CN210506561U - Electrolytic tank for electrodeposition experiment - Google Patents
Electrolytic tank for electrodeposition experiment Download PDFInfo
- Publication number
- CN210506561U CN210506561U CN201921086115.1U CN201921086115U CN210506561U CN 210506561 U CN210506561 U CN 210506561U CN 201921086115 U CN201921086115 U CN 201921086115U CN 210506561 U CN210506561 U CN 210506561U
- Authority
- CN
- China
- Prior art keywords
- anode
- cover
- bath
- cathode
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
An electrolytic bath for an electrodeposition experiment comprises a plating bath 1, a bath cover 2, a temperature sensor 3, an anode plate 4, an anode frame 5, an anode cover 6, a cathode clamp 7 and a constant-temperature magnetic stirrer 8. The device is characterized in that a tank cover 2 covers a plating tank 1, and the tank cover 2 is provided with a cathode hole positioned in the center, six anode tanks which are symmetrical left and right, and a temperature sensor hole above the left; the two sides of the anode frame 5 are provided with protruding baffle plates for being clamped on the tank cover 2 and fixing the anode plate 4 in the plating tank 1 to prevent the anode plate from shaking; the anode cover 6 is covered on the anode tank without the anode plate, so that the temperature loss and the evaporation of the plating solution are reduced; the cathode clamp 7 is placed on the cathode hole and used for positioning the workpiece and conducting the electrodeposition loop.
Description
Technical Field
The utility model relates to an electroplating processing technology field, in particular to an electrolytic bath for electrodeposition experiment.
Background
The electrolytic bath consists of a bath body, an anode and a cathode, and converts electric energy into chemical energy under the action of an external power supply so as to achieve the purpose of electroplating. The electrodeposition technology is a process in which a cathode plating member and an anode material (plating metal or inert anode) are placed in a salt solution containing the plated metal, and a metal plating layer having a certain performance is obtained under the action of current. In general, the electrolytic cell used in the experiment is only provided with an anode plate on one side, which causes the potential on two sides of the cathode to be unequal, so that the thickness of the prepared coating is not uniform, and the gap between the cathode and the anode can not be adjusted by the electrolytic cell. In order to solve the problems, the utility model designs an electrolytic bath for electrodeposition experiments.
Disclosure of Invention
In order to solve the problems that the potentials at the two sides of the cathode are not equal and the gap between the cathode and the anode of the electrolytic cell can not be adjusted, the electrolytic cell for the electrodeposition experiment is designed.
The technical scheme of the utility model is that:
an electrolytic bath for an electrodeposition experiment comprises a plating bath 1, a bath cover 2, a temperature sensor 3, an anode plate 4, an anode frame 5, an anode cover 6, a cathode clamp 7 and a constant-temperature magnetic stirrer 8, and is characterized in that the bath cover 2 covers the plating bath 1, and the bath cover 2 is provided with a cathode hole positioned at the center, six anode tanks which are bilaterally symmetrical and a temperature sensor hole positioned at the upper left; the two sides of the anode frame 5 are provided with protruding baffle plates for being clamped on the tank cover 2 and fixing the anode plate 4 in the plating tank 1 to prevent the anode plate from shaking; the anode cover 6 is covered on the anode tank without the anode plate, so that the temperature loss and the evaporation of the plating solution are reduced; the cathode clamp 7 is placed on the cathode hole and used for positioning the workpiece and conducting the electrodeposition loop.
The utility model has the advantages that:
(1) the structure is simple, the operation is simple, and the two-stage gap is controllable. The electric potentials at the two sides of the cathode are ensured to be equal, and the gap between the cathode and the anode can be adjusted by replacing the position of the anode slot.
(2) Preventing the plating solution from volatilizing. The evaporation of the solvent is reduced, and the harm of volatile matters to operators and the environment is reduced.
Drawings
Fig. 1 is a schematic diagram of the three-dimensional structure of the present invention.
FIG. 2 is a schematic diagram of the three-dimensional structure of the electrolytic cell.
In the figure, 1, a plating bath, 2, a bath cover, 3, a temperature sensor, 4, an anode plate, 5, an anode frame, 6, an anode cover, 7, a cathode clamp and 8, a constant temperature magnetic stirrer.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 1.
An electrolytic bath for an electrodeposition experiment comprises a plating bath 1, a bath cover 2, a temperature sensor 3, an anode plate 4, an anode frame 5, an anode cover 6, a cathode clamp 7 and a constant-temperature magnetic stirrer 8, and is characterized in that the bath cover 2 covers the plating bath 1, and the bath cover 2 is provided with a cathode hole positioned at the center, six anode tanks which are bilaterally symmetrical and a temperature sensor hole positioned at the upper left; the two sides of the anode frame 5 are provided with protruding baffle plates for being clamped on the tank cover 2 and fixing the anode plate 4 in the plating tank 1 to prevent the anode plate from shaking; the anode cover 6 is covered on the anode tank without the anode plate, so that the temperature loss and the evaporation of the plating solution are reduced; the cathode clamp 7 is placed on the cathode hole and used for positioning the workpiece and conducting the electrodeposition loop.
The working process is as follows:
pouring a proper amount of prepared plating solution into the plating tank 1, and setting the temperature parameter of the constant-temperature magnetic stirrer 8 to the temperature specified by the process parameter. After the plating solution is heated to a set temperature, putting the plating solution into a magnetic rotor; the temperature sensor 3 is immersed in the plating solution through the temperature sensor hole on the tank cover 2; mounting the workpiece on a cathode clamp 7 and placing the workpiece in a cathode hole on the tank cover 2; placing an anode plate 4 in the anode holes on the tank cover 2 through an anode frame 5, and covering the rest anode holes with anode covers 6; the anode plate 4 and the cathode clamp 7 are respectively connected with the anode and the cathode of the electroplating power supply. After power supply technological parameters are set, stirring and processing are started. After the processing is finished, the power supply is turned off, the workpiece is disassembled, and the anode plate 4 is cleaned on time.
Claims (1)
1. An electrolytic bath for an electrodeposition experiment comprises a plating bath (1), a bath cover (2), a temperature sensor (3), an anode plate (4), an anode frame (5), an anode cover (6), a cathode clamp (7) and a constant-temperature magnetic stirrer (8), and is characterized in that the bath cover (2) covers the plating bath (1), and the bath cover (2) is provided with a cathode hole positioned at the center, six anode tanks which are bilaterally symmetrical and a temperature sensor hole positioned at the upper left; the two sides of the anode frame (5) are provided with protruding baffle plates for being clamped on the tank cover (2), and the anode plate (4) is fixed in the plating tank (1) to prevent the anode plate from shaking; the anode cover (6) is covered on the anode tank without the anode plate, so that the temperature loss and the evaporation of the plating solution are reduced; and the cathode clamp (7) is placed on the cathode hole and used for positioning the workpiece and conducting the electrodeposition loop.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921086115.1U CN210506561U (en) | 2019-07-09 | 2019-07-09 | Electrolytic tank for electrodeposition experiment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921086115.1U CN210506561U (en) | 2019-07-09 | 2019-07-09 | Electrolytic tank for electrodeposition experiment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210506561U true CN210506561U (en) | 2020-05-12 |
Family
ID=70582631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921086115.1U Expired - Fee Related CN210506561U (en) | 2019-07-09 | 2019-07-09 | Electrolytic tank for electrodeposition experiment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210506561U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113151882A (en) * | 2021-05-18 | 2021-07-23 | 大连理工大学 | Sealed electrolytic tank for electrodeposition |
-
2019
- 2019-07-09 CN CN201921086115.1U patent/CN210506561U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113151882A (en) * | 2021-05-18 | 2021-07-23 | 大连理工大学 | Sealed electrolytic tank for electrodeposition |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5332487A (en) | Method and plating apparatus | |
US4043891A (en) | Electrolytic cell with bipolar electrodes | |
US8926820B2 (en) | Working electrode design for electrochemical processing of electronic components | |
CN110139949B (en) | Electroplating device for small parts | |
CN210506561U (en) | Electrolytic tank for electrodeposition experiment | |
JP4579306B2 (en) | Circular plating tank | |
CN102534733A (en) | Electroplating device and electroplating method | |
CN111850628A (en) | Method for manufacturing punched copper foil of shielding cathode plate | |
US20070144896A1 (en) | Plating process enhanced by squeegee roller apparatus | |
CN213739734U (en) | Be used for axle sleeve part outside selectivity to electroplate tool | |
CN105297096A (en) | Electroplating device and electroplating method for electrodepositing different platings on double sides | |
CN104630858A (en) | Self-rotating type electroplating device capable of uniformly plating chromium in axial and circumferential directions | |
JP3915762B2 (en) | Partial plating equipment | |
CN205529104U (en) | Plating device | |
CN208218985U (en) | Rotary cylinder-block electroplanting device | |
CN203474935U (en) | Metal product inner cavity surface treatment device | |
CN218710999U (en) | Electroplating bath body conductive device | |
CN211734511U (en) | Electroplating device for rear cover of mobile phone | |
CN105063700A (en) | Method for electroplating silver on surface of printed circuit board through pulse current | |
CN219079681U (en) | Simple electroplating tin bath for experiments | |
CN214183689U (en) | Spraying device for manufacturing curved surface type electrode | |
CN220300895U (en) | Simple device for electroplating on semiconductor substrate | |
JPH0441698A (en) | Method and device for electroplating and jig utilize therefor | |
JP6750186B1 (en) | Method for suppressing increase in zinc concentration of plating solution and method for producing zinc-based plated member | |
CN217809773U (en) | Integrated electrolytic polishing device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200512 Termination date: 20210709 |