CN216237347U

CN216237347U - Electroplating equipment

Info

Publication number: CN216237347U
Application number: CN202122933511.7U
Authority: CN
Inventors: 任念; 雷志红
Original assignee: Jianding Hubei Electronics Co ltd
Current assignee: Jianding Hubei Electronics Co ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-04-08
Anticipated expiration: 2031-11-26

Abstract

The utility model discloses an electroplating device, which comprises: the electroplating bath comprises a bath body, and a cathode and an anode which are arranged in the bath body. The fixture device comprises a frame body, a fixture group and two distance adjusting mechanisms, wherein the fixture group comprises two first fixtures and a second fixture which are connected with the two distance adjusting mechanisms, the two first fixtures and the second fixture are respectively connected with an anode and a cathode, the two distance adjusting mechanisms can be used for adjusting the relative positions between the two first fixtures and the second fixture, the two shielding plate assemblies are arranged inside the groove body, the two shielding plate assemblies are arranged at intervals, the two first fixtures clamp the two shielding plate assemblies, the second fixture can be used for clamping a circuit board, the circuit board is positioned between the two shielding plate assemblies, and the equipment can improve the electroplating uniformity and the surface roughness effect of the circuit board by adjusting the distance between the two shielding plate assemblies.

Description

Electroplating equipment

Technical Field

The utility model relates to the technical field of electroplating equipment, in particular to electroplating equipment.

Background

When a circuit board is plated by the conventional electroplating equipment, the problems of uneven plating or poor surface roughness are often caused by different sizes of the circuit board, so how to overcome the above defects by improving the structural design becomes one of the important problems to be solved by the industry.

SUMMERY OF THE UTILITY MODEL

This section is for the purpose of summarizing some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the utility model.

The present invention has been made in view of the above and/or other problems occurring in the prior art plating apparatus.

Therefore, an object of the present invention is to provide an electroplating apparatus, wherein the distance between two shutter assemblies is adjusted by using the technical solutions that "two shutter assemblies are disposed inside the tank body of the electroplating tank and are spaced apart from each other", "two first clamps clamp two shutter assemblies and the second clamp the circuit board, and the circuit board is located between the two shutter assemblies", and "two distance adjusting mechanisms can be used to adjust the relative positions of the two first clamps and the second clamp", so as to improve the electroplating uniformity and surface roughness of the circuit board.

To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions:

an electroplating apparatus, comprising:

the electroplating bath comprises a bath body, a cathode and an anode which are arranged on the bath body, and electrolyte is contained in the bath body;

the clamp device is arranged inside the tank body of the electroplating tank and comprises a frame body, a clamp group arranged on the frame body and two distance adjusting mechanisms; the two distance adjusting mechanisms are respectively connected with the two first clamps, and the two distance adjusting mechanisms can be used for adjusting the relative positions of the two first clamps and the second clamps;

the shielding plate assembly is arranged inside the tank body of the electroplating tank, and the two shielding plate assemblies are arranged at intervals; wherein two of the first clamps clamp two of the shutter assemblies and the second clamp is operable to clamp a circuit board between the two shutter assemblies.

In a preferred embodiment of the electroplating apparatus of the present invention, the electroplating apparatus further includes a power control device electrically connected to the cathode and the anode, and the power control device is configured to control the amount of power supplied to the cathode and the anode.

As a preferable mode of the electroplating apparatus according to the present invention, the electroplating tank further includes a plurality of stirrers mounted on the tank, and the plurality of stirrers are configured to stir the electrolyte disposed inside the tank.

In a preferable embodiment of the electroplating apparatus according to the utility model, the electroplating tank further comprises a tank cover mounted on the tank body, and the tank cover can be used to prevent the electrolyte from overflowing.

In a preferable embodiment of the plating apparatus according to the utility model, the tank cover further includes a plurality of gas outlets for discharging gas generated by electrolysis of the electrolytic solution.

In a preferred embodiment of the electroplating apparatus of the present invention, the electroplating tank further comprises a waste liquid valve disposed adjacent to the bottom of the tank body, and the waste liquid valve can be used to form an opening for the electrolyte to flow out.

As a preferable embodiment of the electroplating apparatus of the present invention, the electroplating tank further comprises a liquid level measuring device, which is installed in the tank body and electrically connected to the waste liquid valve; the liquid level measurer can be used for measuring the liquid level height of the electrolyte in the tank body and controlling the waste liquid valve to enable the electrolyte to flow out of the tank body.

In a preferable embodiment of the electroplating apparatus according to the present invention, the distance between the two shutter assemblies is between 200 mm and 390 mm.

In a preferable embodiment of the electroplating apparatus according to the present invention, a distance between any one of the anodes and the circuit board is 370 mm to 410 mm.

As a preferable scheme of the electroplating apparatus of the present invention, the width of the tank body is between 550 mm and 650 mm.

Compared with the prior art, the utility model has the beneficial effects that: the technical scheme that the two shielding plate assemblies are arranged inside the tank body of the electroplating tank and are arranged at intervals, the two first clamps clamp the two shielding plate assemblies and the second clamp clamps the circuit board, the circuit board is positioned between the two shielding plate assemblies, and the two distance adjusting mechanisms can be used for adjusting the relative positions of the two first clamps and the second clamp is adopted, so that the distance between the two shielding plate assemblies is adjusted, and the electroplating uniformity and the surface roughness of the circuit board are improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise. Wherein:

FIG. 1 is a schematic cross-sectional view of an electroplating apparatus according to the present invention;

FIG. 2 is an enlarged schematic view of a portion II of an electroplating apparatus according to the present invention;

FIG. 3 is a schematic circuit block diagram of an electroplating apparatus according to the present invention.

In the figure:

100. an electroplating bath; 110. a trough body; 120. a cathode; 130. an anode; 140. an electrolyte; 150. a stirrer; 160. a slot cover; 161. an exhaust port; 170. a waste liquid valve; 180. a liquid level measurer; 200. a clamp device; 210. a frame body; 220. a clamp group; 221. a first clamp; 222. a second clamp; 230. a distance adjusting mechanism; 231. a screw; 2311. an external thread; 232. a bearing seat; 233. a drive motor; 234. A threaded sleeve; 300. a shutter assembly; 310. a first shutter member; 320. a second shutter member; 400. a circuit board; 500. a power control device; H. in the horizontal direction.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Next, the present invention will be described in detail with reference to the drawings, wherein for convenience of illustration, the cross-sectional view of the device structure is not enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The utility model provides electroplating equipment, which achieves the effects of adjusting the distance between two shielding plate assemblies and improving the electroplating uniformity and surface roughness of a circuit board by adopting the technical scheme that the two shielding plate assemblies are arranged in the groove body of an electroplating bath and are arranged at intervals, the two shielding plate assemblies are clamped by the two first clamps, the second clamp is used for clamping the circuit board, and the circuit board is positioned between the two shielding plate assemblies, and the two distance adjusting mechanisms can be used for adjusting the relative positions of the two first clamps and the second clamp.

Referring to fig. 1 to 3, which are schematic structural views illustrating an embodiment of an electroplating apparatus according to the present invention, referring to fig. 1 to 3, a main body of the electroplating apparatus according to the embodiment includes: plating cell 100, clamping apparatus 200, shutter assembly 300, and power control apparatus 500.

As shown in fig. 1, the plating cell 100 includes a cell body 110, a cathode 120, an anode 130, a plurality of stirrers 150, a cell cover 160, a waste liquid valve 170, and a liquid level measuring device 180, wherein the cathode 120 and the anode 130 are disposed in the cell body 110, and an electrolyte 140 is contained in the cell body 110. The groove body 110 is a containing groove with an opening at the upper part, and in the preferred embodiment of the present disclosure, the width of the groove body 110 is between 550 mm and 650 mm.

Further, the tank body 110 is made of an acid-resistant material, so that the tank body 110 can be used to contain the electrolyte 140 for a long time. When the tank body 110 is in operation, the internal temperature of the tank body 110 is 22-26 ℃, and the electrolyte 140 is copper sulfate electrolyte in the embodiment, and the concentration thereof is 220-240 g/l, but the utility model is not limited thereto. For example, in other embodiments not shown in this disclosure, the internal temperature of the tank 110 may be adjusted according to actual requirements, and the concentration of the copper sulfate electrolyte may be adjusted according to actual requirements.

As shown in fig. 1 to 2, a plurality of the stirrers 150 are installed on the tank 110, and the stirrers 150 are used for stirring the electrolyte 140 disposed inside the tank 110, so as to keep the overall concentration of the electrolyte 140 constant, wherein:

the number of the plurality of stirrers 150 is preferably two, and each stirrer 150 is a propeller-type stirrer, the number of the plurality of stirrers 150 can be adjusted according to actual needs, and each stirrer 150 can be replaced by other types of stirrers according to needs.

As shown in fig. 1 to 2, the upper portion of the tank cover 160 is movably mounted on the tank body 110, and the tank cover 160 can be used to prevent the electrolyte 140 from overflowing, wherein:

the tank cover 160 includes a plurality of gas discharge ports 161 for discharging gas generated when the electrolyte 140 is electrolyzed.

As shown in fig. 1 to 2, the waste liquid valve 170 is disposed adjacent to the bottom of the tank 110, and the waste liquid valve 170 can be used to form an opening for the electrolyte 140 to flow out, wherein:

the waste liquid valve 170 is made of an acid-resistant material so that the tank 110 can be used to hold the electrolyte 140 for a long time.

