JP2001181893A - Surface treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface treatment apparatus which can be applied to a member to be surface-treated which is light in weight and not necessarily high in strength like a bond magnet, and achieve the uniform plating free from any contact trace. SOLUTION: The surface treatment apparatus to achieve the surface treatment on the member to be surface-treated having an inner circumferential surface of a cylindrical shape or the like comprises a supporting member to support the member to be surface-treated and gives the rotation thereto, and a load applying member to press the member to be surface-treated against the supporting member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape, and more particularly to an R-Fe-B-based permanent magnet,
The present invention relates to a surface treatment apparatus useful for performing electroplating on a ring-shaped bonded magnet or a cylindrical bonded magnet.

[0002]

2. Description of the Related Art R-Fe-B-based permanent magnets represented by Nd-Fe-B-based permanent magnets use abundant and inexpensive materials as resources and have high magnetic properties. From today, it is used in various fields. However,
R-Fe-B permanent magnets contain R and Fe, which are susceptible to oxidative corrosion in the atmosphere. Therefore, if used without any surface treatment, the surface will be affected by the presence of a slight amount of acid, alkali or moisture. Therefore, there is a problem that rust is generated due to the progress of corrosion, which causes deterioration and variation in magnet characteristics.

[0003] In order to solve the above problems, a method of applying a metal plating film or a resin coating as an oxidation-resistant film on the magnet surface has conventionally been adopted. For example, R-Fe-B
As a method of forming a corrosion-resistant film on the surface of a system-based permanent magnet by electroplating, a method of placing a member to be plated in a mesh basket and performing plating while rotating the mesh basket (barrel method),
A method (rack method) of performing plating by supporting a member to be plated on a conductive support member connected to a negative electrode has been adopted.

[0004]

Although the above-mentioned barrel plating and rack plating are excellent in versatility, the former method is applied to a bonded magnet in which the strength of the magnet itself is not necessarily high. However, there is a problem that the magnet may be cracked or chipped. Further, the latter method has a problem that a portion of the magnet that is in contact with the conductive support member remains as a contact mark, and that the treatment is required after plating. On the other hand, Japanese Patent Application Laid-Open No. 61-52367 proposes a plating apparatus in which a shaft is passed through a hole of a plate-shaped work, and the work itself is rotated by rotating the shaft. However, in this device, the problem of cracking and chipping,
Although the problem of contact marks has been solved, when plating a light member such as a bonded magnet, the magnet is weakly pressed against the shaft due to its own weight. However, there is a problem in that the contact cannot be made and the plating efficiency deteriorates.

Accordingly, an object of the present invention is to apply the method to a light-weight and not necessarily high-strength surface-treated member, such as a bonded magnet, and to perform uniform plating without contact marks.

[0006]

According to a first aspect of the present invention, there is provided a surface treatment apparatus for performing a surface treatment on a surface-treated member having a cylindrical inner peripheral surface. A support member is provided for supporting the surface treatment member and giving a rotating operation to the surface treatment member, and a load member for pressing the surface treatment member against the support member is provided. According to a second aspect of the present invention, in the surface treatment apparatus according to the first aspect, a plurality of the loading members are provided, and each of the loading members presses the surface-treated member from the outer peripheral surface side. And According to a third aspect of the present invention, in the surface treatment apparatus according to the first aspect, a plurality of the support members are provided, and each of the support members supports the surface-treated member from an outer peripheral surface side. .
According to a fourth aspect of the present invention, in the surface treatment apparatus of the first aspect, the load member and the support member are arranged on an outer peripheral surface side of the surface-treated member. According to a fifth aspect of the present invention, in the surface treatment apparatus according to the first aspect, the loading member is disposed above the supporting member, and the surface-treated member is pressed by the weight of the loading member. It is characterized by. According to a sixth aspect of the present invention, in the surface treatment apparatus according to the first aspect, the load member is rotatably provided. According to a seventh aspect of the present invention, in the surface treatment apparatus according to the first aspect, the load member is constituted by a permanent magnet disposed on all or a part of the support member. The surface treatment apparatus according to the present invention is a surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape. A contacting first member and a second member contacting the outer peripheral surface of the surface-treated member are juxtaposed so that the axial direction is the same, and the first member or the second member forms the surface to be treated. The processing member is driven to rotate.
A surface treatment apparatus according to a ninth aspect of the present invention is a surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape. A first member that is in contact with the first member and a second member that is in contact with an inner peripheral surface at a position facing the inner peripheral surface with which the first member is in contact with each other so as to have the same axial direction; The surface-treated member is rotationally driven by a member or the second member. The surface treatment apparatus according to the present invention is a surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape, wherein the inner peripheral surface or the outer periphery of the surface treated member is provided. Multiple members that contact the surface,
A plurality of the members are provided so as to have the same axial direction, and the surface-treated member is rotationally driven by at least one of the plurality of members. Claim 1
The first aspect of the present invention is the first aspect of the present invention.
0, wherein the supporting member is formed of a conductive member, and a plating current is applied to the surface-treated member by the supporting member.
According to a twelfth aspect of the present invention, in the surface treatment apparatus of the eleventh aspect, an insulating spacer is provided on the support member, and the surface-treated member is disposed between the insulating spacers. According to a thirteenth aspect of the present invention, in the surface treatment apparatus of the twelfth aspect, the insulating spacers are arranged such that the members to be surface-treated are arranged at equal intervals. According to a fourteenth aspect of the present invention, there is provided a surface treatment apparatus comprising a plurality of the surface treatment apparatuses according to any one of the first to thirteenth aspects disposed in a treatment tank. It is characterized in that the members are arranged in parallel. According to a fifteenth aspect of the present invention, there is provided a bond magnet electroplating apparatus for performing electroplating on a bond magnet using the surface treatment apparatus according to any one of the first to fourteenth aspects. The surface treatment method for a surface-treated member according to the present invention according to claim 16,
A surface treatment is performed using the surface treatment apparatus according to any one of claims 1 to 14. Claim 1
The R-Fe-B-based permanent magnet according to the present invention as described in claim 7,
An electroplating treatment is performed using the bond magnet electroplating apparatus described in 5, and a corrosion resistant film is formed on the surface. The surface-treated member of the present invention according to claim 18 is characterized in that a film is formed on the surface by the surface treatment method of the surface-treated member according to claim 16.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface treatment apparatus according to a first embodiment of the present invention is provided with a support member for supporting a member to be surface-treated and rotating the member to be treated.
A load member is provided for pressing the surface-treated member against the support member. According to the present embodiment, for example, when the surface-treated member is light, or when the outer diameter of the shaft of the support member is small, the frictional resistance between the support member and the surface-treated member is small, Even when is not sufficiently rotated, the surface-treated member is pressed against the support member by the load member, so that the surface-treated member surely rotates. Therefore, the contact position of the surface-treated member with the support member is surely moved, and uniform surface treatment without leaving traces of contact with the support member can be performed.

According to a second embodiment of the present invention, in the surface treatment apparatus according to the first embodiment, a plurality of loading members are provided, and each of the loading members presses the surface-treated member from the outer peripheral surface side. Things. According to the present embodiment, since the surface-treated member is pressed by the plurality of load members, the surface-treated member can be reliably and stably pressed against the support member. Therefore, the member to be surface-treated will surely perform a rotation operation, and it is possible to more reliably perform a uniform surface treatment without leaving traces of contact with the support member.

A third embodiment of the present invention is directed to a surface treatment apparatus according to the first embodiment, wherein a plurality of support members are provided, and each of the support members supports the surface-treated member from the outer peripheral surface side. is there. According to this embodiment, since the surface-treated member is supported by the plurality of support members, the surface-treated member can be reliably and stably supported with respect to the load member. Therefore, the member to be surface-treated will surely perform a rotation operation, and it is possible to more reliably perform a uniform surface treatment without leaving traces of contact with the support member.

In a fourth embodiment of the present invention, in the surface treatment apparatus according to the first embodiment, the load member and the support member are arranged on the outer peripheral surface side of the member to be surface treated. According to the present embodiment, even when the inner peripheral diameter of the surface-treated member is extremely small, the surface-treated member can be reliably and stably pressed against the support member. Therefore, the member to be surface-treated will surely perform a rotation operation, and it is possible to more reliably perform a uniform surface treatment without leaving traces of contact with the support member.

According to a fifth embodiment of the present invention, in the surface treatment apparatus according to the first embodiment, the load member is disposed above the support member, and the surface member to be pressed is pressed by the weight of the load member. Is what you do. According to this embodiment, after arranging the surface-treated member on the support member, the load member can be arranged from above the support member, and the surface-treated member is pressed by the weight of the load member. Removal work efficiency is good.

According to a sixth embodiment of the present invention, a load member is rotatably provided in the surface treatment apparatus according to the first embodiment. According to the present embodiment, the loading member also performs a rotating operation together with the surface-treated member,
It is possible to reliably rotate the surface-treated member without hindering the rotation drive by the support member.

In the surface treatment apparatus according to a seventh embodiment of the present invention, all or a part of the support member is constituted by a permanent magnet, and the whole or a part of the surface treatment member is formed of a magnetic material. In this case, the member to be treated is pressed using the suction force. According to the present embodiment, for example, when the surface-treated member is light, or when the outer diameter of the shaft of the support member is small, the frictional resistance between the support member and the surface-treated member is small, Even when the rotating member does not rotate sufficiently, the attraction force with the permanent magnet constituting the supporting member can reliably and stably press the member to be treated against the supporting member. The member will surely rotate. Therefore,
The contact position of the member to be treated with the support member is surely moved, so that a uniform surface treatment can be performed without leaving traces of contact. In addition, when the surface treatment apparatus of the present embodiment is used for electroplating, for example, even when the surface-treated member is made of a material that is not attracted to the magnet or hardly attracted by the magnet, for example, a ferromagnetic material such as nickel is used. When a plating process is performed on a material, as a plating film is formed on the surface of the surface-treated member, a suction force is generated between the support member and the surface-treated member, and the contact state can be reliably ensured. Therefore, the electroplating process can be performed uniformly without variation. In addition, according to this aspect, the role of the load member can be fulfilled by the support member alone without separately providing the load member, and the structure of the device is simplified, but the attraction force by the magnet is insufficient. For example, a load member may be further disposed.

According to an eighth embodiment of the present invention, there is provided a surface treatment apparatus comprising: a first member contacting an inner peripheral surface of a member to be treated; and a second member contacting an outer peripheral surface of the member to be treated. Are installed together so that the axial direction is the same, and the first member or the second member
The member to be surface-treated is driven to rotate by the above member. According to this embodiment, for example, when the surface-treated member is light or when the outer diameter of the shaft of the support member is small, the frictional resistance between the support member and the surface-treated member is small, and the surface-treated member is sufficient. Even when the surface processing member does not rotate, the surface processing member is reliably sandwiched between the first member abutting on the inner peripheral surface and the second member abutting on the outer peripheral surface. Will be done. Therefore, the contact position of the surface-treated member with the contacting member such as the support member is reliably moved, and uniform surface treatment without contact traces can be performed.

A surface treatment apparatus according to a ninth embodiment of the present invention comprises a first member contacting an inner peripheral surface of a member to be treated, and a first member contacting an inner peripheral surface contacting the first member. A second member that is in contact with the inner peripheral surface is juxtaposed so that the axial direction is the same, and the surface-treated member is rotated by the first member or the second member. According to the present embodiment, for example, when the surface-treated member is light, or when the outer diameter of the shaft of the support member is small, the frictional resistance between the support member and the surface-treated member is small, When the first member and the second member do not rotate sufficiently, the first member and the second member can surely ensure the contact state with the member to be treated. become. Therefore, the contact position of the surface-treated member with the contacting member such as the support member is reliably moved, and uniform surface treatment without contact traces can be performed.

In a surface treatment apparatus according to a tenth embodiment of the present invention, a plurality of members abutting on an inner peripheral surface or an outer peripheral surface of a surface-treated member are juxtaposed so that their axial directions are the same. The surface-treated member is rotated by at least one of the plurality of members. According to the present embodiment, for example, when the surface-treated member is light, or when the outer diameter of the shaft of the support member is small, the frictional resistance between the support member and the surface-treated member is small, Even when does not rotate sufficiently, the contact state with the surface-treated member can be reliably ensured by the plurality of members, so that the surface-treated member surely performs the rotating operation. Therefore, the contact position of the surface-treated member with the contacting member such as the support member is reliably moved, and uniform surface treatment without contact traces can be performed.

According to an eleventh embodiment of the present invention, in the surface treatment apparatus according to the first or eighth to tenth embodiments, the support member is formed of a conductive member, and the support member is used for the surface treatment member. A plating current is passed. According to the present embodiment, since the conduction between the support member and the surface-treated member can be reliably ensured, the electroplating process can be performed effectively. In particular, even when a plurality of surface-treated members are subjected to plating at the same time, electricity can be reliably supplied to all the surface-treated members.

According to a twelfth embodiment of the present invention, in the surface treatment apparatus according to the eleventh embodiment, an insulating spacer is provided on a support member, and a surface-treated member is disposed between the insulating spacers. According to the present embodiment, since the contact between the members to be surface-treated can be prevented by the insulating spacer, it is possible to prevent the nonuniform electroplating due to the contact.

According to a thirteenth embodiment of the present invention, in the surface treating apparatus according to the twelfth embodiment, insulating spacers are arranged so that members to be treated are arranged at equal intervals. According to this embodiment, the position or axial width of the spacer is adjusted, and the distance between the surface-treated members is made equal to each other at a predetermined size, so that the electric force to the edge portion of the surface-treated member is adjusted. The concentration of lines can be reduced, and the uniformity of plating can be further improved. It is desirable to select an appropriate value for each interval such that concentration of lines of electric force on the edge of the surface-treated member is reduced and the film thickness at the edge is uniform. Further, the spacer may be one in which the interval is adjusted to a predetermined dimension in advance and integrated with the support member, or one that can be adjusted in position.

A surface treatment apparatus according to a fourteenth embodiment of the present invention is a surface treatment apparatus using a plurality of surface treatment apparatuses according to the first to thirteenth embodiments arranged in a treatment tank. Are arranged so that the support members of the surface treatment device are parallel. According to this embodiment, it is possible to simultaneously process more surface-treated members,
According to the size of the processing tank in which the apparatus of the present invention is used, they can be effectively utilized.

An electroplating apparatus for bonded magnets according to a fifteenth embodiment of the present invention performs electroplating on a bonded magnet using the surface treatment apparatus according to the first to fourteenth embodiments. According to the present embodiment, it is possible to uniformly perform electroplating on the inner peripheral surface of the bonded magnet without variation.

The surface treatment method for a member to be surface-treated according to the sixteenth embodiment of the present invention performs the surface treatment using the surface treatment apparatus according to the first to fourteenth embodiments. According to the present embodiment, it is possible to uniformly perform the surface treatment on the inner peripheral surface of the surface-treated member without variation.

RF according to a seventeenth embodiment of the present invention
The eB-based permanent magnet was subjected to electroplating using the bond magnet electroplating apparatus according to the fifteenth embodiment. According to the present embodiment, it is possible to obtain an R-Fe-B-based permanent magnet in which a corrosion-resistant coating is uniformly formed on the inner peripheral surface without variation.

The member to be surface-treated according to the eighteenth embodiment of the present invention has a film formed on the surface by the surface treatment method for the member to be surface-treated according to the sixteenth embodiment. According to the present embodiment, it is possible to obtain a surface-treated member in which a coating is uniformly formed on the inner peripheral surface without variation.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface treatment apparatus according to one embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a conceptual configuration diagram of a bond magnet electroplating apparatus according to the present embodiment, and FIG.
FIG. 2 is a sectional view taken along line II-II of FIG. FIG. 1 shows a positive electrode plate 10 arranged in an electrolytic plating solution in a plating tank and a surface treatment jig 30 for holding a ring-shaped bonded magnet 20 as a surface-treated member. The surface treatment jig 30 supports the ring-shaped bonded magnet 20 from the inner peripheral surface side, and provides a rotating operation to the ring-shaped bonded magnet 20;
A load member 50 for pressing the ring-shaped bonded magnet 20 against the support member 40 is provided. As shown in FIG.
The two positive electrode plates 10 connected to 1 are arranged in parallel so as to face each other, and the jig 30 for surface treatment is
Are arranged between the anode electrodes 10 such that the axis of the The surface treatment jig 30 includes a gear 32 for transmitting the power of a motor 31 installed outside to the support member 40. Also, the surface treatment jig 3
Numeral 0 includes a negative electrode joint 34 connected to the negative electrode 33, and the support member 40 is connected to the negative electrode 33 by the negative electrode joint 34. The support member 40 includes a metal support shaft 41 and a resin insulation spacer 42 arranged at a predetermined interval on the support shaft 41. The load member 50 includes a rotating shaft 51 and a contact member 52 arranged at a predetermined interval on the rotating shaft 51.
Note that the width of the contact members 52 is smaller than the gap between the insulating spacers 42, and the respective contact members 52 are arranged so as to be located between the insulating spacers 42. Further, the load member 50 is made of an insulating material or has its surface insulated. This load member 50
Are held by bearings 35 at both ends. The rotating bearing portion 35A provided on the bearing 35 has an open upper portion so that the load member 50 can be disposed from above. When the rotating shaft 51 is disposed, the rotating bearing portion 35A has a depth such that the contact member 52 contacts the ring-shaped bonded magnet 20 and the weight of the load member 50 is applied to the ring-shaped bonded magnet 20. are doing.

Next, the method of use and operation of the apparatus for electroplating bonded magnets according to the present embodiment will be described. First,
The ring-shaped bonded magnet 20 is disposed between the insulating spacers 42 of the support member 40. The support member 40 on which the ring-shaped bonded magnets 20 are arranged as described above is placed on the surface treatment jig 30. Although FIG. 1 shows an arrangement in which one ring-shaped bonded magnet 20 is provided, the ring-shaped bonded magnet 20 can be provided between the insulating spacers 42. After the support member 40 is installed on the surface treatment jig 30, the bearing 35 is provided, and both ends of the rotating shaft 51 of the load member 50 are provided on the rotating bearing portion 35A from above. In this state, as shown in FIG. 2, the contact member 52 of the load member 50
It contacts the upper outer peripheral surface of the ring-shaped bonded magnet 20. After the above state is completed, electroplating is performed. Positive electrode 1
1 and the negative electrode, and the motor 31 is driven. The driving force of the motor 31 is transmitted to the support member 40 via the gear 32, and the support member 40 rotates.

As shown in FIG. 2, when the support member 40 is rotated counterclockwise (arrow A), the ring-shaped bonded magnet 20 in contact with the support shaft 41 is also rotated counterclockwise (arrow B). At this time, since the ring-shaped bonded magnet 20 is pressed against the support member 40 from the outer surface side by the contact member 52 of the load member 50, the ring-shaped bonded magnet 20 reliably receives the rotational force of the support member 40. Since the load member 50 is rotatably provided by the bearing 35, it rotates clockwise (arrow C) with the rotation of the ring-shaped bonded magnet 20. As described above, since the ring-shaped bonded magnet 20 is reliably rotated, a uniform plating process can be performed without leaving traces of contact with the support member 40 and the load member 50. In addition, since the ring-shaped bonded magnet 20 is reliably rotated, the distance between each part of the outer surface and the positive electrode plate 10 is averaged constant for each magnet, and the film thickness of the coating varies among the magnet parts. No plating process can be performed. Furthermore, the surrounding plating solution is agitated by the rotating operation of the ring-shaped bonded magnet 20, and a highly efficient plating process can be performed. Although FIG. 1 shows two sets of support members and load members, one set may be used, or three or more sets of support members and load members may be arranged so that they are parallel to each other. Many surface-treated members can be processed simultaneously.

FIG. 3 shows another embodiment. FIG. 3 is a cross-sectional view of a main part corresponding to FIG. 2, and the basic configuration is the same as that of FIG. Note that members having the same functions are given the same reference numerals and description thereof will be omitted. In this embodiment, a load member 50A is different from the embodiment shown in FIG. That is, the rotating shaft 51A and the contact member 52A are formed as separate members, the inner peripheral diameter of the contact member 52A is formed larger than the outer peripheral diameter of the rotating shaft 51A, and the contact member 52A has its own weight. It is configured to contact the ring-shaped bonded magnet 20. Therefore, in the configuration of the present embodiment, the rotating shaft 51A does not necessarily have to be rotatable, and the own weight of the rotating shaft 51A also acts on the ring-shaped bonded magnet 20 with respect to the depth of the rotating bearing 35A described in the above embodiment. It is not necessary to have such a depth. According to the configuration of the present embodiment, since the own weight of each contact member 52A is applied to the corresponding ring-shaped bonded magnet 20, for example, the horizontality of the surface treatment jig 30, the support member, or the load member 50 is set. Can be applied uniformly to each of the ring-shaped bonded magnets 20 even when the pressure is not held. Therefore, since all the ring-shaped bonded magnets 20 rotate reliably, a uniform plating process can be performed without leaving traces of contact with the support member 40 and the load member 50.

FIG. 4 shows still another embodiment. FIG. 4 is a cross-sectional view of a main part corresponding to FIG. 2, and the basic configuration is the same as that of FIG. Note that members having the same functions are given the same reference numerals and description thereof will be omitted. In this embodiment,
The load member 50B is different from the embodiment shown in FIG.
That is, the two load members 50 </ b> B are configured to contact the ring-shaped bonded magnet 20. Therefore, in the configuration of the present embodiment, the load member 50B does not necessarily need to include a contact member having a diameter larger than the rotation shaft. However, a load member 50 shown in FIG. 2 or a load member 50A shown in FIG. 3 may be used. The load member 5
About 0B, three or more may be provided, and in the present embodiment, the configuration is such that the pressing is performed from the outer peripheral surface side of the ring-shaped bonded magnet 20. However, all the load members 50B or some of the load members 50B are used. The configuration may be such that the ring-shaped bonded magnet 20 is pressed from the inner peripheral surface side. According to the configuration of the present embodiment, since the plurality of loading members 50B are applied to the ring-shaped bonded magnet 20, for example, the surface treatment jig 30,
Even when the horizontality of the supporting member 40 or the load member 50 is not maintained, the respective ring-shaped bonded magnets 20 are pressed, so that the ring-shaped bonded magnet 20 is reliably and stably held against the supporting member 40. Can be pressed.

FIG. 5 shows still another embodiment. FIG. 5 is a cross-sectional view of a main part corresponding to FIG. 2, and the basic configuration is the same as that of FIG. Note that members having the same functions are given the same reference numerals and description thereof will be omitted. In this embodiment,
The first member 40A contacting the inner peripheral surface of the ring-shaped bonded magnet 20 and the second member 40B contacting the inner peripheral surface at a position facing the inner peripheral surface contacting the first member 40A are axially moved. Are attached so that they are the same. And the first
The ring-shaped bonded magnet 20 is rotated by using at least one of the member 40A and the second member 40B as a supporting member. In the present embodiment, the first member 4
0A or at least one of the second members 40B functions as a load member. In the configuration of the present embodiment, the insulating spacers 42A and 42B are provided on both the first member 40A and the second member 40B. However, the insulating spacers are provided on at least one of the first member 40A and the second member 40B. It should just be. It is preferable that either the first member 40A or the second member 40B be made of an insulating material or subjected to an insulating treatment on the surface. Further, the second member 40B may be configured as a load member 50A shown in FIG. According to the configuration of the present embodiment, the first member 40
Since the contact state between the ring-shaped bonded magnet 20 and the ring-shaped bonded magnet 20 can be reliably ensured by A and the second member 40B, the ring-shaped bonded magnet 20 reliably rotates.

In the above embodiment, the supporting member 40 is provided with the insulating spacer 42. However, the insulating spacer 42 may not be provided, and even when the insulating spacer 42 is provided, the supporting member 40 may be substantially adjacent to the supporting member 40. A simple protrusion may be used as long as the contact between the matching ring-shaped bonded magnets 20 can be prevented.

FIG. 6 shows still another embodiment. FIG. 6 is a cross-sectional view of a main part corresponding to FIG. 2, and the basic configuration is the same as that of FIG. Note that members having the same functions are given the same reference numerals and description thereof will be omitted. In this embodiment,
This embodiment differs from the embodiment shown in FIG. 2 in that the support member 40 is arranged on the outer peripheral surface side of the ring-shaped bonded magnet 20. That is, the ring-shaped bonded magnet 20 is supported from the lower portion on the outer peripheral surface side by the two support members 40A and 40B.
Therefore, in the configuration of the present embodiment, the ring-shaped bonded magnet 20
This is particularly effective when the inner peripheral diameter of is small. Note that, as the load member of this embodiment, a load member 50A shown in FIG. 3 or a load member 50B shown in FIG. 4 may be used. In this embodiment, two support members 40A, 40A are used as support members.
B has been described, but three or more may be provided, and when a plurality of support members are provided in this manner, the rotation operation with respect to the ring-shaped bonded magnet 20 is performed by at least one of the support members. Should be given. In this case, it is preferable that the other support member is provided rotatably.
Also, the plating current may be configured to flow using any one of the support members. According to the configuration of the present embodiment, since the support member 40 and the load member 50 are arranged on the outer peripheral surface side of the ring-shaped bonded magnet 20, the ring-shaped bonded magnet 20 itself is small or the inner diameter is smaller. Even if it is small, the ring-shaped bonded magnet 20 can be reliably and stably pressed against the support member 40.

FIG. 7 shows still another embodiment. FIG. 7 is a cross-sectional view of a main part corresponding to FIG. 2 and its basic configuration is the same as that of FIG. Note that members having the same functions are given the same reference numerals and description thereof will be omitted. In this embodiment,
In the embodiment shown in FIG. 6, a load member 50 is arranged at a lower portion on the inner peripheral surface side of the ring-shaped bonded magnet 20. That is, the ring-shaped bonded magnet 20 is supported from the lower part on the outer peripheral surface side by the two support members 40A and 40B, and the ring-shaped bonded magnet 20 is Is pressed. Note that the load member 50A shown in FIG. 3 may be used as the load member 50 of the present embodiment. In this embodiment, two support members 40A and 40B are used as support members.
Although the case where was used was shown, three or more may be provided, and when a plurality of support members are provided as described above, at least one of the support members rotates with respect to the ring-shaped bonded magnet 20. Just give it. In this case, it is preferable that the other support member is provided rotatably.
Also, the plating current may be configured to flow using any one of the support members. According to the configuration of the present embodiment, the load member 50 is disposed at the lower portion on the inner peripheral surface side of the ring-shaped bonded magnet 20, that is, at the lowest portion of the ring-shaped bonded magnet 20, so that the load of the load member 50 is reduced. , Can be reliably and stably added to the ring-shaped bonded magnet 20.

FIG. 8 shows still another embodiment. FIG. 8 shows FIG.
2 is a cross-sectional view of a main part corresponding to. The basic configuration is the same as that of FIG. Note that members having the same functions are given the same reference numerals and description thereof will be omitted. In this embodiment,
The ring-shaped bonded magnet 20 is disposed between the insulating spacers 42 of the support member 40. The support member 40 is configured such that a permanent magnet bar 44 is embedded in a pipe-shaped metal support shaft 43. In addition, the support shaft 43 has not only the above configuration but also a configuration in which only a magnet bar is used, or a configuration in which a magnet bar is embedded in a resin pipe and a metal foil is stretched on the surface of the pipe. Any configuration may be used as long as the magnet can conduct electricity to the surface. According to the configuration of the present embodiment, the ring-shaped bonded magnet 20 is
Can be reliably and stably pressed. Therefore, in this embodiment, the permanent magnet rod 44 embedded in the support member 40 is used.
Thus, a load member is configured.

FIG. 9 shows still another embodiment. FIG. 9 shows FIG.
2 is a cross-sectional view of a main part corresponding to. The basic configuration is the same as that of FIG. Note that members having the same functions are given the same reference numerals and description thereof will be omitted. In this embodiment,
The ring-shaped bonded magnet 20 is supported from below the outer peripheral surface by the two support members 40A and 40B. The supporting members 40A and 40B are pipe-shaped metal supporting shafts 43A and 43.
B has a configuration in which rods 44A and 44B of permanent magnets are embedded. Note that the support shafts 43A and 43B have not only the above-described configuration but also a configuration including only a magnet bar, a configuration in which a magnet bar is embedded in a resin pipe, and a metal foil is stretched on the pipe surface. Any structure may be used as long as it is entirely a magnet and can conduct electricity to the surface. According to the configuration of the present embodiment, the ring-shaped bonded magnet 20 can be reliably and stably pressed against the support members 40A and 40B by the magnetic force. Therefore, in this embodiment, the support members 40A, 40B
A load member is constituted by the permanent magnet rods 44A and 44B embedded in the fin.

The surface treatment apparatus of the present invention is not limited to the electroplating treatment, but can be used for an apparatus for performing electroless plating treatment, chemical conversion treatment, etching treatment and the like. The surface-treated member to be subjected to the surface treatment effectively by the surface treatment apparatus of the present invention is an R—Fe—B ring magnet or an R—Fe—B column bond magnet.

[0037]

According to the present invention, according to the load member,
Since the surface-treated member is pressed against the support member, the surface-treated member surely rotates. Therefore, the contact position of the surface-treated member with the support member is surely moved, and uniform surface treatment without leaving traces of contact with the support member can be performed.

[Brief description of the drawings]

FIG. 1 is a conceptual configuration diagram of a bond magnet electroplating apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a sectional view of a main part according to another embodiment of the present invention.

FIG. 4 is a sectional view of a main part according to another embodiment of the present invention.

FIG. 5 is a sectional view of a main part according to another embodiment of the present invention.

FIG. 6 is a sectional view of a main part according to another embodiment of the present invention.

FIG. 7 is a sectional view of a main part according to another embodiment of the present invention.

FIG. 8 is a sectional view of a main part according to another embodiment of the present invention.

FIG. 9 is a sectional view of a main part according to another embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 20 ring-shaped bonded magnet 40 support member 42 insulating spacer 50 load member

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Fumiaki Kikui 2-15-17 Egawa, Shimamoto-cho, Mishima-gun, Osaka Prefecture F-term in Sumitomo Special Metals Co., Ltd. Yamazaki Works 4K024 BA01 BB14 BC06 CB02 CB04 CB21 CB26

Claims (18)

[Claims] 1. A surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape, the surface-treating device supporting the surface-treated member and giving a rotating operation to the surface-treated member. A surface treatment apparatus comprising: a support member; and a load member that presses the surface-treated member against the support member. 2. The surface treatment apparatus according to claim 1, wherein a plurality of the load members are provided, and each of the load members presses the surface-treated member from an outer peripheral surface side. 3. The surface treatment apparatus according to claim 1, wherein a plurality of the support members are provided, and each of the support members supports the surface-treated member from an outer peripheral surface side. 4. The surface treatment apparatus according to claim 1, wherein the load member and the support member are arranged on an outer peripheral surface side of the surface-treated member. 5. The surface treatment apparatus according to claim 1, wherein the load member is disposed above the support member, and the surface treatment member is pressed by the weight of the load member. 6. The surface treatment apparatus according to claim 1, wherein the load member is rotatably provided. 7. The surface treatment apparatus according to claim 1, wherein the load member is constituted by a permanent magnet disposed on all or a part of the support member. 8. A surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape, wherein the first member is in contact with an inner peripheral surface of the surface-treated member; A second member that is in contact with the outer peripheral surface of the surface-treated member is provided in parallel so that the axial direction is the same, and the surface-treated member is rotationally driven by the first member or the second member. Characteristic surface treatment equipment. 9. A surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape, the first member being in contact with an inner peripheral surface of the surface-treated member; An inner peripheral surface at a position facing the inner peripheral surface with which the first member abuts and a second member that abuts with the inner peripheral surface are juxtaposed so that the axial direction is the same, and the first member or the second member is used. A surface treatment apparatus, wherein the surface treatment member is driven to rotate. 10. A surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape, wherein a plurality of members abutting on an inner peripheral surface or an outer peripheral surface of the surface treated member are provided. A surface treatment apparatus, wherein a plurality of the members are provided so as to have the same axial direction, and the surface-treated member is rotationally driven by at least one of the plurality of members. 11. The support member comprises a conductive member,
The surface treatment apparatus according to claim 1, wherein a plating current is caused to flow through the surface-treated member by the support member. 12. The surface treatment apparatus according to claim 11, wherein an insulating spacer is provided on the support member, and the surface-treated member is disposed between the insulating spacers. 13. The surface treatment apparatus according to claim 12, wherein the insulating spacers are arranged such that the members to be surface-treated are arranged at equal intervals. 14. A surface treatment apparatus using a plurality of the surface treatment apparatuses according to claim 1 in a treatment tank, wherein each support member is arranged in parallel. A surface treatment apparatus characterized in that: 15. An electroplating apparatus for bonded magnets, wherein electroplating is performed on a bonded magnet using the surface treatment apparatus according to any one of claims 1 to 14. 16. A surface treatment method for a member to be surface-treated, wherein the surface treatment is performed using the surface treatment apparatus according to claim 1. Description: 17. An R-Fe-B, which has been subjected to an electroplating process using the apparatus for electroplating a bonded magnet according to claim 15 to form a corrosion-resistant film on a surface thereof.
System permanent magnet. 18. A member to be surface-treated, wherein a film is formed on the surface by the method for surface-treating a member to be surface-treated according to claim 16.