CN113846369B

CN113846369B - Electrochemical deposition device

Info

Publication number: CN113846369B
Application number: CN202111098380.3A
Authority: CN
Inventors: 季小好; 杨晓杰; 刘志方
Original assignee: Anhui Guangzhi Technology Co Ltd
Current assignee: Anhui Guangzhi Technology Co Ltd
Priority date: 2021-09-18
Filing date: 2021-09-18
Publication date: 2022-09-27
Anticipated expiration: 2041-09-18
Also published as: CN113846369A

Abstract

The invention discloses an electrochemical deposition device, comprising: the electrolytic cell comprises an electrolytic cell, a base, an inner clamping seat, an outer clamping seat and a driving piece; the bottom of the electrolytic cell is provided with a power-on hole, and the inner wall of the electrolytic cell is provided with an internal thread; the base is provided with a bubble level gauge and an elastic plug which is matched and sealed with the electrifying hole, and a counter electrode is inserted in the elastic plug; the inner clamping seat is provided with a driving column; the lower surface of the bottom of the inner clamping seat is provided with a first convex ring; the outer peripheral surface of the outer clamping seat is provided with an external thread matched with the internal thread; the outer clamping seat is provided with a conductive column, and the upper surface of the bottom of the outer clamping seat is sequentially provided with a liquid inlet hole, an elastic conductive sheet and a second convex ring from inside to outside; the conductive sheet is used for placing a wafer; the driving end of the driving piece is connected with the driving column. In the passivation process of the device, the driving piece can drive the wafer to move through the inner clamping seat and the outer clamping seat, so that the distance between the wafer and the electrolyte is adjusted, and compared with manual adjustment, the controllability and the stability are higher; and the base is provided with a bubble level gauge, so that the level of the electrolytic cell can be better adjusted.

Description

Electrochemical deposition device

Technical Field

The invention relates to the technical field of electrochemistry, in particular to an electrochemical deposition device.

Background

In the focal plane array, passivation can enhance the sealing performance of the device, isolate external impurities, saturate the dangling bonds on the surface of the material and seal the surface leakage electronic channels. Compared with physical vapor deposition and chemical passivation, electrochemical passivation is of great interest because of its simplicity, short time, and high degree of controllability. Common electrochemical passivation of focal planes include sulfidation, fluorination, and the like.

In the passivation process, the electrochemical deposition equipment needs to ensure that the water in the focal plane is placed, the conductive electrode is in nondestructive contact with the wafer, and the uniform passivation is realized. At present, the existing deposition equipment is difficult to ensure the level of a device and the nondestructive contact of a wafer; and along with the proceeding of electrodeposition, the concentration of the electrolyte can be changed, so that the passivation is not uniform, and the stability of the passivation process is influenced.

Therefore, how to improve the stability of the passivation process is an urgent problem to be solved in the field at the present stage.

Disclosure of Invention

In view of the above, the present invention provides an electrochemical deposition apparatus, which can improve the stability of the passivation process and solve the problems in the prior art.

An electrochemical deposition apparatus comprising:

the electrolytic cell is used for containing electrolyte and is provided with a power-on hole at the bottom; the inner wall of the electrolytic cell is provided with internal threads;

the base is provided with a bubble level gauge and an elastic plug which is matched and sealed with the power-on hole, a counter electrode is inserted in the elastic plug, and the counter electrode penetrates through the elastic plug and extends into the electrolyte;

the inner clamping seat is of a cylindrical cavity structure, and a driving column is arranged inside the inner clamping seat; the lower surface of the bottom of the inner clamping seat is provided with a first convex ring;

the outer clamping seat is sleeved and fixed on the outer peripheral surface of the inner clamping seat, and the outer peripheral surface is provided with an external thread matched with the internal thread; the outer clamping seat is provided with a conductive column, and the upper surface of the bottom of the outer clamping seat is sequentially provided with a liquid inlet, an elastic conductive sheet and a second convex ring from inside to outside; the conducting sheet is electrically connected with the conducting column and used for placing a wafer; the second convex ring is matched with the first convex ring so that the wafer can be accommodated between the conducting strip and the bottom of the inner clamping seat;

the driving end of the driving piece is connected with the driving column, and under the action of the driving piece, the driving column drives the outer clamping seat to move up and down along the inner wall of the electrolytic cell through the inner clamping seat so as to adjust the distance between the wafer and the electrolyte.

Preferably, in the electrochemical deposition device, an annular sleeve is nested on the edge of the top of the electrolytic cell, and the internal thread is arranged on the inner circumferential surface of the sleeve.

Preferably, in the electrochemical deposition apparatus, the base is provided with a supporting column for placing the electrolytic cell, and the bubble level gauge is arranged on the supporting column.

Preferably, in the electrochemical deposition apparatus, the base is further provided with a groove for the counter electrode to protrude.

Preferably, in the electrochemical deposition apparatus, the conductive column is disposed at an upper edge of the outer clamping seat.

Preferably, in the electrochemical deposition apparatus, the bottom of the inner clamping base is provided with a connecting hole, the bottom of the outer clamping base is provided with a connecting column matched with the connecting hole, and the outer peripheral surface of the connecting column is sleeved with a nut for fixing the inner clamping base and the outer clamping base.

Preferably, the electrochemical deposition device further comprises an L-shaped right-angle frame, the bottom of the right-angle frame is fixed with the base, and a connecting plate is arranged at the top of the right-angle frame;

the connecting plate is provided with a guide rail, and the driving piece is in sliding connection with the connecting plate through the guide rail.

Preferably, in the electrochemical deposition apparatus, the conductive sheet has a spiral shape.

Preferably, in the electrochemical deposition apparatus, a liquid level observation hole is formed at the bottom of the inner clamping seat.

Preferably, in the electrochemical deposition apparatus, an external connection pipe connected with the circulating pump is arranged on the outer peripheral surface of the electrolytic cell.

The invention provides an electrochemical deposition device, which comprises: the electrolytic cell comprises an electrolytic cell, a base, an inner clamping seat, an outer clamping seat and a driving piece; electrolyte is filled in the electrolytic cell, and the bottom of the electrolytic cell is provided with a power-on hole; the inner wall of the electrolytic cell is provided with internal threads; the base is provided with a bubble level gauge and an elastic plug which is matched and sealed with the power-on hole, a counter electrode is inserted in the elastic plug, and the counter electrode penetrates through the elastic plug and extends into the electrolyte; the inner clamping seat is of a cylindrical cavity structure, and a driving column is arranged inside the inner clamping seat; the lower surface of the bottom of the inner clamping seat is provided with a first convex ring; the outer clamping seat is of a cylindrical cavity structure sleeved and fixed on the peripheral surface of the inner clamping seat, and the peripheral surface is provided with an external thread matched with the internal thread; the outer clamping seat is provided with a conductive column, and the upper surface of the bottom of the outer clamping seat is sequentially provided with a liquid inlet hole, an elastic conductive sheet and a second convex ring from inside to outside; the conducting sheet is electrically connected with the conducting column and used for placing the wafer; the second convex ring is matched with the first convex ring so that the wafer can be accommodated between the conducting strip and the bottom of the inner clamping seat; the driving end of the driving piece is connected with the driving column, and under the action of the driving piece, the driving column drives the outer clamping seat to move up and down along the inner wall of the electrolytic cell through the inner clamping seat so as to adjust the distance between the wafer and the electrolyte. In the passivation process of the electrochemical deposition device, the driving piece can drive the wafer to move through the inner clamping seat and the outer clamping seat, so that the distance between the wafer and the electrolyte is adjusted, and compared with manual adjustment, the controllability and the stability are higher; and the base is provided with the bubble level meter, so that the level of the electrolytic cell can be better adjusted, and the passivation effect is further ensured. Therefore, the electrochemical deposition device provided by the invention can improve the stability of the passivation process and solve the problem in the field at the present stage.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a front view of an electrochemical deposition apparatus according to an embodiment of the present invention;

FIG. 2 is an exploded view of an electrochemical deposition apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic view of an inner cartridge according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of an external card socket according to an embodiment of the present invention;

FIG. 5 is a top view of a base in accordance with an embodiment of the present invention;

FIG. 6 is a top view of an electrochemical deposition apparatus suitable for use with a single wafer in accordance with an embodiment of the present invention;

FIG. 7 is a top view of an electrochemical deposition apparatus for multiple wafers in accordance with one embodiment of the present invention.

In fig. 1-7:

an electrolytic cell-1; a power-on hole-2; an internal thread-3; a base-4; an elastic plug-5; a counter electrode-6; an inner clamping seat-7; a drive column-8; a first collar-9; an outer cassette-10; an external thread-11; a conductive post-12; a liquid inlet hole-13; a conductive sheet-14; a second collar-15; a wafer-16; a drive member-17; kit-18; a support post-19; a groove-20; a connecting hole-21; a connecting post-22; a nut-23; a connecting plate-24; liquid level observation hole-25; an extension tube-26; a right-angle frame-27.

Detailed Description

The core of the present embodiment is to provide an electrochemical deposition apparatus, which can improve the stability of the passivation process and solve the problems in the field at the present stage.

Hereinafter, embodiments will be described with reference to the drawings. The embodiments described below do not limit the contents of the invention described in the claims. The entire contents of the configurations shown in the following embodiments are not limited to those required as solutions of the inventions described in the claims.

The electrochemical deposition apparatus provided by the present embodiment includes: the electrolytic cell comprises an electrolytic cell 1, a base 4, an inner clamping seat 7, an outer clamping seat 10 and a driving piece 17; electrolyte is filled in the electrolytic cell 1, and the bottom of the electrolytic cell is provided with a power-on hole 2; the inner wall of the electrolytic cell 1 is provided with internal threads 3; the base 4 is provided with a bubble level gauge and an elastic plug 5 which is matched and sealed with the electrifying hole 2, a counter electrode 6 is inserted in the elastic plug 5, and the counter electrode 6 penetrates through the elastic plug 5 and extends into the electrolyte; the inner clamping seat 7 is of a cylindrical cavity structure, and a driving column 8 is arranged inside the inner clamping seat; the lower surface of the bottom of the inner clamping seat 7 is provided with a first convex ring 9; the outer clamping seat 10 is a cylindrical cavity structure which is fixed on the outer peripheral surface of the inner clamping seat 7 in a sleeved mode, and the outer peripheral surface is provided with an external thread 11 matched with the internal thread 3; the outer clamping seat 10 is provided with a conductive column 12, and the upper surface of the bottom of the outer clamping seat 10 is sequentially provided with a liquid inlet hole 13, an elastic conductive sheet 14 and a second convex ring 15 from inside to outside; the conducting sheet 14 is electrically connected with the conducting column 12 and used for placing the wafer 16; the second convex ring 15 is matched with the first convex ring 9, so that a wafer 16 can be accommodated between the conductive sheet 14 and the bottom of the inner chuck 7; the driving end of the driving piece 17 is connected with the driving column 8, and under the action of the driving piece 17, the driving column 8 drives the outer clamping seat 10 to move up and down along the inner wall of the electrolytic cell 1 through the inner clamping seat 7 so as to adjust the distance between the wafer 16 and the electrolyte.

In the passivation process of the electrochemical deposition device, the driving part 17 can drive the wafer 16 to move through the inner clamping seat 7 and the outer clamping seat 10, so that the distance between the wafer 16 and the electrolyte is adjusted, and compared with manual adjustment, the controllability and the stability are higher; and the base 4 is provided with a bubble level gauge, so that the level of the electrolytic cell 1 can be better adjusted, and the passivation effect is further ensured.

Therefore, the electrochemical deposition device provided by the invention can improve the stability of the passivation process and solve the problem in the field at the present stage. Please refer to fig. 1-7.

Further, the elastic plug 5 may be a rubber plug, a silicone plug, or other plugs capable of performing the same function.

In the electrochemical deposition apparatus provided in this embodiment, the annular sleeve 18 may be nested on the edge of the top of the electrolytic cell 1, and the internal thread 3 is disposed on the inner circumferential surface of the sleeve 18, that is, the electrolytic cell 1 is screwed to the outer holder 10 through the sleeve 18.

In the electrochemical deposition apparatus provided in this embodiment, the base 4 may be provided with a supporting column 19 for placing the electrolytic cell 1, and the bubble level gauge is disposed on the supporting column 19; thereby the base 4 can better support the electrolytic cell 1.

Further, the base 4 may be further provided with a groove 20 for extending the counter electrode 6, thereby facilitating the connection of the counter electrode 6 with an external element.

In the electrochemical deposition apparatus provided in this embodiment, the conductive pillar 12 may be disposed at the upper edge of the outer socket 10, and the conductive pillar 12 may be electrically connected to the conductive sheet 14 through an internal circuit of the outer socket 10.

In the electrochemical deposition apparatus provided by this embodiment, the bottom of the inner holder 7 may be provided with a connecting hole 21, the bottom of the outer holder 10 may be provided with a connecting column 22 matching with the connecting hole 21, and the outer circumferential surface of the connecting column 22 may be sleeved with a nut 23 for fixing the inner holder 7 and the outer holder 10.

Of course, the inner clamping seat 7 and the outer clamping seat 10 can be clamped or fixed in other fixing modes with the same function.

The electrochemical deposition device provided by the present embodiment may further include an L-shaped right-angle frame 27, the bottom of the right-angle frame 27 may be fixed to the base 4, and the top may be provided with a connecting plate 24; and a guide rail is arranged on the connecting plate 24, and the driving piece 17 is connected with the connecting plate 24 in a sliding way through the guide rail.

Namely, when the outer clamping seat 10 moves up and down along the electrolytic cell 1 through the thread, the driving piece 17 moves up and down along the guide rail; the driving member 17 may be a stepping motor or other components capable of playing a role. Further, in order to better control the operation of the stepping motor, a display screen can be provided on the driving member 17, and various parameters of the operation of the driving member 17 can be known.

In the electrochemical deposition apparatus provided in this embodiment, the conductive sheet 14 may be spiral, so as to better realize the elastic function, that is, the conductive sheet is in contact with the wafer 16 by using a flexible connection, thereby avoiding damage to the wafer 16.

In the electrochemical deposition apparatus provided in this embodiment, the bottom of the inner holder 7 may be provided with a liquid level observation hole 25, so as to better observe the position of the liquid level and control the distance between the wafer 16 and the liquid level.

In the electrochemical deposition apparatus provided by the present embodiment, the outer peripheral surface of the electrolytic cell 1 may be provided with an external connection pipe 26 connected to the circulation pump, so as to adjust the concentration of the electrolyte in time as required, ensure the uniformity and uniform passivation of the deposition, and further improve the stability of the passivation process.

The conductive post 12, the conductive piece 14, the connecting post 22, the connecting hole 21 and the like can be matched in number, so that the passivation process is well met.

Referring to fig. 6-7, the electrochemical deposition apparatus may be designed as a passivation apparatus for a wafer; and modular production can be realized, and a device suitable for simultaneously passivating a plurality of wafers is designed, so that the wafer passivation process with various sizes and requirements is met.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electrochemical deposition apparatus, comprising:

the electrolytic cell (1) is internally used for installing electrolyte, and the bottom of the electrolytic cell (1) is provided with an electrifying hole (2); the inner wall of the electrolytic cell (1) is provided with internal threads (3);

the base (4) is provided with a bubble level meter and an elastic plug (5) matched and sealed with the electrifying hole (2), a counter electrode (6) is inserted into the elastic plug (5), and the counter electrode (6) penetrates through the elastic plug (5) and extends into the electrolyte;

the inner clamping seat (7) is of a cylindrical cavity structure, and a driving column (8) is arranged inside the inner clamping seat (7); the lower surface of the bottom of the inner clamping seat (7) is provided with a first convex ring (9);

the outer clamping seat (10) is sleeved and fixed on the outer peripheral surface of the inner clamping seat (7), and the outer peripheral surface is provided with an external thread (11) matched with the internal thread (3); the outer clamping seat (10) is provided with a conductive column (12), and the upper surface of the bottom of the outer clamping seat (10) is sequentially provided with a liquid inlet hole (13), an elastic conductive sheet (14) and a second convex ring (15) from inside to outside; the conducting sheet (14) is electrically connected with the conducting column (12) and used for placing a wafer (16); the second convex ring (15) is matched with the first convex ring (9) so that the wafer (16) can be accommodated between the conducting strip (14) and the bottom of the inner clamping seat (7);

the driving end of the driving piece (17) is connected with the driving column (8), and under the action of the driving piece (17), the driving column (8) drives the outer clamping seat (10) to move up and down along the inner wall of the electrolytic cell (1) through the inner clamping seat (7) so as to adjust the distance between the wafer (16) and the electrolyte.

2. The electrochemical deposition apparatus according to claim 1, wherein the top edge of the electrolytic cell (1) is nested with an annular sleeve (18), and the internal thread (3) is arranged on the inner circumferential surface of the sleeve (18).

3. Electrochemical deposition apparatus according to claim 1, characterized in that the base (4) is provided with support columns (19) for placing the electrolytic cells (1), the bubble level being provided at the support columns (19).

4. Electrochemical deposition device according to claim 1, characterized in that the base (4) is further provided with a recess (20) for the counter electrode (6) to protrude.

5. Electrochemical deposition apparatus according to claim 1, wherein the conductive post (12) is provided at an upper edge of the outer cartridge (10).

6. The electrochemical deposition apparatus according to claim 1, wherein a connecting hole (21) is formed in the bottom of the inner clamping seat (7), a connecting column (22) matched with the connecting hole (21) is formed in the bottom of the outer clamping seat (10), and a nut (23) for fixing the inner clamping seat (7) and the outer clamping seat (10) is sleeved on the outer circumferential surface of the connecting column (22).

7. The electrochemical deposition device according to claim 1, further comprising an L-shaped right-angle stand (27), wherein the bottom of the right-angle stand (27) is fixed with the base (4), and the top of the right-angle stand is provided with a connecting plate (24);

the connecting plate (24) is provided with a guide rail, and the driving piece (17) is in sliding connection with the connecting plate (24) through the guide rail.

8. The electrochemical deposition apparatus according to claim 1, wherein the conductive sheet (14) is helical.

9. Electrochemical deposition device according to claim 1, characterized in that the bottom of the inner cartridge (7) is provided with a liquid level observation hole (25).

10. Electrochemical deposition apparatus according to claim 1, characterised in that the outer circumference of the electrolytic cell (1) is provided with an external pipe (26) connected to a circulation pump.