TW201514347A - Plating apparatus and cleaning device used in the plating apparatus - Google Patents

Abstract

A plating apparatus for plating a substrate is disclosed. The plating apparatus includes: a dip-type plating bath (34); a dry-type plating bath (35) having a hole in a sidewall thereof; and a pressing mechanism (115) configured to press a substrate holder (8), holding a substrate (W), against the sidewall (36) of the dry-type plating bath (35) to close the hole (36a). The substrate holder (8) includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion (66) configured to seal a gap between the substrate (W) and the holding member (58), a second seal portion (68) configured to seal a gap between the base member (54) and the holding member (58), and a third seal portion (69) configured to seal a gap between the holding member (58) and the sidewall (36) of the dry-type plating bath (35).

Description

Plating device and cleaning device used for the plating device

The present invention relates to a plating apparatus for plating a substrate surface such as a wafer. Further, the present invention relates to a cleaning device for cleaning a plating tank of the plating apparatus.

In TAB (Tape Automated Bonding) and flip chip, a plurality of layers of gold, copper, solder, or nickel are formed on a surface designated portion (electrode) of a semiconductor wafer on which wiring is formed, or more The protrusions are connected to the electrodes (bumps), and are electrically connected to the substrate electrodes or the TAB electrodes via the bumps. The method for forming the bumps includes various methods such as a plating method, a vapor deposition method, a printing method, and a ball bump method. Recently, as the number of I/Os of semiconductor wafers has increased and the pitch has been reduced, an electroplating method which is finer and more stable has been used.

A typical plating method is a method in which a substrate is vertically erected in a plating tank, a plating solution is poured from below the plating tank to overflow the substrate, and the substrate is immersed in the plating solution to perform plating. Electroplating method. The immersion plating apparatus usually has a substrate holder that vertically holds the substrate. The substrate holder has a sealing member for forming a sealed space surrounding a peripheral portion of the substrate, and a feeding electrode is disposed in the sealed space. The substrate is held by the substrate holder in a state where the surface (the plated surface) is exposed, and the substrate surface is plated by immersing the substrate together with the substrate holder in the plating solution.

However, when such an immersion plating apparatus picks up the substrate holder from the plating tank, The substrate holder will carry the plating solution from the plating tank, resulting in a decrease in the plating solution in the plating tank. In particular, when an expensive plating solution such as a gold plating solution is used, the cost is increased if the plating solution is frequently replenished. Furthermore, in the case of multi-stage plating in which different metals are plated using a plurality of plating liquids, the plating liquid adhering to the substrate holder is mixed into the additional plating liquid in the subsequent plating tank, and is deposited on the substrate. A plurality of metals.

Further, when the plating solution remains in the substrate holder, metal is deposited on the substrate holder. In particular, the gold plating solution has a property of easily depositing gold. When the metal is deposited on the sealing member, the second plating process is not performed in the substrate holder, and the plating solution may enter the sealed space and come into contact with the feeding electrode. In addition, the deposited metal may hinder the movement of the movable portion of the substrate holder. In order to prevent precipitation of such a metal, it is necessary to increase the number of times of cleaning of the substrate holder, resulting in an increase in the amount of cleaning liquid used and the cleaning time.

Therefore, a dry plating apparatus that performs plating only by bringing the plated surface of the substrate into contact with the plating liquid is known (for example, refer to Patent Document 1 and Patent Document 2). The plating tank using the dry plating apparatus has an opening in its side wall. The substrate holder is pressed against the side wall of the plating tank and occludes the opening by the substrate holder holding the substrate. In this state, a plating solution is injected into the plating tank, and the substrate to be plated is brought into contact with the plating solution while the substrate is plated. Since such a dry plating apparatus can minimize the area where the plating liquid contacts the substrate holder, the amount of plating liquid adhering to the substrate holder can be reduced.

However, the dry plating apparatus requires a space for arranging a mechanism for pressing the substrate holder against the side wall of the plating tank. Therefore, the installation area of the dry plating apparatus is larger than the installation area of the immersion plating apparatus.

Therefore, consider a dry plating tank used in combination with a dry plating device and for use in A plating apparatus for an immersion plating tank of an immersion plating apparatus. The immersion plating tank can reduce the installation area, and the dry plating tank can reduce the amount of plating liquid attached to the substrate holder. Therefore, the plating apparatus of such a configuration does not increase the installation area, and the amount of plating liquid adhering to the substrate holder can be reduced.

However, since the configurations of the dry plating tank and the immersion plating tank are greatly different from each other, the plating apparatus needs to have two substrate holders for the dry plating tank and two substrate holders for the immersion plating tank. Kind of substrate holder. When the substrate is plated in multiple stages, the substrate is plated on one of the two types of substrate holders, and then the substrate is mounted on the other substrate holder for plating. Therefore, each time the substrate is transferred between the dry plating tank and the immersion plating tank, it is necessary to take out the substrate from one of the two types of substrate holders and mount it on the other side, and it becomes difficult to continuously plate the substrate.

Although the dry plating apparatus can reduce the amount of plating liquid adhering to the substrate holder as described above, on the other hand, the plating liquid adheres to the side wall of the plating tank which is in contact with the substrate holder, and metal is deposited on the side wall. In particular, when gold plating is used, it is easy to deposit gold on the side walls. When metal is deposited on the side wall, the opening of the side wall may not be closed in the subsequent plating step, and the plating solution may flow out of the outside. Although it has been proposed to spray the cleaning liquid on the side wall of the plating tank to remove the metal, it is difficult to remove the metal by the jet of the cleaning liquid.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-353048

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2000-192298

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2005-330567

The present invention has been made in view of the above problems in the past, and the first object is to provide a plating apparatus capable of continuously performing multi-stage plating on a substrate without reducing the installation area, reducing the plating liquid adhering to the substrate holder. .

A second object of the present invention is to provide a cleaning apparatus for removing precipitated metal on the side wall of a dry plating tank.

In order to achieve the above object, a plating apparatus according to the present invention is characterized by comprising: a substrate holder that holds a substrate; and an immersion plating tank that holds the first substrate holder impregnated with the substrate a plating solution; a dry plating tank that holds the second plating liquid and has a hole in the side wall; and a transporter that transports the substrate holder to the immersion plating tank and the dry plating described above a predetermined position adjacent to the side wall of the groove; and a pressing mechanism for pressing the substrate holder holding the substrate against the sidewall of the dry plating tank, and blocking the hole by the substrate holder holding the substrate The substrate holder includes: a base member and a holding member that sandwich the substrate; a first sealing portion that seals a gap between the substrate and the holding member; and a second sealing portion that seals the base member a gap with the aforementioned holding member; and a third sealing portion that seals a gap between the holding member and the aforementioned side wall of the dry plating tank .

According to a preferred aspect of the present invention, the plating apparatus further includes an electrical contact connected to the plating power source, wherein the substrate holder includes a power feeding terminal electrically connected to the substrate, and the pressing mechanism The substrate holder holding the aforementioned substrate is pressed against the foregoing Forming the sidewall of the dry plating tank and blocking the hole by the substrate holder holding the substrate, and pressing the feed terminal against the electrical contact.

According to a preferred aspect of the present invention, the substrate holder has: a protruding surface protruding from a normal direction of the substrate; and a step portion disposed on an outer side of the protruding surface, and the third sealing portion In the step portion, the third sealing portion is pressed against the side wall by the pressing mechanism.

According to a preferred aspect of the present invention, when the substrate holder is pressed against the side wall, the protruding surface of the substrate holder is in the same plane as the inner surface of the side wall.

According to a preferred aspect of the present invention, the first sealing portion, the second sealing portion, and the third sealing portion are formed by one sealing member.

The present invention is characterized in that the dry plating tank has an electrolyte chamber for holding the electrolyte, and a partition wall for isolating the second plating solution from the electrolyte. And an anode is disposed in the foregoing electrolyte chamber.

The present invention is characterized in that it further includes a cleaning device that cleans the side wall of the dry plating tank, and the cleaning device has substantially the same shape and size as the substrate holder, and the conveyor is configured to The cleaning device is configured to be transported to the predetermined position adjacent to the side wall of the dry plating tank.

The present invention is characterized in that the cleaning device includes a cleaning member that is in contact with the side wall of the dry plating tank, and a rotating mechanism that rotates the cleaning member that contacts the side wall.

The present invention is characterized in that it further includes a washing nozzle that supplies a cleaning liquid to the cleaning member.

A feature suitable for the present invention is that the second plating solution is a gold plating solution.

A cleaning device according to another aspect of the present invention is for use in a plating apparatus comprising: a substrate holder for holding a substrate; a dry plating tank for holding a plating solution and having a hole in the side wall; and pressing a mechanism for pressing the substrate holder holding the substrate to the sidewall of the dry plating tank, and blocking the hole with the substrate holder holding the substrate, wherein the cleaning device is characterized by: a cleaning member Contacting the sidewall of the dry plating tank; and a rotating mechanism for rotating the cleaning member contacting the sidewall of the dry plating tank, and the cleaning device has substantially the same shape as the substrate holder size.

The present invention is characterized in that it further includes a washing nozzle that supplies a cleaning liquid to the cleaning member.

According to the present invention, the plating apparatus includes a immersion plating tank which can reduce the installation area and a dry plating tank which can reduce the amount of the plating liquid adhering to the substrate holder. Further, the plating apparatus includes a substrate holder in which an immersion plating tank and a dry plating tank can be used in common. According to this configuration, the plating liquid adhering to the substrate holder can be reduced without increasing the installation area of the plating apparatus, and the substrate can be continuously subjected to multi-stage plating.

Further, in the case of the present invention, the metal deposited on the side wall can be removed by slidingly contacting the cleaning member against the side wall of the plating tank.

1‧‧‧ device framework

2‧‧‧Loading

3‧‧‧Control Department

4‧‧‧ aligner

6‧‧‧Rotary washing and drying machine

8‧‧‧Substrate holder

22‧‧‧Substrate transfer robot

24‧‧‧Substrate holder switching mechanism

30‧‧‧Storage tank

32‧‧‧ before cleaning tank

33‧‧‧Pretreatment tank

34‧‧‧Immersion plating tank

35‧‧‧Dry plating tank

36‧‧‧ side wall

36a‧‧ hole

37‧‧‧Retainer containment room

38‧‧‧Air supply trough

40‧‧‧First rinse tank

41‧‧‧Second rinse tank

42‧‧‧ Third rinse tank

50‧‧‧Processing tank

54‧‧‧Base parts

54a‧‧‧through hole

56‧‧‧ Hinges

58‧‧‧ Keeping parts

60‧‧‧ base

62‧‧‧Retainer ring

63‧‧‧Seal ring

64‧‧‧ Pressure ring

64a‧‧‧Protruding

64b‧‧‧ convex

65‧‧‧ spacers

66‧‧‧First seal

68‧‧‧Second seal

69‧‧‧ Third seal

70‧‧‧

71‧‧‧Anode

72‧‧‧Anode holder

74‧‧‧Clamps

74a‧‧‧Protruding

75‧‧‧ plating power supply

80‧‧‧Support surface

82‧‧‧Bulge

84‧‧‧ recess

86‧‧‧Electrical conductor

88‧‧‧Electrical contacts

90‧‧‧Inside hanger

91‧‧‧Feed terminal

92‧‧‧Hand lever

94‧‧‧Outer hanger

96‧‧‧Anode

97‧‧‧Anode holder

98‧‧‧ plating power supply

99‧‧‧Overflow trough

100‧‧‧ stirring paddle

101‧‧‧Transporter

102‧‧‧Fixed base

103‧‧‧ Lifts

104‧‧‧ Arms

106‧‧‧ electrolyte room

107‧‧‧ partition wall

108‧‧‧Retainer hanger

109‧‧‧ plating solution chamber

110a, 110b‧‧‧Contact flow path

112a, 112b‧‧‧Transfer flow path

113‧‧‧ storage tank

114‧‧‧Drainage line

115‧‧‧ Pressing mechanism

116‧‧‧Sucking pad

116a‧‧‧ recess

117‧‧‧Drain hole

118‧‧‧Actuator

119‧‧‧Supply pipeline

120‧‧‧ hanging table

121,133‧‧‧

122,132‧‧‧Electrical contacts

123‧‧‧Sliding parts

124‧‧‧Recycling pipeline

125‧‧‧Tray

126‧‧‧ switch valve

127‧‧‧ overflow trough

128‧‧‧Drain valve

129‧‧‧ hanging table

130‧‧‧Agitating paddle

131‧‧‧Feed terminal

139‧‧‧ partition wall retainer

140‧‧‧cleaning device

141‧‧‧Frame parts

142‧‧‧ cleaning parts

143‧‧‧Rotating mechanism

144‧‧‧ bearing

145‧‧‧moving parts

146‧‧‧ hanger

150‧‧‧ pneumatic cylinder

150a‧‧‧Piston rod

151‧‧‧Linked institutions

151a‧‧‧first link

151b‧‧‧second link

152A, 152B‧‧‧ gas transfer tube

155‧‧‧ Washing nozzle

156‧‧‧Drain hole

160‧‧‧Pressure adjustment components

161‧‧‧ receiving holes

162‧‧‧Power components

163‧‧‧ protruding parts

W‧‧‧Substrate

The first drawing mode shows a plan view of a plating apparatus according to an embodiment of the present invention.

The second figure shows a perspective view of the substrate holder.

The third figure is a plan view of the substrate holder shown in the second figure.

The fourth figure is a right side view of the substrate holder shown in the second figure.

The fifth figure shows a partial enlarged view of the substrate holder shown in the fourth figure.

The sixth figure shows a schematic view of the immersion plating tank.

The seventh figure shows a schematic view of the dry plating tank.

The eighth figure shows a partial view of the substrate holder pressed against the side wall of the dry plating tank.

The ninth diagram shows a drain hole pattern provided at the lower portion of the substrate holder.

Fig. 10(a) is a diagram showing a substrate holder suspended from a suspension table of a dry plating apparatus, and Fig. 10(b) is a diagram showing a substrate holder in a state where a feeding terminal of the substrate holder is pressed against an electric contact. .

Fig. 11(a) is a view showing the substrate holder before hanging from the suspension table of the immersion plating tank, and Fig. 11(b) is a view showing the substrate holder in a state of being suspended from the suspension table.

Fig. 12(a) is a view showing a substrate holder before hanging from a suspension table having electrical contacts thereon, and Fig. 12(b) is a view showing a substrate holder in a state of being suspended from the suspension table.

The thirteenth figure shows a plan view of the cleaning device.

Figure 14 is a cross-sectional view showing the cleaning device.

The fifteenth diagram is a schematic view showing a cleaning device pressed against the side wall of the dry plating tank.

Fig. 16 is a view for comparing the length of the plating apparatus of the present embodiment with the length of a general dry plating apparatus.

The seventeenth figure is a modification of the dry plating tank.

Fig. 18 is a view showing a liquid discharge hole provided in a lower portion of the substrate holder.

The nineteenth image shows an enlarged view of a region surrounded by the symbol A shown in Fig. 17.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the first to the nineteenth aspects, the same or equivalent components are denoted by the same reference numerals, and the repeated description is omitted. The first drawing mode shows a plan view of a plating apparatus according to an embodiment of the present invention. As shown in the first figure, the plating apparatus includes two mounting magazines 2 for mounting a cassette of a substrate W such as a wafer, and a control unit 3 for controlling the operation of the plating apparatus. Further, the plating apparatus includes: an aligner 4 that aligns the orientation flat or the notch position with a predetermined direction; and a spin rinse dryer (Spin Rinse Dryer: SRD) 6 that rotates the plated substrate W at a high speed; The substrate holder 8 (see FIGS. 2 to 5), the substrate holder switch mechanism 24 for attaching and detaching the substrate W to the substrate holder 8, and the substrate transfer robot 22 for transporting the substrate W. The aligner 4, the rotary rinsing dryer 6, the substrate holder switch mechanism 24, and the substrate transfer robot 22 are disposed in the apparatus frame 1.

The storage tank 30 storing the substrate holder 8 and the front cleaning tank 32 for cleaning the substrate W held by the substrate holder 8 before the cleaning liquid such as pure water are disposed inside the apparatus frame 1, and the pretreatment liquid pretreatment is performed. The substrate W is treated before the substrate W. Adjacent to the pretreatment tank 33, a first rinse tank 40 for rinsing the substrate W before rinsing, and a plurality of immersion plating tanks 34 for plating the substrate W are disposed. The immersion plating tank 34 holds the first plating liquid immersed in the substrate holder 8 holding the substrate W. For example, a copper plating solution or a nickel plating solution is used as the first plating solution, and it is relatively inexpensive, and/or even if the plating solution adheres to the substrate holder 8, the plating solution of the metal is less likely to precipitate on the substrate holder 8.

Adjacent to the immersion plating tank 34, a second rinsing tank 41 for rinsing the plated substrate W with a rinsing liquid and a plurality of dry plating tanks 35 for plating the substrate W are disposed. The dry plating tank 35 holds a second plating liquid inside thereof. The second plating solution is, for example, a gold plating solution, etc. When expensive and/or the plating solution adheres to the substrate holder 8, the plating solution of the metal is more likely to be deposited on the substrate holder 8. Adjacent to the dry plating tank 35, a third rinse tank 42 for flushing the plated substrate W with a rinse liquid, and a blower tank 38 for removing the rinse liquid from the substrate W and the substrate holder 8 are disposed. The storage tank 30 is configured to vertically hold a plurality of substrate holders 8 in parallel. The air supply groove 38 is configured to remove droplets remaining on the surface of the substrate held by the substrate holder 8 by blowing nitrogen gas or clean air to dry the droplets.

Storage tank 30, front washing tank 32, pretreatment tank 33, first flushing tank 40, immersion plating tank 34, second flushing tank 41, dry plating tank 35, third flushing tank 42, and air blowing tank 38 Arranged in series in the order of processing. These grooves 32, 33, 34, 35, 38, 40, 41, 42 constitute a processing tank 50.

The apparatus frame 1 is provided with a transporter 101 that transports the substrate holder 8 together with the substrate W between the storage tank 30, the processing tank 50, and the substrate holder switch mechanism 24. The conveyor 101 includes a fixed base 102 that is fixed to the apparatus frame 1 and extends in the horizontal direction, an elevator 103 that can be horizontally moved on the fixed base 102, and an arm 104 that is coupled to the elevator 103. The arm 104 has a gripper 111 that grips the substrate holder 8. The arm 104 moves integrally with the elevator 103 in the horizontal direction, and the arm 104 is raised and lowered by the elevator 103. As a drive source for moving the lifter 103 and the arm 104 in the horizontal direction, a linear motor, a rack and pinion, or a combination of a ball screw and a servo motor can be used.

As shown in the second to fifth figures, the substrate holder 8 has a rectangular flat base member 54 and a holding member 58 that is detachably attached to the base member 54 via a hinge 56. The substrate holder 8 holds the substrate W by sandwiching the substrate W between the base member 54 and the holding member 58. In another configuration example, the holding member 58 may be disposed at a position facing the base member 54, and the holding member 58 may be moved toward or away from the base member 54 to switch the holding member 58.

The base member 54 is made of, for example, vinyl chloride. The retaining member 58 has a base 60 and an annular retainer ring 62. As shown in the fifth figure, the surface of the retainer ring 62 is covered with a seal ring 63 made of an elastic material such as rubber. The seal ring 63 has an annular first seal portion 66. The first sealing portion 66 is configured to be pressed against the peripheral edge portion of the substrate W to seal the gap between the holding member 58 and the substrate W. Further, the seal ring 63 has an annular second seal portion 68 on a surface facing the base member 54. The second seal portion 68 is configured to be pressed against the base member 54 to seal the gap between the base member 54 and the holding member 58.

The retainer ring 62 has an annular step 70, and a pressure ring 64 is disposed below the step 70. The pressure ring 64 is rotatably mounted on a spacer 65. The pressure ring 64 is made of a material which is excellent in acid and alkali corrosion resistance and has sufficient rigidity. The pressure ring 64 is formed, for example, of titanium. The spacer 65 is made of a material having a low coefficient of friction, for example, polytetrafluoroethylene (PTFE), and the pressure ring 64 can be smoothly rotated.

On the outer side of the pressure ring 64, a plurality of clampers 74 are disposed at equal intervals along the circumferential direction of the pressure ring 64. These holders 74 are fixed to the base member 54. Each of the holders 74 has a projecting portion 74a that protrudes from the inner side and has an inverted L shape. The pressure ring 64 has a plurality of projections 64a projecting from the outside, and the lower surface of the projection 74a of the holder 74 is in contact with the upper surface of the projection 64a of the pressure ring 64.

The lower surface of the protruding portion 74a of the holder 74 and the upper surface of the protruding portion 64a of the pressure ring 64 are tapered faces that are inclined in opposite directions to each other in the rotation direction of the pressure ring 64. A plurality of convex portions 64b protruding upward (see the third figure) are provided at a plurality of points (for example, three places) along the circumferential direction of the pressure ring 64. The pressing ring 64 can be rotated by rotating the rotating pin (not shown) and twisting the convex portion 64b from the side.

In a state where the holding member 58 is opened, the substrate W is inserted into the central portion of the base member 54, and the holding member 58 is closed via the hinge 56. The pressure ring 64 is rotated clockwise, and the protruding portion 64a of the pressure ring 64 is slid into the inner protruding portion of the holder 74, and is provided on the tapered surface of the pressing ring 64 and the holder 74, respectively. The base member 54 and the holding member 58 are fastened to each other to lock the holding member 58. Further, by rotating the pressure ring 64 in the counterclockwise direction, the protruding portion 64a of the pressure ring 64 is taken out from the clamp 74, and the locking of the holding member 58 can be released.

When the holding member 58 is locked, the first sealing portion 66 is pressed against the peripheral portion of the substrate W. The first sealing portion 66 is uniformly pressed against the substrate W, thereby sealing the gap between the peripheral edge portion of the substrate W and the holding member 58. Similarly, when the holding member 58 is locked, the second sealing portion 68 is pressed against the surface of the base member 54. The second seal portion 68 is uniformly pressed against the base member 54, whereby the gap between the base member 54 and the holding member 58 is sealed.

As shown in the third figure, a pair of holder hangers 108 are provided outwardly at the ends of the base member 54. The holder hanger 108 is composed of an inner hanger portion 90 and an outer hanger portion 94. A hand lever 92 extends between the inner hanger portions 90 on both sides. The substrate holder 8 is suspended in the processing tank 50 via the inner hanger portion 90 or the outer hanger portion 94 of the holder hanger 108.

An annular ridge portion 82 substantially equal in size to the substrate W is formed on the upper surface of the base member 54. The ridge portion 82 has an annular support surface 80 that abuts against the peripheral edge portion of the substrate W and supports the substrate W. A recess 84 is provided at a predetermined position along the circumferential direction of the ridge portion 82.

As shown in the third figure, a plurality of (12 in the figure) conductors 86 are disposed in the recess 84, respectively. These conductors 86 are respectively connected to a plurality of wires extending from the feed terminals 91 provided on the holder hanger 108. As shown in FIG. 5, when the substrate W is mounted on the substrate holder 8, the conductive The ends of the body 86 are resiliently contacted to electrical contacts 88 that are secured to the retaining member 58.

