CN219430159U

CN219430159U - PCB electroplating device

Info

Publication number: CN219430159U
Application number: CN202320331349.8U
Authority: CN
Inventors: 徐桂庚
Original assignee: Jiangsu Guangqian Electronics Co ltd
Current assignee: Jiangsu Guangqian Electronics Co ltd
Priority date: 2023-02-28
Filing date: 2023-02-28
Publication date: 2023-07-28
Anticipated expiration: 2033-02-28

Abstract

The utility model relates to the technical field of electroplating devices and discloses a PCB electroplating device which comprises an electroplating cylinder, wherein a top plate is arranged at the upper end of the electroplating cylinder, a first vertical plate and a second vertical plate are slidably arranged at the left side and the right side of the lower end of the top plate, a fixed inner shell is arranged at the lower end of the first vertical plate, a pull rod is arranged in the fixed inner shell, a reset spring and an inner disc are sequentially arranged at one side, outside the fixed inner shell, of the pull rod from left to right, a movable clamping shell is arranged at one side, outside the fixed inner shell, of the right end of the pull rod, a fixed clamping shell is arranged at the left side of the lower end of the second vertical plate, and clamping cavities are formed in the movable clamping shell and the fixed clamping shell. Through adopting both ends centre gripping cooperation casing edge parcel's mode to fix the PCB board, improve the fixed stability of PCB board, prevent to drop when electroplating.

Description

PCB electroplating device

Technical Field

The utility model relates to the technical field of electroplating devices, in particular to a PCB electroplating device.

Background

The PCB is generally printed with a circuit board, and the design of the printed circuit board is mainly layout design; the main advantages of the circuit board are greatly reduced wiring and assembly errors, and improved automation level and production labor rate. The PCB board needs to be electroplated in the production process, and electroplating is used for meeting the welding and mounting requirements of components, a large number of micropores are preset on the PCB board, and copper deposition treatment is carried out on the micropores in the holes.

In the prior art, the circuit device of the PCB board is characterized in that the clamp is used for clamping the PCB board and then lowering the PCB board to the inside of the electroplating cylinder, and the clamp is matched with the vibration assembly to discharge bubbles in micropores in the PCB board so as to facilitate the electroplating work and improve the electroplating quality of the PCB board.

The fixture in the prior art generally adopts a fixed fixture similar to scissors, the fixture is clamped at the top end of the PCB, the lifting structure is matched to lift the PCB in the electroplating cylinder to electroplate, however, the PCB shakes along with the vibration assembly when the vibration assembly vibrates, and the clamping stability of the top end of the PCB is insufficient, so that the PCB is caused to fall off, inconvenience is brought to electroplating work, and therefore the PCB electroplating device is provided.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a PCB electroplating device for solving the problems in the background technology.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a PCB board electroplating device, includes electroplates the jar, the upper end of electroplate the jar is provided with the roof, the left and right sides slidable mounting of roof lower extreme has first riser and second riser, fixed inner shell is installed to the lower extreme of first riser, fixed inner shell's internally mounted has the pull rod, reset spring and inner disc are installed in proper order from left to right in the inside one side of fixed inner shell to the outside one side that is located of pull rod outside right-hand member, move the pod in proper order in one side that is located the outside of fixed inner shell, the left side of second riser lower extreme is installed and is decided the pod, move the pod and decide the inside of pod and all be provided with the centre gripping chamber.

Preferably, the outer side frame is all installed to the outside left and right sides of electroplating jar, and outer side frame and electroplating jar fixed connection, elevating system is installed to the upper end of outer side frame, and elevating system's upper and lower both ends respectively with outer side frame and roof fixed connection, make the lift of PCB board more convenient through elevating system.

Preferably, the fixed block is installed to intermediate position department of roof upper end, and fixed block and roof fixed connection, driving motor is all installed to the inside left and right sides of fixed block, and driving motor drives drive screw and makes its rotation.

Preferably, the driving motor is fixedly connected with the fixed block, the driving screw is installed at the output end of the driving motor, the driving screw is fixedly connected with the output end of the driving motor, the driving screw is connected with the first vertical plate and the second vertical plate through threaded fit, and the driving screw is rotated by the driving screw to enable the first vertical plate and the second vertical plate to move under threaded fit.

Preferably, the vibration subassembly is all installed to inside left and right sides of electroplating jar, and vibrate subassembly and electroplating jar fixed connection, vibrate the subassembly and be arranged in getting rid of the bubble in the micropore in the PCB board.

Preferably, the four corners of the lower end outside the electroplating cylinder are respectively provided with supporting feet for supporting, so that the electroplating cylinder is placed conveniently.

(III) beneficial effects

Compared with the prior art, the utility model provides a PCB electroplating device, which has the following beneficial effects:

1. pulling the pull rod makes and moves the clamp shell, inserts the inside of fixed clamp shell with one side of PCB board afterwards, loosens the pull rod, and reset spring resets and promotes the inner disc and makes the pull rod and move the clamp shell and reset the left end of laminating PCB board, through moving the clamp shell and fixing the inside centre gripping of both ends of clamp shell to the PCB board, fall into the electroplating jar and open and vibrate the subassembly when pressing from both sides the PCB board through this mode, the PCB board is vibrate along with it but receives the spacing of moving the clamp shell and fixing the clamp shell and prevent that it from breaking away from, has solved the unstable problem of clamping structure centre gripping among the current electroplating device in the background art.

Drawings

FIG. 1 is a perspective view of the overall structure of the present utility model;

FIG. 2 is a cross-sectional view of the plating cylinder of the present utility model;

fig. 3 is a cross-sectional view of a stationary inner shell of the present utility model.

In the figure: 1. an electroplating cylinder; 2. an outer side frame; 3. a lifting mechanism; 4. a top plate; 5. a fixed block; 6. a driving motor; 7. driving a screw; 8. a first vertical plate; 9. a second vertical plate; 10. an oscillating assembly; 11. fixing the inner shell; 12. a pull rod; 13. a movable clamping shell; 14. a fixed clamping shell; 15. a return spring; 16. an inner disk; 17. and a clamping cavity.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a technical scheme, referring to fig. 1, 2 and 3, of a PCB electroplating device, which comprises an electroplating cylinder 1, wherein a top plate 4 is arranged at the upper end of the electroplating cylinder 1, a first vertical plate 8 and a second vertical plate 9 are slidably arranged at the left side and the right side of the lower end of the top plate 4, a fixed inner shell 11 is arranged at the lower end of the first vertical plate 8, a pull rod 12 is arranged in the fixed inner shell 11, a return spring 15 and an inner disc 16 are sequentially arranged at one side, positioned at the outer part of the fixed inner shell 11, of the pull rod 12 from left to right, a movable clamping shell 13 is arranged at one side, positioned at the outer part of the fixed inner shell 11, of the right end of the pull rod 12, a fixed clamping shell 14 is arranged at the left side of the lower end of the second vertical plate 9, and clamping cavities 17 are respectively arranged in the movable clamping shell 13 and the fixed clamping shell 14.

Referring to fig. 1 and 2, the outer side frames 2 are respectively mounted on the left and right sides of the outside of the electroplating cylinder 1, the outer side frames 2 are fixedly connected with the electroplating cylinder 1, the lifting mechanism 3 is mounted at the upper end of the outer side frames 2, the upper end and the lower end of the lifting mechanism 3 are respectively fixedly connected with the outer side frames 2 and the top plate 4, and lifting of the PCB board is facilitated through the lifting mechanism 3.

Referring to fig. 1 and 2, a fixed block 5 is installed at a middle position of an upper end of a top plate 4, the fixed block 5 is fixedly connected with the top plate 4, driving motors 6 are installed at left and right sides of the inside of the fixed block 5, and the driving motors 6 drive driving screws 7 to rotate.

Referring to fig. 1 and 2, a driving motor 6 is fixedly connected with a fixed block 5, a driving screw 7 is mounted at an output end of the driving motor 6, the driving screw 7 is fixedly connected with an output end of the driving motor 6, the driving screw 7 is connected with a first vertical plate 8 and a second vertical plate 9 through threaded fit, and the driving screw 7 is rotated with the first vertical plate 8 and the second vertical plate 9 to enable the first vertical plate 8 and the second vertical plate 9 to move under threaded fit.

Referring to fig. 2, oscillating assemblies 10 are mounted on both the left and right sides of the interior of the electroplating cylinder 1, and the oscillating assemblies 10 are fixedly connected with the electroplating cylinder 1, wherein the oscillating assemblies 10 are used for removing bubbles in micropores in a PCB.

Referring to fig. 1 and 2, four corners of the lower end of the outer portion of the plating cylinder 1 are provided with supporting feet for supporting so as to facilitate placement of the plating cylinder 1.

The working principle of the device is as follows: according to the size of the PCB, the positions of the movable clamping shell 13 and the fixed clamping shell 14 are adjusted, the driving motor 6 is started to enable the driving screw 7 to rotate, the driving screw 7 is in threaded fit with the first vertical plate 8 and the second vertical plate 9, the rotating motion of the driving screw 7 is converted into linear motion of the first vertical plate 8 and the second vertical plate 9 under sliding connection of the first vertical plate 8 and the second vertical plate 9 with the top plate 4, the positions of the movable clamping shell 13 and the fixed clamping shell 14 are changed, when the PCB needs to be fixed, the pull rod 12 is pulled to enable the movable clamping shell 13 to move, then one side of the PCB is inserted into the fixed clamping shell 14, the pull rod 12 is loosened, the reset spring 15 resets and pushes the inner disc 16 to enable the pull rod 12 and the movable clamping shell 13 to reset and attach to the left end of the PCB, the clamping cavity 17 inside the movable clamping shell 13 and the fixed clamping shell 14 clamps the PCB at the left end and the right end of the PCB, and in this way, the electroplating cylinder 1 is lowered and the oscillating assembly 10 is started to perform electroplating work when the PCB is clamped.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A PCB plate electroplating device is characterized in that: including electroplating jar (1), the upper end of electroplating jar (1) is provided with roof (4), first riser (8) and second riser (9) are installed to the left and right sides slidable mounting of roof (4) lower extreme, fixed inner shell (11) are installed to the lower extreme of first riser (8), fixed inner shell (11) internally mounted has pull rod (12), reset spring (15) and inner disc (16) are installed in proper order from left to right in one side that pull rod (12) outside is located fixed inner shell (11) inside, move double-layered shell (13) are installed to one side that pull rod (12) outside right-hand member is located fixed inner shell (11) outside, fixed double-layered shell (14) are installed in the left side of second riser (9) lower extreme, move double-layered shell (13) and the inside of fixed double-layered shell (14) all are provided with centre gripping chamber (17).

2. The PCB plating apparatus of claim 1, wherein: the electroplating device is characterized in that the outer side frames (2) are arranged on the left side and the right side of the outside of the electroplating cylinder (1), the outer side frames (2) are fixedly connected with the electroplating cylinder (1), the lifting mechanism (3) is arranged at the upper end of the outer side frames (2), and the upper end and the lower end of the lifting mechanism (3) are respectively fixedly connected with the outer side frames (2) and the top plate (4).

3. The PCB plating apparatus of claim 2, wherein: the middle position department of roof (4) upper end installs fixed block (5), and fixed block (5) and roof (4) fixed connection, driving motor (6) are all installed to the inside left and right sides of fixed block (5).

4. A PCB plating apparatus according to claim 3, wherein: the driving motor (6) is fixedly connected with the fixed block (5), a driving screw (7) is installed at the output end of the driving motor (6), the driving screw (7) is fixedly connected with the output end of the driving motor (6), and the driving screw (7) is connected with the first vertical plate (8) and the second vertical plate (9) through threaded matching.

5. The PCB plating apparatus of claim 4, wherein: vibration components (10) are arranged on the left side and the right side of the inside of the electroplating cylinder (1), and the vibration components (10) are fixedly connected with the electroplating cylinder (1).

6. The PCB plating apparatus of claim 5, wherein: the four corners of the lower end outside the electroplating cylinder (1) are provided with supporting feet for supporting, so that the electroplating cylinder (1) can be placed conveniently.