CN218710999U

CN218710999U - Electroplating bath body conductive device

Info

Publication number: CN218710999U
Application number: CN202222164956.8U
Authority: CN
Inventors: 张宇丞; 高长风
Original assignee: Jebsen Microsystems Huizhou Co ltd
Current assignee: Jebsen Microsystems Huizhou Co ltd
Priority date: 2022-08-17
Filing date: 2022-08-17
Publication date: 2023-03-24
Anticipated expiration: 2032-08-17

Abstract

The utility model provides a plating bath body electric installation, include: electroplating the cell body and installing at the annular clamping ring on electroplating cell body notch upper portion through adjusting bolt, still including the conductive component who is used for connecting DC power supply, conductive component includes anode electrode and cathode electrode, and anode electrode is the becket, and anode electrode installs on the upper portion of annular clamping ring, and cathode electrode is circular metal mesh, and cathode electrode installs the inside bottom at electroplating the cell body. The utility model provides an electroplating bath body electric installation, when using, fix the wafer level between annular clamping ring and electroplating bath body notch, positive pole electrode is used for putting through the direct current positive pole, and negative pole electrode is used for putting through the direct current negative pole, and the wafer forms an organic whole with positive pole electrode contact, and the plating solution is located the bottom of wafer, through the aforesaid setting for the upper portion and the plating solution contact of wafer can not arrive, so that the non-electroplating face also produces the plating layer and leads to extravagant and influence electroplating thickness.

Description

Electroplating bath body conductive device

Technical Field

The utility model relates to a wafer processing technology field specifically relates to a plating bath body electric installation.

Background

Electroplating is an electrochemical process and also an oxidation-reduction process, and the basic process of electroplating is to immerse a wafer in a solution of metal salt as a cathode, a metal plate as an anode and connect a direct current power supply to deposit a required coating on a part.

In a new generation of electroplating process (gold electroplating and copper electroplating), the required electroplating precision is higher and higher, a gold plating line required by an electroplating product is narrower and narrower, the process yield of a general electroplating mode is lower and lower, the conventional vertical immersion type is gradually changed into a single-piece horizontal type in the high-precision electroplating process, but the anode and the cathode of the current single-piece horizontal type electroplating tank body are unreasonable in design, so that the back surface of a wafer is dipped in electroplating solution, an electroplating layer is also generated on a non-electroplating surface, waste is caused, and the electroplating thickness is influenced.

Therefore, a plating bath body electric conduction device is provided.

SUMMERY OF THE UTILITY MODEL

The utility model provides a plating bath body electric conduction device aiming at solving the problems in the background technology.

The specific technical scheme is as follows:

a plating cell body electrical conductor comprising: electroplating the cell body and installing through adjusting bolt electroplate the annular clamping ring on cell body notch upper portion, still including the conductive component who is used for connecting DC power supply, conductive component includes anode electrode and cathode electrode, the anode electrode is the becket, just the anode electrode is installed the upper portion of annular clamping ring, the cathode electrode is circular metal mesh, just the cathode electrode is installed electroplate the inside bottom of cell body.

As a preferred scheme of the utility model, conductive component still includes a plurality of anode electrode switch-on points, and is a plurality of the equal fixed mounting in anode electrode switch-on point the upper portion of annular clamping ring, and a plurality of anode electrode switch-on point all with the anode electrode contact switches on, wherein:

the anode electrode is tightly pressed on the upper part of the annular pressing ring through a plurality of anode electrode conducting points.

As an optimized scheme of the utility model, the anode electrode switch-on point is provided with six, six the anode electrode switch-on point is angular distribution such as hoop and is in on the annular clamping ring.

As an optimized scheme of the utility model, conductive component still includes a plurality of cathode electrode switch-on points, every the equal fixed mounting in bottom of cathode electrode switch-on point has the conducting strip, the conducting strip is kept away from the one end embedding of cathode electrode switch-on point on the diapire of electroplating cell body, wherein:

the cathode electrode is connected with one end, far away from the cathode electrode conduction point, of the conducting strip through a fixing bolt, and the cathode electrode is conducted with the cathode electrode conduction point through the conducting strip.

As an optimized proposal of the utility model, the cathode electrode conducting point is provided with three and three, the cathode electrode conducting point is distributed in the circumferential direction at equal angles and is arranged at the periphery of the electroplating tank body.

