate (5) in a penetrating mode, the screw rod (503) is rotationally connected with the clamping blocks (502), and the limiting blocks (504) are arranged at positions, located behind two sides of the mounting plate (5), of the mounting plate;
the limiting block (504) is inserted into a limiting groove on the side wall of the lifting groove (4), the mounting plate (5) is connected with an external power supply assembly through a lead (10), and the bottom of the mounting plate (5) is provided with an electrode rod (9).
2. The electroplating device for automatic circuit board processing according to claim 1, wherein: the top of electrode frame (3) still installs support frame (11), support frame (11) are located between gear (8) and first motor (12), and support frame (11) are run through by first motor (12) output shaft.
3. An electroplating apparatus for automated circuit board processing according to claim 2, wherein: the driving assembly (14) comprises a second motor (1401), a driving wheel (1402) and balls (1403), the driving assembly (14) is integrally L-shaped, the driving wheel (1402) is installed inside the driving assembly (14) through the second motor (1401), and the balls (1403) are arranged at the bottom of the driving assembly (14).
4. An automated circuit board processing electroplating apparatus according to claim 3, wherein: the driving wheel (1402) is attached to the outer side of the top extension edge (2) of the processing pool (1), and the balls (1403) are contacted with the top of the extension edge (2).
5. The electroplating device for automatic circuit board processing according to claim 4, wherein: a third motor (15) is arranged at the top of the lifting frame (13), and an output shaft of the third motor (15) is in butt joint with the screw rod (16).
6. The electroplating device for automatic circuit board processing according to claim 5, wherein: the bottom of gallows (17) is through lifting hook arm (19) installs circuit board rack (20), a plurality of circuit boards have been placed in circuit board rack (20), the top of circuit board rack (20) is equipped with the lifting handle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210593662.9A CN114908401B (en) | 2022-05-27 | 2022-05-27 | Automatic change electroplating device for circuit board processing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210593662.9A CN114908401B (en) | 2022-05-27 | 2022-05-27 | Automatic change electroplating device for circuit board processing |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114908401A CN114908401A (en) | 2022-08-16 |
CN114908401B true CN114908401B (en) | 2023-06-23 |
Family
ID=82768520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210593662.9A Active CN114908401B (en) | 2022-05-27 | 2022-05-27 | Automatic change electroplating device for circuit board processing |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114908401B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105332039A (en) * | 2015-11-26 | 2016-02-17 | 扬中市宏飞镀业有限公司 | Quick electrode replacing device |
WO2018121526A1 (en) * | 2016-12-28 | 2018-07-05 | 汉玛科技股份有限公司 | Electroplating device for small component |
CN112458522A (en) * | 2020-11-23 | 2021-03-09 | 台州椒江扣纳离心机科技有限公司 | A automatic centrifuge of integral type for metal zinc-plating |
CN213113576U (en) * | 2020-09-18 | 2021-05-04 | 沈阳久富电力机械有限公司 | Electroplating equipment is used in spring touch finger production |
CN214655298U (en) * | 2021-01-28 | 2021-11-09 | 江苏文拓机械科技有限公司 | Automatic copper-clad silver electroplating equipment |
CN113789566A (en) * | 2021-09-18 | 2021-12-14 | 青沃精密仪器(苏州)有限公司 | Non-contact micro-arc polishing device and process |
-
2022
- 2022-05-27 CN CN202210593662.9A patent/CN114908401B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105332039A (en) * | 2015-11-26 | 2016-02-17 | 扬中市宏飞镀业有限公司 | Quick electrode replacing device |
WO2018121526A1 (en) * | 2016-12-28 | 2018-07-05 | 汉玛科技股份有限公司 | Electroplating device for small component |
CN213113576U (en) * | 2020-09-18 | 2021-05-04 | 沈阳久富电力机械有限公司 | Electroplating equipment is used in spring touch finger production |
CN112458522A (en) * | 2020-11-23 | 2021-03-09 | 台州椒江扣纳离心机科技有限公司 | A automatic centrifuge of integral type for metal zinc-plating |
CN214655298U (en) * | 2021-01-28 | 2021-11-09 | 江苏文拓机械科技有限公司 | Automatic copper-clad silver electroplating equipment |
CN113789566A (en) * | 2021-09-18 | 2021-12-14 | 青沃精密仪器(苏州)有限公司 | Non-contact micro-arc polishing device and process |
Also Published As
Publication number | Publication date |
---|---|
CN114908401A (en) | 2022-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN209584398U (en) | A kind of metal surface treating apparatus | |
CN114908401B (en) | Automatic change electroplating device for circuit board processing | |
CN114737243A (en) | Electroplating equipment for surface of mechanical part | |
CN211170943U (en) | Liquid receiving device for electroplating travelling crane | |
CN210711810U (en) | Auxiliary positioning device for electroplating of aluminum alloy product | |
CN213925100U (en) | Workpiece moving frame for multistage electroplating bath | |
CN213538143U (en) | Automatic electroplating equipment for nut processing | |
CN215925119U (en) | Full-automatic gantry type E-shaped electroplating production line | |
CN213037867U (en) | Copper bar electroplating production line | |
CN220156738U (en) | Loading attachment for PCB board electroless plating gold thread | |
CN221217955U (en) | Electroplating workpiece blanking device | |
CN215713503U (en) | Environment-friendly chain electroplating equipment | |
CN213417067U (en) | Automatic production device for continuous plating | |
CN114959855B (en) | Machining device applied to hardware electroplating | |
CN213417043U (en) | Automatic production device for rack plating | |
CN216237335U (en) | Full-automatic lithium battery electroplating equipment | |
CN218291151U (en) | Automatic feeding device for product electroplating | |
CN215366029U (en) | Hanging die for electroplating automobile parts | |
CN221810423U (en) | Electroplating processing frame | |
CN218252044U (en) | Positioner is washd step by step to plated item plating solution | |
CN213232556U (en) | Automatic gantry electroplating device | |
CN219508054U (en) | Metal surface electroplating treatment device | |
CN113737259B (en) | Galvanized treatment equipment for metal part machining | |
CN218203127U (en) | Electroplating device for metal mold production | |
CN219547140U (en) | Electroplating equipment with uniform electroplating |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |