CN213652710U - Sheet type pressing plate electroplating line for semiconductor lead frame - Google Patents
Sheet type pressing plate electroplating line for semiconductor lead frame Download PDFInfo
- Publication number
- CN213652710U CN213652710U CN202022465599.XU CN202022465599U CN213652710U CN 213652710 U CN213652710 U CN 213652710U CN 202022465599 U CN202022465599 U CN 202022465599U CN 213652710 U CN213652710 U CN 213652710U
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- China
- Prior art keywords
- automatic
- unloading
- lead frame
- machine
- semiconductor lead
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- 238000009713 electroplating Methods 0.000 title claims abstract description 23
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000003825 pressing Methods 0.000 title description 3
- 239000000463 material Substances 0.000 claims abstract description 35
- 238000007747 plating Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000005611 electricity Effects 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to a semiconductor lead frame piece formula clamp plate electric plate wire, including automatic loader, silvering machine and automatic unloader, for electroplating pretreatment device between automatic loader and the silvering machine, for electroplating after treatment device between silvering machine and the automatic unloader, automatic loader gets the material level including loading manual operation platform and station dress, and the material level setting is got in the station dress, silvering machine includes product delivery track, and product delivery track is equipped with many transfer passage, automatic unloader is including unloading manual operation platform and the position of unloading, and the position of unloading sets up on the manual operation platform of unloading. The utility model discloses a semiconductor lead frame piece formula clamp plate electricity plate wire can realize a plurality of products simultaneous processing in step, has effectively promoted machining efficiency, realizes that the lead frame electroplates in succession, automatic high-efficient production.
Description
Technical Field
The utility model relates to a semiconductor lead frame technical field, in particular to semiconductor lead frame piece formula clamp plate electric plate wire.
Background
The lead frame mainly functions as a carrier for providing mechanical support for the chip, and is used as a conductive medium for connecting the chip circuit inside and outside to form an electric signal path and a heat dissipation path for dissipating heat generated during the operation of the chip together with the package shell. Generally, a copper plate is used as a substrate for manufacturing a lead frame, and the copper plate is etched, plated, and taped on the back surface to form the lead frame. The lead frame is electroplated by special surface treatment on the lead pins and the small islands of the lead frame, and the lead frame is mainly processed by a die stamping method and a chemical etching method at present. The electroplating efficiency of the existing electroplating line is low, and the production efficiency of a production line is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve prior art's problem, provide a can the higher semiconductor lead frame piece formula clamp plate electricity plate wire of production efficiency.
The specific technical scheme is as follows: the utility model provides a semiconductor lead frame piece formula clamp plate electric plate wire, includes automatic loader, silvering machine and automatic discharge machine, for electroplating pretreatment device between automatic loader and the silvering machine, for electroplating after treatment device between silvering machine and the automatic discharge machine, automatic loader gets the material level including loading manual operation platform and station dress, and the station dress gets the material level and sets up on manual operation platform, silvering machine includes product delivery track, and product delivery track is equipped with many transfer passage, automatic discharge machine is including unloading manual operation platform and the position of unloading, and the position of unloading sets up on the manual operation platform of unloading.
As the preferred scheme, station loading material level has a plurality ofly, and a plurality of station loading material level parallel arrangement, the unloading position is for there being a plurality of, a plurality of unloading position parallel arrangement.
As a preferred scheme, the automatic charging machine and the automatic discharging machine are respectively provided with a human-machine operation interface.
As a preferred scheme, the automatic charging machine is provided with a charging manipulator, the charging manipulator is connected with a charging module, and the charging module and the station charging and taking material level are correspondingly arranged.
As an optimal scheme, the automatic unloading machine comprises a material taking manipulator, the material taking manipulator is connected with a material taking module, and the material taking module is arranged corresponding to the unloading position.
The technical effects of the utility model: the utility model discloses a semiconductor lead frame piece formula clamp plate electricity plate wire can realize a plurality of products simultaneous processing in step, has effectively promoted machining efficiency, realizes that the lead frame electroplates in succession, automatic high-efficient production.
Drawings
Fig. 1 is a schematic view of a semiconductor lead frame plate plating line according to an embodiment of the present invention.
Fig. 2 is a schematic view of an automatic loader according to an embodiment of the present invention.
Fig. 3 is an enlarged view of a portion a in fig. 2 according to the present invention.
Fig. 4 is a schematic view of a silvering machine according to an embodiment of the present invention.
Fig. 5 is an enlarged view of a portion B of fig. 4 according to the present invention.
Fig. 6 is a schematic view of an automatic discharging machine according to an embodiment of the present invention.
Fig. 7 is an enlarged view of a portion C of fig. 6 according to the present invention.
Detailed Description
The essential features and advantages of the invention will be further explained below with reference to examples, but the invention is not limited to the embodiments listed.
