JP2015187306A - Plating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating processing method capable of converting a posture of a substrate holder into a vertical state from a horizontal state, or into a horizontal state from a vertical state, without using a large scale rotation mechanism, and a posture conversion method for substrate holder for plating apparatus.SOLUTION: The plating apparatus comprises: a table 120 for horizontally mounting a substrate holder holding a substrate detachably, thereon; a plating processing part 130; and a substrate holder transport part 140 having a holding part for holding the substrate holder and transporting the substrate holder between the table 120 and plating processing part 130. The table 120 has a horizontal movement mechanism which supports one end part of the substrate holder and can move in the horizontal direction. The substrate holder transport part 140 comprises a lift mechanism for lifting up and down the holding part in a state that the other end of the substrate holder is supported by the horizontal movement mechanism, for converting a state of the substrate holder into a horizontal state from a vertical state, or into a vertical state from a horizontal state, followed by horizontal movement of the horizontal movement mechanism.

Description

The present invention relates to a plating apparatus and a plating method for plating on the surface of an object to be plated (substrate) such as a semiconductor wafer, and in particular, a plating film is formed in fine wiring grooves and holes and resist openings provided on the surface of the wafer. The present invention relates to a plating apparatus and a plating method suitable for forming or forming bumps (protruding electrodes) that are electrically connected to package electrodes or the like on the surface of a semiconductor wafer. In order to perform so-called three-dimensional mounting of a semiconductor chip or the like, it is necessary to form a large number of via plugs penetrating the inside of a substrate such as a semiconductor wafer, an interposer, or a spacer. It is also used to fill a via hole for forming such a through via plug. More specifically, the present invention relates to a (dip-type) plating apparatus and a plating method in which a substrate is installed in a holder and the holder is immersed in a plating tank for plating.

The method of plating on the substrate can be roughly divided into a face-down type and a dip type.

In face-down type plating, the substrate, particularly the wafer, is held in a horizontal state, and the surface to be processed is held downward by the head to perform plating. However, the substrate is usually accommodated in a transfer container such as FOUP (Front Opening Unified Pod) with the processing surface facing up in a horizontal state. Therefore, it is necessary to turn the substrate upside down in the apparatus before plating the substrate. On the other hand, a dip type plating apparatus performs plating by vertically inserting a substrate held by a substrate holder into a plating solution in a plating tank. Accordingly, the substrate holder needs to be horizontal when the substrate is set on the substrate holder, and the substrate holder needs to be vertical when the substrate is immersed in the plating tank. In order to change the posture, the plating apparatus has a mechanism for rotating the substrate holder from the vertical state to the horizontal state and from the horizontal state to the vertical state. For example, as shown in FIG. 9, the arm that clamps the substrate holder is rotated, and as shown in FIG. 10, the table on which the substrate holder is placed is rotated.

However, in recent years, the size of the substrate has increased, and accordingly, the rotation mechanism of the arm and table has become large, and the time for changing the posture of the substrate holder from the horizontal state to the vertical state or from the vertical state to the horizontal state tends to be long. It is in. When the rotation mechanism becomes large, the proportion of the space required for rotation in the plating equipment increases, the overall equipment becomes large, and the production cost of the equipment increases as the size increases. .

Further, in the conventional plating apparatus, the substrate holder opening / closing mechanism (fixing robot) used when setting the substrate on the substrate holder also has the following problems. That is, as shown in Patent Document 2, in a plating apparatus in which a substrate is held vertically by a substrate holder and immersed in a plating solution, the substrate is sandwiched between a fixed holding member and a movable holding member. A substrate holder that holds the substrate is used. The fixed holding member and the movable holding member can be opened and closed by a hinge. On the movable holding member side, there is a pressing member that cannot be detached and rotated, and the pressing member is rotated so that a part of the outer periphery of the pressing member is slid into the clamper provided on the fixed holding member side. Thus, the seal provided on the movable holding member side seals the outer periphery of the substrate and a predetermined portion of the fixed holding member, and enables the contact of the power supply contact to the outer periphery of the substrate.

In such a mechanism, there is a problem that wear due to rotation of the presser member or that the movable holding member rotates with the rotation of the presser member, causing displacement of the substrate or deterioration of sealing performance. It was. For this reason, in Patent Document 2 (particularly, refer to FIG. 8 in the document), it has been proposed to press the movable holding member with a pressing rod and rotate the pressing member in a state where rotational friction of the pressing member is reduced. In order to rotate the presser member in a state in which the rotational friction of the presser member is reduced, as shown in Patent Document 3 (particularly, refer to FIG. 14A in the document), the vertical direction is the vertical direction. A device having a complicated mechanism capable of reciprocating and rotating is necessary, and the complicated mechanism has led to a large-scale mechanism. When the substrate holder opening / closing mechanism becomes large, the space occupied by the holder opening / closing mechanism in the plating apparatus increases accordingly, the entire apparatus increases, and the manufacturing cost of the apparatus increases as the size of the apparatus increases. .

Further, in the conventional substrate holder opening / closing mechanism, when the thickness of the substrate holder varies, there is a problem that the amount of seal pressing by the pressing rod to the substrate holder changes. That is, when the substrate holder is thin, the seal is not compressed sufficiently, so that the rotational friction of the holding member becomes large, and when the substrate holder is thick, there is a problem that the seal is excessively compressed and the seal is damaged. There was also a possibility of causing.

Furthermore, in the conventional substrate holder opening / closing mechanism, a substrate guide is installed at the substrate outer peripheral position of the fixed holding member as a displacement detection method for detecting the displacement of the substrate as the substrate is attached to or detached from the substrate holder. Irradiate light from the horizontal direction (lateral direction) in the space above the substrate with a photo sensor or laser sensor and measure the amount of light. When the substrate climbs onto the substrate guide and the substrate tilts, the substrate emits light. Since the light amount is reduced, the amount of light is reduced as compared with the case where the substrate is normally set. Therefore, the positional deviation is detected by increasing or decreasing the amount of light. Here, the substrate guide is placed on the substrate guide to keep the substrate in an oblique state when the substrate is displaced so that the substrate does not become horizontal while being displaced. However, in the light amount detection by this horizontal sensor, the substrate holder is caused by water droplets on the substrate surface, warpage of the substrate itself, warpage of the substrate holder itself, warpage of the table on which the substrate holder is installed, dust attached to the table on which the substrate holder is installed, etc. There is a problem that the sensor erroneously detects misalignment due to a tilt or the like generated in the sensor. In addition, the height of the substrate guide is limited by the size of the substrate holder, and the use of the sensor reduces the amount of light over time due to the surface of the sensor becoming cloudy due to dirt. It was.

Japanese Patent No. 3997847 Japanese Patent No. 3778282 Japanese Patent No. 3940265 Japanese Patent No. 4162440

Therefore, the present invention provides a plating apparatus capable of changing the posture of a substrate holder for holding a substrate in a removable manner from a horizontal state to a vertical state or from a vertical state to a horizontal state without using a large rotation mechanism. An object of the present invention is to provide a plating method and a method for changing the attitude of a substrate holder for a plating apparatus.

Further, according to the present invention, the substrate holder opening / closing mechanism for installing the substrate on the substrate holder can install the substrate on the substrate holder without using a large and complicated mechanism, and allows variation in the thickness of the substrate holder. Then, it aims at providing the plating apparatus which can detect the position shift of the board | substrate accompanying the removal | desorption to the board | substrate holder of a board | substrate, the plating processing method, and the board | substrate installation method to the board | substrate holder for plating apparatuses.

A plating apparatus according to an embodiment of the present invention includes a table for horizontally mounting a substrate holder that detachably holds a substrate, a substrate that holds a plating solution, and is detachably held by the substrate holder. Substrate holder transport for transporting the substrate holder between the table and the plating processing unit, having a plating processing unit for vertically immersing and performing a plating process and a holding unit for holding the substrate holder The table includes a horizontal movement mechanism that supports one end of the substrate holder and is movable in a horizontal direction, and the other end of the substrate holder is connected to the other end of the substrate holder. The substrate holder is suspended from the vertical state or the horizontal state from the vertical state with the horizontal movement of the horizontal movement mechanism by raising and lowering the holding unit while being supported by the horizontal movement mechanism. And having a lifting mechanism for converting the state.

The plating apparatus may include a substrate holder detection unit that detects whether the substrate holder is held by the substrate holder transport unit and / or a distance between the substrate holder and the lifting mechanism.

In the plating apparatus, when the substrate holder detection unit detects that the holding unit does not hold the substrate holder or that the distance between the substrate holder and the lifting mechanism deviates from a reference value. A lifting mechanism control unit that stops the operation of the lifting mechanism may be provided.

The substrate holder may have a round bar-shaped handle bar, and the holding unit may hold the handle bar.

The holding portion may have a shape that rotatably supports the handle bar.

The other end of the substrate holder may have a semicircular shape at a portion in contact with the horizontal movement mechanism.

The horizontal movement mechanism may be urged toward the lowered position of the holding portion by a weight suspended from the horizontal movement mechanism.

The substrate holder transport unit may include a clamper that stops the swing of the substrate holder during transport of the substrate holder.

In addition, the method for changing the orientation of the substrate holder for a plating apparatus according to an embodiment of the present invention includes a method for changing the orientation of the substrate holder that detachably holds the substrate. Held by a holding unit, the substrate holder transport unit moves the substrate holder onto the table, the holding unit descends, the other end of the substrate holder comes into contact with a horizontal movement mechanism of the table, and the holding unit is Further down, the horizontal movement mechanism moves in the horizontal direction, and the substrate holder shifts from the vertical state to the horizontal state.

The plating apparatus substrate holder posture changing method detects whether the substrate holder is held by the substrate holder transport unit and / or a distance between the substrate holder and the lifting mechanism, and the substrate holder detection unit Stopping the operation of the elevating mechanism when the holding unit is not held by the holding unit or when it is detected that the distance between the substrate holder and the elevating mechanism deviates from a reference value; May further be included.

The substrate holder transport unit may move in the horizontal direction in order to tilt the substrate holder by a predetermined angle after the other end of the substrate holder comes into contact with the horizontal movement mechanism.

The plating method according to an embodiment of the present invention includes mounting the substrate holder on a table by a substrate holder transport unit that holds the substrate holder, and mounting the substrate on the substrate holder mounted on the table. And holding the one end portion of the substrate holder by the holding portion of the substrate holder transfer portion, raising the substrate holder transfer portion, and moving the horizontal movement mechanism on the table in the horizontal direction. From the horizontal state to the vertical state, the substrate holder transport unit moves the substrate holder to above the plating processing unit holding the plating solution, and the substrate holder transport unit lowers the substrate holder. And soaked in a plating solution.

In addition, a plating apparatus according to another embodiment of the present invention includes a table for horizontally mounting a substrate holder that detachably holds a substrate, a plating solution, and is detachably held by the substrate holder. A plating processing unit for vertically immersing the substrate and performing a plating process, and a holding unit for holding the substrate holder, and for transporting the substrate holder between the table and the plating processing unit A substrate holder conveying unit; and a substrate holder opening / closing mechanism of the substrate holder placed on the table, wherein the substrate holder includes a movable holding member having a rotatable pressing member, and the substrate holder together with the movable holding member. The substrate holder opening / closing mechanism presses the movable holding member and at least partly rotates to rotate the movable holding member. At least one of the head part, a head part capable of fixing the member to the fixed holding member and releasing the fixation from the fixed holding member and holding the movable holding member, a first actuator for moving the head part up and down, and And a second actuator for rotating the part.

The head portion includes a rotatable rotating plate, and a pressing disk that includes a pulling hook that can hold the movable holding member and presses the movable holding member, and the pressing member has an ear portion, The fixed holding member has a clamper, the rotating plate is connected to a shaft, the shaft is rotated by the second actuator being pushed and moved, the pressing member is rotated by the rotation of the rotating plate, and the ear The portion may be fitted with the clamper and the movable holding member may be fixed to the fixed holding member or may be moved to the lifting position of the lifting hook according to the rotation of the pressing member.

The head unit may include substrate position detection means for confirming a position of the substrate on the substrate holder.

The pressing disk may include a pressing block that presses the movable holding member, and the pressing block may include a pre-compressed spring inside.

According to the present invention, it is possible to stably rotate the substrate holder without using a large-scale rotation mechanism, and it is possible to realize space saving of the apparatus and reduction of manufacturing cost. In particular, by using a transporter that transports the substrate holder to the plating processing unit, a separate power mechanism is not required for the rotation of the substrate holder, and the manufacturing cost can be significantly reduced.

Further, according to the present invention, the mechanism used for opening and closing the substrate holder can be simplified, the size of the apparatus can be kept small, and the cost can be reduced. Further, according to the present invention, it is possible to accurately detect the displacement of the substrate when the substrate is attached to or detached from the substrate holder, regardless of deformation such as warpage of the substrate or the substrate holder or the presence or absence of adhesion of water droplets. Furthermore, according to the present invention, it is possible to reduce the frictional resistance between the members accompanying opening and closing of the substrate holder, and to realize a stable sealing performance even if the thickness of the substrate holder varies.

It is a side view which shows the outline | summary of the plating apparatus which concerns on one Embodiment of this invention. It is a top view of the plating apparatus of FIG. It is a schematic diagram showing the composition of the substrate holder concerning one embodiment of the present invention. (A) is a schematic diagram which shows the structure of the substrate holder conveyance part which concerns on one Embodiment of this invention, (b) is a figure which shows an example in the state where the substrate holder conveyance part of (a) hold | maintained the substrate holder. (C) is a cross-sectional view taken along line YY ′. It is a schematic diagram which shows the operation | movement at the time of mounting a substrate holder horizontally on a table of the raising / lowering mechanism of a substrate holder conveyance part which concerns on one Embodiment of this invention, and the horizontal movement mechanism of a table. FIG. 6 is a detailed view of the substrate holder and the horizontal movement mechanism during the operation of FIG. 5. It is a figure which shows the operation | movement which a board | substrate holder conveyance part installs a board | substrate holder in a horizontal movement mechanism. It is a schematic diagram which shows the other operation | movement form at the time of mounting the substrate holder horizontally on a table of the raising / lowering mechanism of a substrate holder conveyance part, and the horizontal movement mechanism of a table. It is a figure which shows the rotation mechanism of the substrate holder which rotates the arm which clamped the conventional substrate holder. It is a figure which shows the rotation mechanism of the substrate holder which rotates the table which set | placed the conventional substrate holder. It is a schematic diagram which shows the structure of the substrate holder used with the plating apparatus which concerns on other embodiment of this invention. It is a schematic diagram which shows the structure of the board | substrate holder used with the plating apparatus which concerns on other embodiment of this invention, Comprising: (a) shows a fixed holding member and (b) shows the structure of a movable holding member. It is sectional drawing which shows the structure of a part of movable holding member and fixed holding member of a substrate holder used with the plating apparatus which concerns on other embodiment of this invention. It is a schematic diagram which shows the structure of the substrate holder opening / closing mechanism in the plating apparatus which concerns on other embodiment of this invention. It is a schematic diagram which shows the structure of the head part of the substrate holder opening / closing mechanism of FIG. It is a figure which shows an example of the pressing block used in the head part of FIG. It is a figure which shows the method of the position shift detection of the board | substrate by the sensor in the plating apparatus which concerns on other embodiment of this invention. It is a top view which shows the example which provided the notch part in the board | substrate mounting location of the board | substrate holder of the plating apparatus which concerns on other embodiment of this invention. It is a figure which shows the method of the position shift detection of the board | substrate by the sensor in the plating apparatus which concerns on other embodiment of this invention. It is a perspective view for demonstrating operation | movement of the board | substrate holder opening / closing mechanism in the plating apparatus which concerns on other embodiment of this invention. It is a perspective view for demonstrating operation | movement of the board | substrate holder opening / closing mechanism in the plating apparatus which concerns on other embodiment of this invention. It is a perspective view for demonstrating operation | movement of the board | substrate holder opening / closing mechanism in the plating apparatus which concerns on other embodiment of this invention. It is a perspective view for demonstrating operation | movement of the board | substrate holder opening / closing mechanism in the plating apparatus which concerns on other embodiment of this invention.

