KR102548837B1 - An insoluble anode assembly for manufacturing an electrolytic metal foil - Google Patents

Abstract

The present invention proposes an insoluble anode assembly for producing an electrolytic copper foil having an efficient and uniform thickness. The insoluble anode assembly for manufacturing an electrodeposited copper foil of the present invention includes a base 30 having a shape corresponding to a rotating drum type cathode, a plurality of electrodes 20 installed on the base, and the plurality of electrodes on the base, respectively. It includes a plurality of bolts 10 for fixing. A platinum group metal layer is formed on the upper surface 12a of the head 12 of the bolt 10 to generate an electrolytic reaction like an electrode, and the bolt 10 in contact with the electrode 20 at the concave portion 34 of the base 30 ) A platinum group metal layer to increase electrical conductivity is formed on the side surface of the head 12.

Description

An insoluble anode assembly for manufacturing an electrolytic metal foil}

The present invention relates to an insoluble anode assembly used in the manufacture of a metal foil such as an electrolytic copper foil, and more particularly, an insoluble anode assembly capable of increasing a conduction rate by minimizing contact resistance with a plating electrode and thereby producing an efficient copper foil. It is about.

In general, the production of electrolytic copper foil is carried out in the form of electroplating in a large cylindrical manufacturing machine, and high-speed plating is performed by applying a high current density to a high-speed fluid flow for productivity. And the copper foil plated in this way is separated from the drum-shaped negative electrode and rolled into a coil form to be commercialized. Since the length of such an electrodeposited copper foil is quite long, if the thickness of the copper foil is non-uniform, problems not only occur in such a coil shape, but also significantly affect the reliability of products using the same.

As a prior patent for manufacturing such an electrolytic copper foil (metal foil), Korean Patent Publication No. 10-2019-0038325 may be cited, and these prior patent documents are described as follows. In the production of electrolytic metal foil, the principle of electroplating is used, and an electrode for plating is used. And, as shown in FIG. 1, an electroplating apparatus composed of an insoluble anode 520 immersed in an electrolyte solution 510 of an electrolytic cell 500 and a drum-shaped rotating drum cathode 530 is used. The insoluble anode 520 is installed to face the drum-type cathode 530 and has a shape curved to follow the “circular contour” of the drum-type cathode 530 .

When electricity is applied between the insoluble anode 520 and the drum-type cathode 530, metal components can be electrolytically deposited on the surface of the drum-type cathode 530. Therefore, the metal foil 550 is continuously obtained by rotating the drum-shaped cathode 530 relative to the electrode 520 for plating while conducting electricity, and sequentially peeling the metal layer formed due to the electrolytic deposition from the drum-shaped cathode 530. can An apparatus and method for manufacturing such an electrolytic metal film (copper film) are substantially widely known, and will be briefly described as above.

Here, the insoluble anode 520 includes a plating electrode and a base, and the plating electrode and base are coupled by a plurality of screws (bolts). In general, the electrolyte solution contains a lead component, and lead oxide is deposited as a scale on the plating electrode by the electrolytic reaction. In addition, the lead oxide adhesion amount generated by non-uniformity of current distribution according to contact resistance varies on the screw portion of the electrolytic electrode, which is the main cause of irregularities in copper foil products.

In addition, the lead oxide attached to the plating electrode is converted into lead acid, which is a non-direction conductor, when the electrolysis is stopped, resulting in shortening the life of the plating electrode (insoluble electrode) due to non-uniform current distribution. In addition, gelatin, etc., used as an additive in the manufacturing process for electrolytic operation, accelerates the catalyst consumption of the insoluble electrode depending on the adhesion form of lead oxide, thereby acting as a cause of reducing the life of the electrode. The plating electrode of the insoluble anode is separated, the attached lead oxide is removed, and reused a certain number of times. Due to the potential drop caused by the contact of the screw, etc., the thickness deviation of the copper foil product occurs and the replacement cycle of the plating electrode is shortened. do.

An object of the present invention can be said to be to provide an insoluble anode assembly for manufacturing an electrodeposited copper foil capable of obtaining an electrodeposite copper foil having a uniform thickness.

In order to achieve the above object, an insoluble anode assembly for manufacturing an electrodeposited copper foil according to the present invention includes a base having a shape corresponding to a rotating drum type cathode, a plurality of electrodes installed on the base, and the plurality of electrodes on the base. It consists of a number of bolts for fixing each on top. Here, a platinum group metal layer is formed on the upper surface of the bolt head to generate an electrolytic reaction like an electrode, and a platinum group metal layer to increase electrical conductivity is formed on the side surface of the bolt head that contacts the electrode in the concave portion of the base.

According to the above basic configuration, a platinum group metal layer to improve electrical conductivity is formed on the side of the bolt to solve the contact resistance, such as forming a catalyst layer using a platinum group metal, which is a conductive electrode material, on the upper surface of the bolt constituting the insoluble anode. it can be seen that Therefore, the platinum group metal layer formed on the upper surface of the bolt can maximize the uniformity of the thickness of the copper foil made through a uniform electrolytic reaction as a whole, based on the platinum group metal layer formed on the side of the bolt It is expected that a good copper foil thickness can be achieved by solving the problem.

1 is an exemplary diagram of an electrolytic copper foil manufacturing apparatus according to prior patent literature.
Figure 2 is an illustration of both sides of the insoluble in the present invention electrodeposited copper foil manufacturing apparatus.

Next, the present invention will be described in more detail based on the embodiments shown in the drawings.

2 illustratively shows a partial cross-section of the insoluble positive electrode assembly. As can be seen by reference to this, the insoluble anode assembly for forming the electrodeposited copper foil is molded to have a shape corresponding to the rotating drum-type cathode, and the electrode 20 and the base for supporting the electrode 20 (30). And, the electrode 20 is composed of a plurality of pieces having predetermined dimensions, and each of them is supported on the base 10 by a plurality of bolts 10.

Here, the bolt 10 for fixing includes a head 12 and a threaded portion 14 extending downward from the bottom surface of the head 12 . The head 12 has a partially inverted cone shape and has a generally planar upper surface 12a and an inclined side surface 12b extending downward from the upper surface and forming an outer surface of the inverted cone shape. are doing

In addition, in the electrode 20 and the base 30 where the bolt 10 is fixed, a concave portion 34 having an inverted cone shape is formed downward in the concave portion 34, and female threads are formed inside. A screw groove 32 provided in is formed. Here, the electrode 20 covers the base 30 up to the concave portion 34, and the threaded portion 14 of the bolt 10 is screwed into the threaded groove 32 formed in the base 30. When the bolt 10 is coupled to the electrode 20 and the base 30, the upper surface 12a of the head of the bolt 10 is designed not to be higher than the upper surface of the electrode 20.

When the bolt 10 is coupled in this way, the upper surface 12a of the bolt 10 forms a part for generating an electrolytic reaction between the rotating drum-shaped cathode and the upper surface 12a of the electrode 20 . Further, as the threaded portion 14 of the bolt 10 is fastened to the threaded groove 32, the inclined side surface 12b of the bolt 10 maintains close contact with the electrode 20. In this way, in a state where the bolt 10 is in close contact with the electrode 20, a voltage drop occurs due to contact resistance. It is natural that the voltage drop generated in this way adversely affects the electrolysis process, such as adversely affecting the uniform thickness of the copper foil.

Here, in the insoluble anode assembly, the above-described electrode 20 is composed of a plurality of pieces and must be fixed to a base 30 made of titanium at a predetermined position. Since a large number of bolts 10 used for fixing the electrode 20 are used, it is preferable that the upper surface 12a of the bolt 10 is also processed to contribute to the formation of the electrode 20 like the electrode 20.

Therefore, in the present invention, a platinum group coating layer is formed on the upper surface 12a of the bolt 10, which contributes to the electrolysis reaction to form the electrodeposited copper foil, by first forming a part of the electrode 20. In this way, by forming the platinum group coating layer on the upper surface 12a of the bolt 10, it can have the same function as the electrode 20, and an electrodeposited copper foil can be created between the corresponding rotating drum-shaped cathode. The platinum group coating layer formed on the upper surface 12a of the bolt 10 may be formed by any process including a known method.

For example, an electrode material solution containing a platinum group metal (Pt, Ir, Ru, Rh, Pd, Os) is coated on the base metal surface of a titanium material and thermally decomposed in a high temperature (eg 400 to 600 ° C) oxidation-reduction atmosphere. Like the process to form a platinum group coating layer on the electrode 20, a bolt having a platinum group metal layer formed thereon can be manufactured through the above process separately on the upper surface of the bolt 10.

In addition, in order to solve the voltage drop due to the contact resistance caused by the inclined side surface 12b of the bolt 10 in close contact with the electrode 20, the platinum group is attached to the side surface 12b of the bolt 10. form a coating layer. That is, by forming a platinum group metal layer on the side surface 12b of the bolt 10, the electrical conductivity can be increased as much as possible, and the corrosion resistance to the acidic copper sulfate solution, which is the solution condition of the electrodeposited copper foil, can be sufficiently improved. In this way, it is preferable to form a sufficient ground plane by making the roughness of the platinum group metal layer formed on the side surface 12b, which can also be referred to as a ground plane for electrical connection, be as low as possible.

As described above, as a catalyst layer using a platinum group metal, which is a conductive electrode material, is formed on the upper surface of the bolt constituting the insoluble anode, a platinum group metal layer to improve electrical conductivity is formed on the side of the bolt to solve the contact resistance. can know Therefore, as the thickness of the copper foil formed as a whole can be made as uniform as possible by the platinum group metal layer formed on the upper surface 12a, the problem caused by the abnormal current during the electrolytic reaction based on the platinum group metal layer formed on the side surface 12b is solved. A good film thickness can be achieved. In the present invention, the platinum group metal layer can be defined as a concept including a metal or metal alloy containing a platinum group metal as a main component.

As described above, the main technical idea of the present invention is to form a metal coating layer for the purpose of uniform electrolytic reaction on the upper surface of the bolt, and to improve electrical conductivity by minimizing contact resistance on the side surface of the bolt. It can be seen that the It is considered natural that various modifications are possible within the scope of the basic technical idea of the present invention.

10 ..... bolts
12 ..... head
12a ..... top surface
12b ..... side
14 ..... screw part
20 ..... electrode
30 ..... bass
32 ..... screw groove
34 ..... Recess

Claims (1)

It consists of a base 30 having a shape corresponding to a rotating drum-type cathode, a plurality of electrodes 20 installed on the base, and a plurality of bolts 10 for fixing the plurality of electrodes on the base, respectively. ;
The upper surface 12a of the head 12 of the bolt 10 is installed not higher than the upper surface of the electrode 20;
On the upper surface 12a of the head 12 of the bolt 10, a platinum group metal layer for generating an electrolytic reaction is formed like the electrode 20;
On the side of the head 12 of the bolt 10 in contact with the electrode 20 in the concave portion 34 of the base 30, it is possible to prevent a voltage drop due to contact resistance and increase electrical conductivity, and to An insoluble anode assembly for manufacturing an electrodeposited copper foil, characterized in that it forms a platinum group metal layer capable of increasing corrosion resistance.

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