CN219260245U

CN219260245U - Electroplating jig for local plane of semiconductor electronic element

Info

Publication number: CN219260245U
Application number: CN202320213072.9U
Authority: CN
Inventors: 余剑; 周海虎
Original assignee: Shenzhen Jinpin Surface Treatment Technology Co ltd
Current assignee: Shenzhen Jinpin Surface Treatment Technology Co ltd
Priority date: 2023-02-15
Filing date: 2023-02-15
Publication date: 2023-06-27
Anticipated expiration: 2033-02-15

Abstract

The utility model belongs to the technical field of electroplating, in particular to a local plane electroplating jig for a semiconductor electronic element, which comprises a jig base, wherein a rubber groove is formed in one side of the jig base, copper column grooves formed in the jig base are formed in four corners of the rubber groove, the rubber groove is communicated with the copper column grooves, conductive rubber is arranged in the rubber groove, conductive copper columns are arranged in the copper column grooves, a pressing plate is arranged on one side of the jig base, and a shielding plate is arranged on one side of the pressing plate away from the jig base. The semiconductor electronic element has high conductive performance in local area, and then performs electroplating gold/silver process with local contact area, and the other non-electroplating area is covered and shielded by the fixture to achieve the non-electroplating effect, so as to facilitate the subsequent process.

Description

Electroplating jig for local plane of semiconductor electronic element

Technical Field

The utility model relates to the technical field of electroplating, in particular to a local plane electroplating jig for a semiconductor electronic element.

Background

Electroplating is a widely used mature technological means; the most common electroplating method is an immersion plating method, in which a workpiece to be plated is immersed in a plating tank filled with a plating solution, and a plating metal material is simultaneously placed in the plating tank, and the plating metal material and the workpiece to be plated are electrically connected to the positive electrode and the negative electrode respectively, so that electroplating can be performed.

However, since the workpiece to be plated in the dip plating method is necessarily immersed in the plating tank, the surface of the workpiece to be plated, which is in contact with the plating solution, is plated, and thus the plating of local parts cannot be performed; if the plating is to be performed on the local part, the workpiece to be plated must be coated with a coating or an insulating layer, so that the part not to be plated can be coated with the insulating layer, thereby the local part of the workpiece to be plated is plated, and after the local plating, the coating or the insulating layer is stripped by a stripping process, so that the local plating can be completed completely.

At present, when the gold/silver is locally plated on the semiconductor electronic element product, the rest of the non-plating area is inconvenient to cover and shield, which is not beneficial to the subsequent manufacturing process.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides a semiconductor electronic element local plane electroplating jig.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a semiconductor electronic component local plane electroplating jig, includes the tool base, the rubber groove has been seted up to one side of tool base, and the four corners position in rubber groove all is equipped with the copper post groove of seting up on the tool base, and the rubber groove is linked together with the copper post groove, is provided with conductive rubber in the rubber groove, is provided with conductive copper post in the copper post groove, one side of tool base is provided with the clamp plate, and one side that the clamp plate kept away from the tool base is provided with the shielding plate.

Preferably, the conductive rubber is provided with a square groove, and a product is arranged in the square groove.

Preferably, the conductive rubber is in close contact with the conductive copper pillar.

Preferably, the four corners position of the shielding plate is provided with threaded holes, the four corners position of the pressing plate is provided with through holes, the conductive copper column is provided with a threaded groove, and the threaded holes and the corresponding through holes and the threaded grooves are internally threaded with the same screw.

Preferably, a square hole is formed in the center of the shielding plate.

In the utility model, the jig base, the conductive rubber and the conductive copper column are assembled and then fixed by the pressing plate before production, the product is put into the proper position of the conductive rubber, the shielding plate is fixed on the jig, the fixed screw provides the conduction of the cathode power supply, and then the shielding plate is put into the electroplating bath for electroplating.

The semiconductor electronic element has high conductive performance in local area, and then performs electroplating gold/silver process with local contact area, and the other non-electroplating area is covered and shielded by the fixture to achieve the non-electroplating effect, so as to facilitate the subsequent process.

Drawings

FIG. 1 is a schematic diagram of an explosion structure of a semiconductor electronic device local plane electroplating jig according to the present utility model;

FIG. 2 is a schematic diagram of a partial planar electroplating jig for semiconductor electronic devices according to the present utility model;

fig. 3 is a schematic side view of a partial planar electroplating jig for semiconductor electronic components according to the present utility model.

In the figure: 1 a jig base, 2 a rubber groove, 3 a copper column groove, 4 conductive rubber, 5 conductive copper columns, 6 products, 7 pressing plates and 8 shielding plates.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-3, a semiconductor electronic component local plane electroplating jig comprises a jig base 1, wherein a rubber groove 2 is formed in one side of the jig base 1, copper column grooves 3 formed in the jig base 1 are formed in four corners of the rubber groove 2, the rubber groove 2 is communicated with the copper column grooves 3, conductive rubber 4 is arranged in the rubber groove 2, conductive copper columns 5 are arranged in the copper column grooves 3, a pressing plate 7 is arranged on one side of the jig base 1, and a shielding plate 8 is arranged on one side, away from the jig base 1, of the pressing plate 7.

In the utility model, the conductive rubber 4 is provided with a square groove, a product 6 is arranged in the square groove, the shape of the conductive rubber 4 can be processed according to the shape of the product, and the conductive property of the conductive rubber is utilized to fix the product and provide a cathode power supply required by the electroplating process so as to shield an electroplating-free area.

In the present utility model, the conductive rubber 4 is closely contacted with the conductive copper pillar 5 to provide the cathode power connection required in the electroplating process.

In the utility model, screw holes are arranged at four corners of the shielding plate 8, through holes are arranged at four corners of the pressing plate 7, screw grooves are arranged on the conductive copper columns 5, the screw holes and the corresponding through holes and screw grooves are internally provided with the same screw, and the pressing plate 7 is used for fixing conductive rubber and shielding the conductive copper columns from being electroplated.

In the utility model, a square hole is formed in the center of the shielding plate 8, and the shielding plate provides anode shielding in a high current area in the electroplating process so as to achieve uniformity after plating in a pre-full area store of the electroplating area.

In the utility model, the jig base 1, the conductive rubber 4 and the conductive copper column 5 are assembled before production and then fixed by the pressing plate 7, the product 6 is put into the proper position of the conductive rubber 4, the shielding plate 8 is fixed on the jig, the fixed screw provides the conduction of the cathode power supply, and then the cathode power supply is put into the electroplating bath for electroplating.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a semiconductor electronic component local plane electroplating jig, includes tool base (1), its characterized in that, rubber groove (2) have been seted up to one side of tool base (1), and the four corners position of rubber groove (2) all is equipped with copper post groove (3) of seting up on tool base (1), and rubber groove (2) are linked together with copper post groove (3), are provided with conducting rubber (4) in rubber groove (2), are provided with conducting copper post (5) in copper post groove (3), one side of tool base (1) is provided with clamp plate (7), and one side that clamp plate (7) were kept away from tool base (1) is provided with shielding plate (8).

2. The jig for local planar electroplating of a semiconductor electronic component according to claim 1, wherein the conductive rubber (4) is provided with a square groove, and a product (6) is arranged in the square groove.

3. The semiconductor electronic component partial plane plating jig according to claim 1, wherein the conductive rubber (4) is in close contact with the conductive copper pillar (5).

4. The local plane electroplating jig for the semiconductor electronic component according to claim 1, wherein threaded holes are formed in four corners of the shielding plate (8), through holes are formed in four corners of the pressing plate (7), a threaded groove is formed in the conductive copper column (5), and the same screw is installed in the threaded holes and the corresponding through holes and the threads in the threaded groove.

5. The jig for partial planar plating of semiconductor electronic component according to claim 1, wherein a square hole is provided in the center position of the shielding plate (8).