With reference to FIG.1 and FIG.2, the whole plating apparatus which concerns on one Embodiment of this invention is demonstrated.

FIG. 1 is a side view showing an outline of a plating apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of the plating apparatus of FIG.

A plating apparatus according to an embodiment of the present invention includes a substrate holder 110 (see FIG. 3), a load port 170 in which a transport container such as a FOUP containing the substrate 500 can be placed on the plating apparatus frame 100, and substrate transport. A robot 180, a spin rinse dryer (SRD) 190, a table 120, a plating processing unit 130, a substrate holder transport unit 140, a stocker 150, and an aligner 160 are provided.

The substrate transfer robot 180 can take out the substrate 500 from a transfer container (not shown) and transfer it to the table 120. The substrate transfer robot 180 can transfer the substrate 500 from the table 120 and store it in the transfer container. The substrate transfer robot 180 can preferably move in the rotation direction, and can transfer the substrate 500 between the load port 170, the table 120, the spin rinse dryer 190, and the aligner 160. The spin-rinse dryer 190 can be rotated by rotating the plated substrate 500 while rinsing, and finally rotating at a high speed for drying.

The aligner 160 aligns the substrate 500 in the circumferential direction. That is, the aligner 160 detects the position of the notch (notch) provided on the substrate 500, and rotates the substrate 500 to a specified position by directing the notch position to a specified angle. The aligner 160 aligns the center of the substrate 500 while rotating the substrate 500.

In FIGS. 1 and 2, reference numeral 101 denotes a travel shaft for transporting the substrate holder transport unit, 102 denotes a substrate holder opening / closing mechanism, and 103 denotes a control unit (including a substrate holder transport unit control unit).

The substrate holder 110 seals the end and back surface of the substrate 500 from the plating solution and exposes the surface to be plated when the substrate 500 is plated. Moreover, the substrate holder 110 may be provided with a contact for contacting the peripheral portion of the surface to be plated of the substrate and supplying power from an external power source. The substrate holder 110 is stored in the stocker 150 before the plating process, and is moved between the table 120 and the plating processing unit 130 by the substrate holder transport unit 140 during the plating process, and is stored again in the stocker 150 after the plating process.

The substrate holder 110 can be placed horizontally on the table 120. In the table 120, the substrate transport robot 180 attaches / detaches the substrate 500 to / from the substrate holder 110 placed horizontally.

In the plating apparatus according to FIGS. 1 and 2, the substrate 500 held by the substrate holder 110 is vertically immersed in the plating solution in the plating tank, and plating is performed while pouring the plating solution from the bottom of the plating tank and causing overflow. . The substrate 500 held by the substrate holder 110 is processed with a processing solution or gas in each processing tank of the plating processing unit 130. For example, in the case of using a plating apparatus of a type that uses two plating solutions shown in FIG. 1, the arrangement of each treatment tank of the plating processing unit 130 is, in order of process, a pre-washing tank, a pre-treatment tank, a rinse tank, It becomes arrangement | positioning, such as 1 plating tank, a rinse tank, a 2nd plating tank, a rinse tank, and a blow tank. It is preferable to dispose each processing tank in the order of steps (X → X ′ direction) in order to eliminate an extra conveyance path. The kind of tank, the number of tanks, and the arrangement of the tanks in the plating apparatus can be freely selected according to the purpose of processing the substrate.

The substrate holder transport unit 140 is movable along the travel axis 101 between the table 120, the plating processing unit 130, and the stocker 150 by a transport mechanism (not shown) such as a linear motor. The substrate holder transport unit 140 transports the substrate holder while holding it in a vertical posture.

The stocker 150 can store a plurality of substrate holders 110 in a vertical state. In FIG. 1, the stocker 150 is installed adjacent to the rear surface of the apparatus, but the installation location is not limited to this, and may be disposed between the table 120 and the plating processing unit 130, for example.

Below, an example of operation | movement of the plating apparatus which concerns on one Embodiment of this invention is demonstrated.

(A) First, the substrate holder transport unit 140 moves onto the stocker 150 to take out and hold the substrate holder 110 accommodated in the stocker 150.

(B) Next, the substrate holder transport unit 140 moves to the table 120 while holding the substrate holder 110, and the substrate holder 110 is installed horizontally on the table 120.

(C) The substrate 500 is set on the substrate holder 110.

(D) The substrate holder transport unit 140 moves the substrate holder 110 to the pre-rinsing tank of the plating unit 130 while holding the substrate holder 110 vertically. Each step of plating is performed on the substrate 500 held by the substrate holder 110 in each processing tank of the plating processing unit 130. The plating process is sequentially performed from X to X ′.

(E) The substrate holder transport unit 140 moves to the table 120 while holding the substrate holder 110 vertically after the completion of each step in the plating processing unit, and the substrate holder 110 is placed horizontally on the table 120.

(F) The substrate 500 is removed from the substrate holder 110.

(G) When performing continuous processing, the next unprocessed substrate is set, and the process is repeated from (d).

(H) After the processing is completed, the substrate holder transport unit 140 vertically holds the substrate holder 110 from which the substrate 500 has been removed, moves to the stocker 150, and stores the substrate holder 110 vertically in the stocker 150. .

Next, the configuration of the substrate holder 110 according to an embodiment of the present invention will be described.

FIG. 3 is a schematic view showing the configuration of the substrate holder 110 according to one embodiment of the present invention.

The substrate holder 110 includes a handle bar 111 at one end thereof. The handle bar 111 is held by the substrate holder transport unit 140. The handle bar 111 has a round bar shape so that the substrate holder 110 can rotate when the posture is changed from the vertical state to the horizontal state or from the horizontal state to the vertical state.

The handle bar 111 is preferably made of stainless steel that is resistant to corrosion in preparation for a situation where the plating solution adheres. If stainless steel cannot withstand the corrosion caused by the plating solution, it is recommended to increase the corrosion resistance by coating the surface of stainless steel with chromium plating or TiC. The handlebar 111 may be made of titanium having high corrosion resistance, but generally has a high surface frictional resistance and requires a finish suitable for rotational sliding with the lifter 142 of the substrate holder transport unit 140 described later. is there.

In addition, hangers 112 having a rectangular parallelepiped shape or a cubic shape are provided at both upper ends of the substrate holder 110. The hanger part 112 functions as a support part for suspending the substrate holder 110 by arranging it on a hanger receiving member (not shown) when the substrate holder 110 is arranged in each processing tank. When the plating tank is an electrolytic plating tank, a current is supplied from the external power source to the surface to be plated of the substrate 500 when the power supply contact 114 provided on the hanger portion and the electrical contact of the hanger receiving member come into contact with each other. Is done. The power supply contact 114 is provided at a location that does not contact the plating solution in the plating tank when the substrate holder 110 is suspended on the hanger receiving member.

