JP2002363794A - Substrate holder and plating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To use, e.g. a member made of titanium excellent in corrosion resistance as a press ring, and to secure easy processing of the press ring and uniform and sufficient strength (stiffness) along the length (periphery) of the press ring. SOLUTION: In a substrate holder 18 which holds a substrate W so as to be freely attached and detached by disposing the substrate W between a fixed holding member 54 and a movable holding member 58, and rotating the press ring 62 in one direction so as to press the movable holding member 58 toward the fixed holding member 54, the press ring 62 is held by the movable holding member 58 in such a manner that the press ring 62 is freely rotatable and not detached, through a slide plate 64 which is fixed to the press ring 62 and has an engaging part 64c engaging with an engaging part 58e provided at the outer peripheral face of the movable holding member 58.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus for plating, for example, a surface to be plated of a substrate, and more particularly to a plating apparatus for forming a plating film on fine wiring grooves and holes and a resist opening provided on the surface of a semiconductor wafer or the like. The present invention relates to a substrate holder used for a plating apparatus or the like for forming or forming bumps (protruding electrodes) for electrically connecting a semiconductor chip and a substrate on a surface of a semiconductor wafer, and a plating apparatus having the substrate holder.

[0002]

2. Description of the Related Art For example, TAB (Tape Automated Bondi)
ng) and flip chips, gold, copper, solder, or nickel, or protruding connection electrodes (bumps) formed by laminating these layers at predetermined locations (electrodes) on the surface of the semiconductor chip on which wiring is formed Electrical connection to a substrate electrode or a TAB electrode via the bump is widely performed. As a method of forming the bump, there are various methods such as an electrolytic plating method, a vapor deposition method, a printing method, and a ball bump method. However, with the increase in the number of I / Os and the fine pitch of the semiconductor chip, miniaturization is possible. Electroplating methods, which have relatively stable performance, have been increasingly used.

[0003] Here, the electrolytic plating method is a jet type or cup type in which the surface to be plated of a substrate such as a semiconductor wafer or the like is placed horizontally with the surface to be plated facing down (face down), and a plating solution is blown up from below to perform plating. A substrate is vertically divided into a plating tank, and a plating solution is poured from under the plating tank and overflowed while the substrate is immersed in the plating solution to perform plating. The electroplating method employing the dip method has the advantages that bubbles that adversely affect the quality of plating are removed well, the footprint is small, and the wafer size can be easily changed. For this reason, it is considered that the size of the embedding hole is relatively large and is suitable for bump plating which requires a considerable time for plating.

In a conventional electroplating apparatus employing a dipping method, air bubbles can be easily removed, but a substrate such as a semiconductor wafer is sealed by sealing its end surface and back surface to expose the front surface (plated surface) and to be detached. A substrate holder for freely holding the substrate is provided, and the substrate holder is immersed in a plating solution together with the substrate to perform plating on the surface of the substrate.

[0005] Since the substrate holder is used by immersing it in a plating solution, for example, in the case of a sliding member constituting the substrate holder, which is required to have high rigidity, for example, it has corrosion resistance against an oxidizing environment. Titanium excellent in general is used. For example, in a substrate holder in which a pair of supports (holding members) presses the peripheral portion of the substrate and detachably holds the substrate, a holding ring made of titanium is attached to one of the supports, and By rotating the ring in one direction and pressing the support toward the other support, the outer peripheral portion of the substrate is sealed via a seal packing or the like.

[0006]

In a press ring used in a conventional substrate holder of this type, it is necessary to hold the press ring to the holder so as to be rotatable and unable to escape. For this reason, for example, a long hole extending along the rotation direction of the press ring is provided in the press ring, and a pin or the like having one end fixed to the support is inserted into the long hole, so that the press ring rotates using the long hole as a guide. In addition to this, a screw having a head larger in diameter than the width of the elongated hole is screwed onto the pin to prevent the holding ring from coming out.

However, if a process such as drilling is performed on a member (holding ring) made of titanium, which is generally difficult to process, this process is rather troublesome and requires a large number of processing steps. However, when the press ring is bored in this way, the strength (rigidity) partially decreases along the length (circumferential) direction of the press ring, thereby preventing the seal packing or the like from being pressed uniformly. There has been a problem that the pressing force may be excessive or insufficient, and as a result, the plating solution may leak.

It is to be noted that even if a pin having a large diameter is used as the pin or the like, and the strength (rigidity) of a part of the elongated hole along the length direction is locally increased through the pin or the like, the substrate holder cannot be used. In order to prevent an increase in size or the like, there is a certain limit to the diameter of a pin or the like, and it is difficult to secure sufficient strength (rigidity).

The present invention has been made in view of the above, and uses, for example, a titanium ring having excellent corrosion resistance as a holding ring, and furthermore, the ease of processing the holding ring and the length of the holding ring. It is an object of the present invention to provide a substrate holder capable of ensuring more uniform and sufficient strength (rigidity) along a (circumferential) direction and a plating apparatus having the substrate holder.

[0010]

According to the first aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member, and a holding ring is rotated in one direction to fix the movable holding member to the fixed holding member. In a substrate holder which is pressed toward a member and detachably holds a substrate, the substrate holder has an engaging portion fixed to the pressing ring and engaged with an engaging portion provided on an outer peripheral surface of the movable holding member. A substrate holder, wherein the holding ring is rotatably and irremovably held on the movable holding member via a slide plate.

Thus, the holding ring is rotatably and irreversibly held on the movable holding member via the slide plate attached to the holding ring, so that it is not necessary to provide a long hole or the like inside the holding ring. The workability of the holding ring can be ensured, and the strength (rigidity) of the holding ring can be prevented from being partially reduced along the length (circumferential) direction.

According to a second aspect of the present invention, the engaging portion provided on one of the slide plate or the movable holding member comprises a concave portion, and the engaging portion provided on the other comprises a convex portion fitted into the concave portion. The substrate holder according to claim 1, wherein:

According to a third aspect of the present invention, the surface of the slide plate is formed as a tapered surface, and the tapered surface is slid into a claw portion of a clamper erected on the fixed holding member to move the movable holding member to the movable holding member. 3. The substrate holder according to claim 1, wherein the substrate holder is pressed toward the fixed holding member. Thereby, the role of holding the holding ring on the holding member by the slide plate and the role of pressing the movable holding member toward the fixed holding member via the holding ring can be combined.

According to a fourth aspect of the present invention, the fixed holding member is provided with an upright block for abutting an outer peripheral end surface of the movable holding member to stop the holding ring. A substrate holder according to any one of 1 to 3. Accordingly, the holding ring can be prevented (prevented from shifting) by using the outer peripheral end surface of the movable holding member without providing a perforation or the like for holding the movement inside the holding ring.

According to a fifth aspect of the present invention, there is provided a slide plate having a fixed holding member and a movable holding member, and having an engaging portion which is engaged with an engaging portion provided on an outer peripheral surface of the movable holding member. The holding ring is rotatably and undetachably held on the movable holding member, and the holding ring is rotated in one direction to press the movable holding member toward the fixed holding member to hold the substrate detachably. A plating apparatus characterized by having a substrate holder set as described above.

[0016]

FIG. 1 is a block diagram showing an embodiment of the present invention.
35 will be described with reference to FIG. FIG. 1 shows an overall layout of a plating apparatus provided with a substrate holder according to an embodiment of the present invention. As shown in FIG. 1, a cassette 10 containing a substrate W such as a semiconductor wafer is mounted on the plating apparatus.
A cassette table 12, an aligner 14 for adjusting the position of the orientation flat and the notch of the substrate in a predetermined direction, and a spin dryer 16 for rotating the plated substrate at a high speed and drying it are provided along the same circumferential direction. ing. Further, at a position along the tangential direction of the circumference, a substrate attaching / detaching portion 20 for mounting the substrate holder 18 and attaching / detaching the substrate to / from the substrate holder 18 is provided. A substrate transfer device 22 composed of a transfer robot for transferring the substrate between them is arranged.

Note that, as shown in FIG.
2, a resist stripper 600 that strips and removes the resist 502 (see FIG. 35) applied to the surface of the substrate W, and removes an unnecessary seed layer 500 (see FIG. 35) after plating. A seed layer removing unit 602 and a heat treatment unit 604 for performing a heat treatment on the substrate W after plating may be provided. Instead of the heat treatment section 604, as shown in FIG. 3, a reflow section 606 for reflowing the plating film 504 (see FIG. 35) and an annealing section 608 for performing annealing after the reflow may be provided.

A stocker 24 for storing and temporarily placing the substrate holder 18 in order from the substrate attaching / detaching portion 20 side.
A pre-wet bath 26 for improving the hydrophilicity of the surface by immersing the substrate in pure water to wet it, and an oxide film having a large electric resistance on the surface of the seed layer formed on the surface of the substrate is removed by etching with a chemical such as sulfuric acid or hydrochloric acid. A presoak tank 28, a first washing tank 30a for washing the surface of the substrate with pure water, a blow tank 32 for draining the washed substrate, a second washing tank 30b, and a copper plating tank 34 are arranged in this order. The copper plating tank 34 is configured to house a plurality of copper plating units 38 inside an overflow tank 36, and each copper plating unit 38 houses one substrate inside and performs copper plating. ing. In this example, copper plating is described, but it goes without saying that the same applies to nickel, solder, and gold plating.

[0019] Further, located on the side of each of these devices,
A substrate holder transport device (substrate transport device) 40 that transports the substrate holder 18 together with the substrate W between these devices is provided. The substrate holder transport device 40 includes a first transporter 42 that transports a substrate between the substrate attaching / detaching portion 20 and the stocker 24, a stocker 24, a pre-wet tank 26, a pre-soak tank 28, water washing tanks 30a and 30b, and a blower. It has a second transporter 44 for transporting the substrate between the tank 32 and the copper plating tank 34.

On the opposite side of the overflow vessel 36 of the substrate holder transfer device 40, a paddle 202 (FIG. 30 and FIG. 30) serving as a stirring rod for stirring a plating solution, which is located inside each copper plating unit 38. A paddle driving device 46 for driving the driving device is disposed.

The substrate attaching / detaching portion 20 has a flat mounting plate 52 which is slidable in the horizontal direction along the rail 50, and two substrate holders 18 are arranged in parallel on the mounting plate 52 in a horizontal state. After the substrate is transferred between the one substrate holder 18 and the substrate transfer device 22, the mounting plate 52 is slid in the horizontal direction, and the other substrate holder 18 and the substrate transfer device 22 are slid. The transfer of the substrate W is performed between them.

As shown in FIGS. 6 to 15, the substrate holder 18 is, for example, a rectangular flat plate-shaped fixed holding member 54 made of vinyl chloride, and is attached to the fixed holding member 54 via a hinge 56 so as to be freely opened and closed. And a movable holding member 58. The movable holding member 58 has a base portion 58a and a ring-shaped portion 58b, and is made of, for example, vinyl chloride to improve sliding with a holding ring 62 described below.
A ring-shaped seal packing 60 having a substantially U-shaped cross section with one leg lengthened is attached to the surface of the fixed holding member 54 at the side b.

That is, the fitting portion 58 integrally covering the surface of the movable packing member 58 on the fixed holding member 54 side of the ring-shaped portion 58b of the movable packing member 58 is provided.
c is provided, and at the free end of the fitting portion 58c, a locking projection 58d as a locking portion is provided over the entire circumference of the ring-shaped portion 58b. On the other hand, at a position facing the locking projection 58d of the seal packing 60, a locking recess 60a as a locking portion for locking with the locking projection 58d is formed over the entire circumference of the seal packing 60. Is provided. Then, the end of the seal packing 60 on the fixed holding member 54 side is fitted into the fitting portion 58c of the movable holding member 58, and the locking projection 58d is fitted (locked) into the locking recess 60a. The seal packing 60 is attached to the ring-shaped portion 58b of the movable holding member 58.

With this configuration, the seal packing 60 is attached to the movable holding member 58 without using bolts, thereby eliminating the need to provide a mounting hole for inserting a bolt through the seal packing 60. The plating solution can be prevented from leaking into the seal packing 60 from the mounting hole.

That is, such a seal packing 60
Is generally performed by bolts, but if the seal packing 60 is mounted on the ring-shaped portion 58b of the movable holding member 58 by bolts, a sufficient tightening force can be secured at the bolt mounting portion and its surroundings. For example, when the substrate is removed, the seal packing 60 located between the bolts adjacent to each other is loosened, and the plating solution permeates between the movable holding member 58 and the seal packing 60 therefrom. Contamination accumulates here, and a gap is generated between the movable holding member 58 and the seal packing 60, and the plating solution that has penetrated the gap passes through the hole for bolt attachment and enters the inside of the seal packing 60. Will leak. According to this example, it is not necessary to provide a hole (through-hole) for bolt mounting that causes such a leakage of the plating solution, and it is possible to prevent the plating solution from leaking from such a through-hole. .

As described below, the electric contact 75 is accommodated in the accommodating recess 60c provided in the seal packing 60 to eliminate the necessity of providing a through-hole in the seal packing 60, so that the electric contact 75 is provided in the seal packing 60. The leakage of the plating solution from the through hole can be completely eliminated.

In this example, the locking projection 58d is provided over the entire circumference of the ring-shaped portion 58b.
Although the example in which 0a is provided over the entire circumference of the seal packing 60 is shown, it may be provided in a part facing each other. By being provided over the entire circumference, the locking convex portion 58d and the locking concave portion 60a are locked over the entire circumference, and the seal packing 60 and the movable holding member 58 can be interposed via the locking portion. The plating solution can be prevented from infiltrating into the seal packing 60, as shown in FIG.
Even if a through hole 60d for mounting the electric contact 75 is provided in the seal packing 60, the plating solution can be prevented from leaking into the seal packing 60 from the through hole 60d.

As described above, when the seal packing 60 is provided with the through-hole 60d for mounting the electrical contact 75, as shown in FIG. 12, the ring-shaped portion 58b of the movable holding member 58 of the seal packing 60 and Through hole 60 at the joint surface of
Two lips 60b extending in a ring shape over the entire length in the circumferential direction are provided concentrically at positions sandwiching d, and these lips 60b are crimped to the fitting portions of the ring-shaped portions 58b of the movable holding member 58. Thus, the effect of preventing the leakage of the plating solution can be further improved.

On the opposite side of the movable holding member 58 from the fixed holding member 54, a pressing ring 62 is rotatably and irreversibly held via a first slide plate 64 fixed to the pressing ring 62. The holding ring 62 has excellent corrosion resistance to an oxidizing environment and has sufficient rigidity, for example, is made of titanium. That is, as shown in detail in FIGS. 10 and 13, the first slide plate 64 extends from the top plate 64 a and both side ends of the top plate 64 a to the side of the ring-shaped portion 58 b of the movable holding member 58. It is formed in a U-shape in cross section from a pair of extending legs 64b. At the lower end of each of the legs 64b, there is provided a projection 64c for engagement projecting in the direction of the ring-shaped portion 58b of the movable holding member 58. On the other hand, the retaining ring 62 has a flange piece 62a protruding outward in the diameter direction.
In addition, an engaging concave portion 58e extending in the circumferential direction is formed at a position on the outer peripheral end surface of the movable holding member 58 facing the engaging convex portion 64c.

Thus, the flange piece 62a of the holding ring 62 is inserted into the inside of the first slide plate 64, and the bolt 66 is screwed into the first slide plate 64 so that the holding ring 62 is attached to the first slide plate 64. The convex portion 64c for engagement of the plate 64 is fitted into the concave portion 58e for engagement provided on the movable holding member 58, and the convex portion 64c is slid along the concave portion 58e. Pressing ring 62 is moved to movable holding member 58.
So as to be rotatable and unable to escape.

As described above, the holding ring 62 is rotatably and undetachably held on the movable holding member 58 via the first slide plate 64 attached to the holding ring 62, so that the elongated hole is formed inside the holding ring 62. It is not necessary to provide such a member, so that the workability of the holding ring 62 is ensured, and the strength (rigidity) of the holding ring 62 is prevented from being partially reduced along its length (circumferential) direction. be able to. By preventing the holding ring 62 from partially reducing its strength (rigidity) along its length (circumferential) direction as described above, the movable holding member can be held via the holding ring 62 as described below. When the short leg of the seal packing 60 is pressed against the surface of the substrate W and the long leg of the seal packing 60 is pressed against the surface of the fixed holding member 54, the pressing ring 62 partially By preventing bending, the seal packing 60 is pressed evenly and properly,
Thus, it is possible to prevent the plating solution from leaking between the seal packing 60 and the substrate W and between the seal packing 60 and the fixed holding member 54.

That is, the holding of the press ring 62 is generally performed by providing a long hole inside the press ring 62 and inserting a pin member fixed to the movable holding member 58 into the inside of the long hole. This is done by providing a head for preventing escape at the exposed end of the holding ring 62. According to this example, an elongated hole or the like that causes a reduction in workability and rigidity is formed inside the holding ring 62. Can be eliminated.

In this embodiment, three first slide plates 64 which also serve to hold the holding ring 62 on the movable holding member 58, and the first
An example is shown in which three second slide plates 68 not having such a role are mounted at equal intervals along the circumferential direction, located between the slide plates 64. That is,
As shown in FIG. 9, the second slide plate 68
The flange piece 62a of the press ring 62 is inserted into the inside, and the bolt 66 is screwed on, so that the press ring 62 is attached to the press ring 62.

The fixed holding member 54 is located outside the first slide plate 64 and the second slide plate 68.
, Inverted L-shaped clampers 70 each having a protruding portion 70a protruding inward are provided upright at equal intervals along the circumferential direction. The surfaces of the first slide plate 64 and the second slide plate 68 and the lower surface of the inwardly protruding portion 70a of the clamper 70 located so as to cover the surfaces have tapered surfaces inclined in opposite directions along the rotation direction. Has become.

As shown in FIG. 11, when the substrate W is mounted on the fixed holding member 54, the outer edge of the substrate W is guided to position the substrate W. A plurality of guide pins 71 (for example, 6
) Are provided. A bulging portion 58f that bulges outward is provided at a position facing the diametrical direction of the movable holding member 58, and the fixed holding member 54 comes into contact with the outer peripheral end face of the bulging portion 58f to hold down. An anti-vibration block 72 made of, for example, vinyl chloride is provided to perform anti-vibration (prevention of displacement during rotation) of the ring 62. Further, at a plurality of places (for example, four places) along the circumferential direction of the surface of the holding ring 62,
For example, a projection 73 composed of a rotating pin screwed into the holding ring 62 is provided, and the projection 73 is hooked by a rotating mechanism to hold the holding ring 62 with the first slide plate 64 and the second slide plate 64.
It is designed to rotate integrally with the slide plate 68.

As described above, the retaining block 72 provided on the fixed retaining member 54 is brought into contact with the bulging portion 58f of the movable retaining member 58 to prevent the retaining ring 62 from moving. By rotating the presser ring 62 via 73, it is not necessary to provide a hole or the like in the presser ring 62, and the rigidity of the presser ring 62 locally increases in a part along the length (circumferential) direction. It can be prevented from lowering.

When the substrate W is inserted into the center of the fixed holding member 54 with the movable holding member 58 opened, the substrate W is positioned at a predetermined position by the guide pins 71. In this state, the movable holding member 5 is
8 is closed, the holding ring 62 is rotated clockwise, and the slide plates 64 and 68 are slid into the protrusion 70a of the clamper 70, so that the fixed holding member 5
4 and the movable holding member 58 are tightened and locked to each other via a tapered surface, and the pressing ring 62 is rotated counterclockwise to pull out the slide plates 64 and 68 from the protrusion 70a of the inverted L-shaped clamper 70. Then, this lock is released.

Then, in this manner, the movable holding member 58
When the lock is locked, as shown in FIG.
The short leg on the inner peripheral surface side of 0 is pressed against the surface of the substrate W, and the long leg on the outer peripheral surface is pressed against the surface of the fixed holding member 54. Further, as described above, Since there is no place where the strength (rigidity) is partially reduced along the (circumferential) direction, the seal packing 60 is uniformly pressed to surely seal it.

As shown in FIGS. 9 and 10, a conductor (electric contact) 74 connected to an external electrode (not shown) is disposed on the fixed holding member 54, and the substrate W is attached to the fixed holding member 54. When placed, the end of the conductor 74 is exposed on the surface of the fixed holding member 54 on the side of the substrate W.

On the other hand, the conductor 74 of the seal packing 60
As shown in FIG. 14, a rectangular storage recess 60c is provided at a position facing the exposed portion of the storage recess 6c.
0c, an electrical contact 75 having a substantially U-shaped cross section and opening toward the fixed holding member 54 and having a leg 75a extending outward, exposing the leg 75a to the outside. And is fixedly adhered with an adhesive 77 such as silicon.

As described above, since the electrical contact 75 is stored and held in the storage recess 60c provided in the seal packing 60, it is necessary to provide a mounting hole (through hole) for mounting the electrical contact 75 in the seal packing 60. And the plating solution can be prevented from leaking into the seal packing 60 from such a through hole.

In this example, the adhesive 77 is embedded in the recess 60c for storage, and an adhesive force is obtained between the adhesive 77 and the seal packing 60 on the side surface of the recess 60c for storage. The electrical contact 75 may be bonded to the seal packing 60 via an adhesive on the rear side of the electrical contact 75. As shown in FIG. 12, a through hole 60d may be provided at a predetermined position of the seal packing 60, and the electrical contact 75 may be housed and fixed in the through hole 60d.

In this example, the electric contact 75 is formed by bundling a plurality of thin wires 78 made of a conductive spring material such as a gold wire into a plate shape. Each of the thin wires 78 constituting the wire 75 is individually separated and has a spring property due to the rigidity of the thin wire 78 itself.

FIG. 15 shows an example of manufacturing the electric contact 75. First, as shown in FIG. 15A, a plurality of thin wires 78 are arranged in parallel, and as shown in FIG. The region F excluding the outer peripheral edges is joined by, for example, pressing or soldering. Then, as shown in FIG. 1C, the regions joined to each other are manufactured by molding into a predetermined shape by, for example, press molding.

As described above, the electric contact 75 is constituted as a set of contacts by a plurality of thin wires 78 forming a contact of a spring structure, and each thin wire 78 is individually contacted. , The contact can be prevented, the contact with the plurality of fine wires 78 can be secured, and the contact failure can be reduced. In addition, by using relatively inexpensive thin wires 78 and providing the spring property at both ends of each thin wire 78 by the rigidity of the thin wires 78 itself, compared to the conventional electrical contact having a metal contact piece and a coil spring, The structure can be simplified and the cost can be reduced. In particular, by using a gold wire having a low electric resistance and excellent corrosion resistance as the fine wire 78, the electric resistance as a contact is suppressed to be low, and the electric contact 75 is corroded due to leakage of a plating solution or a cleaning solution. Can be prevented.

Further, according to this example, the seal packing 6
0, the electrical contact 75 is accommodated in the accommodating recess 60c, so that the seal packing 60 has the effect of absorbing the contact size, and the accommodating agent 77 is filled in the accommodating recess 60c. Is fixed, it is possible to prevent the inside of the storage recess 60c from being wet with the leaked plating solution or cleaning solution.

As described above, when the movable holding member 58 is locked as described above, the exposed portion of the conductor 74 is exposed at the position sealed by the seal packing 60, that is, in the region between the pair of feet of the seal packing 60. Is attached to the tip of one leg 75a located on the outer peripheral side of the
The substrate W comes into contact with the tip of the other leg 75 a located on the inner peripheral side of the electric contact 75 with the elastic force of each thin wire 78. As a result, the substrate W is sealed with the seal packing 60.
In the state where the substrate W is sealed by and held by the substrate holder 18, power can be supplied to the substrate W via the electric contact 75.

It is preferable that at least the surface of the conductor 74 that is in contact with the electric contact 75 is coated with metal, for example, by applying gold or platinum plating. Further, the conductor 74 may be made of stainless steel having excellent corrosion resistance.

The movable holding member 58 is opened and closed by the weight of the cylinder (not shown) and the movable holding member 58. That is, the fixed holding member 54 is provided with a through hole 54a, and a cylinder is provided at a position facing the through hole 54a when the substrate holder 18 is placed on the mounting plate 52. Thereby, the cylinder rod is extended and the through-hole 5
The base 58 of the movable holding member 58 is pressed by the pressing rod 79 through 4a.
The movable holding member 58 is opened by pushing a upward, and the movable holding member 58 is closed by its own weight by contracting the cylinder rod.

When the movable holding member 58 is opened,
As shown by a virtual line, the air ejection nozzle N disposed at a position facing the substrate W held by the substrate holder 18 on the movable holding member 58 side, for example, 4 kgf
By jetting oil-free air (OFA) or N ₂ gas at a pressure of about / cm ^{2, the} movable holding member 58 is opened while the substrate W after plating is attached to the movable holding member 58 side, and the substrate W It is designed to prevent falling off.

In this example, the movable holding member 58 is locked / unlocked by rotating the press ring 62. This lock / unlock mechanism is provided on the ceiling side. ing. That is, when the substrate holder 18 is mounted on the mounting plate 52, the lock / unlock mechanism is positioned at a position corresponding to each projection 73 of the holding ring 62 of the substrate holder 18 located at the center side. The holding plate 62 is lifted up, and the holding ring 62 is rotated by rotating the holding member about the axis of the holding ring 62 while holding the projection 73 with the holding member. Have been. This lock / unlock mechanism is provided by one,
After locking (or unlocking) one of the two substrate holders 18 mounted on the substrate, the mounting plate 52 is slid laterally to lock (or unlock) the other substrate holder 18. It has become.

The substrate holder 18 is provided with a sensor for confirming the contact state between the substrate W and the contacts when the substrate W is mounted, and a signal from this sensor is input to a controller (not shown). It has become so.

A pair of substantially T-shaped hands 76 serving as support portions for transporting and suspending and supporting the substrate holder 18 are connected to an end of the fixed holding member 54 of the substrate holder 18. Then, in the stocker 24, the protruding end of the hand 76 is hooked on the upper surface of the peripheral wall so as to be suspended and held vertically, and the hand 76 of the suspended and held substrate holder 18 is moved to the substrate holder transport device 40. The substrate holder 18 is transported while being held by the transporter 42. In the pre-wet tank 26, the pre-soak tank 28, the washing tanks 30a and 30b, the blow tank 32, and the copper plating tank 34, the substrate holder 18 is
And are suspended and held on their peripheral walls.

FIGS. 16 and 17 show a linear motor section 80 which is a traveling section of the substrate holder transfer device 40.
The linear motor portion 80 includes a base 82 extending in a long shape.
And two sliders 8 running along the base 82
And sliders 84 and 8 respectively.
The transporters 42 and 44 are mounted on the upper surface of 6. A cable bear (registered trademark) bracket 88 and a cable bear receiver 90 are provided on a side portion of the base 82, and a cable bear 92 extends along the cable bear bracket 88 and the cable bear receiver 90. .

As described above, by adopting the linear motor system as the moving system of the transporters 42 and 44, long-distance movement can be realized and the transporters 42 and 44 can be moved.
By shortening the length of the device 44, the overall length of the apparatus can be made shorter, and components requiring precision and maintenance such as a longer ball screw can be reduced.

FIGS. 18 to 21 show one of the transporters 42. FIG. Note that the other transporter 44 has basically the same configuration, and a description thereof will be omitted here. The transporter 42 includes a transporter main body 100.
An arm 102 projecting laterally from the transporter main body 100; an arm lifting mechanism 104 for lifting and lowering the arm 102; an arm rotating mechanism 106 for rotating the arm 102; It mainly comprises a gripping mechanism 108 provided to grip the hand 76 of the substrate holder 18 in a detachable manner.

As shown in FIGS. 18 and 19, the arm lifting mechanism 104 includes a rotatable ball screw 110 extending in the vertical direction and a nut 112 screwed to the ball screw 110. LM base 114
Are connected. Then, the transporter body 100
A timing belt 122 is stretched between a driving pulley 118 fixed to a driving shaft of a lifting motor 116 fixed to the motor and a driven pulley 120 fixed to an upper end of the ball screw 110. As a result, the ball screw 110 rotates with the driving of the lifting motor 116, and the ball screw 1
LM base 11 connected to nut 112 screwed into 10
4 moves up and down along the LM guide.

As shown by the imaginary line in FIG. 19, the arm rotating mechanism 106 has a sleeve 134 rotatably housed therein and fixed to the LM base 114 via a mounting base 132, and a sleeve 134. And a rotation motor 138 attached to the end of the motor base 136 via a motor base 136. A timing belt 14 is provided between a driving pulley 140 fixed to a driving shaft of the rotation motor 138 and a driven pulley 142 fixed to an end of the rotating shaft 130.
4 has been bridged. Thereby, the rotation motor 1
The rotation shaft 130 rotates with the driving of the drive shaft 38. Then, the arm part 102 is
To the rotating shaft 130 via a coupling 146.
It moves up and down as one unit and rotates.

The arm 102 is shown by the phantom line in FIG.
As shown in FIG. 0 and FIG. 21, a pair of side plates 150 and 1 that are connected to the rotating shaft 130 and rotate integrally with the rotating shaft 130.
50, and the gripping mechanism 10 is provided between the side plates 150, 150.
8 are arranged. In this example, two gripping mechanisms 108 are provided, but they have the same configuration, and only one of them will be described.

The gripping mechanism 108 has an end portion at the side plates 150, 1
A fixed holder 152 housed in the width direction between the fixed holders 152, a guide shaft 154 inserted through the inside of the fixed holder 152, and a movable holder 156 connected to one end (the lower end in FIG. 21) of the guide shaft 154. are doing. The fixed holder 152 is connected via a cylinder joint 160 to a width direction moving cylinder 158 attached to one side plate 150. On the other hand, a shaft holder 162 is attached to the other end (upper end in FIG. 21) of the guide shaft 154.
2 is the cylinder connector 1
64.

Thus, the cylinder 158 for moving in the width direction is formed.
With the operation of the fixed holder 152, the movable holder 156
Together with the side plates 150, 150 in the width direction thereof.
The guide 56 moves up and down while being guided by the guide shaft 154.

When the gripping mechanism 108 grips the hand 76 of the substrate holder 18 suspended and held by the stocker 24 or the like, the movable holder 15 is held while preventing interference with the hand 76.
6 is lowered to this lower position, and then the width-moving cylinder 158 is operated to position the fixed holder 152 and the movable holder 156 at positions where the hand 76 is sandwiched from above and below.
In this state, the vertical movement cylinder 166 is operated,
The movable holder 156 is replaced with the fixed holder 152 and the movable holder 15.
6 to hold it. Then, this gripping is released by performing the reverse operation.

Note that, as shown in FIG.
A concave portion 76a is provided on one side of the hand 76, and a protrusion 168 that fits into the concave portion 76a is provided at a position of the movable holder 156 corresponding to the concave portion 76a, to secure this gripping. It is configured to be able to.

FIGS. 22 to 25 show a copper plating tank 34 containing four copper plating units 38 in two rows. The copper plating tank 34 shown in FIG. 1 in which the eight copper plating units 38 are accommodated in two rows has basically the same configuration. The same is true even if the number of copper plating units is further increased.

The copper plating tank 34 has an overflow tank 36 formed in a rectangular box shape opened upward, and the upper end of the peripheral wall 170 of the overflow tank 36
Peripheral wall 17 of each copper plating unit 38 housed inside
It is configured to protrude above the upper end 180 of the second. When the copper plating unit 38 is stored in the inside, a plating solution flow path 174 is formed around the copper plating unit 38, and a pump suction port 178 is provided in the plating solution flow path 174. Thus, the plating solution that has overflowed the copper plating unit 38 flows through the plating solution channel 174 and is discharged to the outside from the pump suction port 178. The overflow tank 36 is provided with a liquid leveler for uniformly adjusting the liquid level of the plating solution in each plating unit 38.

Here, as shown in FIGS. 22 and 24,
A fitting groove 182 serving as a guide for the substrate holder 18 is provided on the inner peripheral surface of the copper plating unit 38. Then, as shown in FIG. 24, the plating solution Q that has overflowed the plating unit 38 is collected in the overflow tank 36, and is collected by the vacuum pump 320 into a temperature adjustment tank 321, a filter 322, a deaeration unit (deaerator) 328, dissolved oxygen concentration measuring device 340, the plating solution circulating system C ₃ via a flow meter 323 back into the interior of the plating units 38 are provided. The deaeration unit 328 is a vacuum pump that removes various dissolved gases such as oxygen, air, and carbon dioxide present in the plating solution Q through a diaphragm that does not permeate the liquid but permeates only the gas. 329.

[0067] Furthermore, branches into the plating solution circulating system C _3, for example, taking out a 1/10 of the total plating solution volume analyzes the plating solution, adding a component to be insufficient in the plating solution on the basis of the analysis result A plating solution management device 610 is provided. The plating solution management device 610 includes a plating solution adjustment tank 612, and adds a component that is insufficient in the plating solution adjustment tank 612. A temperature controller 614 and a sample are stored in the plating solution adjustment tank 612. A plating solution analysis unit 616 for taking out and analyzing is provided. Then, as the pump 618 is driven,
Plating solution is made to return the plating solution circulating system C ₃ from the plating solution regulating tank 612 through the filter 620.

In this example, the feed-forward control for adding a missing component by predicting disturbances such as the plating processing time and the number of plated substrates, and analyzing the plating solution, and based on the analysis results, the plating solution And feedback control for adding a component that is insufficient to the control. Needless to say, only feedback control may be performed.

The plating solution management device 610 includes, for example,
As shown in FIG. 4, the cassette table 12, the substrate attaching / detaching portion 20, the stocker 24, the pre-wet tank 26, the pre-soak tank 28, the washing tanks 30a and 30b, the copper plating tank 34, and the like are disposed inside a housing 609. But
As shown in FIG. 5, it may be arranged outside the housing 609.

As shown in FIG. 25, a cathode 184 and an anode 186 for empty electrolysis are disposed inside the plating solution flow path 174 of the overflow tank 36. The anode 186 is made of, for example, a basket made of titanium and has a chip made of copper or the like put therein.
As a result, the overflow tank 36 serves as a plating tank to eliminate the unevenness of the plating film between the copper plating units 38, increase the electrode surface of empty electrolysis, and increase the efficiency of empty electrolysis. A large part of the circulating plating solution passes through the empty electrolytic portion, so that a uniform plating solution state can be easily formed.

Even in the pre-wet tank 26, as shown in FIG. 26, pure water overflowing the pre-wet unit 26a is collected in an overflow tank 26b, and this is collected by a vacuum pump 320 into a temperature control tank 321 and a filtration filter 322. Deaeration unit (deaerator) 328, flow meter 3
Pure water circulation system C ₄ to return to the interior of the pre-wet unit 26a through 23 is provided. Deaeration unit 328
Is provided with a vacuum pump 329 that removes various dissolved gases such as oxygen, air, and carbon dioxide present in the liquid through a diaphragm that does not transmit the liquid but transmits only the gas to the flow path of the pure water. . Furthermore, the pure water tank 330 is provided for supplying pure water to the pure water circulation C _4.

FIG. 27 shows a cross section of the copper plating unit 38. As shown in FIG. 27, when the substrate holder 18 on which the substrate W is mounted is arranged along the fitting groove 182 (see FIGS. 22 and 24) inside the copper plating unit 38,
An anode 200 is disposed at a position facing the surface of the substrate W, and a paddle (stirring bar) 202 is disposed substantially vertically between the anode 200 and the substrate W. The paddle 202 includes a paddle driving device 46 described in detail below.
Thereby, it is possible to reciprocate in parallel with the substrate W.

As described above, by disposing the paddle 202 between the substrate W and the anode 200 and reciprocating the paddle 202 in parallel with the substrate W, the flow of the plating solution along the surface of the substrate W is reduced. By making the entire surface more uniform, a plating film having a more uniform film thickness can be formed over the entire surface of the substrate W.

In this example, the substrate W and the anode 20
0, a central hole 204a corresponding to the size of the substrate W
A regulation plate (mask) 204 provided with is provided. Thus, the potential of the peripheral portion of the substrate W can be lowered by the regulation plate 204, and the thickness of the plating film can be made more uniform.

FIG. 28 shows a copper plating tank 3 of this plating apparatus.
FIG. 29 shows a cross section of a portion where 4 is arranged, and FIG. 29 shows details of a plating solution injection portion in FIG. As shown in FIG. 28, a plating solution is supplied from the plating solution supply pipe 206 below the inside of the copper plating unit 38, and the plating solution overflowing the overflow tank 36 passes through a lower plating solution discharge pipe 208. Is discharged.

Here, as shown in FIG. 29, the plating solution supply pipe 206 is opened at the bottom of the copper plating unit 38 into the inside of the copper plating unit 38, and a rectifying plate 210 is attached to the opening end. Then, a plating solution is injected into the copper plating unit 38 through the current plate 210. One end of a drain pipe 212 is attached to the position surrounding the plating liquid supply pipe 206 so as to open to the copper plating unit 38, and a plating liquid discharge pipe 208 is connected to the other end of the drain pipe 212 via a vent pipe 214. Are linked. Thus, the plating solution in the vicinity of the plating solution supply pipe 206 is discharged from the drainage pipe 212 and the plating solution discharge pipe 208, and the plating solution is prevented from staying there.

FIGS. 30 and 31 show the paddle driving device 46.
Is shown. In this example, a plurality of paddle driving devices 46
30 and FIG. 31 show only two, but all have the same configuration, so only one of them will be described, and the other components will be denoted by the same reference numerals and description thereof will be omitted. .

The paddle driving device 46 includes a paddle driving motor 220, a crank 222 having a base end connected to a drive shaft of the motor 220, a cam follower 224 attached to a tip of the crank 222, and a cam follower 2.
24 has a slider 228 having a grooved cam 226 on which it slides. The paddle shaft 230 is connected to the slider 228, and the paddle shaft 230
Are arranged so as to cross the copper plating tank 34. The paddle 202 is suspended from a predetermined position along the length of the paddle shaft 230 and supported by a shaft guide 232 so as to permit only reciprocating movement along the length.

As a result, the crank 222 rotates with the driving of the paddle driving motor 220, and the rotation of the crank 222 is controlled by the slider 228 and the cam follower 2.
The linear motion of the paddle shaft 230 is converted through the paddle shaft 230, and the paddle 202
However, as described above, it reciprocates in parallel with the substrate W.

In the case where the diameter of the substrate is different, this can be easily dealt with by arbitrarily adjusting the mounting position of the paddle 202 with respect to the paddle shaft 230. Further, since the paddle 202 is constantly reciprocating during the plating process, wear occurs, causing particles to be generated due to mechanical sliding. In this example, the structure of the paddle supporting portion is improved. By doing so, durability can be improved and the occurrence of problems can be significantly reduced.

A series of bump plating processes by the plating apparatus configured as described above will be described. First, as shown in FIG. 35A, a seed layer 500 as a power supply layer is formed on the surface, and a height H of, for example, 2 is formed on the surface of the seed layer 500.
After applying a resist 502 of 0 to 120 μm on the entire surface,
At a predetermined position of the resist 502, for example, the diameter D is 2
The substrate provided with the opening 502a of about 0 to 200 μm is placed on the cassette 10 with its surface (plated surface) up.
And the cassette 10 is mounted on the cassette table 12.

One substrate is taken out of the cassette 10 mounted on the cassette table 12 by the substrate transfer device 22,
It is placed on the aligner 14 and the position of the orientation flat or notch is adjusted in a predetermined direction. The substrate aligned by the aligner 14 is transported to the substrate attaching / detaching portion 20 by the substrate transport device 22.

In the board attaching / detaching section 20, the stocker 24
The two substrate holders 18 housed therein are simultaneously gripped by the gripping mechanism 108 of the transporter 42 of the substrate holder transport device 40, and the arm 102 is raised via the arm lifting mechanism 104. The substrate holder 18 is conveyed to 20 and the arm unit 102 is rotated by 90 ° via the arm unit rotating mechanism 106 to make the substrate holder 18 horizontal. Thereafter, the arm unit 102 is lowered via the arm unit lifting mechanism 104, whereby the two substrate holders 18 are simultaneously mounted on the mounting plate 52 of the substrate attaching / detaching unit 20, and the cylinder is operated. Movable holding member 58 of substrate holder 18
Open.

In this state, the substrate transferred by the substrate transfer device 22 is inserted into the substrate holder 18 located on the center side, the cylinder is reversely operated to close the movable holding member 58, and thereafter, the lock and unlock mechanism is used. The movable holding member 58 is locked. After the mounting of the substrate on one of the substrate holders 18 is completed, the mounting plate 52 is slid in the lateral direction, and the substrate is mounted on the other substrate holder 18 in the same manner. Return 52 to its original position.

Thus, the substrate is exposed in a state where the surface to be plated is exposed from the opening of the substrate holder 18.
The surroundings are sealed by a seal packing 60 so that the plating solution does not infiltrate, and are fixed by the seal so as to be electrically connected to a plurality of contacts at portions not in contact with the plating solution. Here, wiring is connected from the contact to the hand 76 of the substrate holder 18, and power can be supplied to the seed layer 500 of the substrate by connecting a power source to the hand 76.

Next, two substrate holders 18 on which the substrates are mounted are simultaneously gripped by the gripping mechanism 108 of the transporter 42 of the substrate holder transporting device 40, and the arm 102 is raised via the arm lifting mechanism 104. To the stocker 24, and the arm unit 1 via the arm rotating mechanism 106.
02 is rotated 90 ° to bring the substrate holder 18 into a vertical state, and then the arm 102 is lowered via the arm lifting mechanism 104, whereby the two substrate holders 18 are suspended from the stocker 24. Hold (temporary placement).

The substrate transfer device 22 and the substrate attaching / detaching portion 2
In the transporter 42 of the transporter 40 and the substrate holder transport device 40, the above-described operation is sequentially repeated, and the substrates are sequentially mounted on the substrate holders 18 accommodated in the stocker 24, and are sequentially suspended and held at predetermined positions of the stocker 24 ( Temporarily).

A sensor provided on the substrate holder 18 for checking the contact state between the substrate and the contact. If the contact state is determined to be defective, a signal is input to a controller (not shown). .

On the other hand, in the other transporter 44 of the substrate holder transfer device 40, the substrate is mounted and the stocker 2 is mounted.
4 are simultaneously held by the holding mechanism 108, the arm 102 is lifted via the arm lifting mechanism 104, and then transported to the pre-wet tank 26. The arm unit 102 is lowered via the elevating mechanism 104, whereby the two substrate holders 18 are placed in the pre-wet bath 26, for example, immersed in pure water to wet the surface of the substrate, thereby improving the hydrophilicity of the surface. Better. It is needless to say that the water is not limited to pure water as long as it can wet the surface of the substrate and replace the air in the hole with water to improve the hydrophilicity.

At this time, the sensor for checking the contact state between the substrate and the contact provided on the substrate holder 18 and the substrate holder 18 containing the substrate judged to be defective in the contact state is stored in the stocker 24. Keep it temporarily. Thereby, even if a contact failure occurs between the substrate and the contact when the substrate is mounted on the substrate holder 18, the plating operation can be continued without stopping the apparatus.
The substrate having the poor contact is not subjected to the plating process. In this case, it is possible to cope with this by removing the unplated substrate from the cassette after returning the cassette.

Next, the substrate holder 18 on which the substrate is mounted
Is transported to the presoak tank 28 in the same manner as described above, and the substrate is immersed in a chemical solution such as sulfuric acid or hydrochloric acid put in the presoak tank 28 to etch an oxide film having a large electric resistance on the surface of the seed layer, and to clean the metal Expose the surface. Further, the substrate holder 18 on which the substrate is mounted is transported to the washing tank 30a in the same manner as described above, and the surface of the substrate is washed with pure water in the washing tank 30a.

The substrate holder 18 on which the rinsed substrate is mounted is conveyed to the copper plating tank 34 filled with the plating solution and suspended and held by the copper plating unit 38 in the same manner as described above. Transporter 44 of substrate holder transfer device 40
The above operation is sequentially repeated, and the substrate holder 18 on which the substrate is mounted is sequentially transferred to the copper plating unit 38 of the copper plating tank 34 and suspended and held at a predetermined position.

After the suspension and holding of all the substrate holders 18 are completed, the plating solution is supplied from the plating solution supply pipe 206,
A plating voltage is applied between the anode 200 and the substrate while the plating solution overflows in the overflow tank 36, and at the same time, the paddle 202 is reciprocated in parallel with the surface of the substrate by the paddle driving device 46, so that the surface of the substrate is Apply plating. At this time, the substrate holder 18 is suspended and fixed by the hand 76 above the copper plating unit 38, and power is supplied from the plating power supply to the seed layer through the hand fixing unit, the hand, and the contact.

The plating solution is a copper plating unit 38.
Flows into the copper plating unit 38 from the lower part, overflows from the outer peripheral part of the upper part of the copper plating unit 38, adjusts the concentration, removes foreign substances by using a filter, and flows into the copper plating unit 38 again from the lower part of the copper plating unit 38 I do. By this circulation, the concentration of the plating solution is always kept constant. At this time, by applying a voltage for empty electrolysis between the cathode 184 for empty electrolysis and the anode 186, the state of the plating solution can be made more uniform.