As shown in fig. 1 to 7, the plate-type press plate plating line for the semiconductor lead frame of the embodiment includes an automatic loader 1, a silver plating machine 2 and an automatic unloader 3, wherein a pre-plating treatment device 4 is disposed between the automatic loader 1 and the silver plating machine 2, and a post-plating treatment device 5 is disposed between the silver plating machine 2 and the automatic unloader 3. The automatic charging machine 1 comprises a charging manual operation platform 11 and a station charging material level 12, wherein the station charging material level 12 is arranged on the manual operation platform 11. The silvering machine 2 comprises a product conveying track 21, and the product conveying track 21 is provided with a plurality of conveying channels 211. The automatic unloading machine 3 comprises an unloading manual operation platform 31 and an unloading position 32, and the unloading position 32 is arranged on the unloading manual operation platform 31. In the technical scheme, materials are placed on an automatic charging machine 1, the materials are charged through the automatic charging machine 1, the materials are subjected to electroplating pretreatment through an electroplating pretreatment device 4, the pretreatment comprises the steps of electrolytic degreasing, water washing, acid washing and the like, and the electroplating pretreatment device 4 can adopt the existing treatment device; the pretreated materials enter a silver plating machine 2 through a conveying rail 21 for electroplating; then the post-treatment is carried out by the electroplating post-treatment device 5, the post-treatment comprises the steps of multi-stage washing, vacuum water absorption rubber rolling, drying and the like, and the electroplating post-treatment device 5 can adopt the existing device. The product is discharged by an automatic discharger 3 after being electroplated. Among the above-mentioned technical scheme, through set up many transfer passage 211 on transfer rail 21, can make transfer rail carry a plurality of products simultaneously and carry out electroplating treatment, promoted electroplating efficiency.
In this embodiment, station charge material level 12 has a plurality ofly, and a plurality of station charge material level 12 parallel arrangement, unloading position 32 is for there being a plurality ofly, a plurality of unloading position 32 parallel arrangement. Through the technical scheme, the number of the station loading and unloading positions 12 is consistent with that of the conveying channels 211, and a plurality of products can be synchronously processed. In this embodiment, the number of the station loading and unloading positions, the number of the unloading positions and the number of the conveying channels are four.
In this embodiment, the automatic loader 1 and the automatic unloader 3 are respectively provided with a man-machine operation interface 6, so that a worker can conveniently control the equipment.
In this embodiment, the automatic loading machine 1 is provided with the loading manipulator 13, and the loading manipulator 13 is connected with the module of feeding 14, and the module of feeding 14 is got the material level 12 with the station dress and is corresponded the setting to make the module of feeding can get the material level from the station dress and take out the material, and remove through the manipulator of feeding.
In this embodiment, automatic unloader 3 includes material taking manipulator 33, and material taking manipulator 33 is connected with material taking module 34, and material taking module 34 corresponds the setting with the position 32 of unloading to when unloading, can unload the position of unloading through getting material module through material taking manipulator removal back with the product.
The sheet type pressing plate electroplating line for the semiconductor lead frame can synchronously process a plurality of products, effectively improves the processing efficiency, and realizes continuous electroplating and automatic high-efficiency production of the lead frame.
It should be noted that the above-mentioned preferred embodiments are only for illustrating the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention accordingly, and the protection scope of the present invention cannot be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. The utility model provides a semiconductor lead frame piece formula clamp plate electric plate wire, its characterized in that, includes automatic loader, silvering machine and automatic unloader, for electroplating pretreatment device between automatic loader and the silvering machine, for electroplating after treatment device between silvering machine and the automatic unloader, automatic loader gets the material level including loading manual operation platform and station dress, and the station dress gets the material level and sets up on manual operation platform, silvering machine includes product delivery track, and product delivery track is equipped with many transfer passage, automatic unloader is including unloading manual operation platform and the position of unloading, and the position of unloading sets up on the manual operation platform of unloading.
2. The semiconductor lead frame sheet press plate electroplating line according to claim 1, wherein the station loading positions are multiple, the station loading positions are arranged in parallel, and the unloading positions are multiple, and the unloading positions are arranged in parallel.
3. The semiconductor lead frame flat platen plating line according to claim 2, wherein the automatic loader and the automatic unloader are respectively provided with a man-machine interface.
4. The semiconductor lead frame sheet type press plate electroplating line according to claim 3, wherein the automatic charging machine is provided with a charging manipulator, the charging manipulator is connected with a charging module, and the charging module is arranged corresponding to a station charging and taking material position.
5. The semiconductor lead frame sheet type press plate electroplating line according to claim 4, wherein the automatic unloading machine comprises a material taking manipulator, the material taking manipulator is connected with a material taking module, and the material taking module is arranged corresponding to the unloading position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022465599.XU CN213652710U (en) | 2020-10-30 | 2020-10-30 | Sheet type pressing plate electroplating line for semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022465599.XU CN213652710U (en) | 2020-10-30 | 2020-10-30 | Sheet type pressing plate electroplating line for semiconductor lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213652710U true CN213652710U (en) | 2021-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022465599.XU Active CN213652710U (en) | 2020-10-30 | 2020-10-30 | Sheet type pressing plate electroplating line for semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213652710U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114717620A (en) * | 2022-03-29 | 2022-07-08 | 昆山一鼎工业科技有限公司 | Silver plating device for manufacturing semiconductor lead frame etching product |
-
2020
- 2020-10-30 CN CN202022465599.XU patent/CN213652710U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114717620A (en) * | 2022-03-29 | 2022-07-08 | 昆山一鼎工业科技有限公司 | Silver plating device for manufacturing semiconductor lead frame etching product |
| CN114717620B (en) * | 2022-03-29 | 2023-10-13 | 昆山一鼎工业科技有限公司 | Silver plating device for manufacturing etched product of semiconductor lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231205 Address after: 200120, Room 1-2, 1st Floor, No. 54, Lane 1755, Nanlu Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Shanghai Siwei Semiconductor Technology Co.,Ltd. Address before: Room 1605, building 1, Guanghua Times Square, no.132greenland Avenue, Huaqiao Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Kunshan Shoujia Intelligent Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |