JP5400408B2 - Current-carrying member for anode holder and anode holder - Google Patents

Description

  The present invention relates to a current-carrying member for an anode holder and an anode holder, and more particularly to a current-carrying member for an anode holder for supplying power to an anode when performing plating on the surface of a substrate such as a semiconductor wafer and an anode holder for holding an anode. It is about. In the present invention, a plating apparatus that performs plating on a substrate is a bump plating apparatus that forms bumps formed on the surface of a semiconductor substrate, for example, a diameter of 10 to 20 μm and a depth of about 70 to 150 μm provided inside the substrate. And a plating apparatus that performs plating on a via hole having a high aspect ratio and a deep depth.

  In recent years, a method of forming a metal film or an organic film on a substrate such as a semiconductor wafer by performing a plating process in a wiring or bump forming method of a semiconductor circuit has come to be used. For example, gold, silver, copper, solder, nickel, or wiring and bumps (projection-like connection electrodes) in which multiple layers of gold, silver, copper, solder, nickel, or the like are formed at predetermined locations on the surface of a semiconductor wafer on which semiconductor circuits and fine wirings connecting them are formed It is widely practiced to form an electrode and connect it to an electrode of a package substrate or a TAB (Tape Automated Bonding) electrode via this bump. There are various wiring and bump formation methods such as electroplating, electroless plating, vapor deposition, and printing. However, as the number of I / Os in semiconductor chips increases and the pitch becomes narrower, they become finer. The electroplating method (for example, patent document 1) which can respond to this and has a high film-forming speed has come to be used frequently. The metal film obtained by electroplating, which is currently most frequently used, is characterized by high purity, high film formation speed, and simple film thickness control method.

  FIG. 26 is a schematic view showing a conventional example of a so-called vertical immersion plating apparatus in which a substrate and an anode are arranged vertically. As shown in FIG. 26, this plating apparatus has an anode 103 held by an anode holder 102 and a substrate W held by a substrate holder 104 in a plating tank 101 having a plating solution Q inside. It is configured to be placed in parallel so as to be electroplated on the surface W1 of the substrate W exposed from the substrate holder 104 by energizing the anode 103 and the substrate W by the plating power source 105. ing. The plating tank 101 is provided with a plating solution circulating means 106 for discharging and circulating the plating solution Q supplied from the plating solution supply port 107 into the plating vessel 101 through the plating solution discharge port 108.

As shown in FIG. 26, the vertical immersion type plating apparatus performs plating while holding a plate-like anode on an anode holder (holding tool) and facing a substrate. As the anode, it is conceivable to use an anode ball in a cage instead of using a plate-like anode, but by fixing the plate-like anode to an anode holder, There are advantages.
1) By attaching a shielding plate to the anode holder, the opening diameter of the anode can be adjusted, and the in-plane uniformity can be easily controlled (for example, Patent Document 2).
2) Since the anode is plate-like, it can be easily kept parallel to the substrate and the in-plane uniformity can be improved.

As described above, there is an advantage in performing plating using the anode holder in the vertical immersion type plating apparatus, but today, the demands for finer wiring and improved throughput are further increased, and are listed below. Functions have come to be required.
1) The reliability of energization to the anode has been demanded by miniaturization of the wiring formed on the substrate.
2) Since the anode is increased in size with the increase in the size of the substrate, it is difficult to manually replace the anode due to its weight, and it is necessary to take measures such as requiring a new jig.
3) The efficiency of working time in anode replacement has been demanded.
Therefore, the applicant of the present application previously described in Japanese Patent Application No. 2007-213521 (filed on August 20, 2007) can surely energize the anode, and can easily replace the anode. An anode holder energization belt and an anode holder that can improve work time efficiency in replacement have been proposed.

27 to 29 are diagrams showing an anode holder energization belt and an anode holder proposed in Japanese Patent Application No. 2007-213521.
FIG. 27 is a front view of an anode holder energization belt holding an anode. As shown in FIG. 27, a current-carrying belt 111 for an anode holder has a strip-shaped thin plate made of a conductive material made circular, a disc-shaped anode 115 is fitted inside, and both ends 111a and 111b of the belt are bolts 116 and nuts. The anode 115 is fixed by fastening with 117. A conductive bracket 112 is fixed to one end 111 a of the energization belt 111 by a bolt 118 and a nut 119, and a contact portion 113 is provided at the tip of the conductive bracket 112.

28 is a partial cross-sectional front view showing the overall configuration of the anode holder that holds the anode 115 and the energization belt 111 shown in FIG. 29 is a sectional view taken along line XXIX-XXIX in FIG.
As shown in FIG. 29, the anode holder 120 is attached to the anode holder base 121 for attaching the anode 115 held by the energization belt 111, and is attached to the back side of the anode holder base 121 to hold the back side of the anode 115. A back cover 122 and an anode mask 123 that is attached to the front side of the anode holder base 121 and covers a part of the front side of the anode 115 are configured.

  As shown in FIG. 28, the anode holder base 121 is formed of a substantially rectangular thin plate, and has a circular accommodation hole 121a for accommodating the anode 115 held by the energization belt 111 at the center thereof. . A pair of substantially T-shaped hands 121b and 121b are formed at the upper end of the anode holder base 121 so as to be transported by a robot when the worn anode is replaced. The contact portion 113 at the tip of the conductive bracket 112 connected to the energization belt 111 is held by the lower portion of the hand 121b.

JP 2000-96292 A JP 2005-29863 A

The present applicant has continuously operated the plating apparatus using the energizing belt and anode holder shown in FIGS. 27 to 29. However, the energizing belt and anode holder shown in FIGS. 27 to 29 have the following problems. It turns out that there is a point.
1) In the substantially circular energization belt 111 shown in FIG. 27, at the position LA close to the conductive bracket 112 and the position LB on the opposite side of the position LA, the anode close to the position LA due to the influence of the electric resistance of the energization belt. There is a possibility that more current flows in the portion than in the anode portion closer to the position LB and is consumed earlier. As a result, there is a problem in that the current density supplied to the substrate varies and the in-plane uniformity deteriorates.
2) As shown in FIG. 30 (partially enlarged view of FIG. 29), the dissolution proceeds little by little from the gap between the outer peripheral portion of the anode 115 and the anode mask 123, and the anode is locally and non-uniformly dissolved. The density distribution may be disturbed.
3) When the width of the energizing belt 111 is made shorter than the width (thickness) of the anode 115, the anode cannot be held between the bottom of the concave portion of the anode holder and the anode mask, the anode fluctuates, and the anode and the substrate There is a problem that the distance between the poles varies.

