CN115094503B - Automatic moving device for driving chip electroplating - Google Patents

Abstract

The application relates to an automatic moving device for driving chip electroplating, which relates to the technical field of chip electroplating and comprises a box body, wherein a moving mechanism is arranged on the box body and comprises: the sliding table is arranged on the box body in a sliding manner; the movable frame is arranged on the sliding table in a vertical sliding manner and is detachably provided with a clamp group; the moving assembly is arranged on the sliding table and used for driving the moving frame to move; and the reciprocating assembly is arranged on the box body and used for driving the sliding table to reciprocate, so that the chip positioned on the clamp group reciprocates in the electroplating liquid to carry out electroplating. According to the application, the chip is mounted on the movable frame, the movable assembly is started to drive the chip to move into the electroplating liquid for electroplating, and then the reciprocating assembly is started to reciprocate the chip, so that the clamp group with the chip is not required to be placed into the electroplating box for electroplating manually, and the electroplating efficiency is improved.

Description

Automatic moving device for driving chip electroplating

Technical Field

The application relates to the technical field of chip electroplating, in particular to an automatic moving device for driving chip electroplating.

Background

The chip refers to a microstructure with a required circuit function, and one procedure in the manufacturing process of the chip is to electroplate an open circuit and short circuit test board of the chip, so that the electroplating enhances the corrosion resistance, the hardness and the like of metal.

In the prior art, a worker generally installs a plurality of chips on a jig, and then places the jig and the chips into a plating tank to perform plating, and the time taken for the plating can be prolonged by a manual operation.

Disclosure of Invention

In order to improve the electroplating efficiency, the application provides an automatic moving device for driving a chip to be electroplated.

The application provides an automatic moving device for driving a chip to be electroplated, which adopts the following technical scheme:

the utility model provides an automatic moving device that drives chip electroplating, includes the box that sets up on electroplating box, be provided with the moving mechanism who is used for removing the chip on the box, moving mechanism includes:

the sliding table is arranged on the box body in a sliding manner;

the movable frame is arranged on the sliding table in a vertical sliding manner and is detachably provided with a plurality of clamp groups for fixing chips;

the moving assembly is arranged on the sliding table and used for driving the moving frame to move;

and the reciprocating assembly is arranged on the box body and used for driving the sliding table to reciprocate, so that the chips on the clamp group reciprocate in the electroplating liquid to carry out electroplating.

Through adopting above-mentioned technical scheme, will be equipped with the anchor clamps group of chip and install on the movable frame, then remove the subassembly and start and drive anchor clamps group and chip and move down for the chip moves and electroplates in the electroplating solution of electroplating tank, then reciprocal subassembly starts and drives the platform and remove, and the platform removes and drive movable frame and chip reciprocating motion, after the electroplating is accomplished, reciprocal subassembly stop operation, and remove the subassembly and start and drive anchor clamps group and chip and move outside the electroplating solution, so realize the electroplating of chip, then continue to change anchor clamps group and chip and electroplate.

Therefore, the clamp group with the chip is not required to be placed into the electroplating box manually for electroplating, so that the electroplating efficiency is improved, and the reciprocating assembly is started to drive the chip to reciprocate for electroplating, so that the electroplating liquid can fully contact with the chip for electroplating, the electroplating effect of the electroplating liquid on the chip is improved, and the electroplating quality is improved while the chip electroplating efficiency is improved.

Optionally, the moving assembly includes:

the moving block is arranged on the moving frame;

the electric push rod is arranged on the sliding table and is connected with the fixed moving block.

By adopting the technical scheme, the electric push rod is started to drive the moving block to move, and the moving block moves to drive the moving frame to move up and down, so that the electric push rod is started to drive the moving frame to move up and down.

Optionally, the moving frame is rotatably provided with an installing frame through a rotating shaft, the clamp groups are arranged at the upper end and the lower end of the installing frame at intervals and are positioned at the upper side and the lower side of the moving frame, and the clamp groups are detachably connected with the installing frame through connecting components; the sliding table is provided with a rotating mechanism which is connected with the movable frame and used for driving the mounting frame to rotate, and the rotating mechanism is used for replacing the clamp groups and the chips which are positioned on the inner side and the outer side of the electroplating liquid.

Through adopting above-mentioned technical scheme, after the electroplating is accomplished, the movable assembly starts to drive the movable frame and shifts up, the movable frame shifts up and drives the mounting bracket through slewing mechanism start-up and rotate, make the anchor clamps group and the chip that electroplate accomplish rotate to movable frame top, make anchor clamps group and chip break away from with the electroplating solution in the electroplating tank, and the anchor clamps group and the chip that wait to electroplate rotate to movable frame below and get into the electroplating solution, thereby realize with inside and outside both sides anchor clamps group and the chip change position of electroplating solution, then can change anchor clamps group and the chip after the electroplating is accomplished, can start to electroplate the chip that waits to electroplate after the change is accomplished, reciprocating assembly starts simultaneously and drives the chip reciprocating motion and electroplate, after the electroplating is accomplished, the movable assembly starts to drive the movable frame and shifts down, the anchor clamps group and the chip change position that move continuously through slewing mechanism drive the inside and outside the electroplating solution, thereby the distance that movable assembly drives anchor clamps group and chip and move outside the electroplating solution has been shortened, thereby time has been saved, electroplating efficiency has been improved.

Meanwhile, the rotating mechanism drives the clamp group and the chip to rotate, so that the electroplating liquid on the clamp group and the chip falls off, the probability of damage to a human body caused by the electroplating liquid is reduced, and the safety during electroplating is improved.

Optionally, the rotating mechanism includes:

the rack is arranged on the sliding table, and the length direction of the rack is parallel to the sliding direction of the moving frame;

the gear is rotatably arranged on the movable frame through the rotating rod and meshed with the rack, and the gear is connected with the rotating shaft through the linkage assembly.

Through adopting above-mentioned technical scheme, remove the frame and remove and drive the gear and remove, make the gear take place to rotate under the effect of rack, the gear rotates and drives pivot and mounting bracket through the linkage subassembly and take place to rotate, remove the frame and remove the completion back, remove the frame and fix a position the position of mounting bracket through gear, rack and linkage subassembly, consequently realize that the mounting bracket rotates and also improved the stability of mounting bracket simultaneously; meanwhile, the movable assembly is started to drive the mounting frame to rotate, so that the consistency in the electroplating process is improved, the electroplating efficiency is further improved, a power source is not required to be additionally improved for driving the mounting frame to move, and the electroplating efficiency is improved and meanwhile energy is saved.

Optionally, the linkage assembly includes:

the first synchronous wheel and the second synchronous wheel are respectively arranged on the rotating rod and the rotating shaft and are connected through a synchronous belt.

Through adopting above-mentioned technical scheme, gear rotation drives the bull stick and rotates, and the bull stick rotates and drives first synchronizing wheel and rotate, and first synchronizing wheel rotates and drives second synchronizing wheel and pivot through the hold-in range and rotate, and the pivot rotates and drives the mounting bracket and take place to rotate to this realizes that the pivot rotates and drives the mounting bracket simultaneously and rotate.

Optionally, the connection assembly includes:

the connecting block is arranged on the mounting frame, and the clamp group is spliced on the connecting block;

the positioning block is arranged on the mounting frame in a sliding manner;

the two ends of the connecting spring are respectively connected with the mounting frame and the positioning block, and the positioning block is propped against the clamp group to be positioned under the action of the connecting spring

Through adopting above-mentioned technical scheme, the clamp group is kept away from to the extrusion locating piece, then can take off the clamp group, inserts the setting of new clamp group on to the connecting block afterwards, then loosens the locating piece, and the locating piece moves back under the coupling spring effect and supports to press and fix a position on the clamp group to this realizes changing clamp group, has also saved the time that changes clamp spent moreover, has improved electroplating efficiency.

Optionally, a connecting plate extending out of the mounting frame is arranged on the clamp group, an anti-falling block is arranged on the connecting plate, a mounting rod group is arranged on the upper surface of the movable frame, two mounting sleeves are detachably arranged on the mounting rod group through a fixing assembly, and a pushing rod is arranged on the mounting rod group;

when any one of the two clamp groups positioned on the mounting frame rotates to the upper part of the movable frame, the connecting plate can rotate to the inside of the mounting sleeve, so that the anti-falling block is clamped and mounted on the mounting sleeve to block the mounting sleeve from being separated from the clamp group, and the push rod is contacted with the positioning block to push the positioning block to be separated from the clamp group for unlocking the clamp group.

Through adopting above-mentioned technical scheme, the mounting bracket rotates and drives the connecting plate and anticreep piece rotates for the connecting plate rotates to in the installation cover, and anticreep piece joint is installed in the installation cover, the mounting bracket rotates simultaneously and drives the locating piece and rotate, contact with the catch bar when the locating piece rotates, therefore when the anticreep piece joint is installed in the installation cover, the catch bar promotes locating piece and anchor clamps group and breaks away from, thereby realize unblock to anchor clamps group, then unblock fixed subassembly, the staff grasps the installation cover and takes off anchor clamps group, consequently, the staff has reduced the contact of staff and plating solution and causes the probability of damage to the health, the security when staff electroplates, also need not to unlock the anchor clamps group simultaneously, thereby saved the time of taking off anchor clamps group, consequently, electroplating efficiency has been improved, the security when electroplating has also been improved simultaneously.

When the chip is electroplated, a worker can replace the electroplated chip with the chip to be electroplated, the clamp group is clamped and mounted on the connecting block after the chip to be electroplated is mounted on the clamp group, the mounting sleeve is connected with the mounting rod group through the fixing component, then the mounting rack rotates to drive the connecting plate and the anti-falling block to be separated from the mounting sleeve, the pushing rod is separated from the positioning block, and the positioning block moves back to be pressed on the clamp group to be positioned under the action of the connecting spring, so that the automatic locking and unlocking of the clamp group is realized, the electroplating efficiency is further improved, and the electroplating safety is also improved.

Optionally, the fixing assembly includes:

the fixing block is arranged on the mounting sleeve, is arranged on the mounting rod group in a sliding manner and can be taken down from the mounting rod group, and when the mounting sleeve moves to drive the fixing block to be taken down from the mounting rod group, the mounting sleeve drives the connecting plate and the clamp group to be taken down from the connecting block;

the magnet piece is arranged on the mounting sleeve and is adsorbed on the mounting rod group for positioning.

Through adopting above-mentioned technical scheme, pulling installation cover drives the magnet piece and breaks away from with the installation pole group, then can take off the installation cover, slide the fixed block and install on the installation pole group after renewing the installation cover afterwards, then promote the installation cover and drive the fixed block and remove for the magnet piece adsorbs the installation pole group on location, so that realize the installation and the dismantlement of installation cover.

Optionally, the installation sleeve is provided with an adsorption sponge for adsorbing the electroplating solution on the connecting plate and the anti-drop block.

Through adopting above-mentioned technical scheme, adsorb the sponge and adsorb the plating solution to further reduce the plating solution and reveal the probability that causes the damage to staff's health, consequently further improved the security when electroplating.

Optionally, the reciprocating assembly includes:

the reciprocating screw rod is rotatably arranged on the box body, is connected with the sliding table and is used for driving the sliding table to reciprocate;

and the reciprocating motor is arranged on the box body and is connected with the reciprocating screw rod.

By adopting the technical scheme, the reciprocating motor starts to drive the reciprocating screw rod to rotate, and the reciprocating screw rod rotates to drive the sliding table to reciprocate, so that the reciprocating motor starts to drive the sliding table to reciprocate, and the reciprocating motor can drive the sliding table to reciprocate without frequent direction change.

In summary, the present application includes at least one of the following beneficial technical effects:

through installing the chip on the movable frame, then move the subassembly start drive chip and move to electroplate in the liquid, then reciprocal subassembly start chip reciprocating motion, thereby realize the electroplating of chip, then continue to change anchor clamps group and chip and electroplate, thereby need not the manual work and put into the anchor clamps group that is equipped with the chip and electroplate in the electroplating tank, thereby electroplating efficiency has been improved, reciprocal subassembly start drive chip reciprocating motion electroplate in addition, make the plating solution fully contact with the chip and electroplate, thereby the electroplating effect of plating solution to the chip has been improved, thereby also improved electroplating quality when improving chip electroplating efficiency.

Drawings

FIG. 1 is a schematic perspective view of the present application;

FIG. 2 is a schematic view of the movement mechanism, rotation mechanism and linkage assembly of the present application;

FIG. 3 is a schematic view of the structure of the mounting bracket, clamp group, mounting bar group and connection assembly of the present application;

FIG. 4 is an enlarged schematic view of portion A of FIG. 2;

FIG. 5 is a schematic view of the structure of the mounting bracket, clamp group and connection assembly of the present application;

FIG. 6 is a partial exploded view of the present application, primarily showing the clamp group and securing assembly;

FIG. 7 is a schematic view of the construction of the mounting sleeve and securing assembly of the present application with a partial cross-section of the side wall of the mounting sleeve.

