CN214960366U

CN214960366U - HDI circuit board blind hole electroplating device

Info

Publication number: CN214960366U
Application number: CN202121447993.9U
Authority: CN
Inventors: 严军; 张晓亮; 袁金钟; 赵灿辉
Original assignee: Suichuan Xincheng Ruijia Electronics Co ltd
Current assignee: Suichuan Xincheng Ruijia Electronics Co ltd
Priority date: 2021-06-28
Filing date: 2021-06-28
Publication date: 2021-11-30
Anticipated expiration: 2031-06-28

Abstract

The utility model relates to a HDI circuit board blind hole electroplating device, which comprises a fixed table, slide rails are fixedly arranged on two sides of the fixed table, a fixed frame is arranged above the fixed table and is connected with the slide rails through a support rod, the bottom of the fixed frame is connected with a lifting plate through an air pressure telescopic rod, the bottom of the lifting plate is slidably provided with a movable plate, the bottom of the movable plate is uniformly and fixedly provided with a clamp, the left side of the fixed table is fixedly provided with an electroplating bath, a circulating pump is fixedly arranged below the electroplating bath, the conveying and the electroplating of a HDI circuit board are facilitated through the slide rails, the use is more convenient, a driving motor is started during the electroplating, the movable plate is enabled to continuously move in small amplitude, meanwhile, the electroplating solution in the electroplating bath can slowly flow from left to right through the circulating pump and is matched with the shaking of the circuit board, so that the electroplating solution can fully enter into the blind hole on a workpiece, thereby better contacting with the electroplating solution and obviously improving the electroplating quality and efficiency.

Description

HDI circuit board blind hole electroplating device

Technical Field

The utility model relates to a device is electroplated to HDI circuit board blind hole belongs to circuit board production technical field.

Background

HD I is an abbreviation for high density interconnect, a technique for producing printed circuit boards, a circuit board with a relatively high line distribution density using micro-blind buried via technology; in HDI board blind hole electroplating process, because HDI board blind hole area is less, the work piece of electroplating the blind hole has a lot of not enoughly, and liquid medicine is difficult to go into in the blind hole, and it is not good to lack in the pore wall and plate or cladding material cohesion when leading to electroplating, and it is lower to electroplate the yield, and the work piece defective rate is high, often needs reworking, leads to the product to scrap and the cost is on the high side.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a device is electroplated to HDI circuit board blind hole, make things convenient for the transport and the electroplating of HDI circuit board through the slide rail, it is more convenient to use, start driving motor when electroplating, let the continuous small range of movable plate remove, can let the plating solution in the plating bath slowly flow from a left side right through the circulating pump simultaneously, mutually support with rocking of circuit board, make in the plating solution can fully get into the blind hole on the work piece, thereby better and plating solution contact, showing and having promoted electroplating quality and efficiency, with the problem of proposing in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a device is electroplated to HDI circuit board blind hole, includes the fixed station, the fixed slide rail that is equipped with in fixed station both sides, the fixed station top is equipped with the mount, the mount passes through bracing piece and sliding rail connection, the mount bottom is connected with the lifter plate through pneumatic telescopic link, the lifter plate bottom slides and is equipped with the movable plate, the even fixed anchor clamps that are equipped with in movable plate bottom, the fixed plating bath that is equipped with in fixed station left side, the fixed circulating pump that is equipped with in plating bath below.

Further, the slide rail inner chamber rotates and is equipped with the lead screw, the lead screw left end is connected with step motor, and the bracing piece bottom is connected with the lead screw through the sliding block.

Further, a placing table is arranged on the right side of the fixing table, liquid guide grooves are evenly formed in the placing table, and the liquid guide grooves are obliquely arranged towards the electroplating bath.

Furthermore, a driving motor is fixedly installed on the lifting plate, and a cam is fixedly arranged on an output shaft of the driving motor.

Furthermore, the sliding grooves are symmetrically formed in the lifting plate, a sliding block is fixedly arranged at the top of the movable plate and penetrates through the sliding grooves, the top ends of the sliding blocks are connected through fixing rods, and the fixing rods are located on two sides of the cam.