  The present invention has been made in view of the above-described circumstances, and can be applied uniformly to the entire anode, the anode can be uniformly dissolved, and the anode holder can be stably held. An object is to provide a member and an anode holder.

To achieve the above object, the anode holder for energizing member of the present invention is used in the plating apparatus placing the substrate and the anode so as to face in the plating bath, the conductive member for the anode holder for feeding the anode A contact member made of an annular conductive material that can come into contact with the outer peripheral surface of the back surface of the anode, and a connection member made of a conductive material that connects the contact member and a power feeding part of the plating apparatus, The connecting member extends from the outer peripheral edge of the contact member.
When the diameter of the wafer is increased, for example, when the diameter of the wafer is changed from 300 mm to 450 mm, the diameter of the anode is increased accordingly. Along with this, the diameter of the anode holder energizing member also increases and the weight also increases.
According to the present invention, since the contact member that contacts the back surface of the anode is not in the shape of a disk but in an annular shape, the weight can be reduced, and the contact member is in an annular shape with a large cross-sectional area and a small electrical resistance. Therefore, it is possible to uniformly energize the entire surface of the anode from the contact member. Therefore, current flows uniformly from the anode to the substrate, and there is no variation in the current density supplied to the substrate.

  According to one aspect of the present invention, a contact portion that can contact a power feeding portion of the plating apparatus is formed at one end of the connection member.

A first aspect of the anode holder of the present invention includes an anode holder base having a circular accommodation hole for accommodating the energizing member for anode holder according to claim 1 or 2 wherein said anode, of the anode holder base An anode mask attached to the front surface side and covering a part of the anode is provided.
According to the present invention, after the anode and the anode holder energization member having the disk-like or annular contact member are accommodated in the accommodation hole of the anode holder base, the anode mask is attached to the anode holder base, The anode can be fixed to the anode holder base.

According to one aspect of the present invention, there is provided a pressing member that is accommodated in the accommodation hole of the anode holder base and that presses the anode holder energization member against the anode.
According to the present invention, since the anode holder energization member can be pressed against the anode by the pressing member, the anode can be pressed against the anode mask. Therefore, even when the anode is consumed and the volume is reduced, the anode can be held between the anode mask and the anode holder energizing member, and therefore the anode can be fixed. Further, there is no gap between the anode and the anode mask, and local dissolution of the anode can be prevented.

  The second aspect of the anode holder of the present invention is used in a plating apparatus in which a substrate and an anode are disposed facing each other in a plating tank. In the anode holder for supplying power to the anode, it is possible to contact almost the entire back surface of the anode. A contact member made of a disc-shaped conductive material, a pressing member for pressing the contact member against the anode, and an anode holder base that accommodates the anode, the contact member, and the pressing member. Features.

According to an aspect of the present invention, the pressing member is made of an elastic member.
According to an aspect of the present invention, the anode and the contact member are fixed to the anode holder base by screwing.
When the diameter of the wafer is increased, for example, when the diameter of the wafer is changed from 300 mm to 450 mm, the diameter of the anode is increased accordingly, and the weight of the anode is increased. For this reason, since it becomes difficult to carry the anode, it is necessary to make the anode thinner than the conventional one, and it is difficult to hold the thin and large anode with an anode holder using an energizing belt.
According to the present invention, since the anode and the anode holder energizing member are fixed to the anode holder base by screwing, the anode can be reliably brought into contact with the entire surface of the anode holder energizing member even when the anode is thin.

According to an aspect of the present invention, the anode mask has a circular opening, and an inner diameter of the circular opening is smaller than an outer diameter of the anode.
According to the present invention, the electric field on the surface of the anode can be controlled by adjusting the opening diameter of the anode mask.

According to an aspect of the present invention, the anode mask has a cylindrical portion extending toward the substrate side.
According to the present invention, the electric field from the anode toward the substrate can be prevented from spreading outward in the radial direction, current flows uniformly from the anode to the substrate, and the current density supplied to the substrate does not vary.

According to an aspect of the present invention, the anode mask has a liquid drain hole for draining the plating solution.
According to an aspect of the present invention, a filter that does not allow anode sludge to permeate or a film that does not allow polymer in the plating solution to permeate but to permeate ions is provided on the front surface of the anode mask.
According to the present invention, since the polymer in the plating solution does not permeate through the functional film, it is possible to suppress consumption of the polymer appendage accompanying anode electrolysis and dissolution.

According to an aspect of the present invention, a transport hand is provided on the anode holder base.
According to an aspect of the present invention, the anode holder base has a liquid drain hole for draining the plating solution.

A plating apparatus of the present invention replaces the anode holder with a plating tank in which the anode holder according to any one of claims 3 to 13 and the substrate holder holding the substrate are arranged to face each other, and arranged vertically. And a transport robot for transporting the anode holder between the plating tank and the temporary storage field.
According to one aspect of the present invention, a rinsing tank for rinsing the anode holder is provided.
According to one aspect of the present invention, a blow tank for removing water droplets from the anode holder is provided.

The present invention has the following effects.
1) The front surface of the disk-shaped contact member is in contact with substantially the entire back surface of the anode, and the connection member for energizing the contact member extends from the center of the disk-shaped contact member. The entire surface of the member can be energized uniformly. Therefore, current can be uniformly supplied from the contact member to the entire surface of the anode, current flows uniformly from the anode to the substrate, and there is no variation in the current density supplied to the substrate.
2) Since the contact member in contact with the back surface of the anode is not in the shape of a disc but in an annular shape, the weight can be reduced, and the contact member is in an annular shape with a large cross-sectional area and a small electrical resistance. Can be applied uniformly to the entire surface of the anode. Therefore, current flows uniformly from the anode to the substrate, and there is no variation in the current density supplied to the substrate.
3) Since the anode holder energization member can be pressed against the anode by the pressing member, the anode can be pressed against the anode mask. Therefore, even when the anode is consumed and the volume is reduced, the anode can be held between the anode mask and the anode holder energizing member, and therefore the anode can be fixed. Further, there is no gap between the anode and the anode mask, and local dissolution of the anode can be prevented.
4) Since the anode and the anode holder energizing member are fixed to the anode holder base by screwing, the anode can be reliably brought into contact with the entire surface of the anode holder energizing member even when the anode is thin.
5) The electric field from the anode toward the substrate can be prevented from spreading outward in the radial direction, current flows uniformly from the anode to the substrate, and the current density supplied to the substrate does not vary.
6) Since the polymer in the plating solution does not permeate through the functional film, it is possible to suppress consumption of the polymer appendage accompanying anode electrolysis and dissolution.

FIG. 1 is a front view of an anode holder energizing member. FIG. 2 is a side view of the energizing member for the anode holder. FIG. 3 is a schematic side view showing a state where the anode holder energizing member and the anode are in contact with each other. FIG. 4 is a partial cross-sectional front view showing the overall configuration of the anode holder. 5 is a cross-sectional view taken along line VV in FIG. FIG. 6 is a view showing an example in which the pressing member is composed of a plurality of protruding members projecting in a mountain shape, FIG. 6A is a sectional view showing the contact member and the pressing member, and FIG. It is a perspective view which shows a member and a pressing member. FIG. 7 is a diagram illustrating an example in which the pressing member is composed of a plurality of compression coil springs. FIG. 8 is a diagram illustrating an example in which the pressing member is formed of a metallic net having a spring action. FIG. 9 is a front view of the energizing member for the anode holder. FIG. 10 is a side view of the energizing member for the anode holder. FIG. 11 is a schematic side view showing a state where the anode holder energizing member and the anode are in contact with each other. FIG. 12 is a partial cross-sectional front view showing the overall configuration of the anode holder. 13 is a cross-sectional view taken along line XIII-XIII in FIG. FIG. 14 is a front view showing a modification of the energizing member for an anode holder shown in FIG. FIG. 15 is a view showing a modification of the anode mask, and is a partial sectional view showing a state in which the anode mask is attached to the anode holder. FIG. 16 is a view taken along arrow XVI in FIG. FIG. 17 is a diagram showing an example in which a functional film is provided on the entire surface of the anode, and is a partial cross-sectional view showing a state in which the functional film is attached to the front surface of the anode mask. FIG. 18 is a view showing a state in which the anode holder is immersed in the plating solution. FIG. 19 is a schematic plan view showing an example of the overall arrangement of the plating apparatus using the energizing member and the anode holder shown in FIGS. 1 to 5. FIG. 20 is a diagram illustrating a linear motor unit of the transport device. FIG. 21 is a front view of FIG. FIG. 22 is a front view of the transporter. FIG. 23 is a plan view of a gripping mechanism provided in the arm portion. FIG. 24 is a longitudinal front view of the gripping mechanism provided in the arm portion. FIG. 25 is a schematic view showing another embodiment of the plating apparatus. FIG. 26 is a schematic view showing a conventional example of a so-called vertical immersion plating apparatus in which a substrate and an anode are arranged vertically. FIG. 27 is a front view of an anode holder energization belt holding an anode. FIG. 28 is a partial cross-sectional front view showing the overall configuration of the anode holder that holds the anode and the energization belt shown in FIG. 27. 29 is a sectional view taken along line XXIX-XXIX in FIG. FIG. 30 is a partially enlarged view of FIG.

  Hereinafter, embodiments of an energizing member for an anode holder and an anode holder according to the present invention will be described with reference to the drawings. The current-carrying member for an anode holder and the anode holder of the present invention are applied to a vertical immersion plating apparatus as shown in FIG. 26. In the following embodiments, the configuration of a plating apparatus provided with a plating tank The description about is omitted.

1 and 2 are views showing an anode holder energizing member according to the present invention. FIG. 1 is a front view of a current-carrying member for an anode holder, and FIG. 2 is a side view of the current-carrying member for an anode holder.
As shown in FIGS. 1 and 2, the anode holder energizing member 1 is composed of a disk-like contact member 2 that contacts the back surface of the anode and a rod-shaped member that extends from the back surface of the contact member 2. And a connection member 3 for connecting to a contact point (not shown). The contact member 2 and the connection member 3 are made of a conductive material such as titanium, for example. One end of the connection member 3 is fixed to the center of the disk-shaped contact member 2. Further, a contact portion 4 is provided at the other end of the connecting member 3, and the contact portion 4 can come into contact with a contact portion for power feeding in the plating tank.

  FIG. 3 is a schematic side view showing a state where the anode holder energizing member 1 and the anode 5 are in contact with each other. As shown in FIG. 3, the front surface of the disk-shaped contact member 2 is in contact with substantially the entire back surface of the anode 5. The connection member 3 for energizing the contact member 2 is fixed to the center of the disk-shaped contact member 2 so that the entire surface of the contact member 2 can be energized uniformly. Therefore, current flows uniformly from the anode 5 to the substrate (not shown), and the current density supplied to the substrate does not vary.

Next, the anode holder 10 that holds the anode 5 and the energization member 1 shown in FIGS. 1 to 3 will be described with reference to FIGS. 4 and 5. 4 is a partial cross-sectional front view showing the overall configuration of the anode holder, and FIG. 5 is a cross-sectional view taken along the line V-V in FIG. 4.
As shown in FIGS. 4 and 5, the anode holder 10 is provided on the back side of the contact member 2 of the current supply member 1 and the anode holder base 11 for holding the current supply member 1 and the anode 5. And a pressing member 12 for pressing the contact member 2 against the anode 5 and an anode mask 13 attached to the front side of the anode holder base 11 and covering a part of the front side of the anode 5. Yes.

