JP2005002407A

JP2005002407A - Plating fixture conducting inspection device and plating fixture conducting inspection method

Info

Publication number: JP2005002407A
Application number: JP2003166819A
Authority: JP
Inventors: Masatoshi Katayama; 昌利片山; Makoto Okumura; 誠奥村
Original assignee: Shinko Electric Industries Co Ltd
Current assignee: Shinko Electric Industries Co Ltd
Priority date: 2003-06-11
Filing date: 2003-06-11
Publication date: 2005-01-06

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating fixture conduction inspection device and a plating fixture conducting inspection method where the specification of the places in trouble at the inside of plating fixture can easily be performed. <P>SOLUTION: In the inspection of a conducting state between a power feed block 220 and a conducting board 240 in a plating fixture, separation parts 150-1 and 150-2 separate the conducting board 240 and each conducting body 250. A conducting inspection part 130 measures electric resistance between the power feed block of a plating fixture in contact with a probe 114-1 for a power feed block and the power feed block of a plating fixture in contact with a probe 114-2 for a power feed block. In the case the measured electric resistance is less than a prescribed value, it is judged that the conduction between the power feed block 220 of the plating fixture and the conducting board 240 is satisfactory, and in the case the electric resistance is the prescribed value or higher, it is judged that the conduction is defective. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体ウェハ等の被処理体のめっき処理に用いられるめっき治具の通電を確認するめっき治具通電検査装置及びめっき治具通電検査方法に関する。
【０００２】
【従来の技術】
半導体ウェハ等の被処理体にめっき処理が施される場合、専用のめっき治具が用いられることが多い。このめっき治具を用いためっき処理においては、被処理体に形成された導電層（以下、適宜「被処理体導電層」と称する）とめっき治具の電極とを接続し、被処理体をめっき液中に投入して通電させる。これにより、被処理体導電層の上面にめっき層が形成される。
【０００３】
めっき処理においては、被処理体に対する給電不良が生じると、めっき層が形成されなかったり、形成されたとしてもその厚さが不均一になるといっためっき不良が生じる。このようなめっき不良を防止するため、従来、めっき処理に先立って、被処理体導電層とめっき治具とが接続され、当該被処理体導電層が通電されているか否かを確認する方法が採用されている（例えば特許文献１及び２参照）。
【０００４】
【特許文献１】
特開平１１−１８１６００号公報（第２−３頁、図１）
【０００５】
【特許文献２】
特開２００１−３１６８９１号公報（第６頁、図８）
【０００６】
【発明が解決しようとする課題】
しかしながら、上述した従来の被処理体導電層の通電確認方法では、被処理体導電層が通電されているか否かを確認することはできるものの、めっき治具内部に断線等の障害が発生したことにより被処理体導電層が通電されなかった場合、その障害箇所を特定することが困難であった。
【０００７】
本発明は、上記の問題を解決するものであり、めっき治具内部の障害箇所の特定が容易なめっき治具通電検査装置及びめっき治具通電検査方法を提供することを課題とする。
【０００８】
【課題を解決するための手段】
上記課題を解決するために、本発明は請求項１に記載されるように、給電部と、前記給電部に接続される通電板と、めっき処理の対象となる被処理体に形成される導電層と接続され、前記通電板と接離自在な複数の通電体とを有するめっき治具の通電を確認するめっき治具通電検査装置において、前記給電部と前記通電板との間の通電を検査する第１の通電検査手段と、前記給電部と前記通電体との間の通電を検査する第２の通電検査手段と、前記通電体間の通電を検査する第３の通電検査手段とを備える。
【０００９】
また、本発明は請求項２に記載されるように、請求項１に記載のめっき治具通電検査装置において、前記第１の通電検査手段は、前記給電部と前記通電板との間の電気抵抗を測定し、前記第２の通電検査手段は、前記給電部と前記通電体との間の電気抵抗を測定し、前記第３の通電検査手段は、前記通電体間の電気抵抗を測定する。
【００１０】
また、本発明は請求項３に記載されるように、請求項１又は２に記載のめっき治具通電検査装置において、前記第１の通電検査手段は、前記通電板と前記複数の通電体とを離隔させた状態で、前記給電部と前記通電板との間の通電を検査し、前記第２の通電検査手段は、前記通電板と前記複数の通電体とを接続させた状態で、前記給電部と前記通電体との間の通電を検査し、前記第３の通電検査手段は、前記通電板と前記複数の通電体とを離隔させた状態で、前記通電体間の通電を検査する。
【００１１】
また、本発明は請求項４に記載されるように、請求項３に記載のめっき治具通電検査装置において、前記通電板と前記複数の通電体とを離隔させる離隔手段を備える。
【００１２】
また、本発明は請求項５に記載されるように、請求項１乃至４の何れかに記載のめっき治具通電検査装置において、前記第３の通電検査手段は、前記給電部と前記通電体のそれぞれとの間の通電を検査する。
【００１３】
また、本発明は請求項６に記載されるように、請求項１乃至５の何れかに記載のめっき治具通電検査装置において、前記第３の通電検査手段は、前記導電層の上面において対向する位置に配置された２つの通電体間の通電を検査する。
【００１４】
また、本発明は請求項７に記載されるように、請求項１乃至６の何れかに記載のめっき治具通電検査装置において、前記給電部に対応し、該給電部に接触する測定子と、前記複数の通電体のそれぞれに対応し、該通電体のそれぞれに接触する複数の測定子とを備える。
【００１５】
また、本発明は請求項８に記載されるように、給電部と、前記給電部に接続される通電板と、めっき処理の対象となる被処理体に形成される導電層と接続され、前記通電板と接離自在な複数の通電体とを有するめっき治具の通電を確認するめっき治具通電検査方法において、前記給電部と前記通電板との間の通電を検査し、前記給電部と前記通電体との間の通電を検査し、前記通電体間の通電を検査する。
【００１６】
本発明によれば、めっき治具が、給電部と、この給電部に接続される通電板と、めっき処理の対象となる被処理体に形成される導電層と接続され、通電板と接離自在な複数の通電体とにより構成されている場合、給電部と通電板との間の通電、給電部と通電体との間の通電、及び、通電体間の通電が検査される。即ち、めっき治具内部において、複数の箇所の通電が検査されるため、めっき治具内部に断線等の障害が発生した場合に、その障害箇所の特定を容易に行うことが可能となる。
【００１７】
【発明の実施の形態】
以下、図面を参照しながら本発明の実施の形態を説明する。
【００１８】
図１は、本実施形態において、通電検査の対象となるめっき治具の斜視図である。同図に示すめっき治具は、搭載部２１０、給電部としての給電ブロック２２０−１、２２０−２、配線２３０−１、２３０−２、通電板２４０、導通板２５１−１〜２５１−８（以下、これら導通板２５１−１〜２５１−８をまとめて、適宜「導通板２５１」と称する）、及び、配線２５２−１〜２５２−８（以下、これら配線２５２−１〜２５２−８をまとめて、適宜「配線２５２」と称する）により構成される。これらのうち、導通板２５１−１と配線２５２−１により通電体２５０−１が構成される。同様に、導通板２５１−２と配線２５２−２、導通板２５１−３と配線２５２−３、導通板２５１−４と配線２５２−４、導通板２５１−５と配線２５２−５、導通板２５１−６と配線２５２−６、導通板２５１−７と配線２５２−７、導通板２５１−８と配線２５２−８により、それぞれ通電体２５０−２、通電体２５０−３、通電体２５０−４、通電体２５０−５、通電体２５０−６、通電体２５０−７、通電体２５０−８が構成される（以下、通電体２５０−１〜２５０−８をまとめて、適宜「通電体２５０」と称する）。
【００１９】
搭載板２１０は、めっき処理の対象となる、上面に導電層（図示せず）が形成された半導体ウェハ３００を搭載する。給電ブロック２２０−１、２３０−２は、めっき処理の際に、電源（図示せず）からの電力を配線２３０−１、２３０−２を介して通電板２４０へ供給する。
【００２０】
通電板２４０は、長手方向の所定の回転軸を中心に回転することができ、各通電体２５０を構成する導通板２５１と接触したり、離れたりすることができる。めっき処理の際には、通電板２４０は、各通電体２５０と接触し、給電ブロック２２０−１、２２０−２からの電力をこれら各通電体２５０へ供給する。
【００２１】
通電体２５０は、上述の通り、導通板２５１と配線２５２により構成される。導通板２５１は、その一端が通電板２４０と接触したり、離れたりする。一方、配線２５２は、一端が導通板２５１と接続され、他端が半導体ウェハ３００の上面に形成された導電層に接続される。めっき処理の際には、通電体２５０は、導通板２５１が通電板２４０と接触し、当該通電板２４０からの電力を半導体ウェハ３００の導電層へ供給する。
【００２２】
なお、各配線２５２の他端は、半導体ウェハ３００の上面に形成された導電層上の外縁部分に対向するように配置される。図１においては、配線２５２−１の他端と配線２５２−５の他端とが対向するように配置され、配線２５２−２の他端と配線２５２−６の他端とが半導体ウェハ３００を挟んで対向するように配置される。同様に、配線２５２−３の他端と配線２５２−７の他端とが半導体ウェハ３００を挟んで対向するように配置され、配線２５２−４の他端と配線２５２−８の他端とが半導体ウェハ３００を挟んで対向するように配置される。このような配線２５２の配置により、半導体ウェハ３００の導電層上に形成されるめっき層にムラが生じることが抑制される。
【００２３】
図２は、本実施形態におけるめっき治具通電検査装置の構成例を示す図である。同図に示すめっき治具通電検査装置１００は、給電ブロック受け部１１２−１、１１２−２、測定子としての給電ブロック用プローブ１１４−１、１１４−２、プローブ支持部１２２、測定子としての通電体用プローブ１２４−１〜１２４−８（以下、これら通電体用プローブ１２４−１〜１２４−８をまとめて、適宜「通電体用プローブ１２４」と称する）、通電検査部１３０、駆動部１４０、離隔部１５０−１、１５０−２により構成される。
【００２４】
給電ブロック受け部１１２−１は、図１に示しためっき治具の給電ブロック２２０−１を支持する。同様に、給電ブロック受け部１１２−２は、めっき治具の給電ブロック２２０−２を支持する。給電ブロック用プローブ１１４−１は、給電ブロック受け部１１２−１によって給電ブロック２２０−１が支持された際に、当該給電ブロック２２０−１と接触する。同様に、給電ブロック用プローブ１１４−２は、給電ブロック受け部１１２−２によって給電ブロック２２０−２が支持された際に、当該給電ブロック２２０−２と接触する。
【００２５】
プローブ支持部１２２は、各通電体用プローブ１２４を支持する。各通電体用プローブ１２４は、図１に示しためっき治具の各導通板２５１と接触する。具体的には、通電体用プローブ１２４−１は導通板２５１−１と接触し、通電体用プローブ１２４−２は導通板２５１−２と接触し、通電体用プローブ１２４−３は導通板２５１−３と接触し、通電体用プローブ１２４−４は導通板２５１−４と接触する。同様に、通電体用プローブ１２４−５は導通板２５１−５と接触し、通電体用プローブ１２４−６は導通板２５１−６と接触し、通電体用プローブ１２４−７は導通板２５１−７と接触し、通電体用プローブ１２４−８は導通板２５１−８と接触する。なお、各通電体用プローブ１２４間は、絶縁されている。
【００２６】
通電検査部１３０は、めっき治具の給電ブロック２２０と通電板２４０との間、給電ブロック２２０と各通電体２５０との間、及び、各通電体２５０の間の検査箇所とし、これら検査箇所を検査箇所切替機能１３２により切り替えながら、当該検査箇所における電気抵抗を測定することにより、通電状態を検査する。
【００２７】
具体的には、めっき治具の給電ブロック２２０と通電板２４０との間の通電状態の検査においては、通電検査部１３０は、めっき治具の通電板２４０と各通電体２５０とを離隔させるように駆動部１４０を制御する。駆動部１４０は、この通電検査部１３０の制御により、離隔部１５０−１、１５０−２を駆動させる。この際、離隔部１５０−１、１５０−２は、図３に示すように、伸張し、通電板２４０を各通電体２５０から離れる方向に押圧する。これにより、通電板２４０は、所定の回転軸を中心として回転し、各通電体２５０から離隔する。
【００２８】
通電検査部１３０は、このように、めっき治具の通電板２４０と各通電体２５０とを離隔させると、給電ブロック用プローブ１１４−１が接触しているめっき治具の給電ブロック２２０−１と、給電ブロック用プローブ１１４−２が接触しているめっき治具の給電ブロック２２０−２との間の電気抵抗を測定する。そして、通電検査部１３０は、測定した電気抵抗が第１の所定値未満である場合には、めっき治具の給電ブロック２２０と通電板２４０との間の通電が良好であると判断し、第１の所定値以上である場合には、通電が不良であると判断する。
【００２９】
また、めっき治具の給電ブロック２２０と各通電体２５０との間の通電状態の検査においては、通電検査部１３０は、めっき治具の通電板２４０と各通電体２５０とを接触させるように駆動部１４０を制御する。駆動部１４０は、この通電検査部１３０の制御により、離隔部１５０−１、１５０−２を駆動させる。この際、離隔部１５０−１、１５０−２は、図４に示すように、縮退する。これにより、通電板２４０は、所定の回転軸を中心として回転して元の位置に戻り、各通電体２５０に接触する。
【００３０】
通電検査部１３０は、このように、めっき治具の通電板２４０と各通電体２５０とを接触させると、給電ブロック用プローブ１１４−１が接触しているめっき治具の給電ブロック２２０−１、あるいは、給電ブロック用プローブ１１４−２が接触している給電ブロック２２０−２と、通電体用プローブ１２４−１が接触している通電体２５０−１との間の電気抵抗を測定する。そして、通電検査部１３０は、測定した電気抵抗が第２の所定値未満である場合には、めっき治具の給電ブロック２２０と通電体２５０−１との間の通電が良好であると判断し、第２の所定値以上である場合には、通電が不良であると判断する。同様に、通電検査部１３０は、給電ブロック用プローブ１１４−１が接触しているめっき治具の給電ブロック２２０−１、あるいは、給電ブロック用プローブ１１４−２が接触している給電ブロック２２０−２と、通電体用プローブ１２４−２〜１２４−８が接触している通電体２５０−２〜２５０−８のそれぞれとの間の電気抵抗を測定し、通電の良好及び不良を判断する。
【００３１】
更に、めっき治具の通電体２５０の間の通電状態の検査においては、通電検査部１３０は、めっき治具の給電ブロック２２０と通電板２４０との間の通電状態の検査の際と同様、めっき治具の通電板２４０と各通電体２５０とを離隔させるように駆動部１４０を制御する。駆動部１４０は、この通電検査部１３０の制御により、離隔部１５０−１、１５０−２を駆動させる。この際、離隔部１５０−１、１５０−２は、図３に示すように、伸張し、通電板２４０を各通電体２５０から離れる方向に押圧する。これにより、通電板２４０は、所定の回転軸を中心として回転し、各通電体２５０から離隔する。
【００３２】
通電検査部１３０は、このように、めっき治具の通電板２４０と各通電体２５０とを離隔させると、半導体ウェハ３００の導電層上の外縁部分において対向する位置に配置されている２つの配線２５２−１、２５２−５に接続された導通板２５１−１と導通板２５１−５との間、換言すれば、通電体用プローブ１２４−１が接触している導通板２５１−１と、通電体用プローブ１２４−５が接触している導通板２５１−５との間の電気抵抗を測定する。そして、通電検査部１３０は、測定した電気抵抗が第３の所定値未満である場合には、導通板２５１−１と導通板２５１−５との間の通電が良好であると判断し、第３の所定値以上である場合には、通電が不良であると判断する。同様に、通電検査部１３０は、半導体ウェハ３００の導電層上の外縁部分において対向する位置に配置されている２つの配線２５２−２、２５２−６に接続された導通板２５１−２と導通板２５１−６との間（通電体用プローブ１２４−２が接触している導通板２５１−２と、通電体用プローブ１２４−６が接触している導通板２５１−６との間）、２つの配線２５２−３、２５２−７に接続された導通板２５１−３と導通板２５１−７との間（通電体用プローブ１２４−３が接触している導通板２５１−３と、通電体用プローブ１２４−７が接触している導通板２５１−７との間）、２つの配線２５２−４、２５２−８に接続された導通板２５１−４と導通板２５１−８との間（通電体用プローブ１２４−４が接触している導通板２５１−４と、通電体用プローブ１２４−８が接触している導通板２５１−８との間）のそれぞれについて、電気抵抗を測定し、通電の良好及び不良を判断する。
【００３３】
次に、フローチャートを参照しつつ、本実施形態のめっき治具通電検査装置の動作を説明する。図５は、めっき治具通電検査装置１００の動作を示すフローチャートである。
【００３４】
給電ブロック受け部１１２−１によってめっき治具の給電ブロック２２０−１が支持され、当該給電ブロック２２０−１と給電ブロック用プローブ１１４−１とが接触し、給電ブロック受け部１１２−２によってめっき治具の給電ブロック２２０−２が支持され、当該給電ブロック２２０−２と給電ブロック用プローブ１１４−２とが接触するとともに、各通電体用プローブ１２４とめっき治具の各導通板２５１とが接触した状態で、めっき治具通電検査装置１００は、めっき治具の通電板２４０と各通電体２５０とを離隔させる（ステップ１０１）。次に、めっき治具通電検査装置１００は、めっき治具の給電ブロック２２０間の電気抵抗を測定し（ステップ１０２）、その電気抵抗値が第１の所定値以上であるか否かを判定する（ステップ１０３）。めっき治具通電検査装置１００は、電気抵抗値が第１の所定値以上である場合には、めっき治具の給電ブロック２２０と通電板２４０との間の通電が不良であると判断し（ステップ１０４）、第１の所定値未満である場合には、通電が良好であると判断する（ステップ１０５）。
【００３５】
次に、めっき治具通電検査装置１００は、めっき治具の通電板２４０と各通電体２５０とを接触させる（ステップ１０６）。更に、めっき治具通電検査装置１００は、めっき治具の給電ブロック２２０と各通電体２５０との間の電気抵抗を測定し（ステップ１０７）、その電気抵抗値が第２の所定値以上であるか否かを判定する（ステップ１０８）。めっき治具通電検査装置１００は、電気抵抗値が第２の所定値以上である場合には、めっき治具の給電ブロック２２０と各通電体２５０との間の通電が不良であると判断し（ステップ１０９）、第２の所定値未満である場合には、通電が良好であると判断する（ステップ１１０）。
【００３６】
次に、めっき治具通電検査装置１００は、めっき治具の通電板２４０と各通電体２５０とを離隔させる（ステップ１１１）。更に、めっき治具通電検査装置１００は、半導体ウェハ３００の導電層上の外縁部分において対向する位置に配置された２つの配線２５２に対応する通電体２５０の間の電気抵抗を測定し（ステップ１１２）、その電気抵抗値が第３の所定値以上であるか否かを判定する（ステップ１１３）。めっき治具通電検査装置１００は、電気抵抗値が第３の所定値以上である場合には、通電体２５０の間の通電が不良であると判断し（ステップ１１４）、第３の所定値未満である場合には、通電が良好であると判断する（ステップ１１５）。
【００３７】
このように、本実施形態のめっき治具通電検査装置１００では、めっき治具の給電ブロック２２０と通電板２４０との間、給電ブロック２２０と通電体２５０との間の通電、及び、通電体２５０間の通電が検査される。即ち、めっき治具内部において、複数の箇所の通電が検査されるため、めっき治具内部に断線等の障害が発生した場合に、その障害箇所の特定を容易に行うことが可能となる。
【００３８】
また、本実施形態のめっき治具通電検査装置１００では、予め、給電ブロック２２０−１、２２０−２に対応して、これらに接触する給電ブロック用プローブ１１４−１、１１４−２が備えられ、通電体２５０−１〜２５０−８に対応して、これらに接触する通電体用プローブ１２４−１〜１２４−８が備えられているため、検査箇所を切り替える際にプローブを移動させる必要がなく、検査時間の短縮を図ることも可能となる。
【００３９】
なお、上述した実施形態では、通電検査部１３０が測定した電気抵抗から検査箇所における通電の良好及び不良を判断したが、電気抵抗値をモニタ表示等により検査者へ通知し、当該検査者が通電の良好及び不良を判断するようにしても良い。
【００４０】
また、上述した実施形態では、めっき治具の給電ブロック２２０と通電板２４０との間、給電ブロック２２０と各通電体２５０との間、及び、各通電体２５０の間の順序で通電状態が検査されたが、検査の順序はこれに限定されるものではなく、どのような順序で検査されても良い。
【００４１】
【発明の効果】
本発明によれば、めっき治具内部の障害箇所の特定が容易となる。
【図面の簡単な説明】
【図１】めっき治具の斜視図である。
【図２】めっき治具通電検査装置の構成例を示す図である。
【図３】めっき治具通電検査装置とめっき治具の接触部分の第１の拡大図である。
【図４】めっき治具通電検査装置とめっき治具の接触部分の第２の拡大図である。
【図５】めっき治具通電検査装置の動作を示すフローチャートである。
【符号の説明】
１００めっき治具通電検査装置
１１２−１、１１２−２給電ブロック支持部
１１４−１、１１４−２給電ブロック用プローブ
１２２プローブ支持部
１２４−１〜１２４−８通電体用プローブ
１３０通電検査部
１３２検査箇所切替機能
１４０駆動部
１５０−１、１５０−２離隔部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plating jig energization inspection apparatus and a plating jig energization inspection method for confirming energization of a plating jig used for plating a target object such as a semiconductor wafer.
[0002]
[Prior art]
When plating is performed on an object to be processed such as a semiconductor wafer, a dedicated plating jig is often used. In the plating process using the plating jig, a conductive layer formed on the object to be processed (hereinafter, referred to as “processed object conductive layer” as appropriate) and an electrode of the plating jig are connected to each other. Put it in the plating solution to energize it. Thereby, a plating layer is formed on the upper surface of the workpiece conductive layer.
[0003]
In the plating process, when a power feeding failure to the object to be processed occurs, a plating failure occurs such that the plating layer is not formed or even if formed, the thickness becomes non-uniform. In order to prevent such plating defects, there is a conventional method for confirming whether the object conductive layer and the plating jig are connected and the object conductive layer is energized prior to the plating process. Has been adopted (for example, see Patent Documents 1 and 2).
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-181600 (page 2-3, FIG. 1)
[0005]
[Patent Document 2]
JP 2001-316891 A (Page 6, FIG. 8)
[0006]
[Problems to be solved by the invention]
However, in the above-described conventional method for confirming whether or not the object conductive layer is energized, it is possible to confirm whether or not the object conductive layer is energized, but a failure such as disconnection has occurred inside the plating jig. When the object conductive layer was not energized, it was difficult to identify the fault location.
[0007]
This invention solves said problem and makes it a subject to provide the plating jig | tool conduction | electrical_connection inspection apparatus and plating jig | tool conduction | electrical_connection inspection method with which identification of the fault location inside a plating jig | tool is easy.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present invention as described in claim 1, a power feeding part, a current-carrying plate connected to the power feeding part, and a conductive material formed on a target object to be plated. In a plating jig energization inspection device for confirming energization of a plating jig having a plurality of energizers that are connected to a layer and are capable of contacting and separating from the energization plate, the energization between the power feeding unit and the energization plate is inspected First energization inspection means, second energization inspection means for inspecting energization between the power feeding unit and the energization body, and third energization inspection means for inspecting energization between the energization bodies. .
[0009]
Further, according to a second aspect of the present invention, in the plating jig energization inspection device according to the first aspect, the first energization inspection unit includes an electric circuit between the power feeding unit and the energization plate. Measure the resistance, the second energization inspection means measures the electrical resistance between the power feeding unit and the energization body, and the third energization inspection means measures the electrical resistance between the energization bodies. .
[0010]
Moreover, as described in claim 3, the present invention provides the plating jig energization inspection apparatus according to claim 1 or 2, wherein the first energization inspection means includes the energization plate, the plurality of energization bodies, and the like. In a state where the power supply unit and the power supply plate are separated from each other, and the second power supply inspection unit is configured to connect the power supply plate and the plurality of power supply members, Inspecting the energization between the power feeding unit and the energization body, the third energization inspection means inspects the energization between the energization bodies in a state where the energization plate and the plurality of energization bodies are separated from each other. .
[0011]
According to a fourth aspect of the present invention, in the plating jig energization inspection apparatus according to the third aspect of the present invention, the electroplating jig energization inspection apparatus further includes a separation unit that separates the energization plate and the plurality of energization bodies.
[0012]
Further, according to a fifth aspect of the present invention, in the plating jig energization inspection device according to any one of the first to fourth aspects, the third energization inspection means includes the power feeding unit and the energization body. Inspect the energization between each of the.
[0013]
Further, according to a sixth aspect of the present invention, in the plating jig electric current inspection apparatus according to any one of the first to fifth aspects, the third electric current inspection means is opposed to the upper surface of the conductive layer. The power supply between the two power supply bodies arranged at the position to be inspected is inspected.
[0014]
Further, according to a seventh aspect of the present invention, in the plating jig energization inspection device according to any one of the first to sixth aspects, a measuring element corresponding to the power supply unit and in contact with the power supply unit is provided. And a plurality of measuring elements corresponding to each of the plurality of current-carrying members and contacting each of the current-carrying members.
[0015]
Moreover, as described in claim 8, the present invention is connected to a power feeding unit, a current-carrying plate connected to the power feeding unit, and a conductive layer formed on a target object to be plated, In a plating jig energization inspection method for confirming energization of a plating jig having a plurality of energizers that can be connected to and separated from the energization plate, the energization between the power supply unit and the energization plate is inspected, and the power supply unit The power supply between the current conductors is inspected, and the current supply between the current conductors is inspected.
[0016]
According to the present invention, the plating jig is connected to the power feeding unit, the current supply plate connected to the power supply unit, and the conductive layer formed on the object to be plated, and is connected to and separated from the current supply plate. In the case of being configured by a plurality of flexible current-carrying members, the current-carrying between the power supply unit and the current-carrying plate, the current-carrying between the power-feeding unit and the current-carrying member, and the current-carrying between the current-carrying members are inspected. That is, since energization at a plurality of locations is inspected inside the plating jig, when a failure such as a disconnection occurs inside the plating jig, it is possible to easily identify the failure location.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0018]
FIG. 1 is a perspective view of a plating jig to be subjected to an electric current inspection in the present embodiment. The plating jig shown in the figure includes a mounting portion 210, power supply blocks 220-1 and 220-2 as power supply portions, wirings 230-1 and 230-2, a current plate 240, and conductive plates 251-1 to 251-8 ( Hereinafter, the conductive plates 251-1 to 251-8 are collectively referred to as “conductive plates 251” and wirings 252-1 to 252-8 (hereinafter, these wirings 252-1 to 252-8 are combined). And appropriately referred to as “wiring 252”. Among these, the conductive plate 251-1 and the wiring 252-1 constitute an energizing body 250-1. Similarly, the conduction plate 251-2 and the wiring 252-2, the conduction plate 251-3 and the wiring 252-3, the conduction plate 251-4 and the wiring 252-4, the conduction plate 251-5 and the wiring 252-5, and the conduction plate 251. -6 and wiring 252-6, conductive plate 251-7 and wiring 252-7, conductive plate 251-8 and wiring 252-8, respectively, A current-carrying body 250-5, a current-carrying body 250-6, a current-carrying body 250-7, and a current-carrying body 250-8 are configured (hereinafter, the current-carrying bodies 250-1 to 250-8 are collectively referred to as “current-carrying body 250”. Called).
[0019]
The mounting plate 210 mounts a semiconductor wafer 300 having a conductive layer (not shown) formed on the upper surface, which is an object of plating processing. The power supply blocks 220-1 and 230-2 supply power from a power source (not shown) to the current supply plate 240 via the wirings 230-1 and 230-2 during the plating process.
[0020]
The energizing plate 240 can rotate around a predetermined rotation axis in the longitudinal direction, and can contact or leave the conducting plate 251 that constitutes each energizing body 250. In the plating process, the energization plate 240 comes into contact with each energizing body 250 and supplies the electric power from the power supply blocks 220-1 and 220-2 to each energizing body 250.
[0021]
As described above, the current-carrying body 250 includes the conduction plate 251 and the wiring 252. One end of the conductive plate 251 is in contact with or away from the energizing plate 240. On the other hand, the wiring 252 has one end connected to the conduction plate 251 and the other end connected to a conductive layer formed on the upper surface of the semiconductor wafer 300. In the plating process, the current-carrying member 250 contacts the current-carrying plate 240 with the conductive plate 251 and supplies power from the current-carrying plate 240 to the conductive layer of the semiconductor wafer 300.
[0022]
The other end of each wiring 252 is disposed so as to face the outer edge portion on the conductive layer formed on the upper surface of the semiconductor wafer 300. In FIG. 1, the other end of the wiring 252-1 and the other end of the wiring 252-5 are arranged to face each other, and the other end of the wiring 252-2 and the other end of the wiring 252-6 constitute the semiconductor wafer 300. It arrange | positions so that it may oppose on both sides. Similarly, the other end of the wiring 252-3 and the other end of the wiring 252-7 are arranged to face each other with the semiconductor wafer 300 interposed therebetween, and the other end of the wiring 252-4 and the other end of the wiring 252-8 are arranged. It arrange | positions so that the semiconductor wafer 300 may be pinched | interposed. Such arrangement of the wirings 252 suppresses unevenness in the plating layer formed on the conductive layer of the semiconductor wafer 300.
[0023]
FIG. 2 is a diagram illustrating a configuration example of the plating jig energization inspection apparatus according to the present embodiment. The plating jig energization inspection apparatus 100 shown in the figure includes power supply block receiving portions 112-1 and 112-2, power supply block probes 114-1 and 114-2 as measuring elements, a probe support part 122, and a measuring element. Current-carrying probe 124-1 to 124-8 (hereinafter, these current-carrying probes 124-1 to 124-8 are collectively referred to as “current-carrying probe 124” as appropriate), a current-carrying inspection unit 130, and a drive unit 140. , The separation portions 150-1 and 150-2.
[0024]
The power feeding block receiving portion 112-1 supports the power feeding block 220-1 of the plating jig shown in FIG. Similarly, the power feeding block receiving portion 112-2 supports the power feeding block 220-2 of the plating jig. The power supply block probe 114-1 contacts the power supply block 220-1 when the power supply block 220-1 is supported by the power supply block receiving portion 112-1. Similarly, the power supply block probe 114-2 contacts the power supply block 220-2 when the power supply block 220-2 is supported by the power supply block receiving portion 112-2.
[0025]
The probe support portion 122 supports each current-carrying probe 124. Each current probe 124 is in contact with each conduction plate 251 of the plating jig shown in FIG. Specifically, the current-carrying probe 124-1 is in contact with the conduction plate 251-1, the current-carrying probe 124-2 is in contact with the conduction plate 251-2, and the current-carrying probe 124-3 is in contact with the conduction plate 251. -3 and the current-carrying probe 124-4 is in contact with the conductive plate 251-4. Similarly, the current-carrying probe 124-5 is in contact with the conduction plate 251-5, the current-carrying probe 124-6 is in contact with the conduction plate 251-6, and the current-carrying probe 124-7 is in contact with the conduction plate 251-7. And the current probe 124-8 is in contact with the conductive plate 251-8. It is to be noted that the current-carrying probe 124 is insulated.
[0026]
The energization inspection unit 130 is an inspection location between the feeding block 220 and the energization plate 240 of the plating jig, between the feeding block 220 and each energization body 250, and between each energization body 250, and these inspection locations are While switching by the inspection location switching function 132, the current state is inspected by measuring the electrical resistance at the inspection location.
[0027]
Specifically, in the inspection of the energization state between the power supply block 220 of the plating jig and the energization plate 240, the energization inspection unit 130 separates the energization plate 240 of the plating jig from the respective energization bodies 250. The drive unit 140 is controlled. The drive unit 140 drives the separation units 150-1 and 150-2 under the control of the energization inspection unit 130. At this time, as shown in FIG. 3, the separation portions 150-1 and 150-2 extend and press the current-carrying plates 240 in directions away from the current-carrying bodies 250. Thereby, the current supply plate 240 rotates around a predetermined rotation axis and is separated from each current supply body 250.
[0028]
In this way, when the current-carrying inspection unit 130 separates the current-carrying plate 240 of the plating jig from the current-carrying members 250, the power-supply block 220-1 of the plating jig in contact with the power-supply block probe 114-1 The electric resistance between the power supply block 220-2 of the plating jig in contact with the power supply block probe 114-2 is measured. Then, when the measured electrical resistance is less than the first predetermined value, the energization inspection unit 130 determines that the energization between the power supply block 220 of the plating jig and the power supply plate 240 is good, and the first If it is equal to or greater than a predetermined value of 1, it is determined that the energization is defective.
[0029]
Further, in the inspection of the energization state between the power supply block 220 of the plating jig and each of the current conductors 250, the current inspecting unit 130 is driven so that the current supply plate 240 of the plating jig and each of the current conductors 250 are in contact with each other. The unit 140 is controlled. The drive unit 140 drives the separation units 150-1 and 150-2 under the control of the energization inspection unit 130. At this time, the separation portions 150-1 and 150-2 are degenerated as shown in FIG. As a result, the energizing plate 240 rotates around a predetermined rotation axis, returns to the original position, and contacts each energizing body 250.
[0030]
In this way, when the energization inspection unit 130 makes the energization plate 240 of the plating jig and each energization body 250 contact with each other, the power supply block 220-1 of the plating jig with which the power supply block probe 114-1 is in contact, Alternatively, the electrical resistance between the power supply block 220-2 in contact with the power supply block probe 114-2 and the power supply body 250-1 in contact with the power supply probe 124-1 is measured. Then, when the measured electrical resistance is less than the second predetermined value, the energization inspection unit 130 determines that the energization between the power feeding block 220 of the plating jig and the current conducting body 250-1 is good. If it is equal to or greater than the second predetermined value, it is determined that the energization is defective. Similarly, the power supply inspection unit 130 includes a power supply block 220-1 of a plating jig in contact with the power supply block probe 114-1 or a power supply block 220-2 in contact with the power supply block probe 114-2. Then, the electrical resistance between each of the current-carrying members 250-2 to 250-8 that are in contact with the current-carrying probes 124-2 to 124-8 is measured to determine whether the current is good or bad.
[0031]
Further, in the inspection of the energization state between the energization bodies 250 of the plating jig, the energization inspection unit 130 performs the same plating as in the inspection of the energization state between the power supply block 220 of the plating jig and the energization plate 240. The drive unit 140 is controlled so that the current-carrying plate 240 of the jig and each current-carrying body 250 are separated from each other. The drive unit 140 drives the separation units 150-1 and 150-2 under the control of the energization inspection unit 130. At this time, as shown in FIG. 3, the separation portions 150-1 and 150-2 extend and press the current-carrying plates 240 in directions away from the current-carrying bodies 250. Thereby, the current supply plate 240 rotates around a predetermined rotation axis and is separated from each current supply body 250.
[0032]
In this way, when the current-carrying inspection unit 130 separates the current-carrying plate 240 of the plating jig from each current-carrying body 250, the two wirings arranged at positions facing each other at the outer edge portion on the conductive layer of the semiconductor wafer 300. Between the conductive plate 251-1 connected to 252-1 and 252-5 and the conductive plate 251-5, in other words, the conductive plate 251-1 in contact with the current-carrying probe 124-1, The electrical resistance between the conductive plate 251-5 and the body probe 124-5 is measured. And when the measured electrical resistance is less than the third predetermined value, the energization inspection unit 130 determines that the energization between the conduction plate 251-1 and the conduction plate 251-5 is good, and the first If it is equal to or greater than a predetermined value of 3, it is determined that the energization is defective. Similarly, the current inspecting unit 130 includes a conductive plate 251-2 and a conductive plate connected to two wirings 252-2 and 252-6 disposed at opposing positions on the outer edge portion on the conductive layer of the semiconductor wafer 300. 251-6 (between the conductive plate 251-2 in contact with the current-carrying probe 124-2 and the conductive plate 251-6 in contact with the current-carrying probe 124-6) Between the conductive plate 251-3 and the conductive plate 251-7 connected to the wirings 252-3 and 252-7 (the conductive plate 251-3 in contact with the conductive member probe 124-3 and the conductive member probe) Between the conductive plate 251-4 connected to the two wirings 252-4 and 252-8 and the conductive plate 251-8 (between the conductive plate 251-7 in contact with 124-7) Conductive plate 251- in contact with probe 124-4 When, for each of between) the conductive plate 251-8 energization-body probe 124-8 is in contact, the electrical resistance is measured to determine the good and bad of the energization.
[0033]
Next, the operation of the plating jig energization inspection apparatus of the present embodiment will be described with reference to a flowchart. FIG. 5 is a flowchart showing the operation of the plating jig energization inspection apparatus 100.
[0034]
The power supply block receiving portion 112-1 supports the power supply block 220-1 of the plating jig, the power supply block 220-1 and the power supply block probe 114-1 come into contact with each other, and the power supply block receiving portion 112-2 makes the plating treatment. The power supply block 220-2 of the tool is supported, the power supply block 220-2 and the power supply block probe 114-2 are in contact with each other, and each of the power supply probe 124 and each of the conduction plates 251 of the plating jig are in contact with each other. In this state, the plating jig energization inspection apparatus 100 separates the energizing plate 240 of the plating jig from each energizing body 250 (step 101). Next, the plating jig current inspection apparatus 100 measures the electrical resistance between the power supply blocks 220 of the plating jig (step 102), and determines whether or not the electrical resistance value is equal to or greater than a first predetermined value. (Step 103). When the electric resistance value is equal to or higher than the first predetermined value, the plating jig current inspection apparatus 100 determines that the current supply between the power supply block 220 and the current supply plate 240 of the plating jig is defective (step). 104) If it is less than the first predetermined value, it is determined that the energization is good (step 105).
[0035]
Next, the plating jig energization inspection apparatus 100 causes the energization plate 240 of the plating jig to contact each energization body 250 (step 106). Furthermore, the plating jig energization inspection apparatus 100 measures the electrical resistance between the power supply block 220 of the plating jig and each of the energization bodies 250 (step 107), and the electrical resistance value is equal to or greater than a second predetermined value. Whether or not (step 108). When the electrical resistance value is equal to or greater than the second predetermined value, the plating jig current inspection apparatus 100 determines that the current conduction between the power supply block 220 of the plating jig and each of the current conductors 250 is defective ( Step 109), if it is less than the second predetermined value, it is determined that the energization is good (Step 110).
[0036]
Next, the plating jig energization inspection apparatus 100 separates the energization plate 240 of the plating jig from each energization body 250 (step 111). Furthermore, the plating jig energization inspection apparatus 100 measures the electrical resistance between the energizers 250 corresponding to the two wirings 252 arranged at opposing positions in the outer edge portion on the conductive layer of the semiconductor wafer 300 (step 112). ), It is determined whether or not the electrical resistance value is greater than or equal to a third predetermined value (step 113). When the electrical resistance value is equal to or greater than the third predetermined value, the plating jig current inspection apparatus 100 determines that the current conduction between the current-carrying bodies 250 is defective (step 114) and is less than the third predetermined value. If it is, it is determined that the energization is good (step 115).
[0037]
As described above, in the plating jig energization inspection apparatus 100 of the present embodiment, the energization between the power supply block 220 and the energization plate 240 of the plating jig, between the power supply block 220 and the energization body 250, and the energization body 250. The energization between is inspected. That is, since energization at a plurality of locations is inspected inside the plating jig, when a failure such as a disconnection occurs inside the plating jig, it is possible to easily identify the failure location.
[0038]
In addition, in the plating jig energization inspection apparatus 100 of the present embodiment, power feeding block probes 114-1 and 114-2 that are in contact with the power feeding blocks 220-1 and 220-2 are provided in advance. Corresponding to the current-carrying bodies 250-1 to 250-8, the current-carrying body probes 124-1 to 124-8 that are in contact with the current-carrying bodies 250-1 to 250-8 are provided. It is also possible to shorten the inspection time.
[0039]
In the above-described embodiment, whether or not energization at the inspection location is determined from the electrical resistance measured by the energization inspection unit 130, the electrical resistance value is notified to the inspector by a monitor display or the like, and the inspector energizes the It may be determined whether the quality is good or bad.
[0040]
Further, in the above-described embodiment, the energization state is inspected in the order between the power supply block 220 and the power supply plate 240 of the plating jig, between the power supply block 220 and each power supply 250, and between each power supply 250. However, the order of inspection is not limited to this, and the inspection may be performed in any order.
[0041]
【The invention's effect】
According to the present invention, it becomes easy to identify a fault location inside a plating jig.
[Brief description of the drawings]
FIG. 1 is a perspective view of a plating jig.
FIG. 2 is a diagram illustrating a configuration example of a plating jig energization inspection apparatus.
FIG. 3 is a first enlarged view of a contact portion between a plating jig energization inspection device and a plating jig.
FIG. 4 is a second enlarged view of a contact portion between a plating jig current inspection device and a plating jig.
FIG. 5 is a flowchart showing the operation of the plating jig energization inspection apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 100 Plating jig electricity supply inspection apparatus 112-1, 112-2 Power supply block support part 114-1, 114-2 Power supply block probe 122 Probe support part 124-1 to 124-8 Power supply probe 130 Current supply inspection part 132 Inspection Location switching function 140 Drive unit 150-1, 150-2 Separation unit

Claims

A power supply unit, a current plate connected to the power supply unit, and a plurality of current units that are connected to a conductive layer formed on an upper surface of a target object to be plated and are capable of contacting and leaving the power supply plate. In the plating jig energization inspection device for confirming the energization of the plating jig having,
First energization inspection means for inspecting energization between the power feeding unit and the energization plate;
Second energization inspection means for inspecting energization between the power feeding unit and the energization body;
A third energization inspection means for inspecting energization between the energization bodies;
A plating jig energization inspection device comprising:

In the plating jig energization inspection device according to claim 1,
The first energization inspection unit measures an electrical resistance between the power feeding unit and the energization plate,
The second energization inspection unit measures an electrical resistance between the power feeding unit and the energization body,
The third energization inspection means is a plating jig energization inspection apparatus for measuring an electrical resistance between the energization bodies.

3. The plating jig energization inspection device according to claim 1, wherein the first energization inspection unit is configured to separate the energization plate and the plurality of energization bodies from each other, and Inspect the energization between
The second energization inspection unit inspects the energization between the power feeding unit and the energization body in a state where the energization plate and the plurality of energization bodies are connected,
The third energization inspection unit is a plating jig energization inspection apparatus that inspects the energization between the energization bodies in a state where the energization plate and the plurality of energization bodies are separated from each other.

In the plating jig energization inspection device according to claim 3,
A plating jig energization inspection device comprising separation means for separating the energization plate and the plurality of energization bodies.

In the plating jig energization inspection device according to any one of claims 1 to 4,
The third energization inspection unit is a plating jig energization inspection apparatus that inspects energization between the power feeding unit and each of the energization bodies.

In the plating jig energization inspection device according to any one of claims 1 to 5,
The third jig energization inspection unit is a plating jig energization inspection apparatus that inspects energization between two energizers arranged at opposing positions on the upper surface of the conductive layer.

In the plating jig energization inspection device according to any one of claims 1 to 6,
A measuring element corresponding to the power supply unit and in contact with the power supply unit;
A plurality of measuring elements corresponding to each of the plurality of current-carrying members and in contact with each of the current-carrying members;
A plating jig energization inspection device comprising:

Plating having a power feeding unit, a current-carrying plate connected to the power-feeding unit, and a plurality of current-carrying members connected to and away from the current-carrying plate connected to a conductive layer formed on a target object to be plated. In the plating jig energization inspection method to check the energization of the jig,
Inspecting energization between the power feeding unit and the energization plate,
Inspecting the energization between the power feeding unit and the energization body,
A plating jig energization inspection method for inspecting energization between the energization bodies.