CN215628381U - Electroplating device for printed circuit board - Google Patents

Electroplating device for printed circuit board Download PDF

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Publication number
CN215628381U
CN215628381U CN202121247908.4U CN202121247908U CN215628381U CN 215628381 U CN215628381 U CN 215628381U CN 202121247908 U CN202121247908 U CN 202121247908U CN 215628381 U CN215628381 U CN 215628381U
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China
Prior art keywords
circuit board
electroplating
printed circuit
mounting panel
fixedly connected
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Application number
CN202121247908.4U
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Chinese (zh)
Inventor
李世成
夏仲坤
侯记彬
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Zhuhai Feiya Circuit Co ltd
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Zhuhai Feiya Circuit Co ltd
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Priority to CN202121247908.4U priority Critical patent/CN215628381U/en
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  • Manufacturing Of Printed Wiring (AREA)

Abstract

The utility model relates to the technical field of printed circuit board production, in particular to an electroplating device for a printed circuit board. This electroplating device for printed circuit board drives the installation piece through the motor that mounting panel surface was equipped with and reciprocates at the inside regularity of slide for bottom electroplating box can carry out the repeated electroplating process, through the fixed establishment on electroplating box surface that is equipped with, current electroplating device has been solved because printed circuit board need be electroplated inside the plating bath repeatedly, lack reciprocal intermittent type mechanism, make operating personnel need repeat electroplating treatment to the circuit board, it is comparatively troublesome, traditional electroplating device lacks the fixed establishment to printed circuit board, make the circuit board produce the problem that drops easily.

Description

Electroplating device for printed circuit board
Technical Field
The utility model relates to the technical field of printed circuit board production, in particular to an electroplating device for a printed circuit board.
Background
Since printed circuit boards are not typical end products, they are somewhat confusing in the definition of names such as: the motherboard for a personal computer is called a motherboard and cannot be directly called a circuit board, and although the circuit board exists in the motherboard, the motherboard is different from the motherboard, so that the two aspects cannot be said to be the same when evaluating the industry. For another example: because of the integrated circuit components mounted on the circuit board, the news media is called an IC board, but it is not substantially identical to a printed circuit board. By printed circuit board we generally say bare board-i.e. a circuit board without upper components;
when a printed circuit board is produced, electroplating treatment needs to be carried out on the surface of the circuit board, the existing electroplating device is lack of a reciprocating intermittent mechanism because the printed circuit board needs to be repeatedly electroplated inside an electroplating bath, so that an operator needs to repeatedly carry out electroplating treatment on the circuit board, and the electroplating device is troublesome.
SUMMERY OF THE UTILITY MODEL
In order to make up for the above deficiencies, the present invention provides an electroplating apparatus for a printed circuit board.
The technical scheme of the utility model is as follows:
the utility model provides an electroplating device for printed circuit board, includes the mounting panel, the anterior medial side fixedly connected with fixed plate of mounting panel, two motors are installed to the top inboard of mounting panel, the motor is located respectively the left and right sides of mounting panel, equal coaxial coupling has the rolling disc on the output shaft of motor, the rolling disc rotate connect in the anterior surface of mounting panel, the bottom of rolling disc is equipped with the backup pad, backup pad fixed connection in the surface of fixed plate, the bottom of backup pad is equipped with steadying plate, the slide has all been seted up on steadying plate's surface.
As an optimal technical scheme, the position of the surface of the rotating disc deviating from the circle center is fixedly connected with a connecting column, the bottom of the connecting column is fixedly connected with a connecting rod, the bottom of the connecting rod is provided with an installation block, and the installation block is slidably connected in the slide way.
As the preferred technical scheme, the bottom of the mounting block is fixedly connected with a suspender, and the bottom of the suspender is provided with an electroplating box.
As an optimized technical scheme, round holes are formed in the left side and the right side of the electroplating box, threaded rods are connected to the inner portions of the round holes in a sliding mode, nuts are connected to the surface of the threaded rods in a threaded mode, the threaded rods are far away from one end of each nut fixedly connected with clamping plates, and the clamping plates are connected to the inner portions of the electroplating box in a sliding mode.
As the preferred technical scheme, the clamping grooves are formed in the surfaces of the clamping plates.
As a preferable technical scheme, an electroplating pool is arranged on the front side of the bottom of the mounting plate.
Compared with the prior art, the utility model has the beneficial effects that: this electroplating device for printed circuit board drives the installation piece through the motor that mounting panel surface was equipped with and reciprocates at the inside regularity of slide for bottom electroplating box can carry out the repeated electroplating process, through the fixed establishment on electroplating box surface that is equipped with, current electroplating device has been solved because printed circuit board need be electroplated inside the plating bath repeatedly, lack reciprocal intermittent type mechanism, make operating personnel need repeat electroplating treatment to the circuit board, it is comparatively troublesome, traditional electroplating device lacks the fixed establishment to printed circuit board, make the circuit board produce the problem that drops easily.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the electroplating bath according to the present invention;
FIG. 3 is a schematic view of a mounting plate assembly of the present invention;
FIG. 4 is a schematic view of the structure of the electroplating tank assembly of the present invention.
In the figure: 1. mounting a plate; 2. an electroplating pool; 3. rotating the disc; 30. a motor; 31. connecting columns; 32. a connecting rod; 33. a mounting block 4 and a fixing plate; 40. a support plate; 5. a stabilizing plate; 50. a slideway; 60. a boom; 6. electroplating box; 61. a splint; 62. a threaded rod; 63. a nut; 610. a clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Referring to fig. 1-4, the present invention provides a technical solution:
the utility model provides an electroplating device for printed circuit board, including mounting panel 1, side fixedly connected with fixed plate 4 in the front portion of mounting panel 1, two motors 30 are installed to mounting panel 1's top inboard, motor 30 is located mounting panel 1's the left and right sides respectively, equal coaxial coupling has rolling disc 3 on motor 30's the output shaft, rolling disc 3 rotates and connects in the anterior surface of mounting panel 1, the bottom of rolling disc 3 is equipped with backup pad 40, 40 fixed connection in the surface of fixed plate 4 of backup pad, the bottom of backup pad 40 is equipped with steadying plate 5, slide 50 has all been seted up on steadying plate 5's surface, operating personnel starter motor 30, motor 30 drives rolling disc 3 and is rotatory at mounting panel 1's surface.
What needs to be supplemented is that, the position fixedly connected with spliced pole 31 of the skew centre of a circle in rolling disc 3 surface, the bottom fixedly connected with connecting rod 32 of spliced pole 31, the bottom of connecting rod 32 is equipped with installation piece 33, installation piece 33 sliding connection is in the inside of slide 50, along with rolling disc 3 rotates on the surface of mounting panel 1, spliced pole 31 moves around the centre of a circle of rolling disc 3 to drive installation piece 33 under connecting rod 32 regularly slides from top to bottom in the inside of slide 50.
Preferably, the bottom of each mounting block 33 is fixedly connected with a suspension rod 60, the bottom of each suspension rod 60 is provided with a plating box 6, and an operator can place the circuit board in the plating box 6.
As the preferred of this embodiment, the round hole has been seted up to the left and right sides of electroplating box 6, the equal sliding connection in inside of round hole has threaded rod 62, threaded rod 62's surperficial threaded connection has nut 63, threaded rod 62 keeps away from the one end fixedly connected with splint 61 of nut 63, splint 61 sliding connection is in electroplating box 6's inside, operating personnel lays the circuit board in electroplating box 6's inside, and slip both sides threaded rod 62 makes splint 61 hug closely the surperficial realization of circuit board fixed, adjust and fix through screwing up outside nut 63 after finishing, make the circuit board keep fixed in electroplating box 6's inside.
As the preferred embodiment, the clamping plates 61 are all provided with clamping grooves 610 on the surfaces thereof, and the operator inserts the circuit board into the clamping grooves 610.
It is worth to say that the bottom front side of mounting panel 1 is equipped with electroplating bath 2, along with mounting panel 1 top motor drives electroplating tank 6 constantly up-and-down motion in electroplating bath 2's inside for the circuit board is electroplated the process repeatedly.
When the electroplating device for the printed circuit board is used, an operator firstly fixes the circuit board, at the moment, the circuit board is placed in the electroplating box 6, and the threaded rods 62 at the two sides are slid to ensure that the clamping plate 61 is tightly attached to the surface of the circuit board to realize fixation, the outer side nut 63 is screwed to fix the circuit board after the adjustment is finished, so that the circuit board is kept fixed in the electroplating box 6, at the same time, the clamping grooves 610 are clamped into two sides of the circuit board, an operator immediately starts the motor 30, the motor 30 drives the rotating disc 3 to rotate on the surface of the mounting plate 1, the connecting column 31 moves around the circle center of the rotating disc 3 along with the rotation of the rotating disc 3 on the surface of the mounting plate 1, and the mounting block 33 under the connecting rod 32 is driven to regularly slide up and down in the slide way 50, and at the moment, the electroplating box 6 continuously moves up and down in the electroplating pool 2, so that the circuit board is repeatedly subjected to an electroplating process.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (6)

1. An electroplating device for a printed circuit board, comprising a mounting plate (1), characterized in that: the anterior well side fixedly connected with fixed plate (4) of mounting panel (1), two motors (30) are installed to the top inboard of mounting panel (1), motor (30) are located respectively the left and right sides of mounting panel (1), equal coaxial coupling has rolling disc (3) on the output shaft of motor (30), rolling disc (3) rotate connect in the anterior surface of mounting panel (1), the bottom of rolling disc (3) is equipped with backup pad (40), backup pad (40) fixed connection in the surface of fixed plate (4), the bottom of backup pad (40) is equipped with steadying plate (5), slide (50) have all been seted up on the surface of steadying plate (5).
2. A plating apparatus for a printed circuit board according to claim 1, wherein: the position fixedly connected with spliced pole (31) of the skew centre of a circle in rolling disc (3) surface, the bottom fixedly connected with connecting rod (32) of spliced pole (31), the bottom of connecting rod (32) is equipped with installation piece (33), installation piece (33) sliding connection in the inside of slide (50).
3. A plating apparatus for a printed circuit board according to claim 2, wherein: the bottom of the mounting block (33) is fixedly connected with a suspender (60), and the bottom of the suspender (60) is provided with an electroplating box (6).
4. A plating apparatus for a printed circuit board according to claim 3, wherein: the round hole has been seted up to the left and right sides of electroplating box (6), and the equal sliding connection in inside of round hole has threaded rod (62), the surperficial threaded connection of threaded rod (62) has nut (63), threaded rod (62) are kept away from the one end fixedly connected with splint (61) of nut (63), splint (61) sliding connection in the inside of electroplating box (6).
5. An electroplating apparatus for a printed circuit board according to claim 4, wherein: clamping grooves (610) are formed in the surfaces of the clamping plates (61).
6. A plating apparatus for a printed circuit board according to claim 1, wherein: the bottom front side of mounting panel (1) is equipped with electroplating bath (2).
CN202121247908.4U 2021-06-04 2021-06-04 Electroplating device for printed circuit board Active CN215628381U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121247908.4U CN215628381U (en) 2021-06-04 2021-06-04 Electroplating device for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121247908.4U CN215628381U (en) 2021-06-04 2021-06-04 Electroplating device for printed circuit board

Publications (1)

Publication Number Publication Date
CN215628381U true CN215628381U (en) 2022-01-25

Family

ID=79941428

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121247908.4U Active CN215628381U (en) 2021-06-04 2021-06-04 Electroplating device for printed circuit board

Country Status (1)

Country Link
CN (1) CN215628381U (en)

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