CN114717620A - Silver plating device for manufacturing semiconductor lead frame etching product - Google Patents
Silver plating device for manufacturing semiconductor lead frame etching product Download PDFInfo
- Publication number
- CN114717620A CN114717620A CN202210324353.1A CN202210324353A CN114717620A CN 114717620 A CN114717620 A CN 114717620A CN 202210324353 A CN202210324353 A CN 202210324353A CN 114717620 A CN114717620 A CN 114717620A
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- Prior art keywords
- base
- lead frame
- shielding jig
- silver plating
- track
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000005530 etching Methods 0.000 title claims abstract description 21
- 238000007747 plating Methods 0.000 title claims abstract description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 15
- 239000004332 silver Substances 0.000 title claims abstract description 15
- 230000002457 bidirectional effect Effects 0.000 claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000003723 Smelting Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 17
- 238000005516 engineering process Methods 0.000 description 5
- 239000000306 component Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011265 semifinished product Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention belongs to the technical field of etching and manufacturing of semiconductor integrated circuit lead frames, and particularly relates to a silver plating device for manufacturing semiconductor lead frame etching products, which comprises the following components: the bidirectional track, the shielding jig arranged on the track and the pushing mechanism arranged on the shielding jig, wherein the pushing mechanism pushes the shielding jig to slide on the bidirectional track; the shielding jig is movably connected with an anode plate, and the anode plate is fixed through a fixing component; the pushing mechanism comprises a driving device and a crankshaft arranged on a driving shaft of the driving device, and the crankshaft is rotatably connected to the shielding jig through a connecting assembly; the shielding jig comprises a base and a plurality of nozzles arranged on the base, and rollers placed on the bidirectional rails extend from two sides of the base. The silver plating device for manufacturing the semiconductor lead frame etching product has the effects of uniformly distributing the thickness of the electrolytic metal film and improving the quality of the product.
Description
Technical Field
The invention belongs to the technical field of etching and manufacturing of semiconductor integrated circuit lead frames, and particularly relates to a silver plating device for manufacturing semiconductor lead frame etching products.
Background
In the field of semiconductor lead frame manufacturing technology, it is an important issue to manufacture and process metal materials into precision semiconductor electronic products required in various high-tech fields by etching. For example, the core of semiconductor integrated circuit technology, chip fabrication technology, is an important foundation and core component for advanced scientific and technological development; the semiconductor lead frame is used as a chip carrier of an integrated circuit and is an important basic raw material in the electronic information industry; semiconductor lead frame fabrication techniques are thus an important base material for the fabrication of high precision semiconductor integrated circuits.
Semiconductor lead frame etching equipment is a very important basic manufacturing core technology in the modern electronic information industry field. Semiconductor leadframe etch manufacturing equipment is currently a vital core foundation affecting the level of fabrication of modern integrated circuit semiconductor leadframes. The continuous development of the manufacturing technology of the lead frame of the semiconductor integrated circuit in the modern electronic information industry can be continuously improved only by continuously improving the process level and the manufacturing and processing precision of etching manufacturing equipment.
The semi-finished product after etching is processed by the semiconductor lead frame electrolytic surface processing device, and the phenomenon of uneven electrolytic metal film thickness distribution exists.
Disclosure of Invention
The invention aims to provide a silver plating device for manufacturing an etched product of a semiconductor lead frame, which aims to solve the technical problem that the thickness of an electrolytic metal film is not uniformly distributed when the semi-finished product is processed by an electrolytic surface processing device of the semiconductor lead frame after etching, so that the etched semi-finished product is processed by the electrolytic surface processing device of the semiconductor lead frame, the thickness of the electrolytic metal film is uniformly distributed, and the quality of the product is improved.
In order to solve the above technical problems, the present invention provides a silver plating apparatus for manufacturing an etched product of a semiconductor lead frame, comprising:
the shielding jig comprises a bidirectional track, a shielding jig arranged on the track and a pushing mechanism arranged on the shielding jig, wherein the pushing mechanism pushes the shielding jig to slide on the bidirectional track;
the shielding jig is movably connected with an anode plate, and the anode plate is fixed through a fixing component;
the pushing mechanism comprises a driving device and a crankshaft arranged on a driving shaft of the driving device, and the crankshaft is rotatably connected to the shielding jig through a connecting assembly;
the shielding jig comprises a base and a plurality of nozzles arranged on the base, and rollers arranged on the bidirectional rails extend from two sides of the base.
Furthermore, the connecting assembly comprises a vertical connecting sheet arranged on the base and a hinged fixing seat arranged at the upper end of the vertical connecting sheet, a vertical rotating shaft is vertically rotatably connected to the hinged fixing seat, a rocker is rotatably connected to the vertical rotating shaft, and the rocker is connected with a crankshaft on a driving shaft of the driving device.
Furthermore, the fixing assembly comprises two vertical supporting rods arranged on the anode plate and a transverse connecting rod connected with the two vertical supporting rods, and the transverse connecting rod is provided with an external fixing rod fixed outside through a bolt.