Even if the hanger part 112 has a rectangular parallelepiped shape or a cubic shape, a force is applied from the direction of the arrow A shown in FIG. Good. When the substrate holder 110 is in a vertical state (a state in which the lower end portion 113 of the substrate holder 110 faces in the “down” direction shown in FIG. 3), the upper surface of the hanger portion 112 is horizontal.

The lower end 113 of the substrate holder 110 may be formed in a semicircular shape (see FIG. 6) as viewed from the side in order to smoothly rotate and slide with a horizontal movement mechanism 121 of the table 120 described later. .

FIG. 4A is a schematic diagram showing the configuration of the substrate holder transport unit 140 according to an embodiment of the present invention, and FIG. 4B shows the state in which the substrate holder transport unit 140 of FIG. It is a figure which shows an example, (c) is sectional drawing seen from the YY 'line | wire.

The substrate holder transport unit 140 has an elevating mechanism (not shown) for elevating the substrate holder 110 by operating in the vertical direction inside the support column 145. The lifting mechanism includes an arm 141 for suspending the substrate holder 110. The arm 141 includes a lifter 142 that supports the handle bar 111 from below and lifts the substrate holder 110. In order to support the handle bar 111 from below, the lifter 142 has a semicircular claw (not shown), and the inner diameter of the claw is slightly larger than the outer diameter of the handle bar 111. A space may be provided between the two claws, and a sensor 144 that detects the presence / absence of the handlebar 111 and the distance to the handlebar 111 in the space may be provided. The sensor 144 detects an abnormality such as the absence of the handle bar 111, that is, the substrate holder 110, and the distance to the handle bar 111 deviating from the reference value, that is, the substrate holder 110 is displaced from the arm 141. In this case, the sensor 144 transmits an abnormality to the lifting mechanism control unit (not shown), and the lifting mechanism control unit stops the lifting operation of the arm 141. Further, by providing the sensor 144, the substrate holder 110 is displaced when the claw of the lifter 142 is supported so as to scoop up the handle bar 111, and the claw of the lifter 142 cannot correctly support the handle bar 111. Such an abnormality can be detected.

The portion of the lifter 142 that contacts the handlebar 111 is made of a resin such as PTFE incorporated into the handlebar 111 so as to rotate and slide, or the friction coefficient is reduced by using an aluminum material that has been subjected to a turfrum treatment or PEEK coating. Then, a movement becomes smooth and it is preferable.

The substrate holder transport unit 140 includes a clamper 143 for preventing the substrate holder 110 from swinging. The clamper 143 applies a downward force to the upper surface of the hanger part 112 of the substrate holder 110 to prevent the substrate holder transport unit 140 from swinging in the moving direction during horizontal movement. In order to prevent the substrate holder 110 from swinging, the hanger portion 112 may be designed to fit with the clamper 143.

According to the embodiment of the present invention, the clamper 143 applies a downward force to the upper surface of the hanger portion 112 of the substrate holder 110 and supports the vertical surfaces on both sides to support the swinging. The shape of the letter. When the force that presses the horizontal plane vertically can be set larger than the deflection force of the substrate holder 110, it is not necessary to support the vertical surface, but in general, the area of the upper surface of the hanger portion 112 of the substrate holder 110 cannot be increased. It is also preferable to support.

When the substrate holder 110 shifts from the vertical state to the horizontal state, the clamper 143 moves upward and the steadying is released. The vertical movement of the clamper 143 may be performed by an actuator 146 such as an air cylinder or an electric actuator. When supporting the hanger portions 112 at both ends of the substrate holder 110, the number of the actuators 146 may be two, but for simultaneous operation and simplification, one actuator 146 is installed at the center position of the substrate holder 110, and the actuator 146 An attachment member (not shown) may be provided on the movable portion, and the two clampers 143 may be attached to the attachment member for operation.

A table 120 is used to shift and place the substrate holder 110 from the vertical state to the horizontal state. The table 120 supports the lower end 113 of the substrate holder 110 and freely slides in the traveling axis direction of the substrate holder transport unit 140 along a guide (not shown) such as an LM guide for linear movement. The horizontal movement mechanism 121 (refer FIG. 5) is provided.

The horizontal movement mechanism 121 always has a weight (see FIG. 5) or a coil so that it returns to the initial position, that is, the position where the lower end 113 of the substrate holder 110 contacts when the substrate holder transport unit 140 is lowered toward the table 120. An external force such as a spring may be applied. The horizontal movement mechanism 121 is preferably of a shape and material suitable for sliding with the lower end portion 113 of the substrate holder 110.

Hereinafter, a procedure for horizontally placing the substrate holder 110 in the vertical state on the table 120 will be described with reference to FIGS. 5, 6, and 7.

5 (A) to 5 (F) show operations when the substrate holder is horizontally placed on the table by the lifting mechanism of the substrate holder transport unit and the horizontal movement mechanism of the table according to one embodiment of the present invention. FIGS. 6A to 6F are detailed views of the substrate holder and the horizontal movement mechanism during the operation of FIG. 5, and FIGS. 7A to 7D are substrate holder transfer units. FIG. 8 is a diagram illustrating an operation of installing the substrate holder on the horizontal movement mechanism.

First, the substrate holder transport unit 140 moves up to the upper side of the table 120 in a state where the substrate holder 110 is lifted and held by the lifter 142 by the arm 141 and the substrate holder 110 is prevented from being shaken by the clamper 143. The positional relationship between the substrate holder 110 and the horizontal movement mechanism 121 at this time is as shown in FIGS. 7A to 7B. The table 120 is provided with a horizontal movement mechanism 121 that can move in the horizontal direction while supporting the lower end portion 113 of the substrate holder 110. When the substrate holder transport unit 140 moves to above the table 120, the arm 141 starts the lowering operation while holding the substrate holder 110 vertically. FIG. 5A shows a state where the lower end portion 113 of the substrate holder 110 is lowered to a slightly higher position of the horizontal movement mechanism 121. The positional relationship between the substrate holder 110 and the horizontal movement mechanism 121 at this time is as shown in FIGS. 6 (A) and 7 (B).

In FIG. 7C, the clamper 143 is released. Then, as shown in FIGS. 5B, 6 </ b> B, and 7 </ b> D, the arm 141 is lowered until the lower end portion of the substrate holder 110 contacts the horizontal movement mechanism 121.

5A to 5B, the clamper 143 is not moved until the lower end 113 of the substrate holder 110 approaches a position slightly higher than the horizontal movement mechanism 121 during the lowering operation of the substrate holder 110. Thus, it is preferable that the substrate holder 110 is lowered at a high speed with the steady state. Then, it is preferable that the clamper 143 is removed, the arm 141 is lowered at a low speed, and the lower end portion of the substrate holder 110 reaches the horizontal movement mechanism 121. Thereby, the stable descent | fall operation | movement is performed, shortening the time which the descent | fall of the board | substrate holder 110 requires.

If the lower end portion 113 of the substrate holder 110 is only in contact with the horizontal movement mechanism 121, it becomes the bottom dead center of rotation, so that the substrate holder 110 cannot be rotated smoothly. Therefore, after the lower end portion 113 of the substrate holder 110 comes into contact with the horizontal movement mechanism 121, the arm 141 is slightly moved laterally toward the plating processing unit 130 as shown in FIG. 5C (with slight lowering). . As a result, as shown in FIG. 6C, the substrate holder 110 can be tilted and the rotation operation of the substrate holder 110 can be started smoothly.

After the substrate holder 110 is tilted by a predetermined angle (preferably about 15 °), the arm 141 of the substrate holder transport unit 140 is lowered, so that the substrate holder 110 has its own weight, as shown in FIG. The lower end 113 of 110 pushes out the horizontal movement mechanism 121. When the arm 141 of the substrate holder transport unit 140 is lowered, there may be a slight movement toward the substrate transport robot 180 side. As shown in FIGS. 5D to 5E, the substrate holder 110 having the lower end 113 supported by the horizontal movement mechanism 121 rotates and tilts from the vertical state to the horizontal state. That is, as shown in FIG. 6E, when the arm 141 is further lowered from the state of FIG. 6D, the substrate holder 110 is inclined to the horizontal state with the fulcrum A as a support.

When the arm 141 is further lowered, the substrate holder 110 is in a horizontal state as shown in FIGS. 5F and 6F, and the lowering operation of the substrate holder transport unit 140 and the horizontal movement of the horizontal moving mechanism 121 are completed. . The load on the substrate holder 110 in the horizontal state is received by the entire table 120. The arm 141 further moves down, moves up after being retracted to the plating processing unit 130 side.

As described above, the substrate holder 110 can be shifted from the vertical posture to the horizontal posture without using a large rotation mechanism having a strong torque for rotating the substrate holder 110. In the case of the present invention, the movement distance of the substrate holder transport unit 140 for tilting the substrate holder 110 first, the lowering speed of the arm 141, the force applied to return the horizontal movement mechanism 121 to the initial position, the handle bar 111 and the lifter 142 It is important to optimally design the sliding resistance of the claw and the shape and sliding resistance of the lower end portion of the substrate holder 110 and the horizontal movement mechanism 121.

In the present invention, the posture of the substrate holder is changed with the horizontal movement of the horizontal movement mechanism 121. However, as shown in FIGS. 8A to 8C, the lower end 113 of the substrate holder 110 is grounded to the left end of the table in FIG. 8A, and the arm 141 moves so as to draw an arc. It is also conceivable to make the substrate holder 110 horizontal. However, above the table 120, as shown in FIG. 1, when the substrate transfer robot 180 delivers the substrate 500 to the substrate holder 110 or receives it from the substrate holder 110, it is used for releasing the holding of the substrate of the substrate holder 110. Since there is the substrate holder opening / closing mechanism 103, the substrate holder transport unit 140 and the substrate holder opening / closing mechanism 103 interfere with each other. Further, as shown in FIGS. 8D to 8F, the lower end 113 of the substrate holder 110 is brought into contact with the right end of the table 120 in FIG. 8D, and the arm 141 similarly plating the substrate holder 110. It is also conceivable that the arm 141 moves the substrate holder 110 in order to place the substrate holder 110 on the table 120 by tilting it toward the processing unit and horizontally. However, as shown in FIG. 8 (E), the substrate holder transport unit 140 protrudes farther toward the plating processing unit 130 than the table 120, and may interfere with the processing in the plating processing unit 130. Unlike the method of changing the posture of the substrate holder 110, according to the method of changing the posture of the substrate holder 110 according to the present invention, the substrate holder transfer unit 140 transfers the substrate holder when the substrate holder transfer unit 140 changes the posture of the substrate holder 110. Since the part 140 does not interfere with the processing in the substrate holder opening / closing mechanism 103 and the plating processing unit 130, there is no need to consider the distance between the substrate holder transport unit 140 and the substrate holder opening / closing mechanism or the plating processing unit 130. Greatly contributes to space saving.

The horizontal movement mechanism 121 may include a mechanism for moving in the horizontal direction by itself, regardless of the weight of the substrate holder 110, but a power source for that purpose is required, and the posture of the substrate holder 110 is changed. Therefore, the operation with the arm 141 needs to be performed in cooperation with each other, so that the control becomes complicated. Therefore, as described above, the horizontal movement mechanism 121 is slidable, and it is desirable to control and horizontally move the mechanism to which an external force such as a weight or a coil spring for returning the horizontal movement mechanism 121 to the initial position is controlled.

In addition, as the substrate holder 110 is shifted from the vertical state to the horizontal state, the handle bar 111 and the claw of the lifter 142, the lower end portion of the substrate holder 110, and the surface of the horizontal movement mechanism 121 are shown to slide with each other. If it is not desirable to slide the handle bar 111, both ends of the handle bar 111 may be supported by bearings, and a rotating roller may be attached to the lower end of the substrate holder 110. However, since the substrate holder 110 is immersed in the plating solution, the bearings and rollers are disposed in the plating solution or near the plating solution surface, so it may not be desirable to provide the bearings or rollers due to the influence of the plating solution adhesion. . Therefore, when sliding is avoided, a rotation roller may be provided on the surface of the claw of the lifter 142 or the horizontal movement mechanism 121 so that the handle bar 111 or the lower end 113 can roll freely.

On the table 120, after completing the operation of taking out the processed substrate 500 from the substrate holder 110 or holding the substrate 500 to be processed next, the posture of the substrate holder 110 is changed from a horizontal state to a vertical state. Is done. At that time, the claw of the lifter 142 enters the lower side of the handle bar 111 and hooks the handle bar 111, and the lifter 142 lifts the substrate holder 110 as the arm 141 moves up. The horizontal movement mechanism 121 returns to the initial position without detaching from the lower end of the substrate holder 110, and the substrate holder 110 assumes a vertical posture. And the arm 141 further moves up. In the middle of ascending, the clamper 143 operates as described above to stop the swing of the substrate holder 110.

According to the above-described embodiment, the vertical posture and the horizontal posture of the substrate holder 110 are converted only by the horizontal movement of the substrate holder transport unit 140 and the raising and lowering of the arm 141 as those requiring power. The mechanisms for horizontal and vertical movements provided in the substrate holder transport unit 140 are necessary for moving the substrate holder 110 to each processing tank and immersing the substrate 500 in the processing liquid of each processing tank. No special power is required to change the posture of the substrate holder 110.

The present invention can be widely applied to apparatuses that hold a substrate with a substrate holder, convey the substrate holder, and plate the substrate. In the present embodiment, the plating apparatus is exemplified, but the present invention can also be applied to, for example, an etching apparatus and an electroless plating apparatus. In addition to the type in which the substrate holder is completely immersed in the processing tank, for example, there is an opening on the vertical side surface of the processing tank, and a type in which the substrate held by the substrate holder is installed so as to block the opening from the side. The present invention can also be applied to other processing apparatuses. Furthermore, in this embodiment, there is only one substrate holder transfer unit in the apparatus, and the substrate holder is transferred into the substrate holder transfer unit used for posture change and each processing tank including the plating tank. The substrate holder transport unit is common. However, there are a plurality of substrate holder transfer units, and the substrate holder transfer unit for changing the posture and the substrate holder transfer unit for transferring to the plating processing unit 130, for example, may be different.

As described above, according to the present invention, the substrate holder can be stably rotated without using a large rotation mechanism, so that space saving of the apparatus and reduction in manufacturing cost can be realized. In particular, by using a transporter that transports the substrate holder to the plating tank, a separate power mechanism is not required for the rotation of the substrate holder, and the manufacturing cost can be significantly reduced.

Next, the operation of the substrate holder opening / closing mechanism 102 in the plating apparatus according to another embodiment of the present invention will be described.

In the substrate holder opening / closing mechanism 102, in order to attach / detach the substrate to / from the substrate holder placed on the table 120, the lid portion of the substrate holder, that is, the movable holding member 11 described later is attached / detached.

The configuration and operation of the substrate holder opening / closing mechanism 102 will be described in detail below. First, the configuration of the substrate holder 110 used in the plating apparatus according to another embodiment of the present invention will be described.

11 to 13 are schematic views showing the configuration of the substrate holder 110 used in the plating apparatus according to another embodiment of the present invention. FIG. 11 shows the movable holding member 11 attached to the fixed holding member 15 and the ear. FIG. 12 is a top view showing a state in which the portion 13 and the clamper 16 are fitted, FIG. 12 is a top view showing the movable holding member 11 and the fixed holding member 15 separately, and FIG. (B) shows the movable holding member 11. FIG. 13 is a partial cross-sectional view of the movable holding member 11 and the fixed holding member 15.

Referring to FIGS. 11 to 13, the substrate holder 110 includes a movable holding member 11 that is a lid portion and a fixed holding member 15 that is placed on the table 120, and the movable holding member 11, the fixed holding member 15, and the like. Thus, the substrate 500 is sandwiched. The movable holding member 11 has a substantially circular ring shape, and includes a pressing member 12 and an ear portion 13 that is integral with the pressing member 12 and protrudes to the outer periphery. The movable holding member 11 can be fixed to the fixed holding member 15 and can be detached from the fixed holding member 15. In FIG. 11, the movable holding member 11 is fixed to the upper surface of the fixed holding member 15. The fixed holding member 15 has a clamper 16 at a location corresponding to the ear portion 13. The clamper 16 has an L-shaped inverted shape, the tip is bent inward, and the ear 13 is inserted (fitted) inside the bent portion of the tip, thereby fixing the movable holding member 11 to the fixed holding member 15. (See FIG. 20 and subsequent figures). In addition, as for the ear | edge part 13 and the clamper 16, it is desirable to have a taper part for fitting smoothly.

The presser member 12 is rotatably held with respect to the movable holding member 11 and is held so as not to be detached. The presser member 12 rotates together with the ear portion 13 with the center R of the movable holding member 11 as a rotation center and a substantially horizontal plane as a rotation surface. The pressing member 12 has, for example, a substantially circular ring shape. The pressing member 12 has a protruding portion 12 a that protrudes in the direction of the head portion 1100 of a substrate holder opening / closing mechanism described later on the periphery of the pressing member 12. The presser member 12 is prevented from being detached from the movable holding member 11 by the presser member detachment preventing member 12b.

The movable holding member 11 and the fixed holding member 15 sandwich the substrate 500 and rotate the pressing member 12 to fit the ear portion 13 to the clamper 16 and fix it. Further, when attaching and detaching the substrate 500, the pressing member 12 is rotated to release the fitting between the ear portion 13 and the clamper 16.

The substrate 500 is placed on the substrate placement location 14 of the fixed holding member 15.

The movable holding member includes a first seal ring 18a and a second seal ring 18b for sealing a portion that does not need to be plated, such as an end portion and a back surface of the substrate, from the plating solution. The first seal ring 18 a contacts the outer peripheral end of the substrate, and the second seal ring 18 b contacts the surface of the fixed holding member 15. Furthermore, in the case of a substrate holder for an electroplating apparatus, it has an electrical contact 20 that contacts the end region of the substrate sealed by the first seal ring 18a and energizes the substrate. The electrical contact 20 is electrically connected to an external power source with the movable holding member 11 and the fixed holding member 15 sandwiching the substrate. The first seal ring 18 a and the second seal ring 18 b are held by a seal ring holder 19. In the following description, the first seal ring 18a and the second seal ring 18b may be collectively referred to as a seal ring 18 for ease of explanation.

When the substrate 500 is taken out from the substrate holder 110, the movable holding member 11 is moved away from the fixed holding member 15. At this time, the first seal ring 18a and the substrate 500 are fixed and the substrate is moved to the movable holding member. There may be a problem of sticking to the side and lifting up. In order to prevent this, the movable holding member is provided with a peeling spring that urges the substrate toward the fixed holding member when the substrate and the first seal ring 18a are separated, and peels the substrate from the first seal ring 18a. Is desirable. This peeling spring is described in Japanese Patent No. 4162440.

However, even if the movable holding member 11 has a spring member, the first seal ring 18a and the substrate may be removed when the movable holding member 11 is removed depending on the properties and properties of the resist applied to the substrate 500 and the thickness. In some cases, the substrate 500 may be displaced from the substrate placement location 14 due to the fixation of the substrate 500. In particular, a part of the end portion of the substrate 500 may be fixed to the first seal ring 18a, and the substrate may be lifted obliquely, or may fall after being lifted, resulting in misalignment on the fixed holding member 15.

As described later, with respect to this problem, in the plating apparatus according to another embodiment of the present invention, the position shift is caused by detecting the position shift by the sensor 1140 provided in the substrate holder opening / closing mechanism 102. This prevents the plating apparatus from continuing to operate.

FIG. 14 is a schematic diagram showing the configuration of the substrate holder opening / closing mechanism 102 of the plating apparatus according to one embodiment of the present invention. Referring to FIG. 14, the substrate holder opening / closing mechanism 102 includes a head unit 1100, a first actuator 1200, and a second actuator 1300.

The head unit 1100 is positioned above the table 120 and can hold the movable holding member 11 of the substrate holder 110 placed on the table 120. Further, the head unit 1100 rotates the holding member 12 of the movable holding member 11 of the substrate holder 110 and rotates the ear portion 13 to fix and release the movable holding member 11 to and from the fixed holding member 15, and to move and hold the movable holding member 11. The member 11 can be held.

The first actuator 1200 is connected to the head unit 1100 by a connection boss 1170 of the head unit 1100 and moves the head unit 1100 up and down. The first actuator 1200 includes, for example, an actuator body 1210 and a shaft 1220, and is connected to the head portion 1100 at the end of the shaft 1220, and moves the head portion 1100 up and down as the shaft 1220 expands and contracts.

The second actuator 1300 includes an actuator 1310 that moves uniaxially and a shaft hook 1330 that is fixed to a moving plate 1320 of the actuator 1310. Two rotating rollers 1340 are attached to the shaft hook 1330 on the left and right sides to ensure slidability when the shaft 1130 is pushed. The rotating roller 1340 is rotatably supported by a rotating roller shaft 1350. The shaft hook 1330 reciprocates in the horizontal direction by driving the second actuator 1300, and pushes and moves the shaft 1130 extended from the head portion 1100 to rotate the rotating plate 1150 of the head portion 1100. For example, the driving method of the second actuator is a ball screw.

A more detailed configuration of the head unit 1100 will be described with reference to FIG. Referring to FIG. 15, the head unit 1100 includes a pressing disk 1110 and a rotating plate 1150 on the pressing disk.

The pressing disk 1110 includes a lifting hook 1111, a rotating plate guide 1112, a guide roller 1113, and a pressing block 1114. Moreover, you may have the sensor 1140 fixedly supported along the outer periphery of the press disc 1110. FIG.

The rotating plate 1150 includes a fastening hook 1151 and is connected to the shaft 1130. The rotating plate 1150 has a substantially circular ring shape and is sandwiched between rotating plate guides 1112 on the pressing disk 1110. The rotating plate 1150 can rotate with the center of the circle as the center of rotation and the substantially horizontal plane as the surface of rotation. The rotating plate 1150 rotates by rotating with the guide roller 1113.

The shaft 1130 has, for example, a rod shape, and the end of the shaft is pushed by the horizontal operation of the second actuator 1300, and the rotating plate rotates. That is, the rotation operation of the rotating plate 1150 can be controlled by controlling the operation of the second actuator 1300. In order to detect the position of the shaft 1130, a sensor 1131 may be provided on the pressing disk 1110.

The rotating plate 1150 rotates the pressing member 12 and the ear portion 13 with the rotation. For example, tightening hooks 1151 extending downward are provided at two positions on the circumference of the rotating plate 1150. When the rotating plate 1150 is rotated by the second actuator 1300, the fastening hook 1151 presses the protruding portion 12 a of the pressing member 12 of the movable holding member 11 to rotate the pressing member 12.

  The pressing disk 1110 has a pressing block 1114 on the bottom surface. When the first actuator 1120 lowers the head portion 1100, the pressing block 1114 comes into contact with the main body portion other than the pressing member 12 of the movable holding member 11, for example, P in FIG. 13, and further presses the movable holding member 11 downward. When a portion other than the pressing member 12 of the movable holding member 11 is pressed downward, the seal ring 18 is deformed by the pressing amount. Since the movable holding member 11 sinks downward, a gap for fitting the ear portion 13 of the pressing member 12 with the clamper 16 is created. Therefore, the force for rotating the pressing member 12, that is, the driving force of the second actuator 1300 suffices, and wear of the clamper 16 and the ear portion 13 can be suppressed.

The pressing amount by which the pressing block 1114 presses the movable holding member 11 downward is determined by the lowered position of the head unit 1100. However, if there is an individual difference in the thickness of each substrate holder 110, the deformation amount (compression amount) of the seal ring 18 ) Are different. That is, when the substrate holder is thin, the seal is not compressed sufficiently, so that the rotational friction of the holding member increases, and when the substrate holder is thick, there is a problem that the seal is excessively compressed and the seal is damaged. Impact may occur. Such a problem can be dealt with by making the pressing block 1114 a plunger having an elastic body 30 such as a spring inside as shown in FIG. An elastic body 30 such as a spring having an elastic force is compressed in advance by a predetermined amount, and the elastic body 30 always presses the pin 31 in contact with the substrate holder. The difference of the compression amount of 18 can be relieved. Thereby, the variation in the thickness of the substrate holder is allowed, the frictional resistance between the members accompanying the opening and closing of the substrate holder can be stably reduced, and as a result, a stable sealing property can be realized.

The pressing disk 1110 has a plurality of lifting hooks 1111 on its outer edge. When the head portion 1100 is lifted in a state where the ear portion 13 of the movable holding member 11 is rotated and moved right above the lifting portion of the lifting hook 1111, the ear portion 13 of the movable holding member 11 is lifted by the lifting hook 1111. As a result, the movable holding member 11 rises together with the head portion 1100. Accordingly, a gap is opened between the movable holding member 11 and the fixed holding member 15, and the substrate 500 can be placed on and taken out from the fixed holding member through the gap.

As described above, the fixing of the movable holding member 11 to the fixed holding member 15 by the rotating operation of the pressing member 12 of the movable holding member 11 and the raising and lowering operations of the movable holding member 11 are performed via the head portion 1100. By operating by separate actuators that perform only simple operations, it is possible to simplify the device without requiring a complicated device that can be reciprocated and rotated as in the conventional device. Miniaturization, simplification, and cost reduction. In the conventional apparatus, the movable holding member 11 and the fixed holding member 15 are connected by a hinge, and it is necessary to provide a mechanism for lifting the movable holding member 11 at the lower part of the table, but by adopting the mechanism of the present invention. The actuator dedicated for opening and closing the substrate holder 110 is no longer necessary.

The pressing disk 1110 may have a sensor 1140 on its outer periphery as a means for detecting the position of the substrate 500 on the substrate holder 110 placed on the table 120. A method of position detection by the sensor 1140 will be described with reference to FIG.

Referring to FIG. 17, the sensor 1140 is provided in the substrate holder opening / closing mechanism 102 and is located above the substrate holder 110. The sensor 1140 is, for example, a laser sensor, but is not limited thereto. The substrate holder opening / closing mechanism 102 may include a plurality of sensors 1140, and thereby can detect the displacement of the substrate more accurately. A cutout portion 17 is provided in the fixed holding member 15 of the substrate holder 110 corresponding to the laser irradiation position of the laser sensor. For example, when the substrate holder opening / closing mechanism 102 includes three sensors 1140, when the cutout portion 17 is viewed from above, the three cutout portions 17 are formed at the substrate placement location 14 of the fixed holding member 15 as shown in FIG. Provided. Preferably, the notch 17 is provided with an inclination so as to face the optical axis of the laser sensor substantially at right angles, and to prevent the plating solution from staying in the notch 17 so as to keep the detection distance constant. Can do.

The sensor 1140 measures the distance to the object, and determines whether the measured distance is within a predetermined range. For example, as shown in FIG. 17A, when the distance from the notch 17 is A when the sensor 1140 is positioned at a predetermined height, the distance to the object measured by the sensor 1140 is A. If there is, the sensor 1140 measures the correct distance to the notch 17 and does not measure the distance to the substrate 500, so that the substrate 500 is not positioned between the sensor 1140 and the notch 17. I understand.

On the other hand, as shown in FIG. 17B, when the distance to the object measured by the sensor 1140 is different from A and is W1 shorter than A, the sensor 1140 is assumed to measure the distance to the substrate 500. It can be seen that the substrate 500 is displaced.

If the correct distances to the plurality of notches 17 are measured by the plurality of sensors 1140, it can be seen that the substrate 500 is not displaced in the direction of any notch, and the displacement is detected more accurately. it can.

By adjusting the distance A and the inclination R of the sensor 1140 from the vertical direction, the threshold value D for the positional deviation of the substrate can be appropriately set. This threshold is preferably set to 0.5 mm to 1.5 mm.

However, as a case where the substrate 500 is not positioned between the sensor 1140 and the notch portion 17, a case where the substrate 500 does not exist on the fixed holding member 15 can be considered. For example, this is a case where the substrate 500 adheres to the movable holding member 11 and moves upward together with the movable holding member 11. Assuming such a case, as shown in FIG. 19, the sensor 1140 of the plating apparatus according to another embodiment of the present invention moves upward as the head portion 1100 rises, and measures the distance to the notch portion. The distance may be measured again from a position higher than the height. That is, as shown in FIG. 19A, when the distance from the sensor 1140 to the substrate 500 is W2 at the position where the sensor 1140 has moved up by H from the height measured by the sensor 1140. In addition, if the distance to the object measured by the sensor 1140 is W2, it can be seen that the sensor 1140 measures the correct distance to the substrate 500 and the substrate 500 is positioned on the fixed holding member 15.

On the other hand, as shown in FIG. 19B, when the distance to the object measured by the sensor 1140 is different from W2 and B is longer than W2, the sensor 1140 measures the distance to the fixed holding member 15. As can be seen, the substrate 500 does not exist on the fixed holding member 15.

Next, the operation when the substrate holder opening / closing mechanism 102 of the plating apparatus according to another embodiment of the present invention places and removes the substrate 500 on the substrate holder 110 will be described with reference to FIGS.

FIG. 20 is a perspective view showing a state in which the substrate holder 110 is placed on the table 120 by the substrate holder transport mechanism 140. In this state, the head portion 1100 connected to the first actuator 1200 via the connection boss 1117 is positioned in a state of being separated upward from the substrate holder 110. The shaft 1130 extends from the head portion 1100 to above the second actuator 1300. The substrate holder 110 does not hold the substrate 500, and the movable holding member 11 is temporarily fixed to the fixed holding member 15. Here, the temporary fixing refers to a state in which the ear portion 13 slightly bites into the clamper 16.

From this state, the head unit 1100 is lowered by the first actuator 1200. The shaft 1130 is positioned between the two rotating rollers 1340 of the second actuator 1300.

Further, when the second actuator 1300 is moved in a direction to release the temporary holding of the movable holding member 11 and the fixed holding member 15, that is, in a direction to release the fitting of the ear portion 13 and the clamper 16, the state shown in FIG. Become. In FIG. 21, the shaft hook 1330 is moved to the X ′ side by the second actuator, and the rotating plate 1150 is rotated counterclockwise. Accordingly, as described above, the fastening hook 1151 of the rotating plate 1150 presses the protruding portion 12a of the pressing member 12 to rotate the pressing member 12, and the ear portion 13 moves to the position of the lifting hook 1111.

From the state of FIG. 21, first, the shaft hook 1330 returns to the intermediate position of XX ′ by the operation in which the second actuator 1300 returns to the origin, and then the first actuator 1200 raises the head portion 1100 to move the movable holding member. 11 lifts. Further, when the substrate transfer robot 180 places the substrate 500 on the substrate placement location 14 of the fixed holding member 15, the state shown in FIG.

From the state of FIG. 22, the first actuator 1200 lowers the head unit 1100 again. At this time, when the pressing block 1114 located on the bottom surface of the pressing disk 1110 presses the movable holding member 11 as described above, the pressing block 1114 includes the elastic body 30 inside, thereby causing variation in the thickness of the substrate holder. Variation in the pressing amount of the seal ring 18 can be reduced.

When the first actuator 1200 lowers the head portion 1100 again from the state of FIG. 22 and the second actuator 1300 further moves the shaft hook 1330 to the X side, the shaft hook 1330 pushes the shaft 1130 to the X side. The rotating plate 1150 rotates clockwise. This state is shown in FIG. When the rotating plate 1150 rotates clockwise, the fastening hook 1151 pushes the protruding portion 12a of the pressing member 12, and the pressing member 12 also rotates clockwise. Since the ear portion 13 is fitted to the clamper 16, the movable holding member 11 is fixed to the fixed holding member 15 and can hold the substrate.

FIG. 23 shows a state in which the ear portion 13 and the clamper 16 are fitted to each other in a state where the substrate 500 is sandwiched between the movable holding member 11 and the fixed holding member 15, but the substrate 500 is not sandwiched between them. When the movable holding member 11 and the fixed holding member 15 are temporarily fixed, it can be achieved by stopping the movement of the shaft hook 1330 in the X direction slightly in front of FIG.

In FIG. 23, after the ear portion 13 and the clamper 16 are fitted to each other, the shaft hook 1330 first returns to the intermediate position of X-X ′ by the operation in which the second actuator 1300 returns to the origin. The substrate holder 110 holding the substrate 500 is transported to the plating processing unit 130 by the substrate holder transporting unit 140, and a predetermined process is performed on the substrate 500.

After predetermined processing is finished in the plating processing unit 130, the substrate holder 110 holding the processed substrate 500 is placed on the table 120, and the substrate holder 110 is opened by the substrate holder opening / closing mechanism 102 and the substrate transport robot 180. Taken from. Although the operation of separating the movable holding member 11 from the fixed holding member 15 in order to take out the substrate 500 from the substrate holder 110 is not described in detail, it is achieved by the operations of the first actuator 1200 and the second actuator 1300 described above. It will be understood. FIG. 22 also shows a state in which the movable holding member 11 is lifted by the head portion 1100 after the substrate holder 110 holding the substrate 500 is placed on the table 120. Here, the substrate 500 is lifted by adhering to the first seal ring 18a, and then dropped onto the fixed holding member 15 to cause a positional shift or remain stuck on the movable holding member 11 side. However, such a trouble can be detected by measuring the distance from the fixed holding member 11 and the substrate 500 by the sensor 1140 attached to the head unit 1100 as described above. .

As described above, the substrate holder opening / closing mechanism 102 of the plating apparatus according to another embodiment of the present invention can keep the size of the apparatus small and reduce the cost by a combination of simple mechanisms. In addition, the substrate holder opening / closing mechanism 102 of the plating apparatus according to another embodiment of the present invention is provided with a sensor 1140 that detects the displacement of the substrate in the head unit 1100 that moves up and down, thereby deforming the substrate 500 and the substrate holder 110. In addition, regardless of whether or not water droplets adhere to the substrate 500, the positional deviation of the substrate can be detected with higher accuracy than the conventional method. Furthermore, the substrate holder opening / closing mechanism 102 of the plating apparatus according to another embodiment of the present invention is provided with the elastic body 30 inside the pressing block 1114 that presses the substrate holder 110, thereby allowing individual differences in the thickness of the substrate holder 110. The change in the compression amount of the seal ring 18 caused by the above can be alleviated, and the sealing performance with respect to the substrate 500 can be stabilized.

Although the embodiment of the present invention has been described so far, the present invention is not limited to the above-described embodiment, and it is needless to say that the present invention may be implemented in various different forms within the scope of the technical idea. For example, in the above-described embodiment, the second actuator 1300 is disposed on the side of the table 120. However, the second actuator rotates the rotating plate 1150 with respect to the pressing disc 1110. A rotary actuator 1150 may be rotated by providing a second actuator on the plate 1110. In the above-described embodiment, the influence of the thickness variation of the substrate holder on the compression amount of the seal ring is mitigated by using the pressing block 1114 having an elastic body inside, but the head portion 1100 is lowered. A torque may be monitored using a servomotor for the first actuator, and the descending operation of the head unit 1100 may be controlled so that the compression force of the seal ring becomes constant. Thereby, even if the thickness of the substrate holder varies, the compression amount of the seal ring can be made constant.

DESCRIPTION OF SYMBOLS 100 Plating apparatus frame 102 Substrate holder opening / closing mechanism 110 Substrate holder 111 Handle bar 112 Hanger part 113 Lower end part 114 of substrate holder Feeding contact 120 Table 121 Horizontal moving mechanism 130 Plating part 140 Substrate holder conveyance part 141 Arm 142 Lifter 143 Clamper 144 Sensor 145 Post unit 146 Actuator 500 Substrate 1100 Head unit 1200 First actuator 1300 Second actuator

Claims (4)

A table for horizontally mounting a substrate holder for detachably holding the substrate;
A plating treatment unit for holding the plating solution, vertically immersing the substrate detachably held in the substrate holder, and performing a plating treatment;
A holding unit for holding the substrate holder, and a substrate holder transfer unit for transferring the substrate holder between the table and the plating unit;
A substrate holder opening and closing mechanism of the substrate holder placed on the table,
The substrate holder includes a movable holding member having a rotatable pressing member, and a fixed holding member to which the movable holding member that holds the substrate holder together with the movable holding member is fixed.
The substrate holder opening / closing mechanism is
A head portion that presses the movable holding member, and at least a part of the movable holding member rotates to fix the movable holding member to and release from the fixed holding member, and to hold the movable holding member;
A first actuator for moving the head portion up and down;
A second actuator for rotating at least a part of the head portion;
A plating apparatus comprising: The head portion is
A rotatable rotating plate,
A pressing disk that includes a lifting hook capable of holding the movable holding member and presses the movable holding member;
The pressing member has an ear part,
The fixed holding member has a clamper,
The rotating plate is connected to a shaft, the shaft is rotated by pushing the second actuator, and the pressing member is rotated by rotating the rotating plate,
In response to the rotation of the presser member, the ear part
The plating apparatus according to claim 1, wherein the plating apparatus is fitted to the clamper and the movable holding member is fixed to the fixed holding member, or moves to a lifting position of the lifting hook.   The plating apparatus according to claim 2, wherein the head unit includes substrate position detecting means for confirming a position of the substrate on the substrate holder. The plating apparatus according to claim 2 or 3, wherein the pressing disk includes a pressing block that presses the movable holding member, and the pressing block includes a spring that is compressed in advance.