CN221254744U - Three-dimensional linkage jet device for improving electroplating uniformity of ceramic plate - Google Patents
Three-dimensional linkage jet device for improving electroplating uniformity of ceramic plate Download PDFInfo
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- CN221254744U CN221254744U CN202322657218.1U CN202322657218U CN221254744U CN 221254744 U CN221254744 U CN 221254744U CN 202322657218 U CN202322657218 U CN 202322657218U CN 221254744 U CN221254744 U CN 221254744U
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- spray
- cross arm
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- ceramic
- ceramic plate
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- 239000000919 ceramic Substances 0.000 title claims abstract description 72
- 238000009713 electroplating Methods 0.000 title claims abstract description 40
- 239000007921 spray Substances 0.000 claims abstract description 73
- 238000007747 plating Methods 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 238000005507 spraying Methods 0.000 claims description 30
- 239000003814 drug Substances 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 19
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
According to the three-dimensional linkage jet copper plating device for improving the electroplating uniformity of the ceramic plate, due to the horizontal arrangement of the cross arm (57) and the actions of the first connecting component (52), the second connecting component (55) and the third connecting component (56), the cross arm (57) moves in the three-dimensional directions of the X axis, the Y axis and the Z axis, so that the distance and the relative position between the spray disc (15) and the surface of the ceramic plate (13) which is fixedly arranged are adjusted and moved in the three-dimensional directions, the spray disc (15) can spray ceramic plates (13) with different sizes better, the electroplating uniformity of the ceramic plates is greatly improved, and the electroplated ceramic plates (13) have no holes.
Description
Technical Field
The utility model relates to a vertical copper plating technology of a printed circuit board, in particular to a jet copper plating device for ceramic plate electroplating.
Background
The conventional vertical copper electroplating technology is generally applicable to a circuit board, and the electroplating tank comprises an anode, a cathode, a circuit board, a spray disc, a pump, a copper sulfate solution and a nozzle, wherein the anode is symmetrically arranged on two sides of the electroplating tank close to the tank wall, the circuit board is clamped and then connected with the cathode, and the cathode is connected with a power supply through a cathode cable; the spray disc comprises a base fixed supporting rod, an upper fixed supporting rod, a lower fixed supporting spray rod, a fixing clamp, a supporting frame and a spray rod, wherein the spray rod is vertically arranged and is perpendicular to the upper fixed supporting rod, a nozzle is arranged on the spray rod, the upper fixed supporting rod (parallel to the lower fixed supporting spray rod and the base fixed supporting rod) is arranged, the distance from the nozzle to a circuit board cannot be adjusted, and therefore, due to the small size of a ceramic plate, the uniformity of the copper plating surface/hole of the ceramic plate is difficult to achieve, and the soaking spray flow only moves forwards and backwards to influence the copper plating uniformity.
Chinese patent CN217203007U discloses a novel semiconductor ceramic through hole filling equipment device, comprising: the cylinder body is internally provided with a plurality of titanium copper-clad anodes, one side of each titanium copper-clad anode is provided with a plurality of back-hanging anode titanium baskets, two sides of the upper end of the cylinder body are provided with swinging frames, two cathode conductive copper bars are arranged on the upper sides of the swinging frames, a vibrator is arranged on the upper side of one swinging frame, an electroplating mechanism is arranged in the cylinder body, two sides of the cylinder body are provided with circulating water pumps, one side of the cylinder body is provided with a filter pump, a control distribution box, a time timing alarm, a temperature display and an electroplating rectifier, and one side lower end of the cylinder body is provided with a booster pump. The utility model can achieve the purpose of electroplating hole filling of the through holes with the aperture of 0.07mm-0.2mm of the ceramic substrate by matching with electroplating hole filling liquid medicine, the electroplating hole filling is full and has no cavity, and the uniformity of the thickness of the surface copper is good.
Because the technical scheme described in chinese patent CN217203007U still has the problem that the uniformity of copper thickness on the plating surface is not high, and the hole filling phenomenon of plating still occurs occasionally, this is also mainly because the distance between the circuit board and the spray disc bracket cannot be effectively adjusted, and the effective and sufficient spraying of the circuit board with the liquid medicine of the nozzle of the spray disc cannot be ensured according to the size of the circuit board, particularly the ceramic plate. Accordingly, there is a need to develop a plating jet for improving the plating uniformity of ceramic plates without hole filling voids.
Disclosure of utility model
The utility model aims to provide a three-dimensional linkage jet copper plating device for improving the electroplating uniformity of ceramic plates, which is characterized in that a spray plate is moved in a three-dimensional direction, and the ceramic plates are kept fixed, so that the spray plate can effectively spray the ceramic plates.
In order to solve the technical problems, the three-dimensional linkage jet copper plating device for improving the electroplating uniformity of the ceramic plate provided by the utility model comprises:
The invention relates to a three-dimensional linkage jet device for improving the electroplating uniformity of a ceramic plate, which is arranged on an electroplating pool (300) and comprises:
a bracket (100);
The fixed frame (200) is arranged on the bracket (100), the fixed frame (200) is provided with two transverse guide rails (201) which are mutually parallel in the Y-axis direction, and the fixed frame (200) is in sliding connection with a plurality of support rods (301) which are vertically arranged on the bracket (100) through a third connecting part (56);
an anode (11) connected to the copper block for copper plating;
a cathode (12) connected to a ceramic plate (13) to be plated with copper;
A pair of cross arms (57, 58) provided on the fixed frame (200) and arranged oppositely in the X-axis direction, the cross arms (57, 58) being located above the plating cell (300);
Two spray trays (15) are oppositely arranged at the end part of one end of the cross arm (57) along the vertical Z-axis direction, the spray trays (15) are vertically arranged, the upper ends of the spray trays (15) are slidably connected with the cross arm (57) through a first connecting component (52) so that the spray trays (15) move left and right along the X-axis direction to adjust the distance between the spray trays (15) and the opposite ceramic plate (13), and the ceramic plate (13) is arranged between the two spray trays (15) so that the two spray trays (15) can spray electroplating liquid medicine of an electroplating pool (300) on two surfaces of the ceramic plate (13); the other end of the cross arm (57) is slidably connected with the transverse guide rail (201) through a second connecting part (55), so that the cross arm (57) moves left and right along the Y-axis direction to adjust the spraying area of the spraying disc (15) to directly spray liquid medicine between the front surface and the rear surface of the ceramic plate (13); the fixed frame (200) is in sliding connection with the supporting rod (301) through a third connecting part (56), so that the fixed frame (200) moves up and down along the Z-axis direction, and the cross arm (57) drives the spray disc (15) to move up and down, so that the spray area of the spray disc (15) directly spraying the liquid medicine between the opposite surfaces of the ceramic plate (13) in the up-down direction is adjusted.
Further, a sliding guide rail is adopted for sliding connection between the upper end of the spray disc (15) and the cross arm (57).
Further, the upper end of the spray disc (15) is in sliding connection with the cross arm (57) through a worm gear.
Further, the other end of the cross arm (57, 58) is in sliding connection with the transverse guide rail (201) by adopting a sliding guide rail.
Further, the other end of the cross arm (57) is in sliding connection with the transverse guide rail (201) through a worm gear.
Further, the fixed frame (200) is slidably connected with the support rod (301) by a sliding guide rail.
Further, the fixed frame (200) is slidably connected with the supporting rod (301) by adopting a worm gear.
Further, the device further comprises a controller (500), wherein the controller (500) is connected with the first connecting part (52), the second connecting part (55) and the third connecting part (56), so that the controller (500) adjusts the distance between the spraying disc (15) and the opposite ceramic plate (13) by controlling the sliding of the upper end of the spraying disc (15) relative to the cross arm (57) through controlling the first connecting part (52), adjusts the spraying area of the spraying disc (15) between the front and back of the opposite surface of the ceramic plate (13) by controlling the sliding of the other end of the cross arm (57) relative to the transverse guide rail (201) through controlling the second connecting part (55), and adjusts the spraying area of the spraying disc (15) between the opposite surface of the ceramic plate (13) in the up-down direction through controlling the third connecting part (56) to slide the fixed frame (200) relative to the support rod (301).