Furthermore, barrier strips are uniformly and fixedly arranged on the inner wall of the inner cavity of the electroplating bath, and the clamps are positioned between the barrier strips.

Furthermore, both sides of the electroplating bath are connected with a circulating pump through a guide pipe, an electromagnetic valve is fixedly arranged in the guide pipe, and the circulating pump is fixedly provided with a filter plate.

The utility model has the advantages that:

1. by arranging the fixing frame, the HDI circuit board can be hung in the fixing frame when in use, so that the HDI circuit board can be moved to the electroplating bath through the sliding rail, and the HDI circuit board can descend into the electroplating bath through the air pressure telescopic rod to be electroplated, and the circuit board can be conveniently taken out after electroplating, so that the use is more convenient;

2. by arranging the movable plate, after the lifting plate moves downwards to immerse the circuit board into the electroplating bath, the driving motor can be started to enable the movable plate to continuously move in small amplitude, so that the movable plate can be in better contact with electroplating solution, and the electroplating efficiency of the movable plate is improved;

3. through setting up the circulating pump, can let the plating solution in the plating bath slowly flow from a left side to the right side, mutually support with rocking of circuit board for in the blind hole on the plating solution can fully get into the work piece, showing and having promoted electroplating quality and efficiency.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

FIG. 1 is a schematic view of the overall structure of a HDI circuit board blind hole electroplating device of the present invention;

FIG. 2 is a top view of an electroplating bath of the HDI circuit board blind hole electroplating device of the present invention;

FIG. 3 is a schematic cross-sectional view of a HDI circuit board blind hole electroplating device according to the present invention;

FIG. 4 is a top view of a lifter plate of the HDI circuit board blind hole electroplating device of the present invention;

reference numbers in the figures: 1. a fixed table; 2. a slide rail; 3. a fixed mount; 4. an air pressure telescopic rod; 5. A lifting plate; 6. moving the plate; 7. a clamp; 8. an electroplating bath; 9. a circulation pump; 10. a screw rod; 11. a placing table; 12. a drive motor; 13. a cam; 14. a chute; 15. a slider; 16. Fixing the rod; 17. a barrier strip; 18. a flow guide pipe; 19. a filter plate.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a device is electroplated to HDI circuit board blind hole, includes fixed station 1, fixed slide rail 2 that is equipped with in 1 both sides of fixed station, 1 top of fixed station is equipped with mount 3, mount 3 is connected with slide rail 2 through the bracing piece, 3 bottoms of mount are connected with lifter plate 5 through atmospheric pressure

telescopic link

4, 5 bottoms of lifter plate slide and be equipped with

movable plate

6, 6 bottoms of movable plate are evenly fixed and are equipped with

anchor clamps

7, 1 left side of fixed station is fixed and is equipped with plating

bath

8, 8 below of plating bath are fixed and are equipped with circulating pump 9.

Specifically, as shown in fig. 2, 2 inner chambers of the slide rail rotate and are provided with a screw rod 10, the left end of the screw rod 10 is connected with a stepping motor, the bottom end of a support rod is connected with the screw rod 10 through a sliding block, so that the fixing frame 3 can move back and forth, thereby realizing the conveying and electroplating of a circuit board, barrier strips 17 are uniformly and fixedly arranged on the inner wall of the inner chamber of the electroplating bath 8, the clamp 7 is positioned between the barrier strips 17, electroplating solution can pass through the space between the relative barrier strips 17 when flowing, the circuit board is positioned between the adjacent barrier strips 17, and the electroplating solution is ensured to flow towards the circuit board.

Specifically, as shown in fig. 1, a placing table 11 is arranged on the right side of the fixing table 1, a liquid guide groove is uniformly formed in the placing table 11, the liquid guide groove is inclined towards the electroplating bath 8, and after the electroplated circuit board is moved back, redundant electroplating solution on the electroplated circuit board can be dripped onto the placing table 11 and can enter the electroplating bath 8 through the liquid guide groove, so that waste is avoided.

Specifically, as shown in fig. 3 and 4, a driving motor 12 is fixedly mounted on the lifting plate 5, a cam 13 is fixedly arranged on an output shaft of the driving motor 12, sliding grooves 14 are symmetrically formed in the lifting plate 5, a sliding block 15 is fixedly arranged on the top of the moving plate 6, the sliding block 15 penetrates through the sliding grooves 14, the top ends of the sliding blocks 15 are connected through a fixing rod 16, the fixing rod 16 is located on two sides of the cam 13, and the fixing rod 16 is continuously in contact with the fixing rod 16 when the cam 13 rotates, so that the moving plate 6 can move back and forth, a circuit board can be driven to shake during electroplating, electroplating efficiency is increased, two sides of the electroplating bath 8 are both connected with a circulating pump 9 through a guide pipe 18, an electromagnetic valve is fixedly arranged in the guide pipe 18, and the circulating pump 9 is fixedly provided with a filter plate 19, so that electroplating solution can circularly flow and be filtered.

The utility model discloses the theory of operation: when using, can hang the HDI circuit board in mount 3, thereby remove to plating bath 8 on through slide rail 2, and let the HDI circuit board descend through pneumatic telescoping rod 4 and sink into and electroplate in plating bath 8, start driving motor 12, let the continuous small amplitude of movable plate 6 remove, can let the plating solution in the plating bath 8 slowly flow from the left right side through circulating pump 9, mutually support with rocking of circuit board, make the plating solution can fully get into in the blind hole on the work piece, thereby better and plating solution contact, electroplating quality and efficiency have been showing to have promoted.

The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.

Claims

1. The utility model provides a device is electroplated to HDI circuit board blind hole, includes fixed station (1), its characterized in that: fixed station (1) both sides are fixed and are equipped with slide rail (2), fixed station (1) top is equipped with mount (3), mount (3) are connected with slide rail (2) through the bracing piece, mount (3) bottom is connected with lifter plate (5) through pneumatic telescoping rod (4), lifter plate (5) bottom slides and is equipped with movable plate (6), even fixed anchor clamps (7) that are equipped with in movable plate (6) bottom, fixed plating bath (8) that are equipped with in fixed plating bath (1) left side, fixed circulating pump (9) that are equipped with in plating bath (8) below.

2. The HDI circuit board blind hole electroplating device of claim 1, characterized in that: the inner cavity of the sliding rail (2) is rotatably provided with a screw rod (10), the left end of the screw rod (10) is connected with a stepping motor, and the bottom end of the supporting rod is connected with the screw rod (10) through a sliding block.

3. The HDI circuit board blind hole electroplating device of claim 2, characterized in that: the right side of the fixed table (1) is provided with a placing table (11), a liquid guide groove is uniformly formed in the placing table (11), and the liquid guide groove is obliquely arranged towards the electroplating bath (8).

4. The HDI circuit board blind hole electroplating device of claim 3, characterized in that: a driving motor (12) is fixedly mounted on the lifting plate (5), and a cam (13) is fixedly arranged on an output shaft of the driving motor (12).

5. The HDI circuit board blind hole electroplating device of claim 4, characterized in that: the lifting plate is characterized in that sliding grooves (14) are symmetrically formed in the lifting plate (5), a sliding block (15) is fixedly arranged at the top of the moving plate (6), the sliding block (15) penetrates through the sliding grooves (14), the top ends of the sliding block (15) are connected through fixing rods (16), and the fixing rods (16) are located on two sides of the cam (13).

6. The HDI circuit board blind hole electroplating device of claim 5, characterized in that: and barrier strips (17) are uniformly and fixedly arranged on the inner wall of the inner cavity of the electroplating bath (8), and the clamps (7) are positioned between the barrier strips (17).

7. The HDI circuit board blind hole electroplating device of claim 6, characterized in that: both sides of the electroplating bath (8) are connected with a circulating pump (9) through a guide pipe (18), an electromagnetic valve is fixedly arranged in the guide pipe (18), and the circulating pump (9) is fixedly provided with a filter plate (19).