After plating is completed, application of a plating power supply
The supply of the plating solution and the reciprocating motion of the paddle are stopped, and the two substrate holders 18 on which the substrates after plating are mounted are simultaneously held by the holding mechanism 108 of the transporter 44 of the substrate holder transporting device 40. The substrate is conveyed to the tank 30b, and is immersed in pure water in the washing tank 30b to wash the surface of the substrate with pure water. Thereafter, the substrate holder 18 on which the substrate is mounted is transported to the blow tank 32 in the same manner as described above, where the substrate holder 1 is blown by air.
The water droplets adhering to 8 are removed. Thereafter, the substrate holder 18 on which the substrate is mounted is returned to a predetermined position of the stocker 24 and suspended and held in the same manner as described above.

The transporter 44 of the substrate holder transporting device 40 repeats the above operations sequentially, and returns the substrate holders 18 on which the plated substrates have been mounted to the predetermined positions of the stocker 24, and suspends them.

On the other hand, in the other transporter 42 of the substrate holder transporting apparatus 40, two substrate holders 18, which have mounted the plated substrates and returned to the stocker 24, are simultaneously held by the holding mechanism 108, In the same manner as described above, it is mounted on the mounting plate 52 of the substrate attaching / detaching portion 20. At this time, the sensor for checking the contact state between the substrate and the contact provided on the substrate holder 18 is used. At the same time, they are transported and placed on the placement plate 52.

Then, the substrate holder 18 located at the center side
Of the movable holding member 58 is unlocked via a lock / unlock mechanism, and the cylinder is operated to move the movable holding member 58.
open. At this time, toward the substrate W held by the substrate holder 18, from the air jet nozzles N arranged in the movable holding member 58 side to jet the oil-free air or N ₂ gas, the substrate W is sticking to the movable holding member 58 This prevents the movable holding member 58 from opening while being held. In this state, the substrate after the plating process in the substrate holder 18 is taken out by the substrate transfer device 22, carried to the spin dryer 16, and the substrate that has been spin-dried (drained) by the high-speed rotation of the spin dryer 16 is used by the substrate transfer device 22. Return to cassette 10.

Then, after the substrate mounted on one substrate holder 18 is returned to the cassette 10 or in parallel with this, the mounting plate 52 is slid in the horizontal direction, and similarly, the other substrate holder 18 The substrate mounted on the substrate is spin-dried and returned to the cassette 10.

After returning the mounting plate 52 to the original state,
The substrate holder 18 from which the substrate has been taken out is transferred to the substrate holder transport device 4.
The two transporters 42 are simultaneously gripped by the gripping mechanism 108 of the transporter 42, and returned to a predetermined position of the stocker 24 in the same manner as described above. Thereafter, the two substrate holders 18 on which the plated substrates have been mounted and returned to the stocker 24 are simultaneously gripped by the gripping mechanism 108 of the transporter 42 of the substrate holder transport device 40, and the substrate attaching / detaching portion 20 And the same operation as described above is repeated.

Then, all the substrates are taken out from the substrate holder 18 in which the substrates after the plating process are mounted and returned to the stocker 24, spin-dried and returned to the cassette 10, and the operation is completed. As a result, as shown in FIG. 35B, a substrate W in which the plating film 504 is grown in the opening 502a provided in the resist 502 is obtained.

As shown in FIG. 2, in a plating apparatus including a resist stripping section 600, a seed layer removing section 602, and a heat treatment section 604, the substrate W spin-dried as described above is first treated with a resist. The resist 502 on the substrate W is peeled and removed as shown in FIG. 35 (c) by being transported to the peeling unit 600 and immersed in a solvent such as acetone having a temperature of 50 to 60 ° C., for example. And this resist 50
2 is transferred to the seed layer removing unit 602,
As shown in FIG. 35D, the unnecessary seed layer 500 exposed to the outside after the plating is removed. Next, the substrate W is transported to a heat treatment section 604 composed of, for example, a diffusion furnace, and the plating film 504 is reflowed, whereby the substrate W shown in FIG.
(E) As shown in FIG.
6 is formed. Further, the substrate W is heated to, for example, 100 ° C.
Annealing is performed at the above temperature to remove the residual stress in the bump 506. Note that, as described below, in the case of a bump formed by multi-layer plating, the bump 506 is alloyed by annealing as described above. Then, the substrate after the annealing is returned to the cassette 10 to complete the operation.

Further, as shown in FIG.
In a plating apparatus provided with a reflow section 606 and an annealing section 608 instead of the reflow section 604,
The reflow of the plating film 504 is performed, and the substrate after the reflow is transported to the annealing section 608 to be annealed.

In this example, a stocker 24 for vertically storing the substrate holder 18 is disposed between the substrate attaching / detaching portion 20 and the copper plating unit 38, and the substrate between the substrate attaching / detaching portion 20 and the stocker 24 is disposed. The transfer of the holder 18 is performed by the first transporter 42 of the substrate holder transfer device 40 by the stocker 2.
By transporting the substrate holder 18 between the substrate holder 4 and the copper plating unit 38 by the second transporter 44, the unused substrate holder 18 is stored in the stocker 24, and the stocker 24 is sandwiched. The transfer of the substrate holder 18 before and after is smoothly performed to improve the throughput. Needless to say, all transports may be performed by one transporter.

Further, a robot having a dry hand and a wet hand is used as the substrate transfer device 22, and the wet hand is used only when the substrate after plating is taken out from the substrate holder 18, and the dry hand is used for the others. ing. The back surface of the substrate is kept out of contact with the plating solution by the seal of the substrate holder 18, and in principle, it is not always necessary to use a wet hand. Plating solution contamination due to wraparound or poor sealing occurs, and this contamination can be prevented from contaminating the back surface of a new substrate.

Further, a substrate cassette 10 having a bar code attached thereto is used, and the stocker 24 of the substrate holder 18 is further provided.
The usage state of the substrate holder 18 such as the storage position in the inside, the relationship between the substrate cassette 10 and the substrate W stored in the cassette 10, the substrate W taken out from the substrate holder 18 and the substrate holder 1
For example, by inputting the relationship with the control panel 8 from the control panel, the substrate before the plating process taken out from the substrate cassette 10 is returned to the original position after the plating process, and the processing state of the substrate W and the state of the substrate holder 18 are performed. Can be monitored. Note that the substrate itself may be managed as it is by attaching a barcode to the substrate itself.

FIG. 32 and FIG. 33 show another example of the plating apparatus, which is provided with a plating tank for performing different kinds of plating so that the process can be freely performed. That is, FIG. 32 shows a plating section provided with a plating tank for performing different types of plating, which includes a stocker 24, a temporary placing table 240, and a pre-wet tank 2.
6, a presoak tank 28, a first washing tank 30a, a nickel plating tank 244 in which a plurality of nickel plating units 242 for applying nickel plating to the surface of the substrate are accommodated in an overflow tank 36a, a second washing tank 30b, and a surface of the substrate. Plating bath 34 containing a plurality of copper plating units 38 in the overflow bath 36, a third washing bath 30c, a blow bath 32, a fourth washing bath 30d, and solder plating on the surface of the substrate. And a solder plating tank 248 in which a plurality of solder plating units 246 are housed in the overflow tank 36b.

Note that these nickel plating units 2
The configuration of the solder plating unit 42 and the solder plating unit 246 is basically the same as the copper plating unit 38.
The configurations of 44 and the solder plating tank 248 are basically the same as those of the copper plating tank 34. Other configurations are the same as those described above.

According to this plating apparatus, while the substrate is mounted on the substrate holder 18, the surface of the substrate is nickel-plated.
Copper plating and solder plating are sequentially performed to
A bump or the like by multilayer plating made of copper-solder can be formed by a series of operations.

In this example, four nickel plating units 242 and four copper plating units 38 and 14 are used.
In the example shown in FIG. 34, there are four solder plating units 246 (a total of 22 plating units). For example, as shown in FIG.
It is needless to say that the number of each of these plating units can be arbitrarily changed, for example, the number of each of the plating units is, for example, the number of the copper plating units 38 and the 18 solder plating units 246 (a total of 26 plating units). Of course, the metal to be plated can be changed arbitrarily.

The bumps formed by multi-layer plating include the N
In addition to i-Cu-solder, Cu-Au-solder, Cu-
Ni-solder, Cu-Ni-Au, Cu-Sn, Cu-
Pd, Cu-Ni-Pd-Au, Cu-Ni-Pd, N
i-solder, Ni-Au and the like. Here, the solder may be either a high melting point solder or a eutectic solder.

Further, a bump formed by Sn-Ag multi-layer plating or a bump formed by Sn-Ag-Cu multi-layer plating may be annealed to alloy these as described above. Thereby, the conventional Sn-P
Unlike b solder, it is Pb-free and can eliminate environmental problems caused by α rays.

Here, in this example, a local exhaust duct 250 is provided in parallel with the substrate holder transfer device 40 side, and a plurality of exhaust ducts communicating with the local exhaust duct 250 are provided as shown in FIG. By suctioning through the holes 252, a one-way air flow toward the local exhaust duct 250 is generated, so that a one-way air flow from below the plating tanks and the like to the ceiling is generated. In this way, by generating a one-way air flow toward the local exhaust duct 250 and putting steam evaporated from each plating tank on this flow, contamination of the substrate or the like by the steam can be prevented.

As described above, according to this plating apparatus, by setting the cassette containing the substrates on the cassette table and starting the apparatus, the electrolytic plating employing the dipping method is performed automatically, and the plating is performed. A metal plating film suitable for a bump or the like can be automatically formed on the surface of the substrate.

[0115]

As described above, according to the present invention,
The holding ring is rotatably and irremovably held on the movable holding member via a slide plate attached to the holding ring, so that it is not necessary to provide a long hole or the like inside the holding ring, thereby facilitating processing of the holding ring. Property can be ensured. Moreover, it is possible to prevent the strength (rigidity) of the presser ring from partially decreasing along its length (circumferential) direction, thereby pressing the seal gasket more uniformly, and thereby securing the seal ring and the fixed side member. Can be prevented from leaking out of the plating solution.

[Brief description of the drawings]

FIG. 1 is an overall layout view of a plating apparatus including a substrate holder according to an embodiment of the present invention.

FIG. 2 is an overall layout view of a plating apparatus showing a modification of FIG.

FIG. 3 is an overall layout view of a plating apparatus showing another modification of FIG. 1;

FIG. 4 is a layout view of a plating apparatus showing still another modified example of FIG. 1;

FIG. 5 is a layout view of a plating apparatus showing still another modified example of FIG.

FIG. 6 is a plan view of a substrate holder.

FIG. 7 is a sectional view taken along line AA of FIG. 6;

FIG. 8 is a right side view of FIG.

FIG. 9B shows a state where the substrate holder is locked.
FIG. 4 is a cross-sectional view taken along line B.

FIG. 10 is an enlarged view of a portion D in FIG. 7 in a state where the substrate holder is unlocked.

FIG. 11 is an enlarged view of a portion C in FIG. 7 in a state where the substrate holder is unlocked.

FIG. 12 is an enlarged view showing a modified example of the seal packing.

FIG. 13 is a perspective view showing a slide plate.

FIG. 14 is a rear view showing a mounting portion of the seal packing for the electric contact.

FIG. 15 is a diagram showing a manufacturing example of the electrical contact in the order of steps.

FIG. 16 is a plan view showing a linear motor section (running section) of the substrate holder transfer device.

FIG. 17 is a front view of FIG. 16;

FIG. 18 is a front view of a transporter.

FIG. 19 is a plan view showing the arm unit rotation mechanism of the transporter by phantom lines.

FIG. 20 is a plan view of a gripping mechanism provided in the arm unit.

FIG. 21 is also a vertical sectional front view.

FIG. 22 is a plan view of a copper plating tank.

FIG. 23 is a vertical sectional front view of FIG. 22;

FIG. 24 is a vertical sectional side view of a copper plating tank.

FIG. 25 is an enlarged sectional view of a copper plating tank.

FIG. 26 is a vertical sectional side view of a pre-wet tank.

FIG. 27 is an enlarged sectional view of the copper plating unit.

FIG. 28 is a cross-sectional view of a copper plating tank arrangement portion in FIG.

FIG. 29 is an enlarged sectional view of the vicinity of a plating solution injection hole of the copper plating unit.

FIG. 30 is a plan view of a paddle driving device.

FIG. 31 is also a vertical sectional front view.

FIG. 32 is a layout view showing still another example of the plating apparatus provided with the substrate holder of the present invention.

FIG. 33 is a view showing a local exhaust duct and an exhaust duct hole communicating with the exhaust duct in FIG. 32;

FIG. 34 is a layout view of a plating apparatus showing a modification of FIG. 32;

FIG. 35 is a cross-sectional view showing a step of forming a bump (protruding electrode) on the substrate in the order of steps.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Cassette 12 Cassette table 14 Aligner 16 Spin dryer 18 Substrate holder 20 Substrate attaching / detaching part 22 Substrate transfer device 24 Stocker 26 Pre-wet tank 28 Pre-soak tank 30a, 30b, 30c, 30d Rinse tank 32 Blow tank 34 Copper plating tank 38 Copper plating unit Reference Signs List 40 substrate holder transport device 42, 44 transporter 46 paddle drive device 54 fixed holding member 56 hinge 58 movable holding member 58b ring-shaped portion 58c fitting portion 58d locking convex portion (locking portion) 58e concave portion (engaging portion) Reference Signs List 60 seal packing 60a locking concave portion (locking portion) 60c storing concave portion 62 holding ring 62a flange piece 64, 68 slide plate 64c convex portion (engaging portion) 66 bolt 70 clamper 70a projecting portion 71 guide pin 72 swing block 7 Projections 74 conductor 75 electrically contacts 76 Hand 78 thin wire 80 linear motor 84, 86 slider 100 transporter body 102 arm portion 104 the arm part moving mechanism 106 arm unit rotating mechanism 108 gripping mechanism

Claims (5)

[Claims] 1. A substrate is interposed between a fixed holding member and a movable holding member, and a pressing ring is rotated in one direction to press the movable holding member toward the fixed holding member to detachably hold the substrate. In the substrate holder, the holding ring is fixed to the holding ring, and the movable holding member is fixed to the holding ring via a slide plate having an engaging portion that engages with an engaging portion provided on an outer peripheral surface of the movable holding member. A substrate holder, which is rotatably held on a member so as not to escape. 2. An engaging portion provided on one of the slide plate and the movable holding member comprises a concave portion, and an engaging portion provided on the other side comprises a convex portion fitted into the concave portion. The substrate holder according to 1. 3. The surface of the slide plate is formed as a tapered surface, and the tapered surface is slid into a claw portion of a clamper erected on the fixed holding member to press the movable holding member toward the fixed holding member. The substrate holder according to claim 1, wherein the substrate holder is configured to perform the operation. 4. The fixed holding member is provided with an upright block for abutting an outer peripheral end surface of the movable holding member to stop the holding ring.
The substrate holder according to any one of the above. 5. It has a fixed holding member and a movable holding member,
A holding plate is rotatably and irreversibly held on the movable holding member via a slide plate having an engagement portion that engages with an engagement portion provided on an outer peripheral surface of the movable holding member, and the holding ring is moved in one direction. A plating holder having a substrate holder that is rotated to press the movable holding member toward the fixed holding member to detachably hold the substrate.