As a preferred scheme of the utility model, the anode electrode is the metal titanium ring, and the cathode electrode is circular metal titanium net.

The utility model discloses following beneficial effect has:

the utility model provides an electroplating bath body electric installation mainly by electroplating the cell body, annular clamping ring, conducting component constitutes, wherein conducting component mainly comprises anode electrode and cathode electrode, when using, fix the wafer level between annular clamping ring and electroplating cell body notch, anode electrode is used for putting through the direct current anodal, cathode electrode is used for putting through the direct current negative pole, the wafer forms integratively with anode electrode contact and anode electrode, the plating solution is located the bottom of wafer, through the aforesaid setting, make the upper portion and the plating solution contact of wafer can not arrive, in order to avoid the non-electroplating face also to produce the plating layer and lead to extravagant and influence electroplating thickness.

Drawings

Fig. 1 is a schematic structural view of an electroplating bath body conductive device provided by an embodiment of the present invention;

fig. 2 is a schematic structural view of another view angle of the electroplating bath body conductive device provided in the embodiment of the present invention;

fig. 3 is a schematic cross-sectional structural view of an electroplating tank body electric conduction device provided by the embodiment of the present invention;

fig. 4 is a schematic view of a partial structure of an electroplating tank body electric conduction device provided by the embodiment of the present invention.

In the drawings:

1. electroplating a tank body; 2. an annular pressing ring; 3. adjusting the bolt; 4. an anode electrode; 5. an anode electrode conduction point; 6. a cathode electrode; 7. a cathode electrode conduction point; 8. a conductive sheet; 9. and (5) fixing the bolt.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are used only for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms will be understood by those skilled in the art according to the specific circumstances.

In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being either a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

The embodiment of the utility model provides an electroplating tank body electric installation, as shown in fig. 1-4, include: electroplating cell body 1 and installing at the annular clamping ring 2 of electroplating cell body 1 notch upper portion through adjusting bolt 3, still including the conductive component who is used for connecting DC power supply, conductive component includes anode electrode 4 and cathode electrode 6, and anode electrode 4 is the becket, and anode electrode 4 installs on the upper portion of annular clamping ring 2, and cathode electrode 6 is circular metal mesh, and cathode electrode 6 installs in the inside bottom of electroplating cell body 1.

Adopt above-mentioned technical scheme's plating bath body electric installation mainly by electroplating bath body 1, annular clamping ring 2, conductive component constitutes, wherein conductive component mainly comprises anode electrode 4 and cathode electrode 6, when using, fix the wafer level between annular clamping ring 2 and electroplating bath body 1 notch, anode electrode 4 is used for putting through the direct current anodal, cathode electrode 6 is used for putting through the direct current negative pole, the wafer forms an organic whole with anode electrode 4 contact, the plating solution is located the bottom of wafer, through the aforesaid setting, make the upper portion and the plating solution contact of wafer not arrive, in order to avoid the non-electroplating face also to produce the plating layer and lead to extravagant and influence electroplating thickness.

Specifically, in order to avoid the plated film thickness of the plated surface being able to be leveled uniformly, in the present embodiment: conductive component still includes a plurality of anode electrode conduction points 5, and a plurality of anode electrode conduction points 5 equal fixed mounting on the upper portion of annular clamping ring 2, and a plurality of anode electrode conduction points 5 all switch on with the contact of anode electrode 4, wherein: anode electrode 4 compresses tightly on annular clamping ring 2's upper portion through a plurality of anode electrode conduction points 5, and anode electrode conduction points 5 are provided with six, and six anode electrode conduction points 5 are angular distribution such as hoop on annular clamping ring 2, and conductive component still includes a plurality of cathode electrode conduction points 7, and the equal fixed mounting in bottom that every cathode electrode conducted points 7 has conducting strip 8, and conducting strip 8 keeps away from on the diapire that the one end embedding electroplating cell body 1 of cathode electrode conduction points 7, wherein: cathode electrode 6 is kept away from the one end of cathode electrode conducting point 7 through fixing bolt 9 and conducting strip 8 and is connected, and cathode electrode 6 switches on through conducting strip 8 and cathode electrode conducting point 7, and cathode electrode conducting point 7 is provided with threely, and three cathode electrode conducting point 7 is the periphery of annular equiangular distribution at electroplating cell body 1, through setting up a plurality of cathode electrode conducting points 7 and anode electrode conducting point 5, can make the bottom of wafer can form even plating layer.