  The anode holder base 11 is constituted by a substantially rectangular thin plate, and has a circular accommodation hole 11 a for accommodating the energizing member 1 and the anode 5 at the center thereof. A pair of substantially T-shaped hands 11b and 11b are formed at the upper end of the anode holder base 11 so as to be transported by a robot when the worn anode is replaced. The contact portion 4 at the tip of the connection member 3 connected to the contact member 2 is held by the lower portion of the hand 11b. Further, a hole 11h for removing the plating solution is formed in the lower part of the anode holder base 11 so that the plating solution can be easily drained when the anode is replaced when it is lifted from the plating tank.

  On the other hand, the anode mask 13 attached to the anode holder base 11 is formed of an annular plate-like component having an opening 13a at the center. The inner diameter of the opening 13 a of the anode mask 13 is smaller than the outer diameter of the anode 5, and the anode mask 13 covers (masks) the outer periphery of the anode 5. The electric field on the surface of the anode 5 can be controlled by the opening diameter of the anode mask 13. The anode mask 13 is made of, for example, vinyl chloride, PEEK (polyether ether ketone), or PVDF (polyvinylidene fluoride) material.

  As described above, the contact member 2 is pressed against the anode 5 between the bottom of the circular accommodation hole 11a of the anode holder base 11 and the contact member 2 of the energization member 1 so that the outer periphery of the anode 5 is the anode mask 13. A pressing member 12 is provided to press against the pressing member 12. In the example shown in FIG. 5, the pressing member 12 is made of an elastic member such as a disk-shaped rubber. In addition, you may comprise the pressing member 12 from the elastic member which can be elastically deformed, such as a coil spring and a net | network with a spring effect | action. By providing the pressing member 12, the contact member 2 can be pressed against the anode 5 and the anode 5 can be pressed against the anode mask 13, so that there is no gap between the anode 5 and the anode mask 13, and the locality of the anode 5 is reduced. Dissolution can be prevented. Further, even when the anode 5 is consumed and the volume is reduced, the anode 5 can be held between the contact member 2 and the anode mask 13, so that the anode 5 can be fixed.

6 to 9 are diagrams showing various examples of the pressing member 12.
FIG. 6 is a diagram showing an example in which the pressing member 12 is composed of a plurality of protruding members 12a protruding in a mountain shape. FIG. 6A is a cross-sectional view showing the contact member 2 and the pressing member 12, and FIG. 6B is a perspective view showing the contact member 2 and the pressing member 12. As shown in FIGS. 6A and 6B, the pressing member 12 is composed of a plurality of protruding members 12a projecting in a mountain shape. The plurality of projecting members 12 a constitute an elastic member that can be elastically deformed to apply a predetermined repulsive force to the contact member 2. In FIG. 6A and FIG. 6B, an example in which a plurality of projecting members 12 a are fixed to the contact member 2 is shown, but these projecting members 12 a are made of members different from the contact member 2. You may form by giving a press work etc. to a metallic disk-shaped thin plate.

FIG. 7 is a view showing an example in which the pressing member 12 is composed of a plurality of compression coil springs 12b. In the example shown in FIG. 7, a plurality of coil springs 12 b are interposed between the bottom of the accommodation hole 11 a of the anode holder base 11 and the contact member 2. The plurality of compression coil springs 12b constitute an elastic member that can be elastically deformed to apply a predetermined repulsive force to the contact member 2.
FIG. 8 is a view showing an example in which the pressing member 12 is composed of a metallic net 12c having a spring action. In the example shown in FIG. 8, a metallic net 12 c having a spring action is interposed between the bottom of the accommodation hole 11 a of the anode holder base 11 and the contact member 2. The metal net 12c constitutes an elastic member that can be elastically deformed to give a predetermined repulsive force to the contact member 2.

9 and 10 are views showing a second mode of the anode holder energizing member according to the present invention. FIG. 9 is a front view of the anode holder energization member, and FIG. 10 is a side view of the anode holder energization member.
As shown in FIGS. 9 and 10, the anode holder energizing member 21 is composed of an annular contact member 22 that contacts the back surface of the anode and a rod-shaped member that extends from the outer periphery of the contact member 22. And a connection member 23 for connecting to a contact (not shown). The contact member 22 and the connection member 23 are made of a conductive material such as titanium, for example. Since the contact member 22 that contacts the back surface of the anode has an annular shape instead of a disc shape, the weight can be reduced. One end of the connection member 23 is fixed to the outer peripheral portion of the annular contact member 22. Further, a contact portion 24 is provided at the other end of the connection member 23, and the contact portion 24 can come into contact with a contact portion for power feeding of the plating tank. The contact member 22 is provided with a plurality of through holes 22h through which screws for fixing the anode are inserted at predetermined intervals.

  FIG. 11 is a schematic side view showing a state where the anode holder energizing member 21 and the anode 5 are in contact with each other. As shown in FIG. 11, the front surface of the annular contact member 22 is in contact with the entire outer periphery of the back surface of the anode 5. Since the cross-sectional area of the annular portion is set to be relatively large and the electrical resistance is small, the contact member 22 can be energized uniformly over the entire circumference of the contact member 22. Further, the connection member 23 for energizing the contact member 22 is connected to the outer peripheral portion of the contact member 22, and this connection portion also has a relatively large cross-sectional area and is set so as to reduce the electrical resistance. Yes. The current flows uniformly over the entire circumference of the contact member 22 via the connection member 23, and further flows uniformly from the contact member 22 to the entire circumference of the outer peripheral portion of the anode 5. As a result, current flows uniformly from the anode 5 to the substrate (not shown), and the current density supplied to the substrate does not vary.

Next, the anode holder 30 that holds the anode 5 and the energization member 21 shown in FIGS. 9 to 11 will be described with reference to FIGS. 12 and 13.
12 is a partial cross-sectional front view showing the overall configuration of the anode holder, and FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG.
As shown in FIGS. 12 and 13, the anode holder 30 includes an anode holder base 31 for holding the current-carrying member 21 and the anode 5, and a part of the front side of the anode 5 attached to the front side of the anode holder base 31. And an anode mask 33 for covering. The anode 5 and the energizing member 21 are fixed to the anode holder base 31 with a plurality of screws 34. The screw 34 is disposed at a position hidden behind the anode mask 33. According to the present embodiment, since the anode 5 and the anode holder energizing member 21 are fixed to the anode holder base 31 by the screws 34, the thin anode 5 can be brought into contact with the entire surface of the anode holder energizing member 21.

  The anode holder base 31 is formed of a substantially rectangular thin plate, and has a circular accommodation hole 31 a for accommodating the current-carrying member 21 and the anode 5 at the center thereof. In addition, a pair of substantially T-shaped hands 31b and 31b are formed at the upper end of the anode holder base 31 so as to be transported by a robot when the worn anode is replaced. The contact portion 24 at the tip of the connection member 23 connected to the contact member 22 is held by the lower portion of the hand 31b. Further, a hole 31h for removing the plating solution is formed in the lower part of the anode holder base 31 so that the plating solution can be drained when the anode is replaced from the plating tank when the anode is replaced.

  The anode mask 33 attached to the anode holder base 31 has the same configuration as the anode mask 13 shown in FIGS. 4 and 5, and the electric field on the surface of the anode 5 can be controlled by the opening diameter of the anode mask 33. It is like that.

  FIG. 14 is a front view showing a modification of the anode holder energization member 21 shown in FIG. In the anode holder energizing member 21 shown in FIG. 9, the contact member 22 is formed in an annular shape, but in the anode holder energizing member 21A shown in FIG. 14, the contact member 22A is formed in a disc shape. In the contact member 22A, a plurality of through holes 22Ah for inserting a screw for fixing the anode are provided at intervals. According to the present embodiment, the anode 5 and the anode holder energizing member 21A are fixed to the anode holder base 31 by screwing. Therefore, even when the anode 5 is thin, the anode 5 is securely attached to the entire surface of the anode holder energizing member 21A. Can be contacted. The other configuration of the anode holder energizing member 21A shown in FIG. 14 is the same as that of the anode holder energizing member 21 shown in FIG.

15 and 16 are diagrams showing modifications of the anode mask. FIG. 15 is a partial cross-sectional view showing a state where the anode mask is attached to the anode holder, and FIG. 16 is a view taken along arrow XVI in FIG.
In the example shown in FIGS. 4 and 5, and in the examples shown in FIGS. 12 and 13, the anode mask is composed of an annular flat member. However, in the examples shown in FIGS. It is comprised from the cylindrical member. That is, the anode mask 43 includes a flat annular portion 43a and a cylindrical portion 43b extending along the axis from the inner peripheral side of the annular portion 43a. The anode holder energization member 1, the anode 5, and the anode holder 10 have the same configuration as that of the embodiment shown in FIGS.

In the anode mask 43 shown in FIGS. 15 and 16, the length (L) of the cylindrical portion 43b is set to 10 to 60 mm, preferably 30 to 50 mm, and more preferably 30 to 40 mm for a wafer having a diameter of 200 mm. In the case of a wafer having a diameter of 300 mm, it is set to 10 to 70 mm, preferably 20 to 60 mm, and more preferably 30 to 50 mm. Thus, since the anode mask 43 includes the cylindrical portion 43b having a predetermined length, it is possible to prevent the electric field from the anode 5 toward the substrate from spreading outward in the radial direction.
In the case of a cylindrical anode mask, the plating solution and anode sludge may remain in the cylindrical portion when the anode mask is lifted from the plating tank. Therefore, in the anode mask 43 shown in FIGS. A plurality (four in the example shown in FIG. 16) of liquid discharge portions 43h are provided. The liquid discharge part 43h is provided so as to penetrate from the inner peripheral side to the outer peripheral side of the annular part 43a.

  FIG. 17 is a diagram showing an example in which a functional film is provided on the entire surface of the anode, and is a partial cross-sectional view showing a state in which the functional film is attached to the front surface of the anode mask. As shown in FIG. 17, the functional film 50 is provided on the front surface of the anode mask 13, and the functional film 50 is held by an annular functional film holding member 51. In this case, the anode mask 13, the functional film 50, and the functional film holding member 51 are fixed by screwing or thermocompression bonding. The functional membrane 50 is composed of a fine filter through which anode sludge does not permeate and an ion exchanger through which only ions do not permeate polymers. According to the present embodiment, since the polymer in the plating solution does not permeate through the functional film 50, it is possible to suppress consumption of the polymer appendage accompanying anode electrolysis and dissolution. The polymer additive includes, for example, three components such as an S-based polymer as an accelerator, an N-based polymer as a smoothing agent, and polyethylene glycol (PEG) as an inhibitor. The anode holder energization member 1, the anode 5, and the anode holder 10 have the same configuration as that of the embodiment shown in FIGS.

  FIG. 18 is a diagram illustrating a state in which the anode holder 10 is immersed in a plating solution. As shown in FIG. 18, the anode holder 10 is arranged such that a pair of substantially T-shaped hands 11 b and 11 b are located slightly above the plating solution upper surface L. The contact portion 4 held by one hand 11b of the anode holder 10 is supplied with power by contacting a contact plate 16 fixed to a holder 15 provided in the plating tank. The contact plate 16 is connected to a plating power source (not shown) via a power supply wiring 17.

FIG. 19 is a schematic plan view showing an example of the overall arrangement of the plating apparatus using the energizing member 1 and the anode holder 10 shown in FIGS. 1 to 5.
As shown in FIG. 19, the plating apparatus includes a load / unload unit U1 that loads and unloads the substrate W, and a plating unit U2 that performs various processes such as plating and cleaning of the substrate. . The load / unload unit U1 includes three cassette tables 125 on which a cassette 127 containing a substrate W such as a semiconductor wafer is mounted, an aligner 124 for aligning the orientation flat or notch of the substrate in a predetermined direction, and plating. A spin dryer 126 that rotates the substrate after processing at high speed is provided. Further, a substrate attaching / detaching portion 130 for placing the substrate holder 128 and attaching / detaching the substrate W to / from the substrate holder 128 is provided at the rearward position. At the center position of the cassette table 125, aligner 124, spin dryer 126, and substrate attaching / detaching unit 130, a transfer robot 132 that transfers the substrate W between these apparatuses is disposed.