The electrical contacts 88 electrically connected to the electrical conductor 86 form a leaf spring shape. The electric contact 88 has a contact portion which is located outside the first sealing portion 66 and protrudes in a leaf spring shape. The electric contact 88 can be easily bent at the contact portion by spring force of its elastic force. When the substrate W is held between the base member 54 and the holding member 58, the contact portion constituting the electrical contact 88 is elastically contacted to the peripheral portion of the substrate W supported on the support surface 80 of the base member 54.

When the first sealing portion 66 is pressed against the substrate W and the second sealing portion 68 is pressed against the base member 54, a sealed space is formed along the peripheral edge portion of the substrate W. The electrical contact 88 and the electrical conductor 86 are disposed in the sealed space. Even if the substrate holder 8 is immersed in the plating solution, the plating solution does not intrude into the sealed space of the substrate holder 8. Therefore, the substrate holder 8 can be used for the immersion plating tank 34.

The opening relationship of the holding member 58 is performed by the weight of the pneumatic cylinder (not shown) and the holding member 58 itself. In other words, the base member 54 is provided with a through hole 54a, and a pneumatic cylinder (not shown) is provided at a position opposed to the through hole 54a. By the piston rod of the pneumatic cylinder passing through the through hole 54a, the retainer ring 62 of the holding member 58 is pushed upward to open the holding member 58, and by shrinking the piston rod, the holding member 58 can be closed by its own weight.

The sixth drawing shows a schematic view of the immersion plating tank 34. As shown in the sixth drawing, the immersion plating tank 34 (hereinafter simply referred to as the plating tank 34) holds the first plating liquid inside. The anode 71 held by the anode holder 72 is immersed in the first plating solution. The substrate holder 8 is immersed in the first plating solution in the plating tank 34 together with the substrate W. That is, the holder hanger 108 of the substrate holder 8 is provided on the suspension table 129 disposed on the stage 133 on the plating tank 34, whereby the substrate holder 8 is suspended in the plating tank 34. The anode 71 and the substrate W are disposed to face each other in the first plating solution. As described above, the first plating solution stored in the plating tank 34 is, for example, a copper plating solution or a nickel plating solution. Or solder plating solution.

An overflow tank 99 is disposed around the plating tank 34, and the first plating liquid overflowing from the upper end of the plating tank 34 can flow into the overflow tank 99. The first plating liquid flowing into the overflow tank 99 is returned to the plating tank 34 through a circulation line (shown by an arrow in the sixth drawing).

In the vicinity of the surface of the substrate W held by the substrate holder 8 in the plating tank 34, a paddle 100 as a stirring tool for stirring the first plating liquid is disposed. The agitating paddle 100 is disposed in the vertical direction, and agitates the first plating solution by reciprocating in parallel with the substrate W to uniformly supply sufficient metal ions to the surface of the substrate W.

The anode 71 is connected to the anode of the plating power source 75 via the anode holder 72, and the substrate W is connected to the cathode of the plating power source 75 via the substrate holder 8. The substrate W is plated by applying a voltage between the anode 71 and the substrate W, and a metal film is formed on the surface of the substrate W. In the plating of the substrate W, the first plating solution circulates between the plating tank 34 and the overflow tank 99.

The seventh figure shows a schematic view of the dry plating tank 35. As shown in the seventh figure, the holder accommodating chamber 37 is disposed adjacent to the dry plating tank 35 (hereinafter simply referred to as the plating tank 35). The substrate holder 8 is transferred to the holder accommodating chamber 37 by the conveyor 101. More specifically, the substrate holder 8 is conveyed to a predetermined position adjacent to the side wall 36 of the plating tank 35.

The plating tank 35 holds the electrolyte and the second plating solution therein. The electrolyte 96 is impregnated with an anode 96 held by an anode holder 97. A plating solution can also be used as the electrolyte. The anode 96 is always immersed in the electrolyte in the plating tank 35. With such a configuration, the surface of the anode 96 is prevented from being deteriorated. In particular, when the anode 96 is made of copper, the black film (Black Film) formed on the surface of the anode 96 is prevented from drying off or oxidizing.

An overflow groove 127 is provided adjacent to the plating tank 35. Overflow from the upper end of the plating tank 35 The electrolyte flows into the overflow tank 127. The electrolyte flowing into the overflow tank 127 is returned to the plating tank 35 by the pump through the circulation line.

The anode holder 97 holding the anode 96 is disposed at a predetermined position in the plating tank 35, and the substrate holder 8 holding the substrate W is disposed at a predetermined position in the holder accommodating chamber 37. A hole 36a is formed in the side wall 36 of the plating tank 35, and the inner open end of the hole 36a is closed by the partition wall 107. The partition wall 107 has a configuration in which a current is passed but the liquid is not allowed to pass. The partition wall 107 is composed of a porous body (for example, ceramics such as tantalum carbide (SiC)) or alumina, or an ion exchange membrane or the like. For example, in the case where a molten anode is used as the anode 96, the partition wall 107 uses an ion exchange membrane. The partition wall 107 is disposed at a position facing the substrate W and disposed between the anode 96 and the substrate W.

A pressing mechanism 115 that moves the substrate holder 8 in a direction approaching the side wall 36 and away from the side wall 36 is disposed in the holder accommodating chamber 37. The pressing mechanism 115 includes a suction pad 116 having a recess 116a and an actuator 118 for moving the suction pad 116. Examples of the actuator 118 include a ring pipe, a pneumatic cylinder, a ball screw mechanism, and the like. The pressing mechanism 115 presses the substrate holder 8 holding the substrate W against the outer surface of the side wall 36, and blocks the outer side open end of the hole 36a formed in the side wall 36 with the substrate holder 8 holding the substrate W. In this state, a plating liquid chamber 109 in which the second plating liquid is present is formed between the substrate W and the partition wall 107.

Inside the side wall 36 of the plating tank 35, transfer flow paths 112a and 112b and a plurality of contact flow paths 110a and 110b for connecting the transfer flow paths 112a and 112b to the plating liquid chamber 109 are formed. The second plating liquid is supplied to the transfer flow path 112a, and is supplied to the plating liquid chamber 109 through the connection flow path 110a. The second plating liquid introduced into the plating liquid chamber 109 is in contact with the plated surface of the substrate W. The second plating liquid that is in contact with the substrate W is introduced into the transfer flow path 112b through the connection flow path 110b, and is discharged from the transfer flow path 112b.

The discharged second plating solution is stored in the storage tank 113 through the discharge line 114. A supply line 119 for supplying the second plating liquid to the transfer flow path 112a is connected to the lower portion of the storage tank 113, and a pump P for transferring the second plating liquid is attached to the supply line 119. When the pump P is driven, the second plating liquid in the storage tank 113 is returned to the transfer flow path 112a through the supply line 119. The supply line 119 is connected to a recovery line 124 for recovering the second plating liquid in the supply line 119. More specifically, one end of the recovery line 124 is connected to the supply line 119 and the other end is connected to the storage tank 113. An on-off valve 126 is installed in the recovery line 124. When the switching valve 126 is opened, the second plating solution is transferred to the storage tank 113 through the recovery line 124. A discharge valve 128 is attached to the lower portion of the supply line 119, and the second plating liquid is discharged to the outside by opening the discharge valve 128.

The second plating solution is circulated through a circulation line indicated by a hollow arrow in the seventh diagram. The width of the plating liquid chamber 109, that is, the distance between the substrate W and the partition wall 107 is sufficiently short, and the second plating liquid can flow at a high speed on the surface of the substrate W. Further, the flow direction of the second plating liquid may be switched to the opposite direction by a switching mechanism (not shown). Alternatively, the second plating solution may be configured to flow the transfer channels 112a and 112b and the contact flow paths 110a and 110b along the circumference of the substrate W in a plurality of types.

