CN114908401A - Automatic change circuit board processing and use electroplating device - Google Patents

Automatic change circuit board processing and use electroplating device Download PDF

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Publication number
CN114908401A
CN114908401A CN202210593662.9A CN202210593662A CN114908401A CN 114908401 A CN114908401 A CN 114908401A CN 202210593662 A CN202210593662 A CN 202210593662A CN 114908401 A CN114908401 A CN 114908401A
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China
Prior art keywords
circuit board
motor
lifting
electroplating
electrode
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Granted
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CN202210593662.9A
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Chinese (zh)
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CN114908401B (en
Inventor
陈静宇
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Anhui Dongou Electronic Technology Co Ltd
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Anhui Dongou Electronic Technology Co Ltd
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Priority to CN202210593662.9A priority Critical patent/CN114908401B/en
Publication of CN114908401A publication Critical patent/CN114908401A/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses an electroplating device for automatic circuit board processing, which comprises: the electrode frame is erected on the left side of the top of the processing pool, two lifting grooves are formed in the right side of the electrode frame, a mounting plate is arranged in each lifting groove, the top of the mounting plate is provided with a lifting rod, one side of the two lifting rods, which is close to each other, is provided with a rack, a first motor is arranged at the top of the electrode frame, a gear is arranged on an output shaft of the first motor, and two sides of the gear are respectively engaged with the two racks, the mounting plate, the lifting rod, the racks, the gear and the first motor are arranged, the first motor is utilized to drive the rotation effect of the gear, so that the movement directions of the racks on the two sides are opposite, and then make the electrode bar of one side mounting panel bottom sink to the back in the electroplating bath, the electrode bar that the mounting panel bottom of opposite side is fixed rises from the electroplating bath in, realizes seamless automatic effect of switching electrode metal, improves the efficiency of processing.