  The plating unit U2 includes, in order from the substrate attaching / detaching unit 130 side, a stocker 134 that stores and temporarily holds the substrate holder 128, and a prewetting bath 136 that improves surface hydrophilicity by immersing the substrate in pure water to wet it. A pre-soak tank 138 for etching and removing an oxide film having a large electrical resistance on the surface of the seed layer formed on the surface of the substrate with a chemical solution such as sulfuric acid or hydrochloric acid; a water washing tank 140 for washing the surface of the substrate and the anode holder 10 with pure water; A blow tank 142, a washing tank 140, and a plating tank 144 for draining the subsequent substrate and the anode holder 10 are sequentially arranged. The plating tank 144 is configured to be plated inside, for example, copper plating. In addition, although copper plating was mentioned as an example, it is the same also in nickel, solder, and also gold plating.

  Further, a transfer device 150 is provided that is located on the side of each device described above and transfers the substrate holder 128 together with the substrate W between these devices. The transport device 150 transports the substrate between the substrate attaching / detaching unit 130 and the stocker 134, and between the stocker 134, the pre-wet tank 136, the pre-soak tank 138, the washing tank 140, the blow tank 142, and the plating tank 144. A transporter 152 for transporting the substrate W is provided. The transporter 152 also serves to transport the anode holder 10 between the temporary storage places 170 and 170 (described later), the pre-wet tank 136, the pre-soak tank 138, the water washing tank 140, the blow tank 142, and the plating tank 144. It has become.

  The substrate attaching / detaching unit 130 includes a plate-like mounting plate 146 that can move 90 ° to a vertical position and a horizontal position around a rotation shaft 145, and two substrate holders 128 are placed horizontally on the mounting plate 146. , The substrate W is transferred between one substrate holder 128 and the transfer robot 132, and then the mounting plate 146 is rotated in the vertical direction to transfer the transporter 152 and the substrate holder 128. Is supposed to do.

  In addition, a temporary storage place 170 for exchanging the anode holder 10 and temporarily placing the anode holder 10 is disposed between the washing tank 140 and the blow tank 142. In the example shown in FIG. 19, the case where the temporary storage place 170 is installed between the washing tank 140 and the blow tank 142 has been described. However, the temporary storage place 170 has two storage places between the stocker 134 and the plating tank 144. As long as it is between apparatuses, you may arrange | position in any position. In FIG. 19, the temporary storage 170 may be disposed between the plating tank 144 and the housing 147 as indicated by a virtual line.

  On the other hand, on the upper part of the anode holder 10, as described above, a pair of substantially T-shaped hands 11b serving as support portions when the anode holder 10 is transported and supported by being suspended are provided (FIG. 4). FIG. 18). In the temporary storage place 170, the anode holder 10 can be held vertically suspended by hooking the hand 11 b on the upper surface of the peripheral wall of the temporary storage place 170. In addition, the anode holder 10 is transported by holding the suspended hand 11b of the anode holder 10 with the transporter 152 of the transport device 150. Note that the anode holder 10 is also suspended and held on the peripheral walls of these devices via the hand 11b in the pre-wet tank 136, the pre-soak tank 138, the washing tank 140, the blow tank 142, and the plating tank 144.

20 and 21 are diagrams illustrating a linear motor unit 185 that is a traveling unit of the transport device 150, FIG. 20 is a diagram illustrating the linear motor unit of the transport device, and FIG. 21 is a front view of FIG. . As shown in FIGS. 20 and 21, the linear motor unit 185 mainly includes a base 186 extending in a long shape and a slider 187 that travels along the base 186, and a transporter is provided on the upper surface of the slider 187. 152 is mounted. Further, a cable bear bracket 189 and a cable bear receiver 190 are provided on the side of the base 186, and the cable bear 192 extends along the cable bear bracket 189 and the cable bear receiver 190.
As shown in FIG. 20 and FIG. 21, by adopting a linear motor system as the transport system of the transporter 152, it is possible to move over a long distance and to keep the length of the transporter 152 short and to further increase the overall length of the apparatus. It can be shortened, and parts that require precision and maintenance, such as longer ball screws, can be reduced.

  22 to 24 are diagrams showing the transporter 152. 22 is a front view of the transporter, FIG. 23 is a plan view of a gripping mechanism provided in the arm portion, and FIG. 24 is a longitudinal front view of the gripping mechanism provided in the arm portion. The transporter 152 is a transfer robot that transfers the substrate holder 128 and also the anode holder 10. In the following description, a case where the anode holder 10 is transferred will be described. As shown in FIG. 22, the transporter 152 includes a transporter main body 153, an arm part 154 that protrudes laterally from the transporter main body 153, an arm part lifting mechanism 155 that lifts and lowers the arm part 154, and an arm part 154. And a gripping mechanism 157 that detachably grips the hand 11 b of the anode holder 10. The arm lifting mechanism 155 has a rotatable ball screw 158 extending in the vertical direction and a nut 159 that is screwed into the ball screw 158, and the LM base 160 is coupled to the nut 159. A timing belt 164 is stretched between a drive pulley 162 fixed to the drive shaft of the lifting motor 161 fixed to the transporter body 153 and a driven pulley 163 fixed to the upper end of the ball screw 158. As a result, the ball screw 158 rotates as the lifting motor 161 is driven, and the LM base 160 connected to the nut 159 screwed to the ball screw 158 moves up and down along the LM guide. .

  As shown in FIGS. 23 and 24, the arm portion 154 includes side plates 174 and 174, and a gripping mechanism 157 is disposed between the side plates 174 and 174. In this example, two gripping mechanisms 157 are provided, but since these are the same configuration, only one will be described.

  The gripping mechanism 157 includes a fixed holder 175 whose end is housed in the width direction between the side plates 174 and 174, a guide shaft 176 inserted through the inside of the fixed holder 175, and one end of the guide shaft 176 (in FIG. 24). And a movable holder 177 connected to the lower end. The fixed holder 175 is connected to a width-direction moving cylinder 178 attached to one side plate 174 via a cylinder joint 179. On the other hand, a shaft holder 182 is attached to the other end (the upper end in FIG. 24) of the guide shaft 176, and this shaft holder 182 is connected to a vertically moving cylinder 180 via a cylinder connector 181.

  With the above-described configuration, the fixed holder 175 moves in the width direction between the side plates 174 and 174 together with the movable holder 177 in accordance with the operation of the width direction moving cylinder 178, and is movable in accordance with the operation of the up and down movement cylinder 180. The holder 177 moves up and down while being guided by the guide shaft 176.

  When gripping the hand 11b of the anode holder 10 suspended and held by the gripping mechanism 157 or the like with the gripping mechanism 157, the movable holder 177 is lowered to the lower side while preventing interference with the hand 11b, and then, for movement in the width direction. The cylinder 178 is operated so that the fixed holder 175 and the movable holder 177 are located at a position where the hand 11b is sandwiched from above and below. In this state, the vertical movement cylinder 180 is operated, and the hand 11b of the anode holder 10 is held and held between the fixed holder 175 and the movable holder 177. Then, the gripping is released by performing the reverse operation.

  4 and 18, a recess 11e is provided in one of the hands 11b of the anode holder 10, and as shown in FIG. 24, the position corresponding to the recess 11e of the movable holder 177 is Protrusions 177a that fit into the recesses 11e are provided so that the positioning of the grip and the installation direction can be determined.

  Next, a processing procedure in the plating apparatus configured as shown in FIGS. 19 to 24 will be described. In the following description, the anode replacement operation will be mainly described. The plating process of the substrate W will be briefly described. After the substrate W is mounted on the substrate holder 128 by the load / unload unit U1, the substrate holder 128 is gripped by the transporter 152 of the transfer device 150, and the stocker 134 Suspend and hold (temporary placement). Next, the substrate holder 128 is taken out of the stocker 134 by the transporter 152, and the substrate holder 128 is sequentially transported to the pre-wet tank 136, the pre-soak tank 138, the plating tank 144, the washing tank 140, etc., and pre-wet, etching, plating, Various processes such as washing after plating are performed.

When the above-described plating process is repeated, the anode 5 is consumed, and thus the anode 5 needs to be replaced. Next, the anode replacement operation will be described.
The anode holder 10 holding the anode 5 which is immersed in the plating tank 144 and consumed is lifted by the transporter 152. At this time, the anode holder 10 is gripped by the gripping mechanism 157 of the transporter 152, the arm portion 54 is lifted via the arm portion lifting / lowering mechanism 155, and then the anode holder 10 is transported to the washing tank 140. Thereafter, the arm unit 154 is lowered via the arm unit elevating mechanism 155, and the anode holder 10 is placed in the water washing tank 140 and washed with water. Then, the washed anode holder 10 is transferred to the blow tank 142 by the transporter 152 in the same manner as described above, and water droplets are removed from the anode holder 10.

  Next, the blown anode holder 10 is transported to the temporary storage place 170 by the transporter 152. Then, the anode holder 10 is taken out from the temporary storage place 170 in the apparatus and moved to a work table (not shown). In this case, the anode holder 10 can be taken out from the temporary storage place 170 to the side of the apparatus, but as shown by the phantom line in FIG. 19, when the temporary storage place 170 is disposed between the blow tank 142 and the housing 147, The anode holder 10 can be taken out to the rear side of the apparatus. On the work table, the anode mask 13 is removed from the anode holder 10, and the consumed anode 5 is taken out and replaced with a new anode 5.

  Next, the removed anode mask 13 is fixed to the anode holder base 11, and the mounting of the new anode 5 to the anode holder 10 is completed. Then, the anode holder 10 equipped with the new anode 5 is returned to the temporary storage place 170 in the apparatus, and is returned to the plating tank 144 by the transporter 152.

According to the plating apparatus configured as shown in FIGS. 19 to 24, the following effects can be obtained.
1) Since the anode holder 10 can be taken out by a fully automated transporter (conveying robot) 152, the anode holder 10 can be easily replaced.
2) When the anode holder 10 is taken out from the apparatus, the anode holder 10 is taken out from the plating tank 144 by the transporter (conveying robot) 152, and the anode is washed in the water washing tank (also used for wafer water washing) 140 in order to drop the attached plating solution. The holder 10 is washed with water, dried in a blow tank (also used as a wafer blow) 142, and the anode holder 10 can be taken out from the temporary storage place 170 (anode holder replacement area). Safety is improved by reducing touching.
3) Since the anode holder 10 can be easily removed, the anode mask 13 can be easily replaced.
4) Since the transporter (transport robot) 152 has high positioning accuracy and easy fine adjustment of the position, the installation position reproducibility of the anode holder 10 is improved, and the distance between the substrate W and the anode 5 is easily increased. It can be changed.

So far, the vertical plating apparatus in which the substrate is held vertically in the plating tank has been described, but the present invention can also be applied to other plating apparatuses, for example, cup-type plating apparatuses.
FIG. 25 is a schematic view showing another embodiment of the plating apparatus. The plating apparatus shown in FIG. 25 is a plating apparatus called a cup type that holds a substrate with a surface to be processed facing down and contacts a plating solution held in a plating tank. As shown in FIG. 25, this plating apparatus has an anode 5 held in an anode holder 60 and a substrate W held in a substrate holder 204 in a plating tank 201 holding a plating solution Q inside. It is arranged so as to be parallel to each other, and is configured to perform electroplating on the surface W1 of the substrate W exposed from the substrate holder 204 by energizing the anode 5 and the substrate W by the plating power source 205. ing. Note that the plating solution Q is supplied from the plating solution supply pipe 207 to the plating tank 201. The anode 5 is in contact with a contact member (a current-carrying member) 2 made of a disk-like conductive material that can contact almost the entire back surface of the anode 5, and is accommodated in a circular accommodation hole 61 a of the anode holder base 61. ing. A pressing member 12 for pressing the contact member 2 against the anode 5 is provided between the contact member 2 and the bottom of the accommodation hole 61 a of the anode holder base 61. As the pressing member 12, those shown in FIGS. 6A, 6B, 7, and 8 can be used. The anode mask 13 is fixed on the upper surface of the anode holder 60, and the anode 5 pushed by the contact member 2 is fixed in contact with the anode mask 13 at the outer peripheral portion. In the present embodiment, power is supplied to the contact member (energizing member) 2 through the outer peripheral end of the contact member 2. If the contact member 2 has sufficient conductivity and thickness, uniform power can be supplied to the anode 5 through the contact member 2. In the present embodiment, the plating solution supply pipe 207 penetrates the center of the anode 5, the contact member 2, the pressing member 12, and the anode holder base 61, and the plating solution enters the plating tank from the outside of the plating tank 201. Supplied. However, the plating solution supply path may be supplied through another path without penetrating the anode holder 60.