Reference numerals: 1. a case; 11. an electroplating box; 12. a support table; 13. a fixed table; 14. a clamp group; 141. a connecting plate; 142. an anti-falling block; 15. a first clamp; 16. a second clamp; 17. a rotating shaft; 18. a rotating rod; 19. a mounting frame; 2. a moving mechanism; 21. a sliding table; 22. a moving rack; 23. a moving assembly; 24. a moving block; 25. an electric push rod; 3. a reciprocating assembly; 31. a reciprocating screw rod; 32. a reciprocating motor; 33. a guide groove; 4. a rotating mechanism; 41. a rack; 42. a gear; 5. a linkage assembly; 51. a first synchronizing wheel; 52. a second synchronizing wheel; 53. a synchronous belt; 6. a connection assembly; 61. a connecting block; 62. a positioning block; 63. a connecting spring; 64. a connecting groove; 65. a plug-in groove; 66. a mounting table; 67. a chip; 7. mounting a rod group; 71. a first mounting post; 72. a second mounting post; 73. a push rod; 74. a first pushing surface; 75. a positioning part; 76. a second pushing surface; 77. a mounting groove; 8. a fixing assembly; 81. a fixed block; 82. a magnet piece; 9. a mounting sleeve; 91. a first anti-drop groove; 92. a second anti-drop groove; 93. adsorbing the sponge.

Detailed Description

The application will be described in further detail below with reference to the accompanying drawings 1-7.

The embodiment of the application discloses an automatic moving device for driving a chip to be electroplated.

Referring to fig. 1, the automatic moving device for driving the chip plating includes a case 1 fixedly installed on opposite side walls of two plating tanks 11, the plating tanks 11 are in a rectangular parallelepiped state, and the two plating tanks 11 are arranged at intervals along the width direction of the plating tank 11, and simultaneously, the top end of the plating tank 11 is in an open shape and is filled with a plating solution for plating, and a moving mechanism 2 for moving the chip 67 for plating is arranged on the case 1.

Referring to fig. 1 and 2, the moving mechanism 2 includes a sliding table 21, a moving frame 22, a moving assembly 23 and a reciprocating assembly 3, two support tables 12 are fixedly installed on the upper surface of the case 1 at intervals along the width direction of the plating tank 11, the sliding table 21 is horizontally slidably installed on the upper surface of the case 1, and the sliding direction of the sliding table 21 is parallel to the width direction of the plating tank 11, while the sliding table 21 is located between the two support tables 12, and two fixing tables 13 are fixedly installed on the upper surface of the sliding table 21 at intervals along the sliding direction perpendicular to the sliding direction of the sliding table 21; the movable frames 22 are arranged at intervals along the sliding direction perpendicular to the sliding tables 21, meanwhile, the movable frames 22 are vertically installed on the side walls of the opposite sides of the two fixed tables 13 in a sliding mode, and two ends of each movable frame 22 extend to the positions above the two electroplating boxes 11 respectively.

Referring to fig. 1 and 2, the moving frame 22 is provided with a clamp group 14 having a chip 67 at both ends thereof, and the clamp group 14 and the chip 67 can be put into a plating solution for plating; the moving assemblies 23 are arranged on the sliding table 21 and used for driving the two moving frames 22 to vertically move, and the two moving assemblies 23 are arranged at intervals along the width direction of the electroplating tank 11; the moving assembly 23 comprises a moving block 24 and an electric push rod 25, wherein the moving block 24 is fixedly arranged on the side wall of the opposite side of the two moving frames 22, the electric push rod 25 is fixedly arranged on the upper surface of the sliding table 21, and a piston rod of the electric push rod 25 is vertically upwards and fixedly connected with the lower surface of the moving block 24.

Referring to fig. 1 and 2, the reciprocating assembly 3 is disposed on the case 1 and is used for driving the sliding table 21 to reciprocate, so that the sliding table 21 drives the chip 67 on the fixture set 14 to reciprocate in the plating solution for plating; the reciprocating assembly 3 comprises a reciprocating screw rod 31 and a reciprocating motor 32, the reciprocating screw rod 31 is horizontally and rotatably arranged on the side wall of the opposite side of the two supporting tables 12, the axis of the reciprocating screw rod 31 is parallel to the sliding direction of the sliding table 21, meanwhile, two guide grooves 33 which are connected end to end and are spiral are formed in the side wall of the reciprocating screw rod 31, the reciprocating screw rod 31 passes through the sliding table 21, and a guide block which is slidably arranged on the guide grooves 33 is rotatably arranged on the sliding table 21; the reciprocating motor 32 is fixedly installed on the case 1, and an output shaft of the reciprocating motor 32 is connected with the reciprocating screw 31. The reciprocating motor 32 is started to drive the reciprocating screw rod 31 to rotate, the reciprocating screw rod 31 rotates to move on one of the guide grooves 33 through the guide block, and then the guide block moves to the other guide groove 33 to move back, so that the sliding table 21 moves back and forth under the action of the guide block.

Referring to fig. 2 and 3, horizontal rotating shafts 17 are rotatably mounted at both ends of the moving frame 22, a mounting frame 19 is fixedly mounted at one end of the two rotating shafts 17 away from the moving frame 22, and both ends of the mounting frame 19 vertically extend to the upper and lower sides of the moving frame 22 respectively; while the clamp group 14 is located on both ends of the mounting frame 19, so that the clamp group 14 and the chip 67 located at the bottom end of the mounting frame 19 are located inside the plating solution, and the clamp group 14 and the chip 67 located at the top end of the mounting frame 19 are located outside the plating solution; and the clamp group 14 comprises a first clamp 15 and a second clamp 16 which are positioned at two ends of the mounting frame 19 and have the same shape and size, and the distance between the first clamp 15 and the axis of the rotating shaft 17 in the vertical direction is larger than the distance between the second clamp 16 and the axis of the rotating shaft 17 in the vertical direction.

Referring to fig. 2 and 3, a rotating mechanism 4 connected to the movable frame 22 and used for driving the rotating shaft 17 to rotate is provided on the sliding table 21, and the rotating mechanism 4 is used for replacing the clamp groups 14 and the chips 67 located on the inner side and the outer side of the plating solution.

Referring to fig. 2 and 4, two rotating mechanisms 4 connected to each moving frame 22 are provided, and the two rotating mechanisms 4 are provided in one-to-one correspondence with the two rotating shafts 17; the rotating mechanism 4 comprises a rack 41 and a gear 42, wherein the rack 41 is fixedly arranged on the upper surface of the sliding table 21, and the rack 41 is in a vertical state; the gear 42 is horizontally rotatably mounted on the side wall of the moving frame 22 by the rotating rod 18, and the gear 42 is positioned on one side of the rack 41 close to the rotating shaft 17, and the gear 42 is meshed with the rack 41, and the axes of the rotating rod 18 and the rotating shaft 17 are parallel.

Referring to fig. 2 and 4, the gear 42 is connected to the rotation shaft 17 through the link assembly 5, the link assembly 5 includes a first synchronizing wheel 51 fixedly installed on the rotation shaft 18 and a second synchronizing wheel 52 fixedly installed on the rotation shaft 17, and the first synchronizing wheel 51 is connected to the first synchronizing wheel 51 through a timing belt 53. The upward movement of the moving frame 22 drives the gear 42 to move upward, the gear 42 rotates due to the rack 41, the gear 42 rotates to drive the first synchronizing wheel 51 to rotate, and the first synchronizing wheel 51 rotates to drive the second synchronizing wheel 52 and the rotating shaft 17 to rotate through the synchronous belt 53.

Referring to fig. 2 and 3, the rotation of the rotating shaft 17 drives the mounting frame 19 to rotate 180 degrees, and the moving frame 22 moves downwards to drive the mounting frame 19 to rotate 180 degrees, when the moving frame 22 moves upwards or downwards, the clamp group 14 and the chip 67 positioned at the bottom end of the mounting frame 19 are always positioned in the electroplating solution; when the movable frame 22 moves down to the lowest position, the first clamp 15 is positioned above the movable frame 22, and the second clamp 16 is positioned below the movable frame 22; and when the movable frame 22 is moved up to the highest position, the second clamp 16 is located above the movable frame 22, and the first clamp 15 is located below the movable frame 22.

Referring to fig. 3 and 5, the first clamp 15 and the second clamp 16, which are positioned at both ends of the mounting frame 19, are detachably connected to the mounting frame 19 through the connection assembly 6, and the connection assembly 6 connected to the first clamp 15 is explained below as an example; the connecting assembly 6 comprises a connecting block 61, a positioning block 62 and a connecting spring 63, wherein the connecting block 61 is fixedly arranged on the side wall of the mounting frame 19, a connecting groove 64 communicated with the side wall of the connecting block 61 on the side away from the mounting frame 19 is formed in the side wall of the connecting block 61, a plugging groove 65 extending to the bottom of the connecting groove 64 is formed in the connecting groove 64, the first clamp 15 is horizontally plugged and installed on the plugging groove 65 and is abutted against the bottom of the connecting groove 64, meanwhile, an installation table 66 extending out of the connecting groove 64 is fixedly arranged on the side wall of the side away from the mounting frame 19 of the first clamp 15, the chip 67 is fixedly arranged on the side wall of the installation table 66 on the side away from the first clamp 15, and meanwhile, the connecting grooves 64 of the two connecting blocks 61 are located on the side walls of the two connecting blocks 61 in the same direction.

Referring to fig. 3 and 5, the positioning block 62 is vertically slidably mounted on the side wall of the mounting frame 19, and the positioning block 62 is located at one side of the connecting block 61 away from the bottom of the connecting groove 64; one end of the connecting spring 63 is fixedly arranged on the side wall of the mounting frame 19 above the positioning block 62, the other end of the connecting spring 63 is fixedly arranged on the top end of the positioning block 62, and the positioning block 62 is propped against one end of the first clamp 15, which is far away from the bottom of the connecting groove 64, for positioning under the action of the connecting spring 63.

Referring to fig. 3 and 5, a vertically upward mounting bar set 7 is fixedly mounted on the upper surface of the moving frame 22, and the mounting bar set 7 includes a first mounting post 71 and a second mounting post 72 at both sides of the mounting frame 19 and the rotation shaft 17, with the top end of the first mounting post 71 being above the top end of the second mounting post 72; the side wall of the first mounting column 71 and the top end of the second mounting column 72 are detachably provided with a mounting sleeve 9 through a fixing assembly 8, and meanwhile, the mounting sleeve 9 on the first mounting column 71 is positioned above the mounting sleeve 9 on the second mounting column 72; the push rod 73 is fixedly mounted on the side wall of the first mounting column 71 above the two mounting sleeves 9 and the side wall of the second mounting column 72 below the two mounting sleeves 9, the push rod 73 is located between the first mounting column 71 and the second mounting column 72, the push rod 73 is in a horizontal state, an inclined first push surface 74 is formed on the upper surface of one end, close to the mounting frame 19, of the push rod 73, a horizontal positioning part 75 is fixedly mounted on the side wall, away from the first clamp 15, of the positioning block 62, and a second push surface 76 which can be attached to the first push surface 74 is formed on one end, away from the positioning block 62, of the positioning part 75.

Referring to fig. 3 and 5, rotation of the mounting bracket 19 drives the first clamp 15 to rotate from above the second mounting post 72 to above the movable bracket 22, and simultaneously drives the second clamp 16 to rotate from below the mounting sleeve 9 of the first mounting post 71 and to the side of the first mounting post 71 to below the movable bracket 22; when the first clamp 15 rotates above the moving frame 22, the positioning block 62 for limiting the first clamp 15 rotates, the positioning block 62 rotates to enable the second pushing surface 76 on the positioning portion 75 to be in contact with the first pushing surface 74 of the pushing rod 73 on the first mounting post 71, the pushing rod 73 pushes the positioning portion 75 and the positioning block 62 to be far away from the first clamp 15, so that the positioning block 62 unlocks the positioning of the first clamp 15, and when the second clamp 16 rotates above the moving frame 22, the pushing rod 73 on the second mounting post 72 pushes the positioning block 62 for limiting the second clamp 16 to unlock.

Referring to fig. 3 and 6, the opposite side walls of the first mounting post 71 and the second mounting post 72 are respectively provided with a mounting groove 77, the mounting grooves 77 are formed along the plugging direction of the first clamp 15 and the plugging grooves 65, the mounting grooves 77 penetrate through the side wall of the first mounting post 71, which is close to the mounting frame 19, and the cross section of the mounting grooves 77 is T-shaped.

Referring to fig. 5 and 6, the fixing assembly 8 includes a fixing block 81 and a magnet piece 82, while two mounting sleeves 9 are located between the mounting frame 19 and the first mounting post 71, while the fixing block 81 is fixedly mounted on a side wall of the mounting sleeve 9 near the mounting groove 77, and the fixing block 81 is inserted and mounted on the mounting groove 77 and can slide on the mounting groove 77, while the magnet piece 82 is fixedly mounted on a side wall of the mounting sleeve 9 near the mounting groove 77 and has magnetism, and when the fixing block 81 is abutted against the bottom of the mounting groove 77, the magnet piece 82 is adsorbed on a side wall of the first mounting post 71 far away from the mounting frame 19 for positioning the mounting sleeve 9.

Referring to fig. 3 and 6, the connecting plates 141 are fixedly installed at the ends of the first and second clamps 15 and 16 extending to the outside of the insertion groove 65, and the ends of the connecting plates 141 away from the clamps extend horizontally to the outside of the mounting frame 19 and are integrally provided with the anti-falling blocks 142, and simultaneously the two anti-falling blocks 142 are located on the opposite side walls of the two connecting plates 141.

Referring to fig. 5 and 7, a first anti-drop groove 91 is formed in the upper surface of one end, close to the mounting frame 19, of the two mounting sleeves 9, the first anti-drop groove 91 is communicated with one end, close to the mounting frame 19, of the mounting sleeve 9, meanwhile, a second anti-drop groove 92 is formed in the bottom of the first anti-drop groove 91 and one end, far away from the mounting frame 19, of the first anti-drop groove 91, and the second anti-drop groove 92 are identical in width and are flush with two side walls connected with each other; and the opposite two side walls of the first anti-drop groove 91 are fixedly provided with adsorption sponge 93, and the adsorption sponge 93 is used for adsorbing the electroplating solution.

Referring to fig. 5 and 7, when the first clamp 15 is rotated above the moving frame 22, the connection plate 141 connected to the first clamp 15 is rotated into the first escape prevention groove 91 of the mounting sleeve 9 of the first mounting post 71, and the adsorption sponge 93 is used to adsorb the plating solution on the connection plate 141 and the escape prevention block 142, and the escape prevention block 142 is clamped and mounted into the second escape prevention groove 92, so that the escape prevention block 142 is used to block the disconnection of the connection plate 141 and the mounting sleeve 9.

Referring to fig. 5 and 7, the mounting sleeve 9 is pulled, the mounting sleeve 9 pulls the magnet piece 82 and the first mounting post 71 to be separated, then the first clamp 15, the chip 67 and the mounting sleeve 9 can be removed, then a new first clamp 15 and the inserting groove 65 are in inserting fit, the fixing block 81 and the mounting groove 77 are in inserting fit, the mounting sleeve 9 is pushed to drive the first clamp 15 to be completely inserted and mounted on the inserting groove 65, and the magnet piece 82 is adsorbed on the first mounting post 71 to be positioned, so that the first clamp 15, the chip 67 and the mounting sleeve 9 can be replaced; when the second jig 16 is moved above the moving frame 22, the connection plate 141 connected to the second jig 16 is turned into the mounting bush 9 located in the second mounting post 72, and then the second jig 16, the chip 67 and the mounting bush 9 are replaced as in the method of replacing the mounting bush 9 connected to the first mounting post 71.

The working principle of the embodiment of the application is as follows:

the reciprocating motor 32 is started to drive the movable frame 22 to reciprocate, the movable frame 22 drives the chip 67 immersed in the plating solution to reciprocate, so that the chip 67 is plated, after plating is completed, the electric push rod 25 is started to drive the movable frame 22 to move downwards, the movable frame 22 moves downwards to drive the mounting frame 19 to rotate 180 degrees, so that the mounting frame 19 rotates to drive the first clamp 15 and the plated chip 67 to rotate out of the plating solution, the first clamp 15 and the plated chip 67 rotate above the movable frame 22, the second clamp 16 and the chip 67 to be plated rotate below the movable frame 22 from above the movable frame 22, the second clamp 16 and the chip 67 to be plated rotate into the plating solution, the positioning block 62 for limiting the first clamp 15 is far away from the first clamp 15 under the action of the pushing rod 73, so that the first clamp 15 is unlocked, the connecting plate 141 connected with the first clamp 15 is rotated to the first anti-falling groove 91, the anti-falling block 142 is clamped and installed in the second anti-falling groove 92 to be positioned, then the installation sleeve 9 is pulled to drive the magnet piece 82 to be separated from the first installation column 71, then the first clamp 15 with the chip 67 to be electroplated is installed on the inserting groove 65 in an inserting mode, the fixing block 81 is installed on the installation groove 77 in an inserting mode, the first clamp 15 is pushed to be installed on the inserting groove 65 in a fully inserting mode, and the magnet piece 82 is adsorbed on the first installation column 71 to be positioned, so that the replacement of the first clamp 15 and the chip 67 is realized.

Then the reciprocating motor 32 is started to continue electroplating, after the electroplating is completed, the electric push rod 25 drives the movable frame 22 to move upwards, and the movable frame 22 drives the mounting frame 19 to rotate 180 degrees, so that the second clamp 16 and the electroplated chip 67 rotate above the movable frame 22, the first clamp 15 and the chip 67 to be electroplated rotate below the movable frame 22, and then the second clamp 16 and the chip 67 are replaced by a method for replacing the first clamp 15 and the chip 67, thereby improving the electroplating efficiency of the chip 67 and the safety during electroplating.

The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.

Claims (7)

1. The utility model provides a drive automatic mobile device that chip electroplated, includes box (1) on two electroplating boxes (11) relative one side lateral walls, its characterized in that: the case (1) is provided with a moving mechanism (2) for moving the chip (67), and the moving mechanism (2) includes:

the sliding table (21) is arranged on the box body (1) in a sliding manner;

the movable frame (22) is arranged on the sliding table (21) in a sliding manner up and down, and a plurality of clamp groups (14) for fixing the chip (67) are detachably arranged on the movable frame (22);

a moving assembly (23), wherein the moving assembly (23) is arranged on the sliding table (21) and is used for driving the moving frame (22) to move;

the reciprocating assembly (3) is arranged on the box body (1) and used for driving the sliding table (21) to reciprocate, so that the chip (67) positioned on the clamp group (14) reciprocates in the electroplating liquid to carry out electroplating;

the movable frame (22) is rotatably provided with a mounting frame (19) through a rotating shaft (17), the clamp groups (14) are arranged at the two ends of the mounting frame (19) at intervals up and down and are positioned at the upper side and the lower side of the movable frame (22), and the clamp groups (14) are detachably connected with the mounting frame (19) through a connecting assembly (6); the sliding table (21) is provided with a rotating mechanism (4) which is connected with the movable frame (22) and used for driving the mounting frame (19) to rotate, and the rotating mechanism (4) is used for replacing the clamp groups (14) and the chips (67) which are positioned at the inner side and the outer side of the electroplating solution;

the rotation mechanism (4) includes:

a rack (41), wherein the rack (41) is arranged on the sliding table (21) and the length direction is parallel to the sliding direction of the movable frame (22);

the gear (42) is rotatably arranged on the movable frame (22) through the rotating rod (18) and meshed with the rack (41), and the gear (42) is connected with the rotating shaft (17) through the linkage assembly (5);

the linkage assembly (5) comprises:

the first synchronous wheel (51) and the second synchronous wheel (52), wherein the first synchronous wheel (51) and the second synchronous wheel (52) are respectively arranged on the rotating rod (18) and the rotating shaft (17) and are connected through a synchronous belt (53).

2. The automatic moving device for driving chips to be plated according to claim 1, wherein: the moving assembly (23) comprises:

a moving block (24), the moving block (24) being provided on a moving frame (22);

and the electric push rod (25) is arranged on the sliding table (21) and is connected with the fixed moving block (24).

3. The automatic moving device for driving chips to be plated according to claim 1, wherein: the connection assembly (6) comprises:

the connecting block (61), the connecting block (61) is arranged on the mounting frame (19), and the clamp group (14) is spliced on the connecting block (61);

the positioning block (62) is slidably arranged on the mounting frame (19);

the connecting spring (63), connecting spring (63) both ends are connected with mounting bracket (19) and locating piece (62) respectively, locating piece (62) support under connecting spring (63) effect and press on anchor clamps group (14) and fix a position.

4. An automatic moving device for driving chips to plate according to claim 3, wherein: the fixture comprises a fixture group (14), wherein a connecting plate (141) extending out of a mounting rack (19) is arranged on the fixture group, an anti-falling block (142) is arranged on the connecting plate (141), a mounting rod group (7) is arranged on the upper surface of a movable rack (22), two mounting sleeves (9) are detachably arranged on the mounting rod group (7) through a fixing assembly (8), and a pushing rod (73) is arranged on the mounting rod group (7);

when any one of the two clamp groups (14) positioned on the mounting frame (19) rotates to the upper part of the movable frame (22), the connecting plate (141) can rotate into the mounting sleeve (9), so that the anti-falling block (142) is clamped and mounted on the mounting sleeve (9) to block the mounting sleeve (9) from being separated from the clamp groups (14), and the push rod (73) is contacted with the positioning block (62) to push the positioning block (62) to be separated from the clamp groups (14) for unlocking the clamp groups (14).

5. The automatic moving device for driving chip plating according to claim 4, wherein: the fixing assembly (8) comprises:

the fixing block (81), the fixing block (81) is arranged on the mounting sleeve (9) and is arranged on the mounting rod group (7) in a sliding manner and can be taken down from the mounting rod group (7), when the mounting sleeve (9) moves to drive the fixing block (81) to be taken down from the mounting rod group (7), the mounting sleeve (9) drives the connecting plate (141) and the clamp group (14) to be taken down from the connecting block (61);

the magnet piece (82), magnet piece (82) set up on installation cover (9) and adsorb on installation pole group (7) and fix a position.

6. The automatic moving device for driving chip plating according to claim 5, wherein: an adsorption sponge (93) for adsorbing the electroplating liquid on the connecting plate (141) and the anti-drop block (142) is arranged on the mounting sleeve (9).

7. The automatic moving device for driving chips to be plated according to claim 1, wherein: the reciprocating assembly (3) comprises:

the reciprocating screw rod (31) is rotatably arranged on the box body (1), is connected with the sliding table (21) and is used for driving the sliding table (21) to reciprocate;

and the reciprocating motor (32) is arranged on the box body (1) and is connected with the reciprocating screw rod (31).