CN116634672B - Production method of electroless copper plating of flexible circuit board - Google Patents
Production method of electroless copper plating of flexible circuit board Download PDFInfo
- Publication number
- CN116634672B CN116634672B CN202310564802.4A CN202310564802A CN116634672B CN 116634672 B CN116634672 B CN 116634672B CN 202310564802 A CN202310564802 A CN 202310564802A CN 116634672 B CN116634672 B CN 116634672B
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- copper plating
- fixedly connected
- circuit board
- guide rail
- Prior art date
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 90
- 239000010949 copper Substances 0.000 title claims abstract description 90
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 238000007747 plating Methods 0.000 title claims abstract description 80
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000005553 drilling Methods 0.000 claims abstract description 13
- 238000001035 drying Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000005485 electric heating Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 22
- 238000009826 distribution Methods 0.000 abstract description 7
- 238000003672 processing method Methods 0.000 abstract description 2
- 238000005137 deposition process Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
- B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
The invention relates to the technical field of circuit board processing methods, in particular to a production method of electroless copper plating of a flexible circuit board, which comprises the following steps: drilling the flexible circuit board to obtain the flexible circuit board with the through holes; placing a plurality of flexible circuit boards with through holes on a conveying device; controlling the conveying device to sink a plurality of flexible circuit boards with through holes into the copper plating solution to finish copper plating; according to the invention, a plurality of flexible circuit boards with through holes are immersed into copper plating solution at the same time, and simultaneously, the copper plating process is carried out on the plurality of flexible circuit boards in the same copper plating solution, so that different influences on different flexible circuit boards caused by the change of copper plating process environment along with time can be avoided, the thickness distribution of copper plating on each flexible circuit board can be kept the same, the non-uniformity of reference standards set when the flexible circuit boards with fine lines are etched is avoided, and stable production quality is further ensured.
Description
Technical Field
The invention relates to the technical field of circuit board processing methods, in particular to a production method of electroless copper plating of a flexible circuit board.
Background
The traditional production process flow of the batch double-sided flexible circuit board comprises the following steps in sequence: cutting the whole plate into pieces, drilling holes, copper deposition, printing lines, etching and subsequent processes, wherein the production mode of the plates requires that each flexible circuit board passes through the processes separately and sequentially, when the traditional batch production process of double-sided flexible circuit boards is used for manufacturing ultrathin flexible circuit boards (the thickness of the flexible circuit boards is smaller than 40 mu m), as each flexible circuit board passes through independent copper deposition process flows respectively, the copper deposition process environment can generate different influences on different flexible circuit boards due to the change of time, the thickness distribution of copper plating on each flexible circuit board can be different, and the reference standard set by the flexible circuit boards of fine lines (smaller than 50 mu m) during etching is not uniform, so that stable production quality cannot be ensured.
Disclosure of Invention
The invention aims to provide a production method of electroless copper plating of a flexible circuit board, which can simultaneously perform a copper deposition process on a plurality of flexible circuit boards, so that the thickness distribution of copper plating on each flexible circuit board is the same, and stable production quality is ensured.
In order to achieve the above object, the present invention provides a method for producing electroless copper plating of a flexible circuit board, comprising:
Drilling the flexible circuit board to obtain the flexible circuit board with the through holes;
Placing a plurality of flexible circuit boards with through holes on a conveying device;
And controlling the conveying device to sink a plurality of flexible circuit boards with through holes into the copper plating solution to finish copper plating.
The conveying device comprises a bracket, a translation mechanism, a connecting plate, two first air cylinders, two mounting frames and a copper plating tank; the translation mechanism is arranged at the side edge of the bracket; the connecting plate is arranged at the bottom of the translation mechanism; the two first cylinders are fixedly connected with the connecting plates respectively and are positioned at the bottoms of the two connecting plates respectively; the two mounting frames are respectively arranged on output rods of the two first cylinders; the copper plating tanks are positioned at the bottoms of the two mounting frames.