DESCRIPTION OF SYMBOLS 1 Anode holder energization member 1c Bolt insertion hole 2 Contact member 3 Connection member 4 Contact part 5 Anode 10 Anode holder 11 Anode holder base 11a Accommodating hole 11b Hand 11e Recess 11h Hole for plating solution removal 12 Pushing member 12a Projection member 12b Compression Coil spring 12c Metal mesh 13 Anode mask 13a Opening 15 Holder 16 Contact plate 17 Power supply wiring 21, 21A Anode holder energization member 22, 22A Contact member 23 Connection member 24 Contact 22h, 22Ah Through hole 30 Anode holder 31 Anode Holder base 31a Accommodating hole 31h Hole for plating solution removal 33 Anode mask 34 Screw 43 Anode mask 43a Toroidal portion 43b Cylindrical portion 43h Liquid discharge portion 50 Functional membrane 51 Functional membrane holding member 60 Anode holder 61 Anode holder base 61a Housing hole 101 Plating tank 102 Anode holder 103 Anode 104 Substrate holder 105 Plating power supply 106 Plating solution circulation means 107 Plating solution supply port 108 Plating solution discharge port 111 Anode-carrying belt 111a, 111b End 112 Conductive bracket 113 Contact portion 115 Anode 118 Bolt 119 Double nut 120 Anode holder 121 Anode holder base 121a Housing hole 121b Hand 122 Back cover 123 Anode mask 124 Aligner 125 Cassette table 126 Spin dryer 127 Cassette 128 Substrate holder 130 Substrate attaching / detaching portion 132 Transport robot 134 Stocker 136 Pre-wet tank 138 Pre-soak tank 140 Flush tank 142 Blow tank 144 Plating tank 145 Rotating shaft 146 Mounting plate 147 Housing 150 Transport device 152 Transporter 153 Transporter body 154 Arm 155 Arm lifting mechanism 157 Grip mechanism 158 Ball screw 159 Nut 160 LM base 161 Lifting motor 162 Drive pulley 163 Drive pulley 164 Timing belt 170 Temporary storage 174 Side plate 175 Fixed holder 176 Guide shaft 177 Movable holder 177a Protrusion 178 Cylinder 179 for moving in the width direction Cylinder joint 180 Cylinder for vertical movement 181 Cylinder connector 182 Shaft holder 185 Linear motor unit 186 Base 187 Slider 189 Cable bear bracket 190 Cable bear bracket 192 Cable bear 201 Plating tank 204 Substrate holder 207 Plating solution supply pipe Q Plating solution W1 Plated surface U1 Load・ Unload unit U2 Plating unit

Claims (16)

In an anode holder energization member for supplying power to the anode, which is used in a plating apparatus in which a substrate and an anode are disposed facing each other in a plating tank,
A contact member made of an annular conductive material capable of contacting the outer peripheral surface of the back surface of the anode;
A connection member made of a conductive material that connects the contact member and a power feeding unit of the plating apparatus;
The current-carrying member for an anode holder, wherein the connecting member extends from an outer peripheral edge of the contact member. The connection to one end of the member, conductive member for the anode holder according to claim 1, wherein the forming the contact portion contactable with the feeding portion of the plating apparatus. An anode holder base having a circular accommodation hole for accommodating the anode and the current-carrying member for an anode holder according to claim 1 or 2 ,
An anode holder, comprising: an anode mask attached to the front side of the anode holder base and covering a part of the anode. 4. The anode holder according to claim 3 , further comprising a pressing member that is accommodated in the accommodation hole of the anode holder base and that presses the anode holder current-carrying member against the anode. In an anode holder for supplying power to an anode, which is used in a plating apparatus in which a substrate and an anode are disposed facing each other in a plating tank,
A contact member made of a disk-shaped conductive material that can contact substantially the entire back surface of the anode;
A pressing member for pressing the contact member against the anode;
An anode holder comprising: an anode holder base that accommodates the anode, the contact member, and the pressing member. The pressing member, the anode holder according to claim 4 or 5, wherein the formed of an elastic member. The anode holder according to claim 3 or 5, wherein the anode and the contact member are fixed to the anode holder base by screwing. The anode holder according to claim 3 or 4, wherein the anode mask has a circular opening, and an inner diameter of the circular opening is smaller than an outer diameter of the anode. The anode holder according to claim 8 , wherein the anode mask has a cylindrical portion extending toward the substrate side. The anode holder according to claim 8 or 9 , wherein the anode mask has a liquid draining hole for draining a plating solution. The filter according to any one of claims 8 to 10 , wherein a filter that does not allow anode sludge to pass through or a film that does not pass through polymers in the plating solution and does not pass through ions is provided on the front surface of the anode mask. Anode holder. The anode holder according to any one of claims 3 to 11 , further comprising a transfer hand on an upper portion of the anode holder base. The anode holder according to any one of claims 3 to 12 , wherein a liquid draining hole for draining a plating solution is provided at a lower portion of the anode holder base. A plating tank that vertically arranges the anode holder according to any one of claims 3 to 13 and the substrate holder holding the substrate,
A temporary storage area for replacing the anode holder;
A plating apparatus comprising: a transfer robot that transfers the anode holder between the plating tank and the temporary storage place. The plating apparatus according to claim 14, further comprising a water washing tank for washing the anode holder. The plating apparatus according to claim 15, further comprising a blow tank that removes water droplets from the anode holder.

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