Description

Automatic change circuit board processing and use electroplating device
Technical Field
The invention relates to the technical field of circuit board electroplating, in particular to electroplating equipment for automatic circuit board processing.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis so as to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate) and improve the appearance, and the like.
However, in the existing circuit board electroplating process, after the anode metal is used up, the electroplating is stopped, and then the replacement process is performed, so that the processing process is stopped, and the circuit board assembly is required to be manually taken down after the circuit board is taken out from the electroplating pool, which is not convenient enough, so that the existing structure needs to be improved.
Disclosure of Invention
The invention aims to provide electroplating equipment for automatic circuit board processing, which aims to solve the problems that in the prior art, in the existing circuit board electroplating process, the electroplating is required to be stopped after anode metal is used up, and then the circuit board assembly is required to be manually taken down after the circuit board is taken out of an electroplating pool, so that the processing process is stopped, and the circuit board assembly is not convenient.
In order to achieve the purpose, the invention provides the following technical scheme: an automatic change electroplating device for circuit board processing includes:
the electrode rack is erected on the left side of the top of the processing pool, two lifting grooves are formed in the right side of the electrode rack, a mounting plate is arranged in each lifting groove, a lifting rod is arranged on the top of the mounting plate, racks are arranged on the sides, close to each other, of the two lifting rods, a first motor is arranged on the top of the electrode rack, a gear is arranged on an output shaft of the first motor, and the two sides of the gear are respectively meshed with the two racks;
the lifting frame is movably mounted at the top of the processing pool, driving assemblies are arranged at the bottoms of the front side and the rear side of the lifting frame, a lifting frame is mounted inside the lifting frame, the two sides of the lifting frame are respectively penetrated through by a screw rod and a sliding rod, and a circuit board placing structure is arranged at the bottom of the lifting frame.
As a further scheme of the invention: the processing pond includes electroplating bath, washing pond, dry storehouse, baffle and electric heat drying device, the inside of processing pond from left to right is electroplating bath, washing pond and dry storehouse in proper order, still be equipped with the baffle in the dry storehouse, be equipped with the circuit board rack in the dry storehouse, install electric heat drying device on the inner wall of baffle, both sides are equipped with around the top of processing pond and extend the limit.
By adopting the technical scheme, the effects of electroplating, cleaning and drying the circuit board are realized.
As a further scheme of the invention: the mounting panel includes fixed slot, clamp splice, screw rod and stopper, the fixed slot has been seted up to the bottom of mounting panel, the inside of fixed slot is equipped with the clamp splice, run through on the mounting panel and install the screw rod, the screw rod rotates with the clamp splice to be connected, the position that the both sides of mounting panel leaned on the back is provided with the stopper.
By adopting the technical scheme, the screw rod is conveniently utilized to drive the clamping block to move, and the object can be clamped conveniently.
As a further scheme of the invention: the limiting block is inserted into a limiting groove in the side wall of the lifting groove, the mounting plate is connected with an external power supply assembly through a wire, and the bottom of the mounting plate is provided with an electrode bar.
By adopting the technical scheme, the electrode bar is convenient to mount and dismount at the bottom of the mounting plate.
As a further scheme of the invention: the top of electrode holder still installs the support frame, the support frame is located between gear and the first motor, and the support frame is run through by first motor output shaft.
Through adopting above-mentioned technical scheme, realize utilizing the support frame to reduce the pressure that the output shaft of first motor received.
As a further scheme of the invention: the drive assembly comprises a second motor, a drive wheel and balls, the drive assembly is integrally L-shaped, the drive wheel is mounted in the drive assembly through the second motor, and the balls are arranged at the bottom of the drive assembly.
Through adopting above-mentioned technical scheme, realize the drive effect to the crane.
As a further scheme of the invention: the driving wheel is attached to the outer side of the extending edge of the top of the processing pool, and the ball is in contact with the top of the extending edge.
Through adopting above-mentioned technical scheme, conveniently reduce the friction of crane.
As a further scheme of the invention: and a third motor is installed at the top of the lifting frame, and an output shaft of the third motor is in butt joint with the screw rod.
Through adopting above-mentioned technical scheme, conveniently drive the lift process of gallows through third motor and lead screw.
As a further scheme of the invention: the circuit board placing frame is installed at the bottom of the hanging frame through the hook arm, a plurality of circuit boards are placed in the circuit board placing frame, and a hanging lifting handle is arranged at the top of the circuit board placing frame.