As shown in fig. 1 to 2, the liquid level measuring device 180 is installed on the tank 110, and the liquid level measuring device 180 is electrically connected to the waste liquid valve 170, wherein:

the liquid level measurer 180 may be configured to measure a liquid level of the electrolyte 140 in the tank 110, and control the waste liquid valve 170 to allow the electrolyte 140 to flow out of the tank 110, so as to control the liquid level of the electrolyte 140 in the tank 110.

As shown in fig. 1 to 3, the clamp device 200 is mounted to the tank body 110 of the plating tank 100, and the clamp device 200 includes a frame body 210, a clamp group 220 and two distance adjusting mechanisms 230, wherein the clamp group 220 and the two distance adjusting mechanisms 230 are mounted to the frame body 210, and the two distance adjusting mechanisms 230 may be disposed above the tank body 110, or disposed inside or outside the tank body 110.

As shown in fig. 1 to 3, each of the two distance adjusting mechanisms 230 includes a screw 231 parallel to the horizontal direction H, two bearing seats 232 connected to two ends of the screw 231, a driving motor 233 connected to the screw 231, and a threaded sleeve 234 sleeved on the screw 231. The two bearing seats 232 are disposed on the frame body 210, and two ends of the screw 231 are rotatably sleeved on the two bearing seats 232, so that the screw 231 can rotate. The driving motor 233 is configured to drive the screw 231 to rotate, an internal thread is disposed inside the screw sleeve 234, and the internal thread of the screw sleeve 234 can be matched with an external thread 2311 outside the screw 231, so that when the screw 231 rotates, the screw sleeve 234 can be driven to displace along the horizontal direction H;

further, the clamp set 220 includes two first clamps 221 and one second clamp 222, the two first clamps 221 and the second clamps 222 are respectively connected to the anode 130 and the cathode 120, the two distance adjusting mechanisms 230 are respectively connected to the two first clamps 221, and the two distance adjusting mechanisms 230 can be used to adjust the relative positions between the two first clamps 221 and the second clamps 222. The second fixture 222 can be used to hold a circuit board 400, and the two distance adjusting mechanisms 230 can be used to adjust the distance between any one of the anodes 130 and the circuit board 400 to be 370 mm-410 mm.

The two nuts 234 of the two distance adjustment mechanisms 230 connect the two first clamps 221, thereby connecting the two first clamps 221 to the two distance adjustment mechanisms 230. When the screws 231 of the two distance adjustment mechanisms 230 are rotated, the two first clamps 221 can be respectively driven to displace in the horizontal direction H.

The two distance adjusting mechanisms 230 drive the two first clamps 221 to displace, so that the relative positions of the two first clamps 221 and the second clamps 222 change, and the two shutter assemblies 300 can be driven to displace along the horizontal direction H, so that the separation distance between the two shutter assemblies 300 changes, and the relative positions of the two shutter assemblies 300 and the circuit board 400 change.

The electroplating apparatus can adjust the distance between the two shutter assemblies 300 through the two distance adjustment mechanisms 230 when electroplating different types of circuit boards 400, so that the distance between the two shutter assemblies 300 can be changed according to the process conditions required for different types of circuit boards 400.

The frame body 210 and the second fixture 222 can be made of metal or other conductive materials to have conductivity, and the frame body 210 is electrically connected to the cathode 120, so that the second fixture 222 is electrically connected to the cathode 120 through the conductivity of the frame body 210. The two first clamps 221 are insulated from the frame body 210, and the two first clamps 221 are electrically connected to the anode 130 through a conductive line not shown in the figure.

As shown in fig. 1 to 3, two of the shutter assemblies 300 are disposed inside the tank body 110 of the electroplating tank 100, and the two shutter assemblies 300 are disposed at an interval from each other, and a distance between the two shutter assemblies 300 is between 200 mm and 390 mm. Wherein the two first clamps 221 clamp the two shutter assemblies 300, and the circuit board 400 is located between the two shutter assemblies 300.

Two of the shutter assemblies 300 can be defined as a first shutter member 310, and a second shutter member 320 coupled to the first shutter member 310, respectively. The first shutter member 310 and the second shutter member 320 are respectively clamped to the two first clamps 221, and when the cathode 120 and the anode 130 are powered on, the shutter assembly 300 partially shields the path of the current conducted to the circuit board 400 through the electrolyte 140, and can be used to correspondingly change the current distribution on the circuit board 400, thereby improving the uniformity and surface roughness of the plating of the circuit board 400.

The circuit board 400 is preferably a Multi-Layer circuit board (Multi-Layer PCB) in the embodiment, and the circuit board 400 may also be a Single Layer PCB or a Double Layer PCB.