Specifically, in order to ensure the service life of the anode electrode 4 and the cathode electrode 6, in the present embodiment: the anode electrode 4 is a metal titanium ring, and the cathode electrode 6 is a circular metal titanium mesh.

In addition, the plating tank body conductive device provided in this embodiment is used for a single wafer flatwise plating tank.

In summary, the plating tank conductive device provided in this embodiment has the following advantages:

this plating bath body conductive device mainly by electroplating cell body 1, annular clamping ring 2, conductive component constitutes, wherein conductive component mainly comprises anode electrode 4 and cathode electrode 6, when using, fix the wafer level between annular clamping ring 2 and electroplating cell body 1 notch, anode electrode 4 is used for putting through the direct current anodal, cathode electrode 6 is used for putting through the direct current negative pole, the wafer forms an organic whole with anode electrode 4 contact and anode electrode 4, the plating solution is located the bottom of wafer, through the aforesaid setting, make the upper portion and the plating solution contact of wafer not arrive, in order to avoid the non-electroplating face also to produce the plating layer and lead to extravagant and influence electroplating thickness.

When the electroplating device is used, the annular pressing ring 2 is detached through the adjusting bolt 3, then a wafer is placed on the upper portion of a notch of the electroplating tank body 1, the annular pressing ring 2 is installed on the upper portion of the notch of the electroplating tank body 1 through the adjusting bolt 3, at the moment, the wafer is in contact with the anode electrodes 4 through the anode electrode conducting points 5 to form a whole, the anode electrodes 4 are connected with the direct current positive electrode, the cathode electrodes 6 are connected with the direct current negative electrode, and metal in the electroplating solution after being electrified is electroplated to the bottom of the wafer to form an even electroplated layer.

The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the invention, and it should be appreciated by those skilled in the art that equivalent substitutions and obvious changes made from the description and drawings should be included within the scope of the present invention.

Claims

1. An electroplating bath body conductive device comprises an electroplating bath body (1) and an annular pressing ring (2) which is arranged on the upper part of a notch of the electroplating bath body (1) through an adjusting bolt (3): the electroplating tank is characterized by further comprising a conductive assembly used for being connected with a direct-current power supply, the conductive assembly comprises an anode electrode (4) and a cathode electrode (6), the anode electrode (4) is a metal ring, the anode electrode (4) is installed on the upper portion of the annular pressing ring (2), the cathode electrode (6) is a circular metal net, and the cathode electrode (6) is installed at the bottom of the electroplating tank body (1).

2. The plating bath body electric conduction device according to claim 1, wherein the electric conduction assembly further comprises a plurality of anode electrode conduction points (5), the plurality of anode electrode conduction points (5) are all fixedly installed on the upper portion of the annular pressing ring (2), and the plurality of anode electrode conduction points (5) are all in contact conduction with the anode electrode (4), wherein:

the anode electrode (4) is tightly pressed on the upper part of the annular pressing ring (2) through a plurality of anode electrode conducting points (5).

3. The plating tank body electric conduction device according to claim 2, wherein the anode electrode conduction points (5) are provided with six, and the six anode electrode conduction points (5) are annularly and equiangularly distributed on the annular pressing ring (2).

4. The plating bath body conducting device according to claim 1, wherein the conducting assembly further comprises a plurality of cathode electrode conducting points (7), a conducting strip (8) is fixedly mounted at the bottom of each cathode electrode conducting point (7), one end of the conducting strip (8) far away from the cathode electrode conducting points (7) is embedded into the bottom wall of the plating bath body (1), and wherein:

the cathode electrode (6) is connected with one end, away from the cathode electrode conducting point (7), of the conducting strip (8) through a fixing bolt (9), and the cathode electrode (6) is conducted with the cathode electrode conducting point (7) through the conducting strip (8).

5. The electroplating bath body electric conduction device according to claim 4, wherein the number of the cathode electrode conduction points (7) is three, and the three cathode electrode conduction points (7) are annularly and equiangularly distributed on the periphery of the electroplating bath body (1).

6. The electrical conduction device of the plating bath according to claim 1, wherein the anode electrode (4) is a metallic titanium ring and the cathode electrode (6) is a circular metallic titanium mesh.