By adopting the technical scheme, the circuit board placing frame is lifted or dismounted by the hook arm at the bottom of the hanging bracket conveniently.
Compared with the prior art, the invention has the beneficial effects that: the electroplating equipment for processing the automatic circuit board,
(1) the electrode bar automatic switching device is provided with a mounting plate, a lifting rod, racks, a gear and a first motor, the first motor is utilized to drive the rotation effect of the gear, so that the movement directions of the racks on two sides are opposite, and the electrode bar fixed at the bottom of the mounting plate on one side is sunk into the electroplating bath and then lifted from the electroplating bath, thereby realizing the effect of seamless automatic switching of electrode metal and improving the processing efficiency;
(2) the lifting frame is arranged, the driving assembly in the lifting frame is used for driving the lifting frame to move left and right, the lifting of the lifting hook arm is realized through the matching of the third motor and the screw rod, the lifting hook at the tail end of the lifting hook arm can easily hook the circuit board placing frame in the drying bin through the matching of two directions, or the circuit board placing frame is placed in the drying bin, the automatic circuit board downward effect is realized, and the contact between hands and electroplating solution is avoided;
(3) the lifting frame is provided with a driving assembly, the transverse moving effect of the lifting frame is driven by the matching of a second motor in the driving assembly and a driving wheel, the driving wheel is prevented from being damaged due to the oppression of gravity in a side driving mode, the friction factor at the bottom of the lifting frame is reduced due to the design of the balls, and the friction force received when the lifting frame moves is conveniently reduced;
(4) be provided with and wash pond and dry storehouse, after electroplating, the crane drives the circuit board rack and transfers to wash in the pond, washs, places dry storehouse in at last, utilizes electric heat drying device stoving circuit board, avoids moisture to remain.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic top view of the processing tank of the present invention;
FIG. 3 is a right side sectional view of the processing tank of the present invention;
FIG. 4 is a schematic diagram of a side view of an electrode holder according to the present invention;
FIG. 5 is a schematic bottom view of the mounting plate of the present invention;
fig. 6 is a schematic side view of the processing tank and the crane of the present invention.
In the figure: 1. the device comprises a processing pool, 101, an electroplating pool, 102, a cleaning pool, 103, a drying bin, 104, a partition board, 105, an electric heating drying device, 2, an extension edge, 3, an electrode frame, 4, a lifting groove, 5, a mounting plate, 501, a fixing groove, 502, a clamping block, 503, a screw rod, 504, a limiting block, 6, a lifting rod, 7, a rack, 8, a gear, 9, an electrode rod, 10, a lead wire, 11, a supporting frame, 12, a first motor, 13, a lifting frame, 14, a driving assembly, 1401, a second motor, 1402, a driving wheel, 1403, a ball, 15, a third motor, 16, a lead screw, 17, a lifting frame, 18, a sliding rod, 19, a lifting hook arm, 20 and a circuit board placing frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: an automatic change electroplating device for circuit board processing, includes:
the electrode rack 3 is erected on the left side of the top of the processing pool 1, two lifting grooves 4 are formed in the right side of the electrode rack 3, a mounting plate 5 is arranged in each lifting groove 4, a lifting rod 6 is arranged on the top of the mounting plate 5, racks 7 are arranged on the sides, close to each other, of the two lifting rods 6, a first motor 12 is arranged on the top of the electrode rack 3, a gear 8 is arranged on an output shaft of the first motor 12, and two sides of the gear 8 are respectively meshed with the two racks 7;
the lifting frame 13 is movably arranged at the top of the processing pool 1, the bottom parts of the front side and the rear side of the lifting frame 13 are respectively provided with a driving assembly 14, a lifting frame 17 is arranged inside the lifting frame 13, two sides of the lifting frame 17 are respectively penetrated by a screw rod 16 and a sliding rod 18, and the bottom part of the lifting frame 17 is provided with a circuit board placing structure;
when the electroplating device is used, the driving assembly 14 drives the lifting frame 13 to transversely move, so that the lifting frame 17 and the circuit board placing structure move to the top of the processing pool 1, the lifting frame 17 and the circuit board placing structure are driven by the lead screw 16 to descend into the electroplating pool 101 for electroplating, after electroplating, the lifting frame 13 lifts the circuit board and moves to the right side to complete replacement of the circuit board, in the continuous electroplating process, the electrode bar 9 on one side of the electrode frame 3 can be continuously consumed, when more electrode bars 9 are consumed and need to be replaced, the first motor 12 is started, the first motor 12 drives the gear 8 to rotate, so that the racks 7 and the lifting rods 6 on two sides respectively lift and descend, the electrode bar 9 which needs to be replaced lifts, the replaced electrode bar 9 descends, and an electrified object is replaced, the seamless replacement process is realized, and the problem that the machining efficiency is influenced due to overlong shutdown time of the device is avoided, the electrode rods 9 at the bottom of the raised mounting plate 5 can be replaced after the elevation is completed.