Further, the controller (500) employs a Programmable Logic Controller (PLC).
Further, the controller (500) employs a central control unit (CPU).
According to the three-dimensional linkage jet copper plating device for improving the electroplating uniformity of the ceramic plate, due to the horizontal arrangement of the cross arm (57) and the actions of the first connecting component (52), the second connecting component (55) and the third connecting component (56), the cross arm (57) moves in the three-dimensional directions of the X axis, the Y axis and the Z axis, so that the distance and the relative position between the spray disc (15) and the surface of the ceramic plate (13) which is fixedly arranged are adjusted and moved in the three-dimensional directions, the spray disc (15) can spray ceramic plates (13) with different sizes better, the electroplating uniformity of the ceramic plates is greatly improved, and the electroplated ceramic plates (13) have no holes.
Drawings
FIG. 1 is a schematic view of the structure of one embodiment of a three-dimensional linkage jet copper plating apparatus for improving the plating uniformity of ceramic plates according to the present utility model.
Fig. 2 is a three-dimensional moving structure part diagram of the embodiment of fig. 1.
Fig. 3 is a control frame diagram for controlling three-dimensional movement.
Detailed Description
The technical scheme of the utility model is described in detail below with reference to the accompanying drawings.
Referring to fig. 1 and 2, the three-dimensional linkage jet copper plating apparatus for improving the plating uniformity of ceramic plates provided by the present utility model is mounted on a plating bath (300) and includes a bracket (100), a fixing frame (200) provided on the bracket (100), an anode (11), a cathode (12), two spray trays (15), and a pair of cross arms (57). Wherein the rack (100) is used for placing the electroplating pool (300), thus forming the whole ceramic plate electroplating equipment. The fixed frame (200) is provided with two transverse guide rails (201) which are mutually parallel in the Y-axis direction, and the fixed frame (200) is in sliding connection with a plurality of support rods (301) which are vertically arranged on the support (100) through a third connecting component (56). The anode (11) is connected with copper blocks for copper plating to provide the same raw materials required by electroplating, and the cathode (12) is connected with a ceramic plate (13) required to be plated with copper. Two cross arms (57) are arranged on the bracket (100) and are oppositely arranged along the X-axis direction, and the cross arms (57) are positioned above the electroplating pool (300). The two spray trays (15) are provided with nozzles (spray heads) which can spray electroplating liquid medicine on the spraying surface of the ceramic plate (13), the nozzles are connected with the liquid medicine in the electroplating pool (300) through pipelines, and the pump conveys the electroplating liquid medicine to the nozzles, so that the two spray trays (15) spray the electroplating liquid medicine on the two surfaces of the ceramic plate (13) respectively.
The two spraying discs (15) are oppositely arranged along the vertical Z-axis direction at the end part of one end of the cross arm (57), the spraying discs (15) are vertically arranged, the upper ends of the spraying discs (15) are slidably connected with the cross arm (57) through a first connecting part (52) so that the spraying discs (15) move left and right along the X-axis direction to adjust the distance between the spraying discs (15) and the opposite ceramic plates (13), and the ceramic plates (13) are arranged between the two spraying discs (15) so that the two spraying discs (15) can spray liquid medicine on the two surfaces of the ceramic plates (13); the other end of the cross arm (57) is slidably connected with the transverse guide rail (201) through a second connecting component (55), so that the cross arms (57, 58) move left and right along the Y-axis direction, and the spraying area of the spraying disc (15) for directly spraying the liquid medicine between the front surface and the rear surface of the ceramic plate (13) opposite to each other is adjusted; the fixed frame (200) is in sliding connection with the supporting rod (301) through a third connecting part (56), so that the fixed frame (200) moves up and down along the Z-axis direction, and the cross arm (57) drives the spray disc (15) to move up and down, so that the spray area of the spray disc (15) directly spraying the liquid medicine between the opposite surfaces of the ceramic plate (13) in the up-down direction is adjusted.
In this embodiment, the sliding connection between the upper end of the spray disc (15) and the cross arm (57) adopts a sliding guide rail, and two guide rails sliding with each other are formed, so that the cