JP2016121397A - Plating device and production method of plating product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating device capable of being applied to jet plating and stabilizing masking quality.SOLUTION: A processing container 10 of a plating device 100 is configured so that, a workpiece 80 installed in a processing tank 16 which is inside of the processing container is brought into contact with a plating liquid P, thereby the workpiece is subjected to plating processing. A masking unit 30 comprises a masking chamber 36 capable of storing a masking target part 81 to which plating adhesion is prevented, on the workpiece 80, and in a state in which the masking unit is attached to the workpiece 80 so as to store the masking target part 81 in the masking chamber 36, a masking liquid M for preventing entry of the plating liquid P is filled in the masking chamber 36. A plating liquid sensor 51 detects that the plating liquid P exceeding a predetermined amount entered the masking chamber 36. A controller 53 controls supply of the masking liquid M to the masking chamber 36 on the basis of a detection signal of the plating liquid sensor 51. A trace amount supply pump 62 can supply the masking liquid M to the masking chamber 36 in response to an instruction from the controller 53.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a plating apparatus and a method for manufacturing a plated product.

  Conventionally, it is known to mask an unplatable part when a non-platable part is included in a part of the workpiece to be plated. For example, when plating the inner and outer surfaces of a spark plug component (hereinafter referred to as “ignition plug”), if the plating adheres to the ground electrode, the plating may be peeled off during the subsequent bending process, which may cause an abnormality such as a spark. is there. Therefore, the plating process is performed with the ground electrode portion masked.

For example, in barrel plating in which a barrel containing a large number of workpieces is rotated in a plating tank, the plating process is performed with a masking component attached to each workpiece.
Moreover, in the plating method disclosed in Patent Document 1, in a plating process performed by holding a workpiece in a specific posture in a plating bath, a state where a non-platable part is exposed to the air above the liquid level By rotating the work at a low speed (for example, 100 rpm), only the plating processing part is selectively partially plated.

Japanese Patent Application Publication No. Sho 62-6753

The method of attaching a masking part or a flexible sealing member to each workpiece is not effective in preventing plating, and it is difficult to stabilize the masking quality. For this reason, after removing the masking component, a post-processing step is required in which the plating adhering to the unplatable portion is removed using a ceramic brush or a laser device.
Moreover, the plating method of patent document 1 presupposes that the pressure of a plating solution is about atmospheric pressure and the liquid level is stationary. Therefore, it could not be applied to jet plating or the like in which a high-pressure and high-speed plating solution is sprayed on the workpiece in the treatment tank.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a plating apparatus that can be applied to jet plating and stabilize the masking quality, and a method for manufacturing a plated product.

The plating apparatus of the present invention includes a processing container, a masking unit, a plating solution sensor, a controller, and a masking fluid supply means.
The processing container is subjected to a plating process when a workpiece installed in an internal processing tank comes into contact with the plating solution.
The masking unit has a masking chamber that can accommodate the masking target part to prevent the plating from adhering to the work, and allows the plating solution to enter while mounted on the work so that the masking target part is stored in the masking chamber. The masking chamber is filled with a masking fluid to prevent. In this specification, the “kanji” of “entry” is used for “shinnyu” which means that the plating solution enters the space called the masking chamber.
Preferably, the masking fluid is a liquid (masking liquid), for example water.

The plating solution sensor detects that a plating solution exceeding a predetermined amount has entered the masking chamber. This detection is performed based on, for example, one or more physical property values of conductivity, PH value, leakage current value, temperature, or heat transfer flow rate in the masking chamber.
The controller controls replenishment of the masking fluid to the masking chamber based on the detection signal of the plating solution sensor.
The masking fluid replenishing means can replenish the masking fluid to the masking chamber by a command from the controller.

The plating apparatus of the present invention prevents the plating solution from contacting the masking target portion by filling the masking fluid around the masking target portion accommodated in the masking chamber. Further, when a plating solution exceeding a predetermined amount enters the masking chamber, the plating solution sensor detects it, and the masking fluid replenishing means replenishes the masking fluid according to a command from the controller based on the detection signal.
Thereby, not only the plating process under static conditions but also the plating method in which a high-pressure and high-speed jet flow is adopted, the masking state can be properly maintained during the plating process. Therefore, the masking quality can be stabilized.

In a particularly preferred form of the plating apparatus, the processing vessel has an inflow direction of the plating solution in a virtual plane orthogonal to the workpiece axis so that the plating solution flowing into the treatment tank spirally circulates with respect to the workpiece axis. It is not in the direction toward the workpiece axis.
In this way, by employing the “spiral plating method” in which the plating solution is flowed as a spiral flow, the plating film thickness in the circumferential direction can be made uniform with respect to a rod-shaped or cylindrical workpiece. In addition, high-speed and efficient plating can be performed.

Moreover, this invention is provided as a manufacturing method of the plating product using the said plating apparatus.
This plating product manufacturing method is based on “a plating solution detection stage in which a plating solution sensor detects that a predetermined amount of plating solution has entered the masking chamber” and “a command from the controller based on the detection signal of the plating solution sensor”. , A masking fluid supply step in which the masking fluid supply means supplies masking fluid to the masking chamber. Thereby, there exists an effect similar to the said plating apparatus.

1 is an overall configuration diagram of a plating apparatus according to an embodiment of the present invention. The (a) side view of the spark plug as an example of the workpiece | work applied to the plating apparatus of FIG. 1, (b) The perspective view which shows the masking object part (ground electrode). Sectional drawing of the masking unit and processing container of the plating apparatus of FIG. Sectional drawing of the plating apparatus in the case of processing a workpiece | work with a short full length with respect to FIG. VV sectional view taken on the line of FIG. The principal part enlarged view of the masking unit of FIG. FIG. 4 is a correlation diagram of a plating solution intrusion amount-conductivity used for detection of a plating solution sensor in a plating apparatus according to an embodiment of the present invention. The correlation figure of plating solution approach amount-PH value same as the above. Correlation diagram of plating solution ingress amount-current value, temperature, and heat penetration flow rate as above. The flowchart which shows the manufacturing method of the plating product by one Embodiment of this invention. The figure of the masking unit corresponding to the ring-shaped workpiece | work as a masking object part as an example of the workpiece | work applied to the plating apparatus by other embodiment of this invention. The figure of the workpiece | work whose masking object part is ring shape or plate shape. The figure of the masking unit corresponding to the workpiece | work with a concave masking object part, and it. The figure of the masking unit corresponding to the workpiece | work with a concave masking object part, and it.

Hereinafter, a plating apparatus according to an embodiment of the present invention and a method of manufacturing a plated product using the same will be described with reference to the drawings.
(One embodiment)
A configuration of a plating apparatus according to an embodiment of the present invention will be described with reference to FIGS. First, FIG. 1 is referred with respect to the overall configuration of the plating apparatus. The plating apparatus 100 includes a processing container 10, a masking unit 30, a plating solution sensor 51, a controller 53, a minute supply pump 62, and the like.

The processing vessel 10 is subjected to a plating process when the workpiece 80 installed in the internal processing tank 16 comes into contact with the plating solution P. Here, the shape characteristic of the “ignition plug” which is an example of the workpiece 80 applied to the plating apparatus 100 of the present embodiment will be described with reference to FIG.
As shown in FIG. 2, the work (ignition plug) 80 has a substantially cylindrical shape having a screw portion 83, a nut portion 84, and the like. A ground electrode 81 is provided on the annular end surface 82 of the screw portion 83 so as to protrude from the end surface 82.

The outer surface of the plating processing unit 85 including the screw portion 83 and the nut portion 84 is subjected to a plating process such as nickel plating. On the other hand, when the plating is attached to the ground electrode 81, the plating is peeled off during the subsequent bending process, and there is a possibility that an abnormality such as a spark may occur. Therefore, the ground electrode 81 serves as a “masking target portion”, and adhesion of plating during the plating process is prevented.
As in this example, when the workpiece 80 is a spark plug, the ground electrode 81 is a masking target portion. However, in the following description, the workpiece 80 is not limited to a spark plug, but is described as a “masking target portion 81” instead of the “ground electrode 81” so that it can be easily generalized and imaged.

  Returning to the description of the plating apparatus 100. In the following description, the upper side of FIGS. 1, 3, 4, and 6 is referred to as “upper” and the lower side is referred to as “lower”. The plating apparatus 100 is basically installed with the vertical direction as the vertical direction. 3 and 4 show the difference in the set state of the apparatus when processing workpieces having different overall lengths. Here, assuming that the workpiece 80 shown in FIG. 3 is a standard length, FIG. 4 shows a case where a workpiece 80S having a shorter overall length than the workpiece 80 is processed. Common items will be described with reference to FIG.

As shown in FIG. 3, the processing container 10 includes an outer cylinder 11, an upper plate 12, a lower plate 13, a bottom receiving member 14, and the like, and a processing tank 16 is formed in a space surrounded by these members. The treatment tank 16 is filled with the electrolytic plating solution P injected from the inlet 15 and discharged from the outlet 17.
Note that the configuration of the plating solution P tank, pump, supply pipe, discharge pipe, and the like are well-known techniques and are not shown.

  In a state where the workpiece 80 is installed in the processing tank 16, the upper electrode 21, which is a (−) electrode, contacts the end surface of the ground electrode 81 of the workpiece 80 as a “ground electrode energizing portion” described in the claims. Touch. Alternatively, as indicated by a broken line, the lower electrode 22 that is a (−) electrode may abut against the inner wall of the nut portion 84. Further, the outer peripheral upper electrode 23 and the outer peripheral lower electrode 24 which are (+) electrodes are provided on the inner wall of the outer cylinder 11. When a voltage is applied between the electrodes 21 and 22 and the electrodes 23 and 24, metal ions (arrow E) in the electrolytic solution are deposited on the surface (thick line portion) of the workpiece 80, and a plating film is generated.

  As shown in FIG. 5, in the processing container 10 of the present embodiment, the inflow direction of the plating solution P is deviated from the direction toward the workpiece 80 in a virtual plane orthogonal to the axis of the workpiece 80. Therefore, the plating solution P that has flowed into the treatment tank 16 from the inlet 15 circulates spirally around the outside and inside of the workpiece 80 with respect to the axis as indicated by an arrow Sp.

  Thus, the method of flowing the plating solution P as a spiral flow is a technique (Japanese Patent Application No. 2014-108898, Japanese Patent Application No. 2014-186526) previously developed by the present applicant, and is hereinafter referred to as “spiral plating method”. In the spiral plating method, the plating film thickness in the circumferential direction can be made uniform with respect to a rod-like or cylindrical workpiece. Further, by using a high-speed spiral flow, a high-speed and efficient plating process can be performed.

By the way, in the plating process in a processing tank, as a prior art which selectively carries out partial plating of only a plating process part, in patent document 1, a work is carried out in the state where the part which cannot be plated was exposed in the air above the liquid level. A method of rotating at low speed is disclosed. However, this method is based on the premise that the pressure of the plating solution is about atmospheric pressure and the liquid surface is stationary.
On the other hand, in the spiral plating method employed by the plating apparatus 100 of the present embodiment, the high-speed plating solution P contacts the masking target portion 81 at a pressure higher than atmospheric pressure (for example, 0.2 MPa). The technology cannot be used.

Therefore, the plating apparatus 100 of the present embodiment masks the masking target portion 81 by appropriately masking the masking target portion 81 even when the spiral plating method or the jet plating method using a high-speed jet other than the spiral flow is adopted. The purpose is to stabilize the quality.
As a configuration for that purpose, the plating apparatus 100 includes a masking unit 30, a plating solution sensor 51, a controller 53, a minute supply pump 62, and the like. Subsequently, these characteristic configurations will be described.

The masking unit 30 of the present embodiment corresponds to the fact that the masking target portion 81 of the workpiece 80 is provided upward from the workpiece 80, and is disposed directly above the workpiece 80 in the upper portion of the processing container 10 (FIG. 2). (See (b)).
The masking unit 30 includes a base 31 and a cylindrical portion 32 depending from the base 31. The base 31 is provided with a supply port 34 to which a pipe 63 for the masking liquid M is connected. The cylindrical portion 32 is formed with a masking chamber 36 that can accommodate the masking target portion 81 on the tip 33 side, and a supply path 35 that connects the supply port 34 and the masking chamber 36.

As shown in FIGS. 3 and 4, the masking unit 30 is movably provided with respect to the processing container 10 so that the position can be adjusted according to the size of the workpieces 80 and 80S. Between the radial direction of the outer wall 321 of the cylindrical part 32 of the masking unit 30 and the inner wall 122 of the upper plate 12 of the processing vessel 10, the lubricity of guiding the axial movement while maintaining the axial center of the cylindrical part 32. A bearing member 37 and a sealing material 38 that prevents leakage of the electrolytic plating solution P from the processing tank 16 are provided.
Furthermore, the upper electrode 21 as the “ground electrode energizing portion” is also provided movably with respect to the processing container 10 so that the position can be adjusted according to the size of the workpieces 80 and 80S.

  In addition, the shape, installation location, number, etc. of the bearing 37 and the sealing material 38 are not limited to the illustrated form, and any one can be used as long as it can secure the core retaining and guiding functions by the bearing and the sealing function by the sealing material. It is good also as such a structure. Further, the movable mechanism of the masking unit 30 and the upper electrode 21 may use a known driving method using an actuator such as transmission, hydraulic pressure, pneumatic pressure, etc., or may be a manual type.

In the masking unit 30, the masking chamber 36 is filled with a masking solution M that prevents the plating solution P from entering while the masking target portion 81 is mounted on the workpiece 80 so as to be accommodated in the masking chamber 36. As the “masking solution”, in this embodiment, “liquid” is used as the “masking fluid” described in the claims, and typically “water” is used.
A gap Δh (see FIG. 6) between the tip 33 of the cylindrical portion 32 and the screw portion end surface 82 of the work 80 is such that the screw portion end surface 82 is well plated and the plating solution P enters the masking chamber 36. Is preferably set to an appropriate value that minimizes.

Further, as shown in FIG. 5, the cross-sectional shape of the masking chamber 36 is formed to be a square that is slightly larger than the quadrangular columnar masking target portion 81, for example, so that a gap Δd with the masking target portion 81 (see FIG. 6). ) Is preferably equal in the circumferential direction. The masking chamber 36 is provided with a check valve 64 on the minute supply pump 62 side so that the plating solution P cannot easily enter the masking chamber 36 when an internal pressure such as a jet plating method or a spiral plating method is applied. A sealing material 39 is attached to the shaft of the shaft to make a semi-sealing structure to prevent entry.
From the viewpoint of suppressing the drop of the masking liquid M in the masking chamber 36 and preventing the plating liquid P from entering, the gap Δd is preferably set to 1.0 mm or less, for example.
Furthermore, after the masking liquid M is supplied, the masking liquid M may be prevented from dropping by sealing the inlet side of the masking chamber 36 or performing a negative pressure operation.

The plating solution sensor 51 is installed in the masking unit 30 so as to face the masking chamber 36, and detects that the plating solution P exceeding a predetermined amount has entered the masking chamber 36.
For example, as shown in FIG. 6, the plating solution P enters the masking chamber 36 from the tip 33 side of the cylindrical portion 32, and the interface between the masking solution M and the plating solution P (shown in matte) is the height of the plating solution sensor 51. When the value reaches the plating solution concentration, the concentration of the plating solution in the vicinity of the plating solution sensor 51 increases. The plating solution sensor 51 measures some physical property value depending on the concentration of the plating solution, and detects that the plating solution P exceeding a predetermined amount has entered the masking chamber 36 when the physical property value reaches a specified value.

The controller 53 and the minute supply pump 62 are provided outside the processing container 10.
The controller 53 receives a detection signal from the plating solution sensor 51 via the signal line 52 and controls replenishment of the masking solution M to the masking chamber 36 based on the detection signal.
Although not specifically mentioned in the present specification, the plating apparatus 100 includes a known control unit that controls plating conditions such as the pressure of the plating solution P, the flow velocity, and the voltage applied to the electrodes. The controller 53 may function as a part of the controller 53 or may be provided independently as a dedicated controller for replenishment control.

The micro supply pump 62 is an embodiment of the masking liquid replenishing means, and further corresponds to the “masking fluid replenishing means” described in the claims in a higher level concept.
The micro supply pump 62 sucks the masking liquid M from the masking liquid tank 61 and supplies it to the supply port 34 of the masking unit 30 via the discharge side pipe 63. In particular, when the plating solution sensor 51 detects that the plating solution P has entered the masking chamber 36 during the plating process, the micro supply pump 62 can supply the masking solution M to the masking chamber 36 according to a command from the controller 53. is there.

  The amount of masking liquid M supplied by the micro supply pump 62 is such an amount that the gap in the masking chamber 36 is filled at the time of initial supply after the work 80 is set in the plating apparatus 100. Further, during the plating process, the amount is such that the decrease due to the ingress of the plating solution P is replenished, and in any case, the amount is very small. Therefore, the trace supply pump 62 as the masking solution replenishing means does not require a large flow rate, but is required to have an ability to accurately supply a trace amount of the masking solution M so as not to affect the plating solution concentration management.

  Next, the physical properties used by the plating solution sensor 51 for detecting the plating solution P and the replenishment control executed by the controller 53 based on the detection result will be described with reference to FIGS. In this embodiment, the masking solution M is water, and the plating solution P is an electrolytic solution for nickel plating. Therefore, paying attention to the physical properties that are significantly different between water and the electrolytic solution, the electrolytic solution is mixed with water. Detect that Examples of such physical properties include (1) conductivity, (2) PH value, (3) leakage current value, (4) temperature, and (5) heat flow rate.

  In FIG. 7 to FIG. 9, the horizontal axis indicates the plating solution intrusion amount (or plating treatment time), and the vertical axis indicates the physical property values. Here, it is assumed that the amount on the horizontal axis is “plating processing time”, and the symbol on the horizontal axis is time t. A broken line arrow indicates a change in the physical property value when the replenishment control of the masking liquid M is not performed, and a solid line arrow indicates a change in the physical property value when the replenishment control of the masking liquid M is performed. A suffix “m” of a symbol representing physical properties indicates a physical property value of the masking solution M, and a suffix “p” indicates a physical property value of the plating solution P. The subscript “x” indicates a specified value used for replenishment control of the masking liquid M.

(1) Conductivity As shown in FIG. 7, the conductivity σm of the masking solution M is relatively small, and the conductivity σp of the plating solution P is relatively large. After starting the plating process at time t0, when the plating solution P exceeding a predetermined amount enters the masking chamber 36, the conductivity increases and reaches the specified value σx. Therefore, the plating solution sensor 51 detects the entry of the plating solution P. be able to.

  When the replenishment control of the masking liquid M is not performed (FIG. 7A), the conductivity continues to increase from the specified value σx toward the value σp in the plating liquid P. On the other hand, when the replenishment control of the masking solution M is performed when the conductivity reaches the specified value σx (FIG. 7B), the conductivity is close to the value σm of the masking solution M at each of the replacement fluid timings t1, t2, and t3. Return to value. That is, the conductivity reciprocates between the masking liquid M value σm and the specified value σx in a sawtooth shape.

(2) PH Value As shown in FIG. 8, the acidic plating solution P has a PH value of about 4, and the neutral masking solution M has a PH value of 7. When the plating solution P exceeding a predetermined amount enters the masking chamber 36, the PH value decreases and reaches the specified value PHx, so the plating solution sensor 51 can detect the entry of the plating solution P.

  When the replenishment control of the masking liquid M is not performed, the PH value continues to decrease from the specified value PHx toward 4. On the other hand, when replenishment control of the masking liquid M is performed when the PH value reaches the specified value PHx, the PH value returns to a value close to 7 at each of the replacement fluid timings t1, t2, and t3, and between 7 and the specified value PHx. Is reciprocated in a sawtooth shape.

(3) Leakage Current Value As shown in FIG. 9A, the leakage current value (conductance) Gm of the masking liquid M is very small, and is 10 μS (Siemens) or less in the case of pure water. When the plating solution P exceeding the predetermined amount enters the masking chamber 36, the leakage current value increases and reaches the specified value Gx, so that the plating solution sensor 51 can detect the entry of the plating solution P.
The replenishment control is the same as described above, and will be omitted.

(4) Temperature, (5) Heat flow rate For example, it is assumed that the masking solution M is at room temperature, the plating solution P is heated to 40 to 60 ° C., and flows into the processing bath 16. As shown in FIGS. 9B and 9C, the temperature Tm and the heat flow rate Hm of the masking liquid M are both low. When the plating solution P exceeding a predetermined amount enters the masking chamber 36, the temperature and heat flow rate increase and reach the specified values Tx and Hx, so that the plating solution sensor 51 can detect the entry of the plating solution P.
The replenishment control is the same as described above, and will be omitted.

Next, a method for manufacturing a plated product using the plating apparatus 100 of the present embodiment will be described with reference to the flowchart of FIG. In the description of the flowchart, the symbol “S” means a step.
The controller 53 performs the determination of the plating solution detection concentration and the replenishment command of the masking solution M to the micro supply pump 62 in the following steps.

In S <b> 1, the workpiece 80 and the masking unit 30 are set in the plating apparatus 100. In S <b> 2, a fixed amount of masking liquid M is supplied from the micro supply pump 62 to the masking chamber 36 of the masking unit 30.
In S3, when it is confirmed that the plating solution sensor 51 detects the masking solution M and the plating solution P is not detected, the process proceeds to S4 and the plating process is started.

  In S <b> 5, the plating solution sensor 51 determines whether or not the detected concentration of the plating solution in the masking chamber 36 is greater than the specified value α, that is, whether or not the plating solution P exceeding a predetermined amount has entered the masking chamber 36. If the plating solution detection concentration is equal to or less than the specified value α (S5: NO), the masking solution M does not need to be replenished, and the process proceeds to S9.

If it is determined in S5 that the plating solution detection concentration is greater than the specified value α (S5: YES), the masking solution M is supplied from the micro supply pump 62 to the masking unit 30 by a command from the controller 53 (S6). ).
As a replenishment control method at this time, a method of shifting to the “plating solution non-detecting step” of S7 after executing replenishment for a certain time or a certain amount in S6 can be taken. “Plating solution non-detection” means, for example, a state where “the detected concentration of the plating solution is substantially smaller than a specified value β (<< α) close to 0”.

When the plating solution P is detected in S7 (S7: NO), the process returns to S6 and the masking solution M is replenished for a certain time or a certain amount again. On the other hand, when the plating solution P is not detected in S7 (S7: YES), the process proceeds to S8, and the replenishment of the masking solution M is stopped.
Alternatively, as another replenishment control method, the masking solution replenishment in S6 and the plating solution concentration detection in S7 proceed simultaneously, that is, until the plating solution is not detected (S7: YES) while monitoring the plating solution concentration. The necessary amount of masking liquid M may be replenished at a time.

  Thus, the process of S5 to S8 is repeated until the completion of the plating process is determined in S9 (S9: YES), that is, while the plating process is continued. In this embodiment, S5 and S6 correspond to the “plating solution detection stage” and the “masking fluid supply stage” described in the claims.

(effect)
The effects of the plating apparatus 100 according to the present embodiment and the method of manufacturing a plated product will be described.
(1) The plating apparatus 100 of this embodiment prevents the plating solution P from contacting the masking target portion 81 by filling the masking target portion 81 accommodated in the masking chamber 36 with the masking solution M. . Further, when the plating solution P exceeding a predetermined amount enters the masking chamber 36, the plating solution sensor 51 detects it, and the trace supply pump 62 replenishes the masking solution M according to a command from the controller 53 based on the detection signal.

  As a result, not only in the plating process under static conditions disclosed in Patent Document 1, but also in the case where a plating method in which a high-pressure and high-speed jet flow such as “spiral plating method” is adopted, the masking state is appropriate during the plating process. Can be maintained. Therefore, the masking quality can be stabilized. As a result, it is possible to eliminate the adhesion plating removal process and the like in the subsequent process of the plating process.

(2) The plating solution sensor 51 of the present embodiment detects the ingress of the plating solution P based on one or more physical property values among conductivity, PH value, leakage current value, temperature, or heat flow rate. . Thereby, the technical idea of the present invention can be easily realized by using a realistic sensor.
(3) In this embodiment, since the masking liquid M (liquid) is used as the masking fluid, it is easier to handle than gas. In particular, the use of water makes the influence on the plating harmless and facilitates the management of the discharge of the remaining liquid.

(4) In this embodiment, the masking unit 30 is provided movably with respect to the processing container 10 so that the position can be adjusted according to the size of the workpieces 80 and 80S.
Further, the upper electrode 21 as the “ground electrode energizing portion” is positioned according to the size of the workpieces 80 and 80S with respect to the workpiece in which the ground electrode 81 as the masking target portion protrudes from the end face 82 like the spark plug. It is provided so as to be movable with respect to the processing container 10 so as to be adjustable.
Thereby, the mixed flow of various products can be performed with respect to one plating apparatus 100, and the productivity is improved.

(5) In the processing container 10 of the present embodiment, the plating solution P in a virtual plane orthogonal to the axis of the workpiece 80 is arranged so that the plating solution P flowing into the processing tank 16 spirally circulates with respect to the axis of the workpiece 80. The inflow direction of P is deviated from the direction toward the workpiece 80 axis.
By adopting the “spiral plating method” with this configuration, the plating film thickness in the circumferential direction can be made uniform with respect to a rod-like or cylindrical workpiece. Further, by using a high-speed spiral flow, a high-speed and efficient plating process can be performed.

(6) The plating product manufacturing method according to the present embodiment includes “a plating solution detection stage in which the plating solution sensor 51 detects that a predetermined amount of the plating solution P has entered the masking chamber 36”, and “the plating solution sensor 51. And a masking liquid (fluid) replenishment stage in which the micro supply pump 62 replenishes the masking liquid M to the masking chamber 36 in accordance with a command from the controller 53 based on the detection signal.
Thereby, there exists an effect similar to the effect (1) of the said plating apparatus 100. FIG.

(Other embodiments)
(A) In the said embodiment, the example of a spark plug is shown as the workpiece | work 80 applied. Here, the ground electrode which is the masking target portion 81 is one place, and has a quadrangular prism shape extending straight upward from the tube end portion 82. The masking unit 30 is provided with a masking chamber 36 having a square cross section corresponding to the shape of the ground electrode, and the masking unit 30 is mounted so as to cover the ground electrode from directly above. This example is the simplest in shape, and can be said to be an optimal form in terms of ease of manufacturing the masking unit 30 and ease of setup during production.

However, the plating apparatus of the present invention can apply a wide variety of workpieces by devising the configuration of the masking unit according to the number, posture, shape, etc. of the masking target portions of the workpiece.
For example, the number of masking target parts such as ground electrodes may be plural. The posture of the masking target part is not limited to the upward direction, and may be a lateral direction or a downward direction. The masking liquid M filled in the masking chamber is held around the masking target portion without being dropped by gravity if the dimension of the gap Δd (see FIG. 6), that is, the thickness of the liquid film is set appropriately. It is.

  Further, the masking target portion is not limited to a straight column shape, and may be bent in an arc shape or the like as long as the masking unit can be mounted. Alternatively, if the divided masking unit is joined to the masking target portion after being attached, the masking target portion may be a shape bent in a crank shape, for example.

Specific examples of other workpieces are shown in FIGS.
In the workpiece 901 shown in FIG. 11A, only the outer surface 911 and the inner surface 912 of the ring-shaped end portion, or the inner surface 912 is a masking target portion.
When masking both the outer surface 911 and the inner surface 912, as shown in FIG. 11B, the masking chamber 461 of the masking unit 401 is formed in an annular groove shape so as to sandwich the end portion of the work 901 from the inside and the outside. The The supply path 451 communicates with the masking chamber 461 from the bottom of the groove, for example.

  On the other hand, when only the inner surface 912 is masked, the masking chamber 462 of the masking unit 402 is formed in contact with the inner surface 912 at the end of the workpiece 901 as shown in FIG. The supply path 452 has an axial and radial passage formed in a T-shape in cross section, and communicates with the masking chamber 462 from the inside of the diameter.

  FIG. 12 shows an example of the shape of the masking target portion representing characters and symbols. The workpiece 903 of (a) and the workpiece 904 of (b) are examples in which the masking target portion is a ring shape. The workpiece 905 in (c) and the workpiece 906 in (d) are examples in which the masking target portion is plate-shaped. For these workpieces, the masking chamber of the masking unit is formed to correspond to the shape of each masking target portion.

13 and 14 show an example of a workpiece having a concave masking target portion.
In the workpiece 907 shown in FIG. 13A, the spherical concave surface is the masking target portion 917. Correspondingly, the masking unit 407 shown in FIG. 13B has a convex spherical surface at the tip 437, and the masking chamber 467 is formed so that the distance from the masking target portion 917 is substantially constant. The supply path 457 communicates with the masking chamber 467 along the central axis.

  A workpiece 908 shown in FIG. 14A has a masked portion 918 on the inner surface of a flat bottom cylinder. Correspondingly, the masking unit 408 shown in FIG. 14B has a cylindrical shape with a flat end surface at the tip 438, and the masking chamber 468 is formed so that the distance from the masking target portion 918 is substantially constant. The supply path 458 communicates with the masking chamber 468 along the central axis.

(A) In the plating apparatus 100 of the above embodiment, a “spiral plating method” in which the plating solution P flows spirally in the treatment tank 16 is employed. In other words, it is an advantage of the plating apparatus 100 and the method for manufacturing a plated product according to the above-described embodiment that it can be applied to a plating method using a high-pressure and high-speed jet as in the spiral plating method.
However, the plating method employed in the plating apparatus and the method for producing a plated product of the present invention is not limited to this, and for example, a jet plating method other than the spiral flow may be employed. Further, the pressure of the plating solution P and the degree of flow rate are not limited.

  (C) In the above embodiment, the micro supply pump 62 is used as the masking liquid supply means, but a dispenser or the like may be used as another masking liquid supply means. Further, the electromagnetic valve may be controlled to open and close while the masking liquid M is being pumped by air pressure. Alternatively, the masking liquid tank 61 may be installed above the supply port 34 of the masking unit 30 so that the masking liquid M flows down by its own weight.

  (D) The masking liquid M may be a liquid that satisfies the following conditions in addition to water. (I) having a viscosity sufficient to be held in the gap between the masking chambers, (ii) not easily mixed with the plating solution, and having no adverse effect on the plating process even if mixed somewhat, (iii) the plating solution The detection characteristics of the sensor are significantly different from the plating solution.

(E) Furthermore, the “masking fluid” of the present invention is not limited to the masking solution M, which is a liquid, and it is theoretically possible to use a gas. In this case, for example, the “masking fluid replenishing means” is expressed as a “masking fluid replenishing means” which is a superordinate concept.
As mentioned above, this invention is not limited to such embodiment, In the range which does not deviate from the meaning of invention, it can implement with a various form.

10 ... processing container,
30 ... Masking unit,
36 ... Masking room,
51 ... Plating solution sensor,
62 ... Trace supply pump (masking liquid supply means, masking fluid supply means),
80, 80S ... spark plug, (work),
81: Ground electrode, masking target part,
100: plating apparatus,
M: Masking liquid (masking fluid)
P: plating solution.

Claims (8)

A processing vessel (10) in which the workpiece (80, 80S) installed in the internal processing tank (16) is plated by contacting the plating solution;
The mask has a masking chamber (36) capable of accommodating a masking target portion (81) to prevent adhesion of plating in the workpiece, and is attached to the workpiece so as to accommodate the masking target portion in the masking chamber. A masking unit (30) in which a masking fluid for preventing the ingress of plating solution is filled in the masking chamber;
A plating solution sensor (51) for detecting that a plating solution exceeding a predetermined amount has entered the masking chamber;
A controller (53) for controlling replenishment of the masking fluid to the masking chamber based on a detection signal of the plating solution sensor;
A masking fluid replenishing means (62) capable of replenishing the masking fluid to the masking chamber according to a command from the controller;
A plating apparatus (100) comprising: The plating solution sensor is
2. The intrusion of the plating solution is detected based on one or more physical property values among conductivity, PH value, leakage current value, temperature, and heat flow rate in the masking chamber. The plating apparatus as described.   The plating apparatus according to claim 1, wherein the masking fluid is a liquid.   The plating apparatus according to claim 3, wherein the masking fluid is water.   The said masking unit is provided movably with respect to the said process container so that a position can be adjusted according to the magnitude | size of the said workpiece | work, The any one of Claims 1-4 characterized by the above-mentioned. Plating equipment. As the workpiece, a plating apparatus in which a workpiece in which the ground electrode that is the masking target portion protrudes from an end surface is used,
The ground electrode energization part (21) that contacts the end face of the ground electrode in a state where the work is installed in the processing container is provided in the processing container so that the position can be adjusted according to the size of the work. The plating apparatus according to claim 1, wherein the plating apparatus is movably provided.   The processing vessel has an inflow direction of the plating solution in a virtual plane orthogonal to the workpiece axis so that the plating solution flowing into the processing tank spirally rotates with respect to the workpiece axis. The plating apparatus according to claim 1, wherein the plating apparatus is deviated from a direction toward the axis. A processing vessel (10) in which the workpiece (80, 80S) installed in the internal processing tank (16) is plated by contacting the plating solution;
The mask has a masking chamber (36) capable of accommodating a masking target portion (81) to prevent adhesion of plating in the workpiece, and is attached to the workpiece so as to accommodate the masking target portion in the masking chamber. A masking unit (30) in which a masking fluid for preventing the ingress of plating solution is filled in the masking chamber;
A plating solution sensor (51) for detecting that a plating solution exceeding a predetermined amount has entered the masking chamber;
A controller (53) for controlling replenishment of the masking fluid to the masking chamber based on a detection signal of the plating solution sensor;
A masking fluid replenishing means (62) capable of replenishing the masking fluid to the masking chamber according to a command from the controller;
A plating product manufacturing method using a plating apparatus comprising:
A plating solution detection stage in which the plating solution sensor detects that a plating solution exceeding a predetermined amount has entered the masking chamber;
A masking fluid replenishing step in which the masking fluid replenishing means replenishes the masking fluid to the masking chamber according to a command from the controller based on a detection signal of the plating solution sensor;
The manufacturing method of the plating product characterized by including.

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