CN213086141U - Electroplating liquid tank with liftable anode and wafer electroplating equipment - Google Patents
Electroplating liquid tank with liftable anode and wafer electroplating equipment Download PDFInfo
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- CN213086141U CN213086141U CN202020927104.8U CN202020927104U CN213086141U CN 213086141 U CN213086141 U CN 213086141U CN 202020927104 U CN202020927104 U CN 202020927104U CN 213086141 U CN213086141 U CN 213086141U
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Abstract
The utility model provides an electroplating liquid groove and wafer electroplating equipment of positive pole liftable. The electroplating solution tank with the liftable anode comprises: a base; an anode mounted on the base; and the driving mechanism is in transmission connection with the anode and is used for driving the anode to reciprocate along the axial direction. The utility model provides an among electroplating liquid groove and wafer electroplating device of positive pole liftable, actuating mechanism can drive the positive pole along axial reciprocating motion, can realize adjusting the position of positive pole, can adjust the distance between positive pole and the negative pole wafer as required to adjust the potential difference between positive pole and the negative pole wafer, can obtain the electroplating effect of preferred, it is high to electroplate the precision.
Description
Technical Field
The utility model relates to an electroplating liquid groove and wafer electroplating device with liftable anode.
Background
Some integrated circuit parts need to be electroplated in the production process, and the requirement on the electroplating precision is very high. In order to obtain better plating quality, the distance between the anode and the cathode in the plating apparatus needs to be adjusted to adjust the potential difference between the anode and the cathode.
However, the position of the anode in the prior art is fixed, and the position of the anode cannot be adjusted according to actual needs, so that the distance between the anode and the cathode is adjusted, the use is inconvenient, and the high-precision requirement of electroplating cannot be met.
SUMMERY OF THE UTILITY MODEL
One of the purposes of the utility model is to overcome at least one deficiency in the prior art, and provide an electroplating liquid tank with a liftable anode and a wafer electroplating device.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
according to the first aspect of the utility model, a plating solution tank with a liftable anode is provided. The electroplating solution tank with the liftable anode comprises:
a base;
an anode mounted on the base; and
and the driving mechanism is in transmission connection with the anode and is used for driving the anode to axially reciprocate.
Optionally, the anode is fixedly mounted on a lifting shaft of the driving mechanism.
Optionally, the drive mechanism is mounted on the base; an avoiding part is arranged on the base; the lifting shaft of the driving mechanism penetrates through the avoiding part from one side to the other side and can move in the avoiding part in a reciprocating mode along the axial direction.
Optionally, a first accommodating groove is formed in the base; the anode is accommodated and installed in the first accommodating groove and can axially move in the first accommodating groove.
Optionally, the first accommodating groove is connected with the avoiding portion through a step surface, and the step surface prevents the anode from entering the avoiding portion.
Optionally, a graduated scale is arranged on the driving mechanism and used for displaying the axial displacement of the anode.
Optionally, the method further comprises:
and the filtering membrane is arranged on the base, is positioned on one axial side of the anode and is used for filtering impurities in the electroplating solution.
Optionally, a second accommodating groove is formed in the base, and the second accommodating groove is located on one axial side of the first accommodating groove; the filtering membrane is fixedly arranged in the second accommodating groove.
Optionally, the first receiving groove and the second receiving groove are axially spaced apart from each other.
Optionally, the anode is axially spaced from the filter membrane.
Optionally, a stirring cavity is arranged on one side of the filtering membrane, which faces away from the anode; and a stirring device is arranged in the stirring cavity and used for stirring the electroplating solution.
Optionally, the method further comprises:
a diffuser plate mounted on the base and positioned between the anode and the base for blocking plating solution to disperse plating solution to pass from the anode.
According to a second aspect of the present invention, a wafer plating apparatus is provided. The wafer electroplating equipment comprises:
the plating bath tank;
a cover which can be covered on the top of the electroplating liquid tank; and
a wafer mounted on the lid;
the wafer plating apparatus is configured to enable metal ions in a plating solution to travel from the anode to the wafer.
Different from the prior art, the utility model provides an among the electroplating liquid groove and the wafer electroplating device of positive pole liftable, actuating mechanism can drive the positive pole along axial reciprocating motion, can realize adjusting the position of positive pole, can adjust the distance between positive pole and the negative pole wafer as required to adjust the potential difference between positive pole and the negative pole wafer, can obtain the electroplating effect of preferred, electroplating precision is high.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of a terminal mounting assembly according to an embodiment of the present invention.
FIG. 2 is a schematic view showing a partial structure of the plating bath tank in FIG. 1.
Fig. 3 is a top view of fig. 2.
Fig. 4 is a sectional view taken along a-a direction in fig. 3.
FIG. 5 is a schematic view of the structure of FIG. 3 with the filter membrane removed.
Fig. 6 is a schematic view of the structure of fig. 5 with the anode and a portion of the base removed.
Fig. 7 is a schematic structural view of fig. 6 from another angle.
Fig. 8 is a schematic diagram of the transmission between the driving mechanism and the anode.
Wherein, 1: a plating bath; 10: a base; 12: a first accommodating groove; 14: avoiding the through hole; 16: a step surface; 18: a second accommodating groove; 20: a stirring chamber; 22: a stirring device; 24: an anode; 26: a filtration membrane; 28: a diffusion plate; 30: a drive mechanism; 32: a lifting shaft; 34: a graduated scale; 5: a cover; 6: and (5) a wafer.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings:
according to an embodiment of the present invention, a wafer plating apparatus is provided. As shown in fig. 1 to 4, the wafer plating apparatus includes a plating bath tank 1, a lid 5, and a wafer 6. Plating bath 1 includes base 10, anode 24, and drive mechanism 30. The base 10 is made of an insulating material. The anode 24 is mounted on the base 10 and is made of a conductive material. The base 10 and the anode 24 are located at the bottom of the plating bath tank. The driving mechanism 30 is in transmission connection with the anode 24 and is used for driving the anode 24 to reciprocate along the axial direction Z. For example, anode 24 may be provided as an anode mesh structure.
The cover 7 is made of an insulating material. The lid 5 may be attached to the top of the plating liquid tank 1, for example, the lid 5 may be rotatably mounted on the plating tank. The wafer 78 is conductive. The wafer 6 is mounted on a lid 5 and can be immersed in a plating solution to act as a cathode. For example, a wafer clamping mechanism may be provided on the lid 5 for mounting the wafer 6.
When the lid 7 is closed on the plating bath, the anode and cathode wafers 78 are spaced apart from each other. When the wafer electroplating equipment is connected with a power supply, a potential difference is generated between the anode 24 and the cathode wafer 6, and metal ions in the electroplating solution tank 1 can move to the wafer 6, so that metal can be electroplated on the wafer 6.
The driving mechanism 30 in this embodiment can drive the anode 24 to reciprocate along the axial direction, so as to adjust the position of the anode 24, and adjust the distance between the anode 24 and the cathode wafer 6 as required, thereby adjusting the potential difference between the anode 24 and the cathode wafer 6 to obtain a better electroplating effect.
In this embodiment, as shown in fig. 7 and 8, the driving mechanism 30 may be mounted on the base 10 by a mounting bracket. The base 10 is provided with an escape portion 14. The driving mechanism 30 includes a lifting shaft 32, and the driving mechanism 30 drives the lifting shaft 32 to move back and forth along the axial direction Z. For example, the drive mechanism 30 may be a linear motor, an air cylinder, or other drive mechanism. The lift shaft 32 is made of an insulating material. The elevating shaft 32 of the driving mechanism 30 passes through the through hole from one side to the other side and can reciprocate in the through hole in the axial direction. The elevating shaft 32 of the driving mechanism 30 is radially clearance-fitted to the escape portion 14.
The anode 24 is fixedly mounted on a lift shaft 32 of the drive mechanism 30. For example, the anode 24 may be threadably secured to an end of the lift shaft 32 of the drive mechanism 30 to be axially movable with the lift shaft 32. In this way, the driving mechanism 30 can drive the anode 24 to reciprocate along the axial direction Z via the lifting shaft 32.
The particular configuration of the anode 24 mounted on the base 10 may be arranged as desired. In this embodiment, as shown in fig. 6, a first receiving groove 12 may be disposed on the base 10. The anode 24 is accommodated in the first accommodation groove 12 and can move axially in the first accommodation groove 12.
The first receiving groove 12 and the escape portion 14 may be connected by a step surface 16. The step surface 16 prevents the anode 24 from entering the escape part 14, and prevents the anode 24 from falling out of the plating bath 1.
As shown in fig. 7 and 8, the elevating shaft 32 and the anode 24 of the driving mechanism 30 are provided so as to be adjustable in axial displacement. A scale 34 may be provided on the drive mechanism 30 to indicate the amount of axial displacement of the anode 24. The amount of axial displacement of the anode 24 can be read by a user looking at the scale 34 on the drive mechanism 30.
In this embodiment, as shown in FIGS. 1 to 4, the plating bath tank 1 may further include a filter membrane 26. The filter membrane 26 is made of an insulating material. A filter membrane 26 is mounted on the base 10 on one axial side of the anode 24 for filtering impurities in the plating solution. For example, the filtration membrane 26 can prevent passage of impurities such as bubbles in electrolysis.
The plating liquid is passed through the filtration membrane 26 after entering the plating liquid tank 1, whereby impurities such as bubbles in the plating liquid can be removed. The impurities such as bubbles in the electroplating solution are removed, the distribution of the electroplating solution is uniform, and a better electroplating effect can be obtained.
Further, as shown in fig. 3 and 4, the base 10 may be provided with a second receiving groove 18. The first receiving groove 12 is located at one axial side of the first receiving groove 12. The second receiving groove 18 may be configured to match the shape of the filter membrane 26. The filter membrane 26 is fixedly installed in the second receiving groove 18.
As shown in fig. 4, the first receiving grooves 12 and the second receiving grooves 18 may be spaced apart from each other in the axial direction Z. Correspondingly, the anode 24 is axially spaced from the filter membrane 26.
The filter membrane 26 in this embodiment is fixed in position, at least in the axial direction. When the driving mechanism 30 drives the anode 24 to reciprocate along the axial direction, the axial distance between the anode 24 and the filter membrane 26 is changed.
In this embodiment, as shown in fig. 1, the side of the filter membrane 26 facing away from the anode 24 may be provided with the stirring chamber 20. The stirring chamber 20 is provided therein with a stirring device 22 for stirring the plating liquid. The stirring device 22 is made of an insulating material. The electroplating solution can enter the stirring chamber 20 after passing through the filtering membrane 26 and is stirred by the stirring device 22, so that the electroplating solution is uniformly distributed, and a better electroplating effect is obtained.
In this embodiment, as shown in fig. 4 and 6, the wafer plating apparatus may further include a diffuser 28. A diffuser plate 28 is mounted on the base 10. Diffuser plate 28 is located between anode 24 and base 10, and diffuser plate 28 is located on the other axial side of anode 24 facing away from filter membrane 24. For example, the base 10 may be provided with a diffusion plate receiving groove in which the diffusion plate 28 is received and mounted. Diffuser plate 28 and anode 24 may be arranged side-by-side and in a shape-matched arrangement. For example, diffuser plate 28 and anode 24 may each be arranged in a circular configuration. The diffuser plate 28 is made of an insulating material. After the plating solution enters plating solution tank 1, diffusion plate 28 blocks the plating solution and allows the plating solution to be dispersed to pass around diffusion plate 28. Thereafter, the plating liquid is filtered through the filter membrane 26.
The utility model discloses in, actuating mechanism can drive the positive pole along axial reciprocating motion, can realize adjusting the position of positive pole, can adjust the distance between positive pole and the negative pole wafer as required to adjust the potential difference between positive pole and the negative pole wafer, can obtain the electroplating effect of preferred, it is high to electroplate the precision.
The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention, and any modification, equivalent replacement or improvement within the spirit of the present invention is encompassed by the claims of the present invention.
Claims (13)
1. Electroplating liquid groove of positive pole liftable, its characterized in that includes:
a base;
an anode mounted on the base; and
and the driving mechanism is in transmission connection with the anode and is used for driving the anode to axially reciprocate.
2. The plating bath according to claim 1, wherein:
the anode is fixedly arranged on a lifting shaft of the driving mechanism.
3. The plating bath according to claim 1, wherein:
and the driving mechanism is provided with a graduated scale for displaying the axial displacement of the anode.
4. The plating bath according to claim 1, wherein:
the driving mechanism is arranged on the base; an avoiding part is arranged on the base; the lifting shaft of the driving mechanism penetrates through the avoiding part from one side to the other side and can move in the avoiding part in a reciprocating mode along the axial direction.
5. The plating bath according to claim 4, wherein:
a first accommodating groove is formed in the base; the anode is accommodated and installed in the first accommodating groove and can axially move in the first accommodating groove.
6. The plating bath according to claim 5, wherein:
the first accommodating groove is connected with the avoiding part through a step surface, and the step surface prevents the anode from entering the avoiding part.
7. The plating bath according to any one of claims 5 or 6, further comprising:
and the filtering membrane is arranged on the base, is positioned on one axial side of the anode and is used for filtering impurities in the electroplating solution.
8. The plating bath according to claim 7, wherein:
a second accommodating groove is formed in the base and is located on one axial side of the first accommodating groove; the filtering membrane is fixedly arranged in the second accommodating groove.
9. The plating bath according to claim 8, wherein:
the first accommodating groove and the second accommodating groove are arranged at intervals in the axial direction.
10. The plating bath according to claim 7, wherein:
the anode and the filter membrane are arranged at intervals in the axial direction.
11. The plating bath according to claim 7, wherein:
a stirring cavity is arranged on one side of the filtering membrane, which is opposite to the anode; and a stirring device is arranged in the stirring cavity and used for stirring the electroplating solution.
12. The plating bath according to claim 1, further comprising:
a diffuser plate mounted on the base and positioned between the anode and the base for blocking plating solution to disperse plating solution to pass from the anode.
13. Wafer electroplating equipment, its characterized in that includes:
a plating bath according to any one of claims 1 to 12;
a cover which can be covered on the top of the electroplating liquid tank; and
a wafer mounted on the lid;
the wafer plating apparatus is configured to enable metal ions in a plating solution to travel from the anode to the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020927104.8U CN213086141U (en) | 2020-05-27 | 2020-05-27 | Electroplating liquid tank with liftable anode and wafer electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020927104.8U CN213086141U (en) | 2020-05-27 | 2020-05-27 | Electroplating liquid tank with liftable anode and wafer electroplating equipment |
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| CN213086141U true CN213086141U (en) | 2021-04-30 |
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| CN202020927104.8U Active CN213086141U (en) | 2020-05-27 | 2020-05-27 | Electroplating liquid tank with liftable anode and wafer electroplating equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113846369A (en) * | 2021-09-18 | 2021-12-28 | 安徽光智科技有限公司 | Electrochemical deposition device |
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2020
- 2020-05-27 CN CN202020927104.8U patent/CN213086141U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113846369A (en) * | 2021-09-18 | 2021-12-28 | 安徽光智科技有限公司 | Electrochemical deposition device |
| CN113846369B (en) * | 2021-09-18 | 2022-09-27 | 安徽光智科技有限公司 | Electrochemical deposition device |
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