As shown in fig. 1 to fig. 3, the power control device 500 is electrically connected to the cathode 120 and the anode 130, and the power control device 500 is used for controlling the electric quantity when the cathode 120 and the anode 130 are powered on.

Referring to fig. 1 to 3, a specific use procedure of the electroplating apparatus of the present embodiment is as follows, "two of the shutter assemblies 300 are disposed inside the tank body 110 of the electroplating tank 100, and the two shutter assemblies 300 are disposed at intervals from each other," two of the first clamps 221 clamp the two shutter assemblies 300, and the second clamp 222 clamps the circuit board 400, while the circuit board 400 is located between the two shutter assemblies 300, "and" the two distance adjustment mechanisms 230 can be used to adjust the relative positions of the two first clamps 221 and the second clamps 222, "so as to achieve the effect of adjusting the distance between the two shutter assemblies 300, so as to improve the uniformity and surface roughness of the electroplating of the circuit board 400, and by" the plurality of stirrers 150 are used to stir the electrolyte 140 disposed inside the tank body 110 "," the technical scheme, the overall concentration of the electrolyte 140 is kept constant, and the overflow of the electrolyte 140 is avoided by the technical scheme of arranging the tank cover 160 on the tank body 110.

While the utility model has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the various features of the disclosed embodiments of the utility model may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the utility model not be limited to the particular embodiments disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. An electroplating apparatus, comprising:

an electroplating tank (100) comprising a tank body (110), and a cathode (120) and an anode (130) which are arranged on the tank body (110), wherein the tank body (110) contains an electrolyte (140);

a jig device (200) installed in the tank body (110) of the plating tank (100), the jig device (200) including a frame body (210), a jig group (220) installed in the frame body (210), and two distance adjustment mechanisms (230); wherein the set of clamps (220) comprises two first clamps (221) and one second clamp (222), the two first clamps (221) and the two second clamps (222) are respectively connected to the anode (130) and the cathode (120), the two distance adjusting mechanisms (230) are respectively connected to the two first clamps (221), the two distance adjusting mechanisms (230) can be used for adjusting the relative positions between the two first clamps (221) and the second clamps (222), each of the two distance adjusting mechanisms (230) comprises a screw rod (231) parallel to the horizontal direction H, two bearing seats (232) connected to two ends of the screw rod (231), a driving motor (233) connected to the screw rod (231), a threaded sleeve (234) sleeved on the screw rod (231), and an external thread (2311) outside the screw rod (231);

a shutter assembly (300) disposed inside the tank body (110) of the plating tank (100), and the two shutter assemblies (300) are disposed to be spaced apart from each other; wherein two of the first clamps (221) clamp two of the shutter assemblies (300) and the second clamp (222) is operable to clamp a circuit board (400) with the circuit board (400) between the two shutter assemblies (300).

2. An electroplating apparatus according to claim 1, comprising a power control device (500) electrically connected to the cathode (120) and the anode (130), wherein the power control device (500) is configured to control the amount of power supplied to the cathode (120) and the anode (130).

3. The electroplating apparatus according to claim 2, wherein the electroplating tank (100) further comprises a plurality of stirrers (150) mounted on the tank (110), and the plurality of stirrers (150) are used for stirring the electrolyte (140) disposed inside the tank (110).

4. An electroplating apparatus according to claim 3, wherein the electroplating tank (100) further comprises a tank cover (160) mounted on the tank body (110), and the tank cover (160) is capable of preventing the electrolyte (140) from overflowing.

5. An electroplating apparatus according to claim 4, wherein the tank cover (160) further comprises a plurality of gas vents (161) for venting gases generated during electrolysis of the electrolyte (140).

6. An electroplating apparatus according to claim 5, wherein the electroplating tank further comprises a waste valve (170) disposed adjacent to the bottom of the tank (110), and the waste valve (170) is configured to form an opening for the electrolyte (140) to flow out.

7. The electroplating apparatus according to claim 6, wherein the electroplating tank further comprises a liquid level measuring device (180) installed on the tank body (110), and the liquid level measuring device (180) is electrically connected to the waste liquid valve (170); the liquid level measurer (180) can be used for measuring the liquid level of the electrolyte (140) in the tank body (110) and controlling the waste liquid valve (170) to enable the electrolyte (140) to flow out of the tank body (110).

8. An electroplating apparatus according to claim 7, wherein the distance between two shutter assemblies (300) is between 200 mm and 390 mm.

9. An electroplating apparatus according to claim 8, wherein the distance between any one of the anodes (130) and the circuit board (400) is between 370 mm and 410 mm.

10. An electroplating apparatus according to claim 9, wherein the width of the tank (110) is between 550 mm and 650 mm.