The translation mechanism comprises a guide rail, a sliding block, a threaded screw rod, a first motor and a connecting rod; the guide rail is fixedly connected with the bracket and is positioned at the side edge of the bracket; the sliding block is connected with the guide rail in a sliding way and is positioned on the inner side of the guide rail; the threaded screw rod is rotationally connected with the guide rail, is in threaded connection with the threaded screw rod and is positioned on the inner side of the guide rail; the first motor is fixedly connected with the guide rail, and the output end of the first motor is fixedly connected with the threaded screw rod and positioned at the side edge of the guide rail; the connecting rod is fixedly connected with the sliding block, fixedly connected with the connecting plate and positioned between the sliding block and the connecting plate.
Wherein, the mounting bracket comprises an elastic piece, a supporting plate and a plurality of hooks; the elastic piece is arranged on the output rod of the first cylinder; the supporting plate is arranged on the side edge of the elastic piece; the hooks are respectively and fixedly connected with the supporting plate and are respectively positioned at the bottom of the supporting plate.
The elastic piece comprises an outer column, a first spring and an inner column; the outer column is fixedly connected with the first cylinder output rod and is positioned at the bottom of the first cylinder; the first spring is fixedly connected with the outer column and is positioned in the outer column; the inner column is fixedly connected with the first spring, fixedly connected with the supporting plate and located between the first spring and the supporting plate.
Wherein the transportation device further comprises two inclined plates and a pushing piece; the two inclined plates are fixedly connected with the two supporting plates respectively and are positioned at the tops of the two supporting plates respectively; the pushing piece is fixedly connected with the connecting plate, is positioned at the bottom of the connecting plate and is positioned between the two inclined plates.
Wherein the transportation device further comprises a drying box; the drying box is arranged on the side edge of the copper plating tank.
According to the production method of the electroless copper plating of the flexible circuit board, when the flexible circuit board is plated with copper, firstly, the flexible circuit board with the through holes is manufactured by adopting the drilling equipment to carry out the drilling process, the transportation device is provided with the hooks matched with the through holes, then a plurality of flexible circuit boards with the through holes are hung on the transportation device by workers, and then the flexible circuit boards with the through holes are immersed into copper plating liquid simultaneously by controlling the transportation device, and meanwhile, the copper plating process is carried out on the flexible circuit boards with the through holes simultaneously in the same copper plating liquid, so that different influences of the copper plating process environment on different flexible circuit boards with time can be avoided, the thickness distribution of copper plating on each flexible circuit board can be kept the same, the non-uniformity of reference standards set when the flexible circuit boards with the thin lines are etched is avoided, and stable production quality is further ensured.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of the transportation device of the present invention.
Fig. 2 is another schematic structural view of the transportation device of the present invention.
Fig. 3 is a cross-sectional view of the transport device of the present invention.
Fig. 4 is an enlarged partial view of detail a of fig. 3.
Fig. 5 is a flow chart of a method of producing electroless copper plating of a flexible circuit board in accordance with the present invention.
1-Bracket, 2-translation mechanism, 3-connecting plate, 4-first cylinder, 5-mounting bracket, 6-copper plating pond, 7-swash plate, 8-pushing piece, 9-stoving case, 10-flexible circuit board, 21-guide rail, 22-slider, 23-screw lead screw, 24-first motor, 25-connecting rod, 51-elastic piece, 52-backup pad, 53-couple, 91-outer box, 92-inner box, 93-heating wire, 94-hollow post, 95-second spring, 96-sliding post, 97-montant, 98-door plant, 99-pushing rod, 511-outer post, 512-first spring, 513-inner post.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
Referring to fig. 1 to 5, the invention provides a method for producing electroless copper plating of a flexible circuit board, comprising the following steps:
s1, drilling the flexible circuit board 10 to obtain the flexible circuit board 10 with the through holes;
S2, placing a plurality of flexible circuit boards 10 with through holes on a conveying device;
S3, controlling the conveying device to sink a plurality of flexible circuit boards 10 with through holes into the copper plating solution to finish copper plating.
In this embodiment, when copper plating is performed on the flexible circuit board 10, the flexible circuit board 10 with the through holes is manufactured by adopting the drilling equipment to perform the drilling process on the flexible circuit board 10, the transportation device is provided with the plurality of hooks 53 which are matched with the through holes, then a worker hangs the plurality of flexible circuit boards 10 with the through holes on the transportation device, and then the transportation device is controlled to simultaneously submerge the plurality of flexible circuit boards 10 with the through holes in copper plating liquid, and simultaneously the plurality of flexible circuit boards 10 simultaneously perform copper plating processes in the same copper plating liquid, so that different influences on different flexible circuit boards 10 caused by the change of copper plating process environment along with time can be avoided, the thickness distribution of copper plating on each flexible circuit board 10 can be kept the same, the non-uniformity of reference standards set when etching the flexible circuit boards 10 with thin lines is avoided, and stable production quality is further ensured.
Further, the transportation device comprises a bracket 1, a translation mechanism 2, a connecting plate 3, two first air cylinders 4, two mounting frames 5 and a copper plating tank 6; the translation mechanism 2 is arranged at the side edge of the bracket 1; the connecting plate 3 is arranged at the bottom of the translation mechanism 2; the two first cylinders 4 are fixedly connected with the connecting plates 3 respectively and are positioned at the bottoms of the two connecting plates 3 respectively; the two mounting frames 5 are respectively arranged on the output rods of the two first cylinders 4; the copper plating baths 6 are positioned at the bottoms of the two mounting frames 5.
In this embodiment, the support 1 is used for supporting the translation mechanism 2, copper plating solution is filled in the copper plating tank 6, when copper plating is performed on the flexible circuit board 10, drilling equipment is firstly adopted to drill the flexible circuit board 10 to obtain the flexible circuit board 10 with through holes, a plurality of hooks 53 matched with the through holes on the flexible circuit board 10 are arranged on the mounting frame 5, a worker hangs the through holes on the plurality of flexible circuit boards 10 on the hooks 53, then the translation mechanism 2 is controlled to drive the connecting plate 3 to move above the copper plating tank 6, then two first cylinders 4 are driven to move downwards the mounting frame 5, the mounting frame 5 is used to drive the plurality of flexible circuit boards 10 to move downwards into the copper plating solution in the copper plating tank 6, and meanwhile, the plurality of flexible circuit boards 10 are simultaneously subjected to copper deposition procedures in the same copper plating solution, so that different influences on different flexible circuit boards 10 due to the change of copper deposition process environment along with time can be avoided, the thickness distribution of copper deposition on each flexible circuit board 10 can be kept the same, and stable production quality of flexible circuit boards 10 is avoided when stable and quality of the flexible circuit 10 is set up.
Further, the translation mechanism 2 comprises a guide rail 21, a sliding block 22, a threaded screw 23, a first motor 24 and a connecting rod 25; the guide rail 21 is fixedly connected with the bracket 1 and is positioned at the side edge of the bracket 1; the sliding block 22 is slidably connected with the guide rail 21 and is positioned on the inner side of the guide rail 21; the threaded screw rod 23 is rotatably connected with the guide rail 21, is in threaded connection with the threaded screw rod 23, and is positioned on the inner side of the guide rail 21; the first motor 24 is fixedly connected with the guide rail 21, and the output end of the first motor 24 is fixedly connected with the threaded screw rod 23 and is positioned at the side edge of the guide rail 21; the connecting rod 25 is fixedly connected with the slider 22, fixedly connected with the connecting plate 3, and positioned between the slider 22 and the connecting plate 3.
In this embodiment, the guide rail 21 is configured to provide guidance for the slider 22, the first motor 24 may drive the threaded screw 23 to rotate, the threaded screw 23 rotates to enable the slider 22 to move horizontally along the guide rail 21, the slider 22 drives the connecting rod 25 to move horizontally, and the connecting rod 25 drives the connecting plate 3 to move horizontally, so that the positions of the two mounting frames 5 may be adjusted.
Further, the mounting frame 5 includes an elastic member 51, a support plate 52, and a plurality of hooks 53; the elastic member 51 is provided on the output rod of the first cylinder 4; the supporting plate 52 is arranged at the side of the elastic piece 51; the hooks 53 are fixedly connected with the support plate 52, and are located at the bottom of the support plate 52.
In this embodiment, the supporting plate 52 is used to support a plurality of hooks 53, two hooks 53 on the same horizontal plane are contacted with each other, when the flexible circuit board 10 is placed, the two hooks 53 are pulled away from each other, so that the elastic member 51 is compressed, then the hooks 53 pass through the through holes on the flexible circuit board 10, so that the flexible circuit board 10 is fixed on the hooks 53, after all the flexible circuit boards 10 are placed, the supporting plate 52 is loosened, the elastic member 51 returns to the original state, so that the two supporting plates 52 are close to each other until the two hooks 53 on the same horizontal plane are abutted, so that the flexible circuit board 10 can be prevented from being pulled out from the hooks 53.
Further, the elastic member 51 includes an outer column 511, a first spring 512, and an inner column 513; the outer column 511 is fixedly connected with the output rod of the first cylinder 4 and is positioned at the bottom of the first cylinder 4; the first spring 512 is fixedly connected with the outer column 511 and is positioned inside the outer column 511; the inner post 513 is fixedly connected to the first spring 512, is fixedly connected to the support plate 52, and is located between the first spring 512 and the support plate 52.
In this embodiment, the outer posts 511 are used to provide guidance for the first springs 512 and the inner posts 513 to avoid shifting the position of the support plate 52.
Further, the transportation device also comprises two inclined plates 7 and a pushing piece 8; the two inclined plates 7 are fixedly connected with the two supporting plates 52 respectively and are positioned at the tops of the two supporting plates 52 respectively; the pushing piece 8 is fixedly connected with the connecting plate 3, is positioned at the bottom of the connecting plate 3 and is positioned between the two inclined plates 7.
In this embodiment, when copper plating is performed on the flexible circuit board 10, firstly, a drilling device is used to drill a hole on the flexible circuit board 10 to obtain the flexible circuit board 10 with a through hole, when the mounting frame 5 is located above the copper plating tank 6, the pushing member 8 is located between the two inclined plates 7, the two first springs 512 are in a compressed state, the hooks 53 located on the same horizontal plane are far away from each other, a worker can hang the through holes on the plurality of flexible circuit boards 10 on the hooks 53, after all the flexible circuit boards 10 are placed, the two first cylinders 4 are controlled to drive the two outer columns 511 to move downwards, the outer columns 511 drive the inner columns 513 and the supporting plates 52 to move downwards, so that the plurality of flexible circuit boards 10 are driven to move downwards into copper plating solution in the copper plating tank 6, and the first springs 512 are gradually restored to be pushed to the original state at the moment along with the downward movement of the supporting plates 52, so that the two supporting plates 52 are close to each other, and the flexible circuit boards 10 can not be stably separated from the same horizontal plane, and the flexible circuit boards 10 can be prevented from being stably etched from the same, and the flexible circuit boards 10 can be prevented from being stably from being separated from the flexible circuit boards 10 due to the same in the same process, and the flexible circuit boards 10 can be prevented from being subjected to the continuous process, and the flexible circuit boards 10 can be prevented from being stably from being subjected to the same quality due to the same process conditions, and the flexible circuit boards 10; after the copper plating process is finished, the first cylinder 4 drives the outer column 511 to move upwards, so that the support plate 52 and the flexible circuit board 10 move upwards, and the pushing member 8 is inserted between the two inclined plates 7 while the flexible circuit board 10 moves out of the copper plating tank 6, so that the two inclined plates 7 are far away from each other, and the two hooks 53 on the same horizontal plane are far away from each other, so that the flexible circuit board 10 after copper plating is conveniently removed by a worker.
Further, the transportation device also comprises a drying box 9; the drying box 9 is arranged at the side edge of the copper plating tank 6.
In this embodiment, after the copper plating process is completed, the first cylinder 4 drives the outer column 511 to move upwards, so that the support plate 52 and the flexible circuit board 10 move upwards, after the flexible circuit board 10 moves out of the copper plating tank 6, the first motor 24 drives the threaded screw rod 23 to rotate, so that the slider 22 drives the connecting rod 25 and the first cylinder 4 to move to the top of the drying box 9, so that the flexible circuit board 10 is located above the drying box 9, and then the first cylinder 4 drives the outer column 511 to move downwards, so that the flexible circuit board 10 enters the drying box 9, and the flexible circuit board 10 after copper plating is dried by the drying box 9, so as to improve the drying efficiency.