Referring to fig. 2 and 3, in an embodiment of the present invention, a processing tank 1 includes an electroplating tank 101, a cleaning tank 102, a drying chamber 103, a partition plate 104 and an electric heating drying device 105, the electroplating tank 101, the cleaning tank 102 and the drying chamber 103 are sequentially arranged inside the processing tank 1 from left to right, the drying chamber 103 is further provided with the partition plate 104, the drying chamber 103 is provided with a circuit board placing frame 20, the inner wall of the partition plate 104 is provided with the electric heating drying device 105, and the front side and the rear side of the top of the processing tank 1 are provided with extending edges 2;
when electroplating, the work piece is driven by crane 13 and sinks to electroplating bath 101 in, electroplates the back that finishes, makes the work piece enter into through crane 13 and carry out clear process in wasing pond 102, places the work piece between the baffle 104 of dry storehouse 103 through crane 13 at last, lifts up another group of circuit board rack 20 again and carries out the process of processing, and the work piece of placing between the baffle 104 can be dried by the heat that electric heat drying device 105 produced.
Referring to fig. 5, in an embodiment of the present invention, the mounting plate 5 includes a fixing groove 501, a clamping block 502, a screw 503 and a limiting block 504, the bottom of the mounting plate 5 is provided with the fixing groove 501, the clamping block 502 is disposed inside the fixing groove 501, the screw 503 is installed on the mounting plate 5 in a penetrating manner, the screw 503 is rotatably connected with the clamping block 502, and the limiting block 504 is disposed at a position behind two sides of the mounting plate 5;
when changing the electrode bar 9 of mounting panel 5 bottom, drive clamp splice 502 and electrode bar 9's top separation through rotating screw rod 503, and then make electrode bar 9 no longer fixed in fixed slot 501, realize the process of changing, it is simple and high-efficient.
Referring to fig. 4, in an embodiment of the present invention, the limiting block 504 is inserted into a limiting groove on the sidewall of the lifting groove 4, the mounting plate 5 is connected to an external power supply module through a wire 10, and the bottom of the mounting plate 5 is provided with an electrode rod 9;
in the process of lifting the mounting plate 5, the limiting block 504 has a limiting effect, and the power supply to the electrode of the whole structure can be realized through the wire 10, so that the electroplating effect is convenient.
Referring to fig. 1, in an embodiment of the present invention, a supporting frame 11 is further installed on the top of the electrode holder 3, the supporting frame 11 is located between the gear 8 and the first motor 12, and the supporting frame 11 is penetrated by an output shaft of the first motor 12;
in the process that mounting panel 5, lifter 6 and rack 7 wholly go up and down, the focus can frequently change, makes the output shaft of first motor 12 can not impaired when the focus changes through the effect of support frame 11, improves the stability when first motor 12 moves.
Referring to fig. 6, in an embodiment of the present invention, the driving assembly 14 includes a second motor 1401, a driving wheel 1402 and a ball 1403, the driving assembly 14 is L-shaped as a whole, the driving wheel 1402 is installed inside the driving assembly 14 through the second motor 1401, and the ball 1403 is disposed at the bottom of the driving assembly 14;
in the embodiment of the invention, the driving wheel 1402 is attached to the outer side of the top extension edge 2 of the processing pool 1, the ball 1403 is in contact with the top of the extension edge 2, the second motor 1401 drives the driving wheel 1402 to rotate in the moving process of the lifting frame 13 to realize the transverse movement of the lifting frame 13, and the ball 1403 has the effect of assisting sliding and improves the operation efficiency.
Referring to fig. 6, in an embodiment of the present invention, a third motor 15 is installed on the top of the lifting frame 13, and an output shaft of the third motor 15 is in butt joint with the screw rod 16;
when the hanger 17 in the lifting frame 13 needs to be lifted, the third motor 15 drives the screw rod 16 to rotate so as to realize the lifting effect of the hanger 17, and the sliding rod 18 plays a role in assisting sliding and has a certain limiting effect.
Referring to fig. 6, in an embodiment of the present invention, a circuit board placing rack 20 is installed at the bottom of the hanger 17 through a hook arm 19, a plurality of circuit boards are placed in the circuit board placing rack 20, and a lifting handle is installed at the top of the circuit board placing rack 20;
when putting down circuit board rack 20, remove circuit board rack 20 to the top of dry storehouse 103 through crane 13, gallows 17 and circuit board rack 20 are transferred to rethread third motor 15 and lead screw 16, after contacting bottom dry storehouse 103 bottom in circuit board rack 20, continue to transfer a section distance, make the lift at davit arm 19 and circuit board rack 20 top separate, the process of separation can be accomplished to lateral shifting crane 13 again, hook new circuit board rack 20 only need the reverse operation can, realize automatic last unloading effect.
The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like refer to orientations or positional relationships that are illustrated in the figures, and are used merely to simplify the description of the present disclosure, rather than to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the scope of the present disclosure.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.