One of the partition walls 107 is in surface contact with the electrolyte, and the other side is in contact with the second plating solution. As described above, the partition wall 107 allows current to pass without allowing liquid to pass. Therefore, the partition wall 107 has a function of isolating the second plating liquid in the plating liquid chamber 109 from the electrolytic solution in the electrolytic solution chamber 106.

The eighth figure shows a partial view of the substrate holder 8 pressed against the side wall 36 of the dry plating tank 35. As shown in the eighth figure, the substrate holder 8 has an annular third sealing portion 69 having a shape surrounding the outer open end of the hole 36a formed in the side wall 36. The substrate holder 8 is pressed against the side At the time of the wall 36, the third seal portion 69 is pressed against the outer surface of the side wall 36 to seal the gap between the side wall 36 and the holding member 58, thereby preventing the second plating liquid from leaking from the plating liquid chamber 109. The first sealing portion 66, the second sealing portion 68, and the third sealing portion 69 described above are constituted by one sealing member (sealing ring 63).

Since the second plating liquid is blocked by the third sealing portion 69, the second plating liquid hardly comes into contact with the substrate holder 8. Therefore, the amount of the second plating liquid adhering to the substrate holder 8 can be minimized. As a result, the amount of metal deposited on the substrate holder 8 can be reduced, and the amount of the second plating solution added to the plating tank 35 can be reduced.

As described above, since the substrate holder 8 has the first sealing portion 66, the second sealing portion 68, and the third sealing portion 69, the substrate holder 8 can be used for both the immersion plating tank 34 and the dry plating tank 35. By. Therefore, the substrate W can be continuously subjected to multi-stage plating without switching the substrate holder from the immersion plating tank 34 to the dry plating tank 35.

As shown in the seventh figure, a tray 125 is disposed below the holder accommodating chamber 37, and the second plating liquid leaking from the third sealing portion 69 is discharged to the outside from the discharge tube 125a formed in the tray 125. Further, when the substrate holder 8 is not shared with the immersion plating tank 34, that is, when the substrate holder 8 is used only for the dry plating tank 35, as shown in FIG. 9, it may be at the lower portion of the substrate holder 8. A drain hole 117 is provided in communication with the closed space. According to this configuration, even if the second plating liquid intrudes into the sealed space of the substrate holder 8, the second plating liquid can be discharged to the outside through the liquid discharge hole 117.

The absorbing pad 116 is connected to a vacuum source (not shown) to form a vacuum in the recess 116a of the absorbing pad 116. In a state where the substrate holder 8 is sucked by the suction pad 116, the absorbing pad 116 is moved away from the side wall 36 by the actuator 118, and the substrate holder 8 is separated from the side wall 36.

The substrate holder 8 is transported to the holder accommodating chamber 37 by the conveyor 101. Holder The hanger 108 is provided on the suspension table 120 disposed on the gantry 121 on the holder accommodating chamber 37, whereby the substrate holder 8 is suspended in the holder accommodating chamber 37.

Fig. 10(a) is a view showing the substrate holder 8 suspended from the suspension table 120. As shown in the tenth figure (a), the suspension table 120 is provided with electrical contacts 122 electrically connected to the plating power source 98. After the substrate holder 8 is suspended from the suspension table 120, the pressing mechanism 115 presses the substrate holder 8 against the side wall 36. The pressing mechanism 115 presses the substrate holder 8 holding the substrate W against the side wall 36 to hold the substrate holder 8 of the substrate W to block the hole 36a while pressing the feeding terminal 91 of the substrate holder 8 to the electric contact 122.

The figure (b) is a view showing the substrate holder 8 in a state where the feed terminal 91 of the substrate holder 8 is pressed against the electric contact 122. As shown in FIG. 10(b), the feed terminal 91 is in contact with the electrical contact 122, and the substrate W is connected to the negative electrode of the plating power source 98 via the substrate holder 8. A sliding member 123 for smoothly moving the substrate holder 8 is provided on the suspension table 120. The sliding member 123 is made of a material having a small coefficient of friction. The feed terminal 91 should be an elastic member that elastically contacts the electrical contact 122.

11(a) is a view showing the substrate holder 8 before being suspended from the suspension table 120 of the immersion plating tank 34, and FIG. 11(b) is a substrate holder showing the suspension state from the suspension table 120. Figure of 8. As shown in FIGS. 11(a) and 11(b), when the substrate holder 8 is used for the immersion plating tank 34, the substrate holder 8 is moved in the direction of the arrow, and the holder hanger 108 is inserted and suspended. In the station 120. By doing so, the feed terminal 91 is in contact with the electrical contact 122. At this time, since it is not necessary to slide the substrate holder 8 in the lateral direction, it is not necessary to provide the sliding member 123 on the suspension table 120.

Twelfth (a) and twelfth (b) shows other aspects of the suspension table 120 used in the immersion plating tank 34. More specifically, the twelfth figure (a) shows that there are electrical contacts 132 from above. A diagram of the substrate holder 8 before the suspension table 120 is suspended, and a twelfth diagram (b) shows a substrate holder 8 in a state of being suspended from the suspension table 120. As shown in Fig. 12 (a) and Fig. 12 (b), in addition to the feed terminal 91 provided on the side of the holder hanger 108, a feed terminal may be provided below the holder hanger 108. 131, and an electrical contact 132 is disposed on the suspension table 120. That is, both the feed terminal 131 for the immersion plating tank 34 and the feed terminal 91 for the dry plating tank 35 may be provided on the holder hanger 108 of the substrate holder 8. When the substrate holder 8 is used for the immersion plating tank 34, the feed terminal 131 is in contact with the electric contact 132 as shown in Fig. 12(b). By providing the immersion plating tank 34 and the individual feed terminals for the dry plating tank 35 in the holder hanger 108 of the substrate holder 8, a shape and a material suitable for the current density of each plating tank can be used. Feed terminal.

The substrate W is plated as follows. The substrate holder 8 holding the substrate W is transferred to the holder accommodating chamber 37. The pressing mechanism 115 presses the substrate holder 8 holding the substrate W against the side wall 36 of the plating tank 35, and blocks the outer open end of the hole 36a with the substrate holder 8 holding the substrate W while feeding the feeding terminal of the substrate holder 8. 91 is pressed against the electrical contact 122. The gap between the holding member 58 and the side wall 36 of the plating tank 35 is sealed by the third sealing portion 69. The second plating liquid is supplied to the plating liquid chamber 109 through the transfer flow path 112a and the contact flow path 110a, and is in contact with the plated surface of the substrate W. In this state, the substrate W is plated by applying a voltage between the substrate W and the anode 96 by the plating power source 98.

After the plating of the substrate W is completed, the supply of the second plating solution to the plating solution chamber 109 is stopped. Next, the on-off valve 126 is opened, and the second plating solution is recovered from the plating solution chamber 109 through the recovery line 124. Next, the substrate holder 8 is separated from the side wall 36 of the plating tank 35 by the pressing mechanism 115. Then, the substrate holder 8 is carried out from the holder accommodating chamber 37 by the conveyor 101.

When the substrate W is plated using the plating tank 35, the plating solution adheres to the side wall 36 that is in contact with the substrate holder 8. As a result, metal is deposited on the side wall 36, and the second plating solution may be from the side wall 36. A gap is leaked from the gap between the third sealing portion 69 of the substrate holder 8. Therefore, it is necessary to clean the side walls 36. The cleaning method contemplates spraying the cleaning liquid directly onto the side wall 36. However, it is difficult to remove the precipitated metal by the jet of the cleaning liquid. Therefore, the plating apparatus of this embodiment is provided with the cleaning apparatus 140 which can remove a precipitation metal.

The thirteenth drawing shows a plan view of the cleaning device 140, and the fourteenth view shows a sectional view of the cleaning device 140. As shown in the thirteenth and fourteenth drawings, the cleaning device 140 includes an annular cleaning member 142 that contacts the side wall 36, a circular movable member 145 that holds the cleaning member 142, and a bearing 144 that rotatably supports the movable member 145. And a rotating mechanism 143 that rotates the movable member 145 and the cleaning member 142. The cleaning member 142 is, for example, a non-woven fabric or a PVA sponge. The rotation mechanism 143 and the bearing 144 are fixed to the frame member 141. At the end of the frame member 141, a pair of hangers 146 are provided to protrude outward. The bearing 144 is made of a corrosion-resistant material such as resin or ceramic. The cleaning device 140 may further include a cleaning nozzle 155 that sprays the cleaning liquid onto the cleaning member 142. The cleaning nozzle 155 is disposed above the cleaning member 142, and sprays the cleaning liquid onto the cleaning member 142 or the contact portion of the cleaning member 142 and the side wall 36 to wet the cleaning member 142.

The rotation mechanism 143 includes a pneumatic cylinder 150 and a coupling mechanism 151 that transmits the operation of the pneumatic cylinder 150 to the movable member 145. The connection mechanism 151 includes a first link 151a connected to the piston rod 150a of the pneumatic cylinder 150, and a second link 151b fixed to the movable member 145. The rotating mechanism 143 can use a rack and a pinion in addition to the combination of the pneumatic cylinder 150 and the coupling mechanism 151. As shown in Fig. 14, one end of the second link 151b is coupled to the first link 151a, and the other end is fixed to the movable member 145.

The rotation mechanism 143 further includes two gas transfer pipes 152A and 152B for operating the pneumatic cylinder 150. The pneumatic cylinder 150 is connected to the gas transfer pipes 152A, 152B, and the gas transfer The tubes 152A, 152B are connected to a gas supply source (not shown).

When the gas is supplied into the pneumatic cylinder 150 through the gas transfer pipe 152A, the piston rod 150a is extended, and the cleaning member 142 and the movable member 145 are rotated in a counterclockwise direction only at a certain angle. When the gas is supplied into the pneumatic cylinder 150 through the gas transfer pipe 152B, the piston rod 150a contracts, and the cleaning member 142 and the movable member 145 rotate in a clockwise direction only at a certain angle. The pneumatic cylinder 150 repeats such an operation, and the cleaning member 142 alternately rotates in a clockwise direction and a counterclockwise direction only at a certain angle. In other words, the cleaning member 142 is rocked in its circumferential direction. Further, the rotating mechanism 143 is a combination of a motor and a gear, and the cleaning member 142 can be completely rotated in the same direction.

The fifteenth diagram shows a schematic view of the cleaning device 140 pressed against the side wall 36 of the plating tank 35. As shown in the fifteenth diagram, the cleaning nozzle 155 may be provided in the dry plating tank 35 instead of the cleaning device 140. The cleaning nozzle 155 is disposed above the plating tank 35, that is, on the gantry 121. The cleaning nozzle 155 is configured to cover the wide range of supply of the cleaning liquid toward the cleaning device 140 (cleaning member 142) located obliquely downward. The washing nozzle 155 uses, for example, a fan nozzle. When the cleaning device 140 is transferred to the holder accommodating chamber 37, the cleaning nozzle 155 sprays the cleaning liquid onto the cleaning member 142 to wet the cleaning member 142. The cleaning nozzle 155 can also continuously spray the cleaning liquid to the cleaning member 142 while the side wall 36 is being cleaned.

As shown in Fig. 14, since the liquid discharge hole 156 is formed in the lower portion of the frame member 141, the cleaning liquid that has entered the gap between the movable member 145 and the frame member 141 is discharged to the outside of the cleaning device 140 through the liquid discharge hole 156. Further, the cleaning liquid is discharged to the outside from the discharge pipe 125a of the holder accommodating chamber 37.

The cleaning device 140 has substantially the same shape and size as the substrate holder 8. Therefore, the conveyor 101 can transport the cleaning device 140 to be adjacent to the dry type, similarly to the substrate holder 8. The designated position of the side wall 36 of the plating tank 35. That is, the cleaning device 140 is conveyed by the conveyor 101 to a predetermined position in the holder accommodating chamber 37. The hanger 146 of the cleaning device 140 is disposed on the suspension table 120, and the cleaning device 140 is suspended from the suspension table 120. Then, the cleaning device 140 is pressed against the side wall 36 by the pressing mechanism 115. The action of the cleaning device 140 being pressed by the pressing mechanism 115 is performed by an appropriate contact surface pressure of the side wall 36 without causing abrasion. The side wall 36 may also be subjected to a surface treatment that imparts abrasion resistance.

As shown in the fifteenth diagram, the pressing mechanism 115 pushes the cleaning device 140 toward the side wall 36 of the plating tank 35 to bring the cleaning member 142 into contact with the side wall 36. The area where the cleaning member 142 is in contact is formed in a peripheral region of the open end of the outer side of the hole 36a of the side wall 36.

The cleaning nozzle 155 supplies the cleaning liquid to the contact portion of the cleaning member 142 and the side wall 36, and wets the cleaning member 142. In this state, the cleaning member 142 is rotated on the side wall 36 by the rotating mechanism 143 to remove the precipitated metal on the side wall 36. The cleaning member 142 is detachably held to the movable member 145, and the cleaning member 142 can be replaced with a new one.

When the pressing mechanism 115 presses the substrate holder 8 against the side wall 36 and presses the cleaning device 140 against the side wall 36 with the same force, the cleaning member 142 may not smoothly rotate and damage the surface of the side wall 36. Therefore, as shown in the thirteenth and fourteenth drawings, the cleaning device 140 may be provided with the pressing force adjusting member 160 that adjusts the force of pressing the cleaning member 142 against the side wall 36. As shown in Fig. 14, the pressing force adjusting element 160 includes a protruding member 163 housed in the receiving hole 161 formed in the frame member 141, and a biasing member 162 that urges the protruding member 163. The urging member 162 is formed of a telescopic member such as a spring, and biases the protruding member 163 in a direction of pressing against the side wall 36.

The pressing force adjusting member 160 is disposed on the frame member 141 at a plurality of positions along the circumferential direction of the cleaning member 142 (the thirteenth figure system 4). The cleaning device 140 is pushed by the pressing mechanism 115 from the back side, and the cleaning member 142 is pressed around the outer open end of the hole 36a of the side wall 36. at this time, The protruding member 163 of the pressing force adjusting member 160 is contracted in contact with the side wall 36, and a part of the pressing pressing mechanism 115 is pressed. Therefore, the cleaning member 142 can smoothly rotate in contact with the side wall 36 with a moderate contact surface.

As another means of adjusting the force of pressing the cleaning device 140 against the side wall 36, the pressing force of the actuator 118 can also be adjusted. For example, when the actuator 118 is composed of a pneumatic cylinder, it can also be switched to an additional working air line after adjusting the working air pressure with a precision pressure regulating valve to reduce the pressing force of the pneumatic cylinder.

As described above, since the cleaning device 140 has substantially the same shape and size as the substrate holder 8, the conveyor 101 can transport the cleaning device 140 to the holder accommodating chamber adjacent to the dry plating tank 35 in the same manner as the substrate holder 8. 37 is provided in a predetermined position in the holder accommodating chamber 37 in the same manner as the substrate holder 8. Therefore, the plating apparatus can clean the side wall 36 without stopping the operation. The cleaning device 140 is stored in the storage tank 30 in advance, and is taken out from the storage tank 30 by the conveyor 101 as needed. During operation of the plating apparatus, the cleaning apparatus 140 can continuously clean the side walls 36 of the unused dry plating tanks 35. The cleaning device 140 is cleaned in the third rinse tank 42. A flushing tank dedicated to the cleaning device 140 may also be additionally provided.

Next, the overall operation of the plating apparatus configured as described above will be described. First, the substrate holder 8 in the vertical posture is taken out from the storage tank 30 by the arm 104 of the conveyor 101. The arm 104 of the holding substrate holder 8 is moved horizontally, and the substrate holder 8 is sent to the substrate holder switching mechanism 24. The substrate holder switching mechanism 24 converts the substrate holder 8 from a vertical posture to a horizontal posture, and opens the substrate holder 8.

The substrate transfer robot 22 takes out one substrate W from the cassette mounted on the load port 2 and places it on the aligner 4. The aligner 4 aligns the orientation plane or the notch position of the substrate W Orientation. The substrate transfer robot 22 takes out the substrate W from the aligner 4 and inserts it into the substrate holder 8. In this state, the substrate holder 8 is closed by the substrate holder switching mechanism 24, and the substrate holder 8 is locked.

Next, the substrate holder switching mechanism 24 converts the substrate holder 8 from a horizontal posture to a vertical posture. The chuck 111 of the arm 104 holds the substrate holder 8 in the upright state, and in this state, the arm 104 moves the substrate holder 8 horizontally to the upper position of the front cleaning tank 32. Further, the elevator 103 of the conveyor 101 lowers the arm 104 together with the substrate holder 8, and places the substrate holder 8 at a predetermined position in the front washing tank 32. In this state, the substrate W is washed before being performed. After the substrate W is cleaned, the gripper 111 of the arm 104 grips the substrate holder 8, and the arm 104 is raised by the lifter 103, and the substrate holder 8 is lifted from the front cleaning tank 32.

Next, the arm 104 moves the substrate holder 8 in the horizontal direction to the upper position of the pretreatment tank 33. The elevator 103 lowers the arm 104 together with the substrate holder 8, and places the substrate holder 8 at a predetermined position in the pretreatment tank 33, in which state the substrate W is processed. After the processing of the substrate W is completed, the gripper 111 of the arm 104 grips the substrate holder 8, and the arm 104 is raised by the lifter 103 to lift the substrate holder 8 from the pretreatment tank 33. Thereafter, the arm 104 moves the substrate holder 8 horizontally to a position above the first flushing tank 40, the elevator 103 lowers the arm 104 together with the substrate holder 8, and places the substrate holder 8 in the first flushing tank. The specified location in 40. In this state, the rinsing of the substrate W is performed. After the rinsing is completed, the jaws 111 of the arms 104 grip the substrate holder 8, and the arms 104 are raised by the elevator 103, and the substrate holder 8 is picked up from the first rinsing tank 40.

The arm 104 moves the substrate holder 8 in the horizontal direction to a position above the immersion plating tank 34. Furthermore, the elevator 103 of the conveyor 101 causes the arm 104 and the substrate holder 8 Falling together, the substrate holder 8 is placed at a designated position in the immersion plating tank 34. The substrate holder 8 immerses each of the substrates W in the plating solution. Thereafter, plating of the substrate W is performed. Since the substrate holder 8 includes the first sealing portion 66 and the second sealing portion 68, the plating solution does not intrude into the substrate holder 8. After the plating is completed, the jaws 111 of the arms 104 grip the substrate holder 8, and the arms 104 are raised by the elevator 103 to lift the substrate holder 8 from the immersion plating tank 34.

The arm 104 moves the substrate holder 8 in the horizontal direction to a position above the second flushing groove 41. Further, the elevator 103 of the conveyor 101 lowers the arm 104 together with the substrate holder 8, and places the substrate holder 8 at a designated position in the second rinsing tank 41. In this state, the substrate W is rinsed after plating. After the rinsing is completed, the jaws 111 of the arms 104 grip the substrate holder 8, and the arms 104 are raised by the elevator 103, and the substrate holder 8 is lifted from the second rinsing tank 41.

The arm 104 moves the substrate holder 8 horizontally to a position above the holder accommodating chamber 37 adjacent to the plating tank 35, and the elevator 103 lowers the arm 104 together with the substrate holder 8 to place the substrate holder 8 At a designated position in the holder housing chamber 37. The pressing mechanism 115 presses the substrate holder 8 against the side wall 36 to bring the substrate holder 8 into close contact with the side wall 36. In this state, the second plating solution is supplied to the plating liquid chamber 109. Then, the surface of the substrate W is plated by applying a voltage between the anode 96 and the substrate W. Since the substrate holder 8 is provided with the third sealing portion 69, the second plating solution does not leak from the plating tank 35 during the plating of the substrate W.

After the plating of the substrate W is completed, the supply of the plating solution to the plating solution chamber 109 is stopped, and the second plating solution is removed from the plating solution chamber 109. When a vacuum is formed in the recess 116a of the absorbing pad 116, the absorbing pad 116 sucks the substrate holder 8, and in this state, the pressing mechanism 115 moves the substrate holder 8 away from the side wall 36. Thereafter, the vacuum in the concave portion 116a is broken, and the arm 104 is raised by the lifter 103, and the substrate holder 8 is lifted from the holder accommodating chamber 37.

The arm 104 moves the substrate holder 8 in the horizontal direction to a position above the third flushing tank 42. Further, the elevator 103 of the conveyor 101 lowers the arm 104 together with the substrate holder 8, and places the substrate holder 8 at a designated position in the third rinsing tank 42. In this state, the substrate W is rinsed after plating. After the rinsing is completed, the jaws 111 of the arms 104 grip the substrate holder 8, and the arms 104 are raised by the elevator 103, and the substrate holder 8 is lifted from the third rinsing tank 42.

The arm 104 moves the substrate holder 8 in the horizontal direction to a position above the air blowing groove 38. Further, the elevator 103 of the conveyor 101 lowers the arm 104 together with the substrate holder 8, and places the substrate holder 8 at a predetermined position in the air supply groove 38. The air blowing groove 38 removes droplets adhering to the surface of the substrate W held by the substrate holder 8 by blowing nitrogen gas or clean air to dry it. After the air blowing process is completed, the jaws 111 of the arm 104 grip the substrate holder 8, and the arm 104 is raised by the elevator 103, and the substrate holder 8 is lifted from the air supply groove 38.

The arm 104 moves in the horizontal direction, and the substrate holder 8 is sent to the substrate holder switching mechanism 24. The substrate holder switch mechanism 24 opens the substrate holder 8 in the same manner as described above. The substrate transfer robot 22 takes out the processed substrate W from the substrate holder 8 and transports the substrate W to the rotary rinse dryer 6. The rotary rinse dryer 6 dries the substrate W by rotating the substrate W at a high speed. The substrate transfer robot 22 takes out the dried substrate W from the rotary rinse dryer 6 and returns it to the cassette of the cassette 2. Thereby, the processing of one substrate W is completed.

Fig. 16 is a view for comparing the length of the plating apparatus of the present embodiment with the length of a general dry plating apparatus. The length of the plating apparatus of the present embodiment is shorter than that of a general dry plating apparatus. A general dry plating apparatus has seven dry plating tanks 35. Further, the plating apparatus of the present embodiment includes five immersion plating tanks 34 and two dry plating tanks 35. Since the plating apparatus of the present embodiment includes the dry plating tank 35 and the immersion plating tank 34, it is possible to reduce the installation area without increasing the installation area. The plating solution remaining in the substrate holder 8 is left.

The seventeenth embodiment is a modification of the dry plating tank 35. The partition wall 107 is held by the partition wall holder 139 disposed inside the plating tank 35. The inside of the plating tank 35 is partitioned into an electrolyte chamber 106 and a plating liquid chamber 109 by a partition wall 107. A stirring paddle 130 for stirring the second plating liquid is disposed in the plating solution chamber 109. The agitating paddle 130 is disposed in the vertical direction and agitates the plating solution by reciprocating in parallel with the substrate W.