Further, the drying box 9 includes an outer box 91, an inner box 92 and an electric heating wire 93; the outer box 91 is fixedly connected with the copper plating tank 6 and is positioned at the side edge of the copper plating tank 6; the inner box 92 is fixedly connected with the outer box 91 and is positioned in the outer box 91; the heating wire 93 is disposed inside the inner case 92.
In this embodiment, there is a space between the outer case 91 and the inner case 92, so that heat loss in the inner case 92 is avoided, and the inside of the inner case 92 is heated by energizing the heating wire 93, so that the copper-plated flexible circuit board 10 in the inner case 92 can be dried, and drying efficiency is improved.
Further, the drying box 9 further comprises a hollow column 94, a second spring 95, a sliding column 96, a vertical rod 97, a door plate 98 and a push rod 99; the hollow column 94 is fixedly connected with the outer box 91 and is positioned at the side edge of the outer box 91; the second spring 95 is fixedly connected with the hollow column 94 and is positioned inside the hollow column 94; the sliding column 96 is fixedly connected with the second spring 95 and is positioned at the side edge of the second spring 95; the vertical rod 97 is fixedly connected with the sliding column 96 and is positioned at the side edge of the sliding column 96; the door plate 98 is fixedly connected with the vertical rod 97 and is positioned at the side edge of the vertical rod 97; the push rod 99 is fixedly connected to the door plate 98 and is located at the top of the door plate 98.
In this embodiment, when copper plating is performed on the flexible circuit board 10, a drilling process is performed on the flexible circuit board 10 by using a drilling device to obtain the flexible circuit board 10 with a through hole, when the mounting frame 5 is located above the copper plating tank 6, the pushing member 8 is located between the two inclined plates 7, the two first springs 512 are in a compressed state, the hooks 53 located on the same horizontal plane are far away from each other, a worker can hang the through holes on a plurality of flexible circuit boards 10 on the hooks 53, after all the flexible circuit boards 10 are placed, the two first cylinders 4 are controlled to drive the two outer columns 511 to move downwards, The outer column 511 drives the inner column 513 and the support plate 52 to move downwards, so that a plurality of flexible circuit boards 10 are driven to move downwards into the copper plating solution in the copper plating tank 6, the inclined plate 7 is far away from the pushing piece 8 along with the downward movement of the support plate 52, the first spring 512 gradually returns to the original state to push the inner column 513, so that the two support plates 52 are close to each other until the two hooks 53 on the same horizontal plane are abutted, thereby avoiding the flexible circuit boards 10 from falling out of the hooks 53, then the plurality of flexible circuit boards 10 simultaneously perform copper deposition in the same copper plating solution, Therefore, the different influences of the change of the copper deposition process environment along with the time on different flexible circuit boards 10 can be avoided, the thickness distribution of copper plating on each flexible circuit board 10 can be kept the same, the non-uniformity of the reference standard set when the flexible circuit board 10 with thin lines is etched is avoided, and stable production quality is further ensured; After the copper plating process is finished, the first cylinder 4 drives the outer column 511 to move upwards, so that the supporting plate 52 and the flexible circuit board 10 move upwards, and the pushing piece 8 is inserted between the two inclined plates 7 when the flexible circuit board 10 moves out of the copper plating tank 6, so that the two inclined plates 7 are far away from each other, and the two hooks 53 on the same horizontal plane are far away from each other, so that the flexible circuit board 10 after copper plating is conveniently removed by a worker; In addition, after the copper plating process is finished, the first motor 24 drives the threaded screw rod 23 to rotate in a forward rotation manner, so that the sliding block 22 drives the connecting rod 25 and the connecting plate 3 to move to the top of the drying box 9, the flexible circuit board 10 is positioned above the drying box 9, in the moving process of the connecting plate 3, the connecting plate 3 pushes the vertical rod 97, the vertical rod 97 drives the sliding column 96 and the door plate 98 to be far away from the inner box 92, the inner box 92 is not closed any more, the second spring 95 is stretched at the moment, the first cylinder 4 drives the outer column 511 to move downwards, The flexible circuit board 10 is made to enter the inside of the drying box 9, the flexible circuit board 10 after copper plating is dried through the drying box 9, drying efficiency is improved, after drying is finished, the second cylinder drives the inner column 513 to move upwards, so that the flexible circuit board 10 moves out of the inner box 92, meanwhile, the second motor is reversed, so that the connecting plate 3 and the flexible circuit board 10 are far away from the inner box 92, at the moment, the second spring 95 is restored to be original state to pull the sliding column 96, so that the door plate 98 returns to the top of the outer box 91 again, the inner box 92 is closed, and therefore temperature loss is avoided.