Claims (9)

1. The utility model provides an automatic change electroplating device for circuit board processing which characterized in that, automatic change electroplating device for circuit board processing includes:
the electrode rack (3) is erected on the left side of the top of the processing pool (1), two lifting grooves (4) are formed in the right side of the electrode rack (3), an installation plate (5) is arranged in each lifting groove (4), lifting rods (6) are arranged on the top of the installation plate (5), racks (7) are installed on one sides, close to each other, of the two lifting rods (6), a first motor (12) is installed on the top of the electrode rack (3), a gear (8) is installed on an output shaft of the first motor (12), and two sides of the gear (8) are meshed with the two racks (7) respectively;
the lifting frame (13), lifting frame (13) movable mounting all is equipped with drive assembly (14) at the top in the front and back both sides bottom of lifting frame (13) in the processing pond (1), the internally mounted of lifting frame (13) has gallows (17), the both sides of gallows (17) are run through by lead screw (16) and litter (18) respectively, the bottom of gallows (17) is equipped with the circuit board and places the structure.
2. The electroplating equipment for automatic circuit board processing according to claim 1, wherein the electroplating equipment comprises: processing pond (1) is including electroplating bath (101), washing pond (102), dry storehouse (103), baffle (104) and electric heat drying device (105), the inside of processing pond (1) from left to right is electroplating bath (101), washing pond (102) and dry storehouse (103) in proper order, still be equipped with baffle (104) in dry storehouse (103), be equipped with circuit board rack (20) in dry storehouse (103), install electric heat drying device (105) on the inner wall of baffle (104), both sides are equipped with around the top of processing pond (1) and prolong limit (2).
3. The electroplating equipment for automatic circuit board processing according to claim 2, wherein the electroplating equipment comprises: mounting panel (5) are including fixed slot (501), clamp splice (502), screw rod (503) and stopper (504), fixed slot (501) have been seted up to the bottom of mounting panel (5), the inside of fixed slot (501) is equipped with clamp splice (502), run through on mounting panel (5) and install screw rod (503), screw rod (503) rotate with clamp splice (502) and are connected, the position that the both sides of mounting panel (5) leaned on the back is provided with stopper (504).
4. The electroplating equipment for automatic circuit board processing according to claim 3, wherein the electroplating equipment comprises: stopper (504) insert the spacing inslot on lifting groove (4) lateral wall, mounting panel (5) are connected with outside power supply module through wire (10), electrode bar (9) are installed to the bottom of mounting panel (5).
5. The electroplating equipment for automatic circuit board processing according to claim 4, wherein the electroplating equipment comprises: the top of electrode frame (3) still installs support frame (11), support frame (11) are located between gear (8) and first motor (12), and support frame (11) are run through by first motor (12) output shaft.
6. The plating apparatus for automatic wiring board processing according to claim 5, wherein: the driving assembly (14) comprises a second motor (1401), a driving wheel (1402) and a ball (1403), the driving assembly (14) is integrally L-shaped, the driving wheel (1402) is mounted in the driving assembly (14) through the second motor (1401), and the ball (1403) is arranged at the bottom of the driving assembly (14).
7. The electroplating equipment for automatic circuit board processing according to claim 6, wherein the electroplating equipment comprises: the driving wheel (1402) is attached to the outer side of the top extending edge (2) of the processing pool (1), and the ball (1403) is in contact with the top of the extending edge (2).
8. The plating apparatus for automatic circuit board processing according to claim 7, wherein: and a third motor (15) is installed at the top of the lifting frame (13), and an output shaft of the third motor (15) is butted with the screw rod (16).
9. The electroplating equipment for automatic circuit board processing according to claim 8, wherein the electroplating equipment comprises: the circuit board placing rack is characterized in that a circuit board placing rack (20) is mounted at the bottom of the hanging bracket (17) through a hanging hook arm (19), a plurality of circuit boards are placed in the circuit board placing rack (20), and a hanging lifting handle is arranged at the top of the circuit board placing rack (20).
CN202210593662.9A 2022-05-27 2022-05-27 Automatic change electroplating device for circuit board processing Active CN114908401B (en)

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Application Number Priority Date Filing Date Title
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CN114908401B CN114908401B (en) 2023-06-23

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Publication number Priority date Publication date Assignee Title
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WO2018121526A1 (en) * 2016-12-28 2018-07-05 汉玛科技股份有限公司 Electroplating device for small component
CN112458522A (en) * 2020-11-23 2021-03-09 台州椒江扣纳离心机科技有限公司 A automatic centrifuge of integral type for metal zinc-plating
CN213113576U (en) * 2020-09-18 2021-05-04 沈阳久富电力机械有限公司 Electroplating equipment is used in spring touch finger production
CN214655298U (en) * 2021-01-28 2021-11-09 江苏文拓机械科技有限公司 Automatic copper-clad silver electroplating equipment
CN113789566A (en) * 2021-09-18 2021-12-14 青沃精密仪器(苏州)有限公司 Non-contact micro-arc polishing device and process

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105332039A (en) * 2015-11-26 2016-02-17 扬中市宏飞镀业有限公司 Quick electrode replacing device
WO2018121526A1 (en) * 2016-12-28 2018-07-05 汉玛科技股份有限公司 Electroplating device for small component
CN213113576U (en) * 2020-09-18 2021-05-04 沈阳久富电力机械有限公司 Electroplating equipment is used in spring touch finger production
CN112458522A (en) * 2020-11-23 2021-03-09 台州椒江扣纳离心机科技有限公司 A automatic centrifuge of integral type for metal zinc-plating
CN214655298U (en) * 2021-01-28 2021-11-09 江苏文拓机械科技有限公司 Automatic copper-clad silver electroplating equipment
CN113789566A (en) * 2021-09-18 2021-12-14 青沃精密仪器(苏州)有限公司 Non-contact micro-arc polishing device and process

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