CN105063700A - Method for electroplating silver on surface of printed circuit board through pulse current - Google Patents
Method for electroplating silver on surface of printed circuit board through pulse current Download PDFInfo
- Publication number
- CN105063700A CN105063700A CN201510436652.4A CN201510436652A CN105063700A CN 105063700 A CN105063700 A CN 105063700A CN 201510436652 A CN201510436652 A CN 201510436652A CN 105063700 A CN105063700 A CN 105063700A
- Authority
- CN
- China
- Prior art keywords
- silver
- pulse
- circuit board
- printed circuit
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for electroplating silver on the surface of a printed circuit board through pulse current. The method is low in cost, simple in process and controllable. The method comprises the steps of (1) preparing electroplate liquid containing silver salt and (2) carrying out the silver plating process. In the step (1), silver cyanide, sodium cyanide and sodium hydroxide are used as main salt, dimethylamine-borane and thiourea serve as supporting electrolytes, and an inorganic molten salt plating solution system is prepared. In the step (2), the silver plating process comprises the steps of grinding of the surface of the printed circuit board, chemical oil removal, water flushing, brush polishing, etching activation, pulse silver plating, washing and drying, wherein the pulse silver plating process is that electroplating is carried out at the temperature of 50-60 DEG C, and reverse pulse electroplating is adopted; pulse parameters are that forward current is 5-15 A, reverse current is 15 A, forward pulse time is 18-108 ms, reverse pulse time is 2 ms, and electroplating time is 60 min. The method can be applied to the field of metal materials.
Description
Technical field
The present invention seeks to provide a kind of with low cost, technique is simply controlled, in the method for printing board surface with pulsed current electrosilvering.Be specifically related to, at printing board surface pulsed current electrosilvering, belong to metallic substance sciemtifec and technical sphere.
Background technology
Electroless Silver Plating is applied in the chronic of printed circuit board, but generates the oxidation film layer of black owing to being subject to air oxidation, and not only surface quality is very poor, the more important thing is that surface resistivity alters a great deal, and directly affects the electrical property of carrier.But after improving, chemical silvering not only can be used for soldering but also may be used for bond technology, thus generally comes into one's own.Major cause is subject to certain restrictions when the chemical nickel plating cost owing to adopting is higher and organic solder resist protective material is assembled, also poor with soldering flux compatibility in addition.
Pulse plating techniques originates in phase late 1970s in China, and his achievement in precious metal electroplating is remarkable, although its advantage is a lot, due to can not provide powerful PC power source and power supply expensive, limit its process of industrialization.
Summary of the invention
The present invention is intended to improve the problems referred to above, propose a kind of with low cost, technique simply controlled with pulsed current in the silver-plated method of printed circuit board surface electrical.
The technical scheme that the method for the invention adopts is: the method comprises the following steps:
(1) preparation is containing silver salt electroplate liquid: with silver cyanide, sodium cyanide and sodium hydroxide for main salt, dimethylin borine, and thiocarbamide, as supporting electrolyte, prepares inorganic fused salt bath system;
(2) silver plating process: circuit board surface polishing-electrochemical deoiling-water flushing-scratch brushing-etch activation-pulse silver-coating-washing-drying; Pulse silver-coating process is wherein: electroplate temperature 50 ~ 60 DEG C, adopt Reverse pulse plating, pulse parameter: forward current is 5 ~ 15A, reversible circulation is 15A, the direct impulse time is 18 ~ 108ms, and the reverse impulse time is 2ms, electroplating time is 60min.
Further, by weight percentage, described electroplate liquid contains the silver cyanide of 60% ~ 85%, the nacn of 3% ~ 10% and the mixture of sodium hydroxide, the dimethylin borine of 12% ~ 30% and compound.
Further, described electroplate liquid system argentiferous 0.5 ~ 0.6g/L, pH value is 6.5 ~ 7, and system temperature is between 43 ~ 53 DEG C.
The invention has the beneficial effects as follows: the present invention adopts pulsed current to carry out electrosilvering process at printing board surface, pulse plating, compared with traditional direct current electrode position, can improve the purity of coating, reduces coating porosity, improves the homogeneity of thickness of coating.Pulse plating belongs to a kind of electroplating using modulated current, it is in fact the direct current electrode position of a break-make, but make and break period is with millisecond meter, peak point current during direct current conducting is equivalent to several times even tens times of common current, the high current density of this moment can make metal ion reduce under too high overpotential, thus it is tiny to obtain crystal grain, the coating that density high porosity is low: and disconnect or reverse moment at electric current, then can the plating solution in coating and negative electrode electrostatic double layer be adjusted, the electric current stopped instantaneously making peripheral metal ion be delivered to rapidly near negative electrode, that the ion of electrostatic double layer is supplemented, hydrogen or impurity desorption is made to return plating solution, contribute to improving coating purity and reducing fragility, the settling that reversible circulation instantaneously can make coating edge too much is by electrochemical dissolution, be conducive to the homogeneity of coating.
The present invention is by the average current density in adjustment pulse silver-coating process, and the turn-off time, ON time etc., deposit one deck densification at printing board surface, the film that conductivity is good, and it has following advantage:
1. more consistent with thickness of coating on plate face in hole;
2. average current density can double, and the increase of current density, decreases electroplating time, improves working efficiency;
3. on plate face, thickness of coating homogeneity is greatly improved;
4. through-hole plating thickness one timing, due on the lid of coating uniformity, so thickness of coating can reduce on plate face, and lateral erosion when decreasing etching.
Embodiment
Described in detail by specific embodiment according to inventive method below.Following embodiment just in order to better by clear for the explaination of the technology of the present invention principle, do not represent the present invention and only limits this embodiment of use.
embodiment one:
By the copper coin of negative electrode 320 orders, 600 order sand paperings, use alkaline degreaser oil removing.By the zone of oxidation on the hydrochloric acid soln removing steel part surface of about 15%.Then at room temperature soak in the hydrochloric acid soln of 10% and activated to 1 minute for 30 seconds; The main purpose of activation exposes the matrix made new advances, and to increase the epitaxy of coated metal grain growing, improves the bonding force of coating and matrix.Lower same.
Electroplate temperature 50 ~ 60 DEG C, adopt Reverse pulse plating, pulse parameter: forward current is 5A, reversible circulation is 15A, the direct impulse time is 18ms, the reverse impulse time is 2ms, electroplating time is 60min.
Silver-colored homogeneity on the present embodiment galvanic deposit through hole and compactness are well, good with copper substrate caking power.
embodiment two:
By the copper coin of negative electrode 320 orders, 600 order sand paperings, use alkaline degreaser oil removing.By the zone of oxidation on the hydrochloric acid soln removing steel part surface of about 15%.Then at room temperature soak in the hydrochloric acid soln of 10% and activated to 1 minute for 30 seconds.
Electroplate temperature 50 ~ 60 DEG C, adopt Reverse pulse plating, pulse parameter: forward current is 5A, reversible circulation is 15A, the direct impulse time is respectively 36ms, 72ms, 108ms, reverse impulse time are 2ms, electroplating time is 60min.
Silver-colored homogeneity on the present embodiment galvanic deposit through hole and compactness are well, good with copper substrate caking power.Along with the increase of direct impulse time, the even performance of through hole increases.
embodiment three:
By the copper coin of negative electrode 320 orders, 600 order sand paperings, use alkaline degreaser oil removing.By the zone of oxidation on the hydrochloric acid soln removing steel part surface of about 15%.Then at room temperature soak in the hydrochloric acid soln of 10% and activated to 1 minute for 30 seconds.
Electroplate temperature 50 ~ 60 DEG C, adopt Reverse pulse plating, pulse parameter: forward current is 5A, reversible circulation is 15A, the direct impulse time is 18ms, the reverse impulse time is 2ms, 4ms, 8ms, electroplating time are 60min.
Silver-colored homogeneity on the present embodiment galvanic deposit through hole and compactness are well, good with copper substrate caking power.Along with the increase of reverse impulse time, the thru-hole uniformity in all apertures presents the situation first increasing and reduce afterwards, obtains extreme value when the reverse impulse time is 4ms.
embodiment four:
By the copper coin of negative electrode 320 orders, 600 order sand paperings, use alkaline degreaser oil removing.By the zone of oxidation on the hydrochloric acid soln removing steel part surface of about 15%.Then at room temperature soak in the hydrochloric acid soln of 10% and activated to 1 minute for 30 seconds.
Electroplate temperature 50 ~ 60 DEG C, adopt Reverse pulse plating, pulse parameter: forward current is 5A, 10A, 15A, reversible circulation are 15A, the direct impulse time is 18ms, the reverse impulse time is 2ms, electroplating time is 60min.