The side wall 36 of the plating tank 35 has a hole 36a for bringing the plated surface of the substrate W into contact with the second plating liquid in the plating liquid chamber 109. The substrate holder 8 holding the substrate W is pressed against the side wall 36 of the plating tank 35 by the pressing mechanism 115, whereby the hole holder 36a is closed by the substrate holder 8 holding the substrate W. In this state, the second plating liquid is supplied into the plating liquid chamber 109 to be in contact with the plated surface of the substrate W. Then, the substrate W is plated by applying a voltage between the substrate W and the anode 96. In the plating of the substrate W, the second plating solution circulates between the overflow tank (not shown) and the plating liquid chamber 109. That is, the second plating solution overflows from the plating liquid chamber 109 and flows into the overflow tank (not shown), and further returns to the plating liquid chamber 109.

When the substrate holder 8 is not shared with the immersion plating tank 34, that is, when the substrate holder 8 is used only for the plating tank 35, as shown in FIG. 18, it is also possible to provide communication at the lower portion of the substrate holder 8. The liquid discharge hole 117 in the above-mentioned sealed space. According to this configuration, even if the second plating liquid intrudes into the sealed space of the substrate holder 8, the second plating liquid can be discharged to the outside through the liquid discharge hole 117.

The nineteenth image shows an enlarged view of a region surrounded by the symbol A shown in Fig. 17. The substrate holder 8 has a protruding surface that protrudes in the normal direction of the substrate W (the surface 63a of the seal ring 63), and has a step portion 70 on the outer side of the protruding surface 63a. When the pressing mechanism 115 presses the substrate holder 8 against the side wall 36, the portion of the retainer ring 62 that is inside the annular step portion 70 is inserted into the hole 36a. in In this state, the annular step portion 70 extends so as to surround the open end of the outer side of the hole 36a. The substrate holder 8 has a third sealing portion 69 at its step 70. When the substrate holder 8 is pressed against the side wall 36 by the pressing mechanism 115, the third sealing portion 69 on the step 70 contacts the side wall 36. The third seal portion 69 is pressed against the outer surface 36b of the side wall 36 to seal the gap between the side wall 36 and the holding member 58 of the substrate holder 8.

In the fifth and eighth embodiments, the third sealing portion 69 constitutes the surface of the holding member 58 that protrudes most in the normal direction of the substrate W. However, in the embodiment shown in Fig. 19, the third sealing portion is provided. The portion 69 is disposed in the step portion 70. The first seal portion 66, the second seal portion 68, and the third seal portion 69 constitute a seal ring 63 integrally formed of an elastic material such as rubber. The configuration of the seal ring 63 shown in Fig. 19 is the same as that of the seal ring 63 shown in Figs. In other words, when the substrate holder 8 is used in the plating tank 35 shown in FIG. 7, one of the seal rings 63 constituting the most protruding surface of the substrate holder 8 functions as the third sealing portion 69, and the substrate holder 8 is used for In the case of the plating tank 35 shown in Fig. 17, one of the seal rings 63 on the step portion 70 of the retainer ring 62 functions as the third seal portion 69.

In order to agitate the plating solution in the vicinity of the surface of the substrate W, the stirring blade 130 should be disposed as close as possible to the surface of the substrate W. Therefore, when the substrate holder 8 is pressed against the side wall 36, the most protruding surface of the substrate holder 8, that is, the surface 63a of the seal ring 63 is preferably in the same plane as the inner surface 36c of the side wall 36. According to this configuration, the agitation paddle 130 can be disposed closer to the plated surface of the substrate W. Further, the surface 63a of the seal ring 63 may protrude from the plating liquid chamber side than the inner surface 36c of the side wall 36, and the agitating paddle 130 may be further brought closer to the plated surface of the substrate W.

The above cleaning device 140 can also be used in the dry plating tank 35 shown in FIG.

The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. The form of the application can of course be implemented in various forms within the scope of its technical idea.

36‧‧‧ side wall

36a‧‧ hole

54‧‧‧Base parts

58‧‧‧ Keeping parts

62‧‧‧Retainer ring

63‧‧‧Seal ring

64‧‧‧ Pressure ring

64a‧‧‧Protruding

65‧‧‧ spacers

66‧‧‧First seal

68‧‧‧Second seal

69‧‧‧ Third seal

70‧‧‧

74‧‧‧Clamps

74a‧‧‧Protruding

80‧‧‧Support surface

86‧‧‧Electrical conductor

88‧‧‧Electrical contacts

107‧‧‧ partition wall

109‧‧‧ plating solution chamber

W‧‧‧Substrate

Claims (12)

A plating apparatus comprising: a substrate holder that holds a substrate; an immersion plating tank that holds a first plating solution impregnated with the substrate holder holding the substrate; and a dry plating tank; Holding the second plating solution and having a hole in the side wall; and the conveyor transporting the substrate holder to the immersion plating tank and a predetermined position adjacent to the sidewall of the dry plating tank; and a pressing mechanism The substrate holder holding the substrate is pressed against the side wall of the dry plating tank, and the substrate holder holding the substrate blocks the hole, and the substrate holder includes a base member and a holding member. The first sealing portion seals a gap between the substrate and the holding member; the second sealing portion seals a gap between the base member and the holding member; and a third portion a sealing portion that seals a gap between the holding member and the side wall of the dry plating tank. The plating apparatus of claim 1, wherein the plating apparatus further includes an electrical contact connected to the plating power source, wherein the substrate holder includes a feeding terminal electrically connected to the substrate, The pressing mechanism presses the substrate holder holding the substrate against the side wall of the dry plating tank, and blocks the hole by the substrate holder holding the substrate, and presses the feed terminal against the electrical contact. The plating apparatus of claim 1, wherein the substrate holder has a protruding surface protruding from a normal direction of the substrate, and a step portion disposed on an outer side of the protruding surface, and the foregoing The third sealing portion is provided at the step portion, and the third sealing portion is pressed against the side wall by the pressing mechanism. The plating apparatus of claim 3, wherein when the substrate holder is pressed against the side wall, the protruding surface of the substrate holder is in the same plane as the inner surface of the side wall. A plating apparatus according to claim 1, wherein the first sealing portion, the second sealing portion, and the third sealing portion are formed of one sealing member. The plating apparatus of claim 1, wherein the dry plating tank comprises: an electrolyte chamber for holding the electrolyte; and a partition wall for the second plating solution and the electrolysis The liquid is isolated and the anode is disposed in the aforementioned electrolyte chamber. A plating apparatus according to claim 1, further comprising a cleaning device for cleaning the side wall of the dry plating tank, wherein the cleaning device has substantially the same shape and size as the substrate holder, and the conveyor system The cleaning device is configured to be transported to the predetermined position adjacent to the side wall of the dry plating tank. The plating apparatus of claim 7, wherein the cleaning device comprises: a cleaning member that is in contact with the sidewall of the dry plating tank; and a rotating mechanism that rotates the cleaning member that contacts the sidewall . The plating apparatus of claim 8, further comprising a cleaning nozzle that supplies the cleaning liquid to the cleaning member. The plating apparatus of claim 1, wherein the second plating liquid is a gold plating liquid. A cleaning device for use in a plating apparatus, the plating apparatus comprising: a substrate holder for holding a substrate; a dry plating tank for holding a plating solution and having a hole in the side wall; and a pressing mechanism The substrate holder holding the substrate is pressed against the side wall of the dry plating tank, and the substrate holder holding the substrate blocks the hole, and the cleaning device is characterized by: a cleaning member that is in contact with the dry type a side wall of the plating tank; and a rotating mechanism that rotates the cleaning member that contacts the side wall of the dry plating tank, and the cleaning device has substantially the same shape and size as the substrate holder. A cleaning device according to claim 11, further comprising a cleaning nozzle that supplies the cleaning liquid to the cleaning member.