CN111809226A

CN111809226A - Device and process for treating residual copper of electroplating copper pin clamp

Info

Publication number: CN111809226A
Application number: CN202010558885.2A
Authority: CN
Inventors: 刘烨
Original assignee: Guangde Zhengda Electronic Technology Co ltd
Current assignee: Guangde Zhengda Electronic Technology Co ltd
Priority date: 2020-06-18
Filing date: 2020-06-18
Publication date: 2020-10-23

Abstract

The invention discloses a device for treating residual copper of an electroplating copper pin clamp, which comprises a reaction tank, wherein a pair of negative plates are arranged on the left side wall and the right side wall of the reaction tank, a placing frame is arranged in the reaction tank, a group of conductive chucks are arranged above the placing frame, a rectifier is arranged on the outer side of the reaction tank, the negative electrode of the rectifier is connected with the negative plates through a lead, and the positive electrode of the rectifier is connected with the conductive chucks through a lead. A process for treating residual copper on the fixture of electroplated copper pin includes such steps as adding the solution prepared from copper sulfate and sulfuric acid to reaction pool, clamping the electric clamper to the fixture with residual copper, putting the fixture in frame, and reverse electroplating. The method has the advantages of convenient operation, simple process, little pollution and good effect of removing residual copper.

Description

Device and process for treating residual copper of electroplating copper pin clamp

Technical Field

The invention relates to the technical field of residual copper treatment devices, in particular to a device and a process for treating residual copper of an electroplating copper pin clamp.

Background

At present, the residual copper mode of the electroplating copper pin clamp is nitric acid microetching treatment, nitric acid is strong acid with strong oxidizing property and corrosiveness, great potential safety hazards exist in the use process, the discharge nitrogen content of nitric acid waste liquid is high, the waste liquid is not easy to treat and has great environmental pollution, and the nitric acid liquid medicine is easily brought into the bath solution of a back process, so that the bath solution pollution is easily caused, the product scrapping is caused, and the service life of the bath solution is shortened. And the traditional nitric acid etching method for removing residual copper from the hanger has high requirements on temperature and environment, and the etching capability of the nitric acid etching method is changed along with the increase of copper ions in the groove, so that the removal of the residual copper from the hanger is not facilitated.

Disclosure of Invention

The invention aims to provide a device and a process for treating residual copper of an electroplating copper pin clamp, which aim to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides an incomplete copper processing apparatus of electroplating copper round pin anchor clamps, includes the reaction tank, be provided with a pair of negative plate on the lateral wall about the reaction tank, be provided with in the reaction tank and place the frame, the top of placing the frame is provided with a set of electrically conductive chuck, the outside of reaction tank is provided with the rectifier, the negative pole of rectifier passes through the wire and links to each other with the negative plate, and the positive pole of rectifier passes through the wire and links to each other with electrically conductive chuck.

Preferably, the left side wall and the right side wall of the reaction tank are rotatably connected with rotating plates, bottom plates are arranged at the bottoms of the rotating plates, clamping jaws are arranged on the rotating plates, a pair of clamping grooves are formed in the negative plates, and the clamping jaws are clamped in the clamping grooves.

Preferably, the placing frame, the rotating plate and the clamping jaws are made of plastic materials.

Preferably, the end of the claw is provided with a notch, and the outer side of the notch is provided with an opening which is opened outwards.

Preferably, the top of the reaction tank is fixedly connected with a group of supporting rods, a cross rod is fixedly connected between the supporting rods on the front side and the rear side, a cross beam is fixedly connected in front of the cross rods on the left side and the right side, and the placing frame is hung on the cross beam through a rope.

Preferably, the beam is rotatably connected with a group of turntables, the wire is wound on the turntables, and the conductive chuck is connected to the tail end of the wire.

Preferably, a coil spring is arranged in the rotating disc.

A treatment process for residual copper of an electroplating copper pin clamp comprises the following steps:

the method comprises the following steps:

adding a liquid medicine into the reaction tank, wherein the liquid medicine is prepared from copper sulfate and sulfuric acid according to a component ratio of 1: 3;

step two:

and clamping the electric clamp head onto a clamp with residual copper, then placing the clamp into a placing frame, and finally performing reverse electroplating by using a rectifier.

Compared with the prior art, the invention has the beneficial effects that: the invention adopts a reverse electroplating method, does not use nitric acid, has longer service life than a nitric acid pin hanger, and has lower environmental protection pressure. The components of the adopted liquid medicine are the same as those of the main tank liquid medicine, so that the problem of cross contamination does not exist. The reverse electroplating method has a good treatment effect on residual copper of the clamp. The clamp has no copper slag residue. The jack catch joint is conveniently changed the negative plate in the draw-in groove, makes the rotor plate stretch out the reaction tank with the rotor plate rotation degree during the change. The placing frame, the rotating plate and the clamping jaws are made of plastic materials and cannot be corroded by copper sulfate solution. The notch is used for limiting the cathode plate, and the opening is convenient for the cathode plate to be clamped in the clamping jaw. The placing frame is hung on the cross beam through a rope, so that the fixture can conveniently remove residual copper in batches. The wire is wound on the turntable, so that the wires are prevented from being entangled. The coil spring can make the wire automatically wind on the rotary disk. The method has the advantages of convenient operation, simple process, little pollution and good effect of removing residual copper.

Drawings

FIG. 1 is a schematic structural diagram of a copper residue treatment device of an electroplating copper pin clamp;

FIG. 2 is a schematic structural diagram of a claw in a copper residue processing device of an electroplating copper pin clamp.

In the figure: 1-reaction tank, 2-rotating plate, 3-bottom plate, 4-clamping jaw, 5-notch, 6-opening, 7-cathode plate, 8-clamping groove, 9-supporting rod, 10-cross rod, 11-cross beam, 12-rope, 13-placing frame, 14-rotating disc, 15-lead, 16-conductive chuck and 17-rectifier.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution:

the utility model provides an incomplete copper processing apparatus of electroplating copper round pin anchor clamps, includes reaction tank 1, be provided with a pair of negative plate 7 on the lateral wall about reaction tank 1, be provided with in the reaction tank 1 and place frame 13, the top of placing frame 13 is provided with a set of electrically conductive chuck 16, the outside of reaction tank 1 is provided with rectifier 17, rectifier 17's negative pole passes through wire 15 and links to each other with negative plate 7, and rectifier 17's positive pole passes through wire 15 and links to each other with electrically conductive chuck 16.

Preferably, the left side wall and the right side wall of the reaction tank 1 are rotatably connected with a rotating plate 2, the bottom of the rotating plate 2 is provided with a bottom plate 3, the rotating plate 2 is provided with a clamping jaw 4, the cathode plate 7 is provided with a pair of clamping grooves 8, and the clamping jaw 4 is clamped in the clamping grooves 8.

The jack catch 4 joint is conveniently changed negative plate 7 in draw-in groove 8, rotates 180 degrees with rotor plate 2 during the change and makes rotor plate 2 stretch out reaction tank 1.

Preferably, the placing frame 13, the rotating plate 2 and the jaws 4 are made of plastic material.

The placing frame 13, the rotating plate 2 and the clamping jaws 4 are made of plastic materials and cannot be corroded by copper sulfate solution.

Preferably, the end of the jaw 4 is provided with a notch 5, and the outside of the notch 5 is provided with an opening 6 which is flared outwards.

The notch 5 is used for limiting the cathode plate 7, and the opening 6 facilitates clamping of the cathode plate 7 into the clamping jaw 4.

Preferably, the top of the reaction tank 1 is fixedly connected with a group of support rods 9, a cross rod 10 is fixedly connected between the support rods 9 at the front side and the rear side, a cross beam 11 is fixedly connected in front of the cross rods 10 at the left side and the right side, and the placing frame 13 is hung on the cross beam 11 through a rope 12.

Place frame 13 and hang through rope 12 and establish on crossbeam 11, make things convenient for anchor clamps to remove incomplete copper in batches.

Preferably, the beam 11 is rotatably connected with a set of rotating discs 14, the conducting wire 15 is wound on the rotating discs 14, and the conducting clamp 16 is connected with the tail end of the conducting wire 15.

The wires 15 are wound on the turntable 14 to avoid the wires 15 from being entangled.

Preferably, a coil spring is provided in the turntable 14.

The coil spring allows the wire 15 to be automatically wound onto the turntable 14.

A treatment process for residual copper of an electroplating copper pin clamp, which is characterized in that the treatment device for residual copper of the electroplating copper pin clamp disclosed by any one of claims 1 to 7 is used, and comprises the following steps:

the method comprises the following steps:

adding a liquid medicine into the reaction tank 1, wherein the liquid medicine is prepared from copper sulfate and sulfuric acid according to a component ratio of 1: 3;

step two:

the electric clamp 16 is clamped on a clamp with residual copper, then the clamp is placed in the placing frame 13, and finally the rectifier 17 works to perform reverse electroplating.

The working principle of the invention is as follows: the invention adopts a reverse electroplating method, does not use nitric acid, has longer service life than a nitric acid pin hanger, and has lower environmental protection pressure. The components of the adopted liquid medicine are the same as those of the main tank liquid medicine, so that the problem of cross contamination does not exist. The reverse electroplating method has a good treatment effect on residual copper of the clamp. The clamp has no copper slag residue. The jack catch 4 joint is conveniently changed negative plate 7 in draw-in groove 8, rotates 180 degrees with rotor plate 2 during the change and makes rotor plate 2 stretch out reaction tank 1. The placing frame 13, the rotating plate 2 and the clamping jaws 4 are made of plastic materials and cannot be corroded by copper sulfate solution. The notch 5 is used for limiting the cathode plate 7, and the opening 6 facilitates clamping of the cathode plate 7 into the clamping jaw 4. Place frame 13 and hang through rope 12 and establish on crossbeam 11, make things convenient for anchor clamps to remove incomplete copper in batches. The wire 15 is wound around the turntable 14 to avoid the wire 15 from getting tangled. The coil spring allows the wire 15 to be automatically wound onto the turntable 14.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a surplus copper processing apparatus of electroplating copper round pin anchor clamps, includes reaction tank (1), its characterized in that: the reactor is characterized in that a pair of cathode plates (7) are arranged on the left side wall and the right side wall of the reaction tank (1), a placing frame (13) is arranged in the reaction tank (1), a group of conductive chucks (16) are arranged above the placing frame (13), a rectifier (17) is arranged on the outer side of the reaction tank (1), the negative pole of the rectifier (17) is connected with the cathode plates (7) through a lead (15), and the positive pole of the rectifier (17) is connected with the conductive chucks (16) through the lead (15).

2. The residual copper processing device of the electroplating copper pin clamp according to claim 1, characterized in that: the reactor is characterized in that a rotating plate (2) is rotatably connected to the left side wall and the right side wall of the reaction tank (1), a bottom plate (3) is arranged at the bottom of the rotating plate (2), a clamping jaw (4) is arranged on the rotating plate (2), a pair of clamping grooves (8) is arranged on the negative plate (7), and the clamping jaw (4) is clamped in the clamping grooves (8).

3. The residual copper processing device of the electroplating copper pin clamp according to claim 2 or 1, characterized in that: the placing frame (13), the rotating plate (2) and the clamping jaws (4) are made of plastic materials.

4. The residual copper processing device of the electroplating copper pin clamp according to claim 1, characterized in that: the tail end of the clamping jaw (4) is provided with a notch (5), and the outer side of the notch (5) is provided with an opening (6) which is opened outwards.

5. The residual copper processing device of the electroplating copper pin clamp according to claim 1, characterized in that: the top fixedly connected with a set of bracing piece (9) of reaction tank (1), fixedly connected with horizontal pole (10) between bracing piece (9) of front and back both sides, fixedly connected with crossbeam (11) before horizontal pole (10) of the left and right sides, it hangs through rope (12) and establishes on crossbeam (11) to place frame (13).

6. The residual copper processing device of the electroplating copper pin clamp according to claim 5, characterized in that: the beam (11) is rotatably connected with a group of turntables (14), the wire (15) is wound on the turntables (14), and the conductive chuck (16) is connected to the tail end of the wire (15).

7. The residual copper processing device of the electroplating copper pin clamp according to claim 6, characterized in that: a coil spring is arranged in the rotary disc (14).

8. A treatment process for residual copper of an electroplating copper pin clamp, which is characterized in that the treatment device for residual copper of the electroplating copper pin clamp disclosed by any one of claims 1 to 7 is used, and comprises the following steps:

the method comprises the following steps:

adding a liquid medicine into the reaction tank (1), wherein the liquid medicine is prepared from copper sulfate and sulfuric acid according to a weight ratio of 1: 3;

step two:

and clamping the electric chuck (16) on a clamp with residual copper, then placing the clamp in a placing frame 13, and finally operating a rectifier (17) to perform reverse electroplating.