The above disclosure is only a preferred embodiment of the present invention, and it should be understood that the scope of the invention is not limited thereto, and those skilled in the art will appreciate that all or part of the procedures described above can be performed according to the equivalent changes of the claims, and still fall within the scope of the present invention.
Claims (3)
1. A method for producing electroless copper plating of a flexible circuit board, comprising:
Drilling the flexible circuit board to obtain the flexible circuit board with the through holes;
Placing a plurality of flexible circuit boards with through holes on a conveying device;
Controlling the conveying device to sink a plurality of flexible circuit boards with through holes into the copper plating solution to finish copper plating;
The conveying device comprises a bracket, a translation mechanism, a connecting plate, two first air cylinders, two mounting frames and a copper plating pool; the translation mechanism is arranged at the side edge of the bracket; the connecting plate is arranged at the bottom of the translation mechanism; the two first cylinders are fixedly connected with the connecting plates respectively and are positioned at the bottoms of the two connecting plates respectively; the two mounting frames are respectively arranged on output rods of the two first cylinders; the copper plating tanks are positioned at the bottoms of the two mounting frames;
The mounting frame comprises an elastic piece, a supporting plate and a plurality of hooks; the elastic piece is arranged on the output rod of the first cylinder; the supporting plate is arranged on the side edge of the elastic piece; the hooks are respectively fixedly connected with the supporting plate and are respectively positioned at the bottom of the supporting plate;
The elastic piece comprises an outer column, a first spring and an inner column; the outer column is fixedly connected with the first cylinder output rod and is positioned at the bottom of the first cylinder; the first spring is fixedly connected with the outer column and is positioned in the outer column; the inner column is fixedly connected with the first spring, fixedly connected with the supporting plate and positioned between the first spring and the supporting plate;
The conveying device further comprises a drying box; the drying box is arranged on the copper plating Chi Cebian and comprises an outer box body, an inner box body and an electric heating wire; the outer box body is fixedly connected with the copper plating tank and is positioned on the copper plating Chi Cebian; the inner box body is fixedly connected with the outer box body and is positioned in the outer box body; the heating wire is arranged inside the inner box body.
2. A method for producing electroless copper plating of a flexible circuit board according to claim 1,
The translation mechanism comprises a guide rail, a sliding block, a threaded screw rod, a first motor and a connecting rod; the guide rail is fixedly connected with the bracket and is positioned at the side edge of the bracket; the sliding block is connected with the guide rail in a sliding way and is positioned on the inner side of the guide rail; the threaded screw rod is rotationally connected with the guide rail, is in threaded connection with the threaded screw rod and is positioned on the inner side of the guide rail; the first motor is fixedly connected with the guide rail, and the output end of the first motor is fixedly connected with the threaded screw rod and positioned at the side edge of the guide rail; the connecting rod is fixedly connected with the sliding block, fixedly connected with the connecting plate and positioned between the sliding block and the connecting plate.
3. A method for producing electroless copper plating of a flexible circuit board according to claim 2,
The conveying device further comprises two inclined plates and a pushing piece; the two inclined plates are fixedly connected with the two supporting plates respectively and are positioned at the tops of the two supporting plates respectively; the pushing piece is fixedly connected with the connecting plate, is positioned at the bottom of the connecting plate and is positioned between the two inclined plates.
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| CN102573307A (en) * | 2012-01-19 | 2012-07-11 | 欣兴同泰科技（昆山）有限公司 | Production process of flexible circuit board |
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| CN217839166U (en) * | 2022-06-02 | 2022-11-18 | 浙江鑫柔科技有限公司 | Uniform copper plating device for metal grid circuit |
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