CN114717620B - Silver plating device for manufacturing etched product of semiconductor lead frame - Google Patents
Silver plating device for manufacturing etched product of semiconductor lead frame Download PDFInfo
- Publication number
- CN114717620B CN114717620B CN202210324353.1A CN202210324353A CN114717620B CN 114717620 B CN114717620 B CN 114717620B CN 202210324353 A CN202210324353 A CN 202210324353A CN 114717620 B CN114717620 B CN 114717620B
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- China
- Prior art keywords
- shielding jig
- lead frame
- manufacturing
- base
- silver plating
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000007747 plating Methods 0.000 title claims abstract description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 15
- 239000004332 silver Substances 0.000 title claims abstract description 15
- 230000002457 bidirectional effect Effects 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000009826 distribution Methods 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 17
- 239000000306 component Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000011265 semifinished product Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The application belongs to the technical field of etching and manufacturing of semiconductor integrated circuit lead frames, and particularly relates to a silver plating device for manufacturing of a semiconductor lead frame etching product, which comprises the following components: the device comprises a bidirectional track, a shielding jig arranged on the track and a pushing mechanism arranged on the shielding jig, wherein the pushing mechanism pushes the shielding jig to slide on the bidirectional track; an anode plate is movably connected to the shielding jig and fixed through a fixing component; the pushing mechanism comprises a driving device and a crankshaft arranged on a driving shaft of the driving device, and the crankshaft is rotationally connected with the shielding jig through a connecting component; the shielding jig comprises a base and a plurality of nozzles arranged on the base, and rollers arranged on the bidirectional track extend from two sides of the base. The silver plating device for manufacturing the etched product of the semiconductor lead frame has the effects of uniform thickness distribution of electrolytic metal film and improvement of product quality.
Description
Technical Field
The application belongs to the technical field of etching and manufacturing of semiconductor integrated circuit lead frames, and particularly relates to a silver plating device for manufacturing a semiconductor lead frame etching product.
Background
In the field of semiconductor lead frame manufacturing technology, the use of etching techniques to manufacture and process metal materials into a variety of precision semiconductor electronic products required in high-tech fields is currently an important subject. For example, the important technology core of semiconductor integrated circuits, chip manufacturing technology is an important basis and core component for the development of high-sophisticated scientific technologies; the semiconductor lead frame is taken as a chip carrier of an integrated circuit and is an important basic raw material in the electronic information industry; semiconductor lead frame fabrication techniques are thus an important base material for fabricating high-precision semiconductor integrated circuits.
In the field of modern electronic information industry, semiconductor leadframe etching equipment is a very important basic manufacturing core technology. Currently, semiconductor leadframe etching fabrication equipment is a critical core foundation that affects the level of modern integrated circuit semiconductor leadframe fabrication. Only if the process level and the manufacturing precision of etching manufacturing equipment are continuously improved, the continuous development of the manufacturing technology of the semiconductor integrated circuit lead frame in the modern electronic information industry can be continuously improved.
The etched semi-finished product is treated by a semiconductor lead frame electrolytic surface treatment device, and the film thickness distribution of the electrolytic metal is uneven.
Disclosure of Invention
The application aims to provide a silver plating device for manufacturing etched products of a semiconductor lead frame, so as to solve the technical problem that the electrolytic metal film thickness distribution is uneven when the etched semi-finished product is processed by a semiconductor lead frame electrolytic surface treatment device, and achieve the purposes of improving the product quality when the etched semi-finished product is processed by the semiconductor lead frame electrolytic surface treatment device.
In order to solve the above technical problems, the present application provides a silver plating apparatus for manufacturing a semiconductor lead frame etching product, comprising:
the device comprises a bidirectional rail, a shielding jig arranged on the rail and a pushing mechanism arranged on the shielding jig, wherein the pushing mechanism pushes the shielding jig to slide on the bidirectional rail;
an anode plate is movably connected to the shielding jig, and is fixed through a fixing component;
the pushing mechanism comprises a driving device and a crankshaft arranged on a driving shaft of the driving device, and the crankshaft is rotationally connected with the shielding jig through a connecting component;
the shielding jig comprises a base and a plurality of nozzles arranged on the base, and rollers arranged on the bidirectional track extend from two sides of the base.
Further, the connecting assembly comprises a vertical connecting sheet arranged on the base and a hinged fixing seat arranged at the upper end of the vertical connecting sheet, a vertical rotating shaft is vertically connected to the hinged fixing seat in a rotating mode, a rocker is rotationally connected to the vertical rotating shaft, and the rocker is connected with a crankshaft on a driving shaft of the driving device.
Further, the fixed subassembly is including locating two vertical support poles on the anode plate and connect two the transverse connection pole of vertical support pole, the transverse connection pole is provided with outside dead lever, outside dead lever passes through the bolt fastening in the outside.
Further, the two sides of the base are extended with upper bearing pieces arranged on the bidirectional track, the upper bearing pieces are provided with a plurality of limiting kidney-shaped holes along the direction of the bidirectional track, and fixing bolts in threaded connection with the bidirectional track are arranged in the limiting kidney-shaped holes.
Further, a plurality of electroplating tanks are arranged on the anode plate.
The beneficial effects of the application are as follows:
1. the shielding jig is pushed to move back and forth on the bidirectional track through the pushing mechanism by the crankshaft, so that the uniform distribution of the film thickness of electrolytic metal on etched products is realized, and the quality of the products is improved.
2. Through shielding the smelting tool, can change and shield the distribution of electric current when the baffle improves electroplating, reach the homogeneity of electroplating product membrane thickness.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of a silver plating apparatus for manufacturing an etched product of a semiconductor lead frame according to the present application;
fig. 2 is a schematic view of the structure of a fixing member of a silver plating apparatus for manufacturing a semiconductor lead frame etching product according to the present application.
In the figure:
1. a bi-directional track;
2. shielding jig; 21. an anode plate; 211. plating bath; 22. a base; 221. loading a bearing piece; 222. limiting waist-shaped holes; 223. a fixing bolt; 23. a nozzle; 24. a roller;
3. a pushing mechanism; 31. a driving device; 32. a crankshaft;
4. a fixing assembly; 41. a vertical support rod; 42. a transverse connecting rod; 43. an external fixing rod;
5. a connection assembly; 51. a vertical connecting sheet; 52. the fixed seat is hinged; 53. a vertical rotating shaft; 54. and (5) a rocker.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Examples:
as shown in fig. 1, a silver plating apparatus for manufacturing a semiconductor lead frame etching product, comprising: the shielding jig comprises a bidirectional rail 1, a shielding jig 2 arranged on the rail, and a pushing mechanism 3 arranged on the shielding jig 2, wherein the pushing mechanism 3 pushes the shielding jig 2 to slide on the bidirectional rail 1, an anode plate 21 is movably connected on the shielding jig 2, and the anode plate 21 is fixed through a fixing component 4. Thus, the current distribution during electroplating can be uniformly distributed on the anode plate 21, so that the uniformity of the film thickness of an electroplated product is improved, and the product quality is improved. Wherein, a plurality of electroplating baths 211 are arranged on the anode plate 21.
As shown in fig. 2, in the present embodiment, the fixing assembly 4 includes two vertical support rods 41 provided on the anode plate 21 and a transverse connection rod 42 connecting the two vertical support rods 41, the transverse connection rod 42 being provided with an external fixing rod 43, the external fixing rod 43 being fixed to the outside by a bolt.
As shown in fig. 1, the pushing mechanism 3 includes a driving device 31 and a crankshaft 32 provided on a driving shaft of the driving device 31, and the crankshaft 32 is rotatably connected to the shielding jig 2 through the connection assembly 5; the shielding jig 2 comprises a base 22 and a plurality of nozzles 23 arranged on the base 22, wherein rollers 24 arranged on the bidirectional track 1 extend from two sides of the base 22, and the rollers 24 slide on the bidirectional track 1 so as to drive the base 22 to slide on the bidirectional track 1. In the present embodiment, the driving device 31 may employ, but is not limited to, a gear motor.
As shown in fig. 1, the connecting assembly 5 includes a vertical connecting piece 51 provided on the base 22 and a hinge fixing seat 52 provided at an upper end of the vertical connecting piece 51, a vertical rotating shaft 53 is vertically rotatably connected to the hinge fixing seat 52, a rocker 54 is rotatably connected to the vertical rotating shaft 53, the rocker 54 is connected to a crankshaft 32 on a driving shaft of the driving device 31, the crankshaft 32 is driven to rotate by a driving motor, the crankshaft 32 drives the rocker 54 to reciprocate due to bending of the crankshaft 32, and the rocker 54 drives the hinge fixing seat 52 to reciprocate, thereby driving the base 22 to reciprocate.
As shown in fig. 1, two sides of the base 22 extend to form an upper bearing piece 221 placed on the bidirectional track 1, a plurality of limiting kidney-shaped holes 222 are formed in the upper bearing piece 221 along the direction of the bidirectional track 1, fixing bolts 223 in threaded connection with the bidirectional track 1 are arranged in the limiting kidney-shaped holes 222, when the base 22 moves forwards and backwards, the limiting kidney-shaped holes 222 of the upper bearing piece 221 on the base 22 move along with the base 22, and the fixing bolts 223 abut against two ends of the limiting kidney-shaped holes 222, so that the moving distance of the base 22 is limited.
To sum up: the shielding jig 2 is pushed to move back and forth on the bidirectional track 1 through the crankshaft 32 by the pushing mechanism 3, so that uniform thickness distribution of electrolytic metal film on etched products is realized, and the product quality is improved. Through shielding tool 2, can change and shield the distribution of electric current when the baffle improves electroplating, reach the homogeneity of electroplating product membrane thickness.
The components selected in the application are all universal standard components or components known to the person skilled in the art, and the structure and principle of the components are all known to the person skilled in the art through technical manuals or through routine experimental methods.
In the description of embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
With the above-described preferred embodiments according to the present application as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the description, but must be determined according to the scope of claims.
Claims (5)
1. A silver plating apparatus for manufacturing an etched product of a semiconductor lead frame, comprising:
the shielding jig comprises a bidirectional rail (1), a shielding jig (2) arranged on the rail and a pushing mechanism (3) arranged on the shielding jig (2), wherein the pushing mechanism (3) pushes the shielding jig (2) to slide on the bidirectional rail (1);
an anode plate (21) is movably connected to the shielding jig (2), and the anode plate (21) is fixed through a fixing component (4);
the pushing mechanism (3) comprises a driving device (31) and a crankshaft (32) arranged on a driving shaft of the driving device (31), and the crankshaft (32) is rotationally connected with the shielding jig (2) through a connecting component (5);
the shielding jig (2) comprises a base (22) and a plurality of nozzles (23) arranged on the base (22), and rollers (24) arranged on the bidirectional track (1) extend from two sides of the base (22).
2. A silver plating apparatus for manufacturing a semiconductor lead frame etching product according to claim 1,
the connecting assembly (5) comprises a vertical connecting sheet (51) arranged on the base (22) and a hinged fixing seat (52) arranged at the upper end of the vertical connecting sheet (51), a vertical rotating shaft (53) is vertically connected to the hinged fixing seat (52) in a rotating mode, a rocker (54) is connected to the vertical rotating shaft (53) in a rotating mode, and the rocker (54) is connected with a crankshaft (32) on a driving shaft of the driving device (31).
3. A silver plating apparatus for manufacturing a semiconductor lead frame etching product according to claim 2,
the fixing assembly (4) comprises two vertical supporting rods (41) arranged on the anode plate (21) and a transverse connecting rod (42) connected with the two vertical supporting rods (41), the transverse connecting rod (42) is provided with an external fixing rod (43), and the external fixing rod (43) is fixed on the outside through a bolt.
4. A silver plating apparatus for manufacturing a semiconductor lead frame etching product according to claim 3,
the base (22) both sides extend have put in go up and hold piece (221) on two-way track (1), go up and hold piece (221) and seted up a plurality of spacing kidney-shaped holes (222) along the direction of two-way track (1), be provided with in spacing kidney-shaped holes (222) with two-way track (1) threaded connection's fixing bolt (223).
5. A silver plating apparatus for manufacturing a semiconductor lead frame etching product according to claim 4,
a plurality of electroplating tanks (211) are arranged on the anode plate (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324353.1A CN114717620B (en) | 2022-03-29 | 2022-03-29 | Silver plating device for manufacturing etched product of semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324353.1A CN114717620B (en) | 2022-03-29 | 2022-03-29 | Silver plating device for manufacturing etched product of semiconductor lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114717620A CN114717620A (en) | 2022-07-08 |
| CN114717620B true CN114717620B (en) | 2023-10-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210324353.1A Active CN114717620B (en) | 2022-03-29 | 2022-03-29 | Silver plating device for manufacturing etched product of semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114717620B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4595480A (en) * | 1985-09-26 | 1986-06-17 | National Semiconductor Corporation | System for electroplating molded semiconductor devices |
| CA2467037A1 (en) * | 2000-03-29 | 2003-06-19 | Sanyo Electric Co., Ltd. | Manufacturing method for semiconductor device |
| KR20110101925A (en) * | 2010-03-10 | 2011-09-16 | (주)휴맥 | Loading and unloading apparatus for semiconductor package lead frame magazine |
| CN207227584U (en) * | 2017-09-26 | 2018-04-13 | 浙江亚芯微电子股份有限公司 | A kind of electroplanting device |
| CN112795968A (en) * | 2020-12-24 | 2021-05-14 | 铜陵蓝盾丰山微电子有限公司 | High efficiency lead frame silver-plating tool |
| CN213652710U (en) * | 2020-10-30 | 2021-07-09 | 昆山首佳智能科技有限公司 | Sheet type pressing plate electroplating line for semiconductor lead frame |
| CN215785799U (en) * | 2021-09-16 | 2022-02-11 | 泰兴市永志电子器件有限公司 | Lead frame punching press front end flattening device |
-
2022
- 2022-03-29 CN CN202210324353.1A patent/CN114717620B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4595480A (en) * | 1985-09-26 | 1986-06-17 | National Semiconductor Corporation | System for electroplating molded semiconductor devices |
| CA2467037A1 (en) * | 2000-03-29 | 2003-06-19 | Sanyo Electric Co., Ltd. | Manufacturing method for semiconductor device |
| KR20110101925A (en) * | 2010-03-10 | 2011-09-16 | (주)휴맥 | Loading and unloading apparatus for semiconductor package lead frame magazine |
| CN207227584U (en) * | 2017-09-26 | 2018-04-13 | 浙江亚芯微电子股份有限公司 | A kind of electroplanting device |
| CN213652710U (en) * | 2020-10-30 | 2021-07-09 | 昆山首佳智能科技有限公司 | Sheet type pressing plate electroplating line for semiconductor lead frame |
| CN112795968A (en) * | 2020-12-24 | 2021-05-14 | 铜陵蓝盾丰山微电子有限公司 | High efficiency lead frame silver-plating tool |
| CN215785799U (en) * | 2021-09-16 | 2022-02-11 | 泰兴市永志电子器件有限公司 | Lead frame punching press front end flattening device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114717620A (en) | 2022-07-08 |
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