Silver-colored homogeneity on the present embodiment galvanic deposit through hole and compactness are well, good with copper substrate caking power.Along with the increase of forward current density, the thru-hole uniformity in aperture all increases.
Visible, adopt the inventive method can thickness of coating in the plate face of printed board and hole consistent, average current density can double, the increase of current density, decrease electroplating time, improve working efficiency, on plate face, thickness of coating homogeneity is greatly improved; Through-hole plating thickness one timing, due on the lid of coating uniformity, so thickness of coating can reduce on plate face, and lateral erosion when decreasing etching.
Above-mentioned example to invention has been detailed description, but and does not mean that the present invention is only confined to this four kinds of examples.When not departing from the technology of the present invention principle, making improvements and being out of shape within the claims in the present invention and technology, also should belong to protection scope of the present invention.
Claims (3)
1. with pulsed current in the silver-plated method of printed circuit board surface electrical, it is characterized in that, the method comprises the following steps:
(1) preparation is containing silver salt electroplate liquid: with silver cyanide, sodium cyanide and sodium hydroxide for main salt, dimethylin borine, and thiocarbamide, as supporting electrolyte, prepares inorganic fused salt bath system;
(2) silver plating process: circuit board surface polishing-electrochemical deoiling-water flushing-scratch brushing-etch activation-pulse silver-coating-washing-drying; Pulse silver-coating process is wherein: electroplate temperature 50 ~ 60 DEG C, adopt Reverse pulse plating, pulse parameter: forward current is 5 ~ 15A, reversible circulation is 15A, the direct impulse time is 18 ~ 108ms, and the reverse impulse time is 2ms, electroplating time is 60min.
2. a kind of pulsed current according to claim 1 is in the silver-plated method of printed circuit board surface electrical, it is characterized in that: by weight percentage, described electroplate liquid contains the silver cyanide of 60% ~ 85%, the nacn of 3% ~ 10% and the mixture of sodium hydroxide, the dimethylin borine of 12% ~ 30% and compound.
3. a kind of pulsed current according to claim 2 is in the silver-plated method of printed circuit board surface electrical, it is characterized in that: described electroplate liquid system argentiferous 0.5 ~ 0.6g/L, pH value is 6.5 ~ 7, and system temperature is between 43 ~ 53 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510436652.4A CN105063700A (en) | 2015-07-23 | 2015-07-23 | Method for electroplating silver on surface of printed circuit board through pulse current |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510436652.4A CN105063700A (en) | 2015-07-23 | 2015-07-23 | Method for electroplating silver on surface of printed circuit board through pulse current |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105063700A true CN105063700A (en) | 2015-11-18 |
Family
ID=54493196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510436652.4A Pending CN105063700A (en) | 2015-07-23 | 2015-07-23 | Method for electroplating silver on surface of printed circuit board through pulse current |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105063700A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110512243A (en) * | 2019-08-14 | 2019-11-29 | 广德三生科技有限公司 | A kind of reversed electroplating technology of HF link |
| CN112323106A (en) * | 2020-10-22 | 2021-02-05 | 深圳市海里表面技术处理有限公司 | Rapid silver plating process |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171561A (en) * | 1996-03-08 | 1998-01-28 | 索尼公司 | Optical unit and electrolytic solution |
| CN1386912A (en) * | 2002-03-28 | 2002-12-25 | 武汉大学 | Brightening agent for cyaniding plant of silver |
| JP2005146330A (en) * | 2003-11-13 | 2005-06-09 | Kurosaka Mekki Kogyosho:Kk | Surface treatment method for non-conductor material |
| CN102238805A (en) * | 2010-04-22 | 2011-11-09 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN103053227A (en) * | 2010-11-04 | 2013-04-17 | 三共化成株式会社 | Method of producing formed circuit component |
| CN103572269A (en) * | 2012-08-06 | 2014-02-12 | 三星电机株式会社 | Method for manufacturing printed circuit board |
| CN104404585A (en) * | 2014-11-18 | 2015-03-11 | 苏州铜盟电气有限公司 | High-performance multi-azimuth silver pulse rack plating production technology |
| CN104514019A (en) * | 2013-09-27 | 2015-04-15 | 无锡华冶钢铁有限公司 | Cyanide-free silvering electroplating solution and electroplating method |
-
2015
- 2015-07-23 CN CN201510436652.4A patent/CN105063700A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171561A (en) * | 1996-03-08 | 1998-01-28 | 索尼公司 | Optical unit and electrolytic solution |
| CN1386912A (en) * | 2002-03-28 | 2002-12-25 | 武汉大学 | Brightening agent for cyaniding plant of silver |
| JP2005146330A (en) * | 2003-11-13 | 2005-06-09 | Kurosaka Mekki Kogyosho:Kk | Surface treatment method for non-conductor material |
| CN102238805A (en) * | 2010-04-22 | 2011-11-09 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN103053227A (en) * | 2010-11-04 | 2013-04-17 | 三共化成株式会社 | Method of producing formed circuit component |
| CN103572269A (en) * | 2012-08-06 | 2014-02-12 | 三星电机株式会社 | Method for manufacturing printed circuit board |
| CN104514019A (en) * | 2013-09-27 | 2015-04-15 | 无锡华冶钢铁有限公司 | Cyanide-free silvering electroplating solution and electroplating method |
| CN104404585A (en) * | 2014-11-18 | 2015-03-11 | 苏州铜盟电气有限公司 | High-performance multi-azimuth silver pulse rack plating production technology |
Non-Patent Citations (2)
| Title |
|---|
| 杨哲龙 等: "脉冲参数对光亮银镀层性能的影响", 《材料保护》 * |
| 赵永刚 等: "耐磨性脉冲镀银工艺研究", 《涂料涂装与电镀》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110512243A (en) * | 2019-08-14 | 2019-11-29 | 广德三生科技有限公司 | A kind of reversed electroplating technology of HF link |
| CN112323106A (en) * | 2020-10-22 | 2021-02-05 | 深圳市海里表面技术处理有限公司 | Rapid silver plating process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101257059B (en) | Method for electrochemical depositing solar cell metallic electrode | |
| CN105283963B (en) | The formation of metal structure in solar cell | |
| CN103046091B (en) | A kind of electroplate liquid of non-cyanide silver electroplating and electro-plating method | |
| TWI445847B (en) | Plating of copper on semiconductors | |
| CN100454627C (en) | Production of aluminum/hydrogen peroxide fuel battery cathode | |
| CN114883560B (en) | Three-dimensional current collector/Zn/Zn-E composite negative electrode, preparation thereof and application thereof in water-based zinc ion battery | |
| CN105063685A (en) | Nickel plated copper product containing nickel-cobalt alloy clad layer, and preparation method and application thereof | |
| CN102817055B (en) | Ultrathin palladium plating and gold plating process for lead wire frame | |
| CN110592623B (en) | Formula and method of nickel electroplating solution for improving uniform distribution of neodymium iron boron magnet coating | |
| CN109898115A (en) | Electro-coppering pre-treating method on a kind of quick aluminum substrate | |
| CN105063700A (en) | Method for electroplating silver on surface of printed circuit board through pulse current | |
| JP2004534151A (en) | How to regenerate plating solution | |
| TWI510680B (en) | Copper plating solutions and method of making and using such solutions | |
| CN101724871B (en) | Double-pulse cyanide-free alkali silver electroplating method | |
| CN106591897A (en) | Cyanide-free ionic-liquid copper-plating solution and copper plating process | |
| CN102181892B (en) | Method for improving bonding force of non-cyanide silver plating layer on nickel layer | |
| CN103540978A (en) | Alkaline non-cyanide Ag-Ni alloy electroplating method | |
| CN101922001B (en) | Method for manufacturing printed circuit board by power triggering electroless plating addition process | |
| CN103806054A (en) | Pulse plating method of Ag-Ni alloy for electric contact material | |
| CN108389936A (en) | The surface treatment method of TCO conductive materials on a kind of solar cell | |
| CN205188464U (en) | Supersaturation brazing filler metal plating increases material device | |
| CN102268714A (en) | Electrochemical pretreatment method of cathode for electrolytic extraction of metal gallium | |
| CN101478038A (en) | Process for preparing lithium ionic cell tin negative pole material by electrodepositing-hydrothermal process | |
| CN106283132B (en) | A kind of soft dispersant of subacidity system electroplating bright copper | |
| CN105442004A (en) | Metal porous surface structure, preparation method thereof and inlay electroplating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151118 |