Furthermore, the two sides of the base extend to form upper bearing pieces which are arranged on the two-way track, a plurality of limiting waist-shaped holes are formed in the upper bearing pieces along the direction of the two-way track, and fixing bolts which are in threaded connection with the two-way track are arranged in the limiting waist-shaped holes.
Furthermore, a plurality of electroplating baths are arranged on the anode plate.
The invention has the beneficial effects that:
1. the shielding jig is pushed to move back and forth on the bidirectional rail through the crankshaft by the pushing mechanism, so that the electrolytic metal film on the etching product is uniformly distributed, and the product quality is improved.
2. Through shielding the smelting tool, can change and shield the distribution that the baffle improved the electric current when electroplating, reach the thick even of electroplating product membrane.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a silver plating apparatus for manufacturing a semiconductor lead frame etching product according to the present invention;
fig. 2 is a schematic structural diagram of a fixing assembly of a silver plating device for manufacturing a semiconductor lead frame etching product of the invention.
In the figure:
1. a bidirectional track;
2. shielding the jig; 21. an anode plate; 211. an electroplating bath; 22. a base; 221. a bearing sheet is arranged; 222. a limiting waist-shaped hole; 223. fixing the bolt; 23. a nozzle; 24. a roller;
3. a pushing mechanism; 31. a drive device; 32. a crankshaft;
4. a fixing assembly; 41. a vertical support bar; 42. a transverse connecting rod; 43. an external fixation rod;
5. a connection assembly; 51. a vertical connecting sheet; 52. a hinged fixed seat; 53. a vertical rotating shaft; 54. a rocker.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b):
as shown in fig. 1, a silver plating apparatus for manufacturing an etched product of a semiconductor lead frame includes: the bidirectional rail 1, locate shielding smelting tool 2 on the track, locate the pushing mechanism 3 who shields smelting tool 2, pushing mechanism 3 promotes to shield smelting tool 2 and slides on bidirectional rail 1, shields the swing joint and has anode plate 21 on smelting tool 2, and anode plate 21 is fixed through fixed subassembly 4. Thereby the distribution of electric current can evenly distributed on anode plate 21 when making electroplating to promote the thick degree of consistency of electroplating product membrane, promote product quality. Wherein, a plurality of plating tanks 211 are arranged on the anode plate 21.
As shown in fig. 2, in the present embodiment, the fixing assembly 4 includes two vertical support rods 41 provided on the anode plate 21 and a transverse connecting rod 42 connecting the two vertical support rods 41, and the transverse connecting rod 42 is provided with an external fixing rod 43, and the external fixing rod 43 is fixed to the outside by a bolt.
As shown in fig. 1, the pushing mechanism 3 includes a driving device 31 and a crankshaft 32 disposed on a driving shaft of the driving device 31, the crankshaft 32 is rotatably connected to the shielding jig 2 through a connecting assembly 5; the shielding jig 2 comprises a base 22 and a plurality of nozzles 23 arranged on the base 22, wherein rollers 24 placed on the bidirectional rail 1 extend from two sides of the base 22, and the rollers 24 slide on the bidirectional rail 1, so that the base 22 is driven to slide on the bidirectional rail 1. In the present embodiment, the driving device 31 may be, but is not limited to, a reduction motor.
As shown in fig. 1, wherein, the connecting assembly 5 includes a vertical connecting plate 51 disposed on the base 22 and a hinged fixing seat 52 disposed at an upper end of the vertical connecting plate 51, the hinged fixing seat 52 is vertically and rotatably connected with a vertical rotating shaft 53, the vertical rotating shaft 53 is rotatably connected with a rocker 54, the rocker 54 is connected with the crankshaft 32 on the driving shaft of the driving device 31, the crankshaft 32 is driven by the driving motor to rotate, the crankshaft 32 drives the rocker 54 to reciprocate because of the self-bending, and the rocker 54 drives the hinged fixing seat 52 to reciprocate, thereby driving the base 22 to reciprocate.
As shown in fig. 1, upper bearing pieces 221 placed on the bidirectional track 1 extend from two sides of the base 22, the upper bearing pieces 221 are provided with a plurality of limiting slotted holes 222 along the direction of the bidirectional track 1, fixing bolts 223 screwed with the bidirectional track 1 are arranged in the limiting slotted holes 222, when the base 22 moves back and forth, the limiting slotted holes 222 of the upper bearing pieces 221 on the base 22 move along with the base 22, and the fixing bolts 223 abut against two ends of the limiting slotted holes 222, so as to limit the moving distance of the base 22.
In summary, the following steps: the shielding jig 2 is pushed by the pushing mechanism 3 through the crankshaft 32 to move back and forth on the bidirectional track 1, so that the electrolytic metal film on an etching product is uniformly distributed, and the product quality is improved. Through shielding smelting tool 2, can change and shield the distribution that the baffle improved the electric current when electroplating, reach the thick even of electroplating product membrane.
All the components selected in the present application are general standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimental methods.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (5)
1. A silver plating device for manufacturing semiconductor lead frame etching products is characterized by comprising:
the device comprises a bidirectional track (1), a shielding jig (2) arranged on the track and a pushing mechanism (3) arranged on the shielding jig (2), wherein the pushing mechanism (3) pushes the shielding jig (2) to slide on the bidirectional track (1);
the shielding jig (2) is movably connected with an anode plate (21), and the anode plate (21) is fixed through a fixing component (4);
the pushing mechanism (3) comprises a driving device (31) and a crankshaft (32) arranged on a driving shaft of the driving device (31), and the crankshaft (32) is rotatably connected to the shielding jig (2) through a connecting assembly (5);
shield smelting tool (2) including base (22) and locate a plurality of nozzles (23) on base (22), base (22) both sides extend have place in on two-way track (1).
2. The silver plating apparatus for semiconductor lead frame etching product manufacture according to claim 1,
connecting assembling (5) are including locating vertical connection piece (51) on base (22) and locating articulated fixing base (52) of vertical connection piece (51) upper end, it is connected with vertical pivot (53) to go up vertical rotation in articulated fixing base (52), vertical pivot (53) rotate and are connected with rocker (54), rocker (54) are connected drive epaxial bent axle (32) of drive arrangement (31).
3. The silver plating apparatus for semiconductor lead frame etching product manufacture according to claim 2,
the fixed assembly (4) comprises two vertical supporting rods (41) arranged on the anode plate (21) and a transverse connecting rod (42) connected with the two vertical supporting rods (41), an external fixing rod (43) is arranged on the transverse connecting rod (42), and the external fixing rod (43) is fixed outside through a bolt.
4. The silver plating apparatus for semiconductor lead frame etching product manufacture according to claim 3,
the two sides of the base (22) extend to form upper bearing pieces (221) placed on the two-way track (1), the upper bearing pieces (221) are provided with a plurality of limiting waist-shaped holes (222) along the direction of the two-way track (1), and fixing bolts (223) in threaded connection with the two-way track (1) are arranged in the limiting waist-shaped holes (222).
5. The silver plating apparatus for semiconductor lead frame etching product manufacture according to claim 4,
a plurality of electroplating baths (211) are arranged on the anode plate (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324353.1A CN114717620B (en) | 2022-03-29 | 2022-03-29 | Silver plating device for manufacturing etched product of semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210324353.1A CN114717620B (en) | 2022-03-29 | 2022-03-29 | Silver plating device for manufacturing etched product of semiconductor lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114717620A true CN114717620A (en) | 2022-07-08 |
| CN114717620B CN114717620B (en) | 2023-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210324353.1A Active CN114717620B (en) | 2022-03-29 | 2022-03-29 | Silver plating device for manufacturing etched product of semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114717620B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4595480A (en) * | 1985-09-26 | 1986-06-17 | National Semiconductor Corporation | System for electroplating molded semiconductor devices |
| CA2467037A1 (en) * | 2000-03-29 | 2003-06-19 | Sanyo Electric Co., Ltd. | Manufacturing method for semiconductor device |
| KR20110101925A (en) * | 2010-03-10 | 2011-09-16 | (주)휴맥 | Loading and unloading apparatus for semiconductor package lead frame magazine |
| CN207227584U (en) * | 2017-09-26 | 2018-04-13 | 浙江亚芯微电子股份有限公司 | A kind of electroplanting device |
| CN112795968A (en) * | 2020-12-24 | 2021-05-14 | 铜陵蓝盾丰山微电子有限公司 | High efficiency lead frame silver-plating tool |
| CN213652710U (en) * | 2020-10-30 | 2021-07-09 | 昆山首佳智能科技有限公司 | Sheet type pressing plate electroplating line for semiconductor lead frame |
| CN215785799U (en) * | 2021-09-16 | 2022-02-11 | 泰兴市永志电子器件有限公司 | Lead frame punching press front end flattening device |
-
2022
- 2022-03-29 CN CN202210324353.1A patent/CN114717620B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4595480A (en) * | 1985-09-26 | 1986-06-17 | National Semiconductor Corporation | System for electroplating molded semiconductor devices |
| CA2467037A1 (en) * | 2000-03-29 | 2003-06-19 | Sanyo Electric Co., Ltd. | Manufacturing method for semiconductor device |
| KR20110101925A (en) * | 2010-03-10 | 2011-09-16 | (주)휴맥 | Loading and unloading apparatus for semiconductor package lead frame magazine |
| CN207227584U (en) * | 2017-09-26 | 2018-04-13 | 浙江亚芯微电子股份有限公司 | A kind of electroplanting device |
| CN213652710U (en) * | 2020-10-30 | 2021-07-09 | 昆山首佳智能科技有限公司 | Sheet type pressing plate electroplating line for semiconductor lead frame |
| CN112795968A (en) * | 2020-12-24 | 2021-05-14 | 铜陵蓝盾丰山微电子有限公司 | High efficiency lead frame silver-plating tool |
| CN215785799U (en) * | 2021-09-16 | 2022-02-11 | 泰兴市永志电子器件有限公司 | Lead frame punching press front end flattening device |
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| Publication number | Publication date |
|---|---|
| CN114717620B (en) | 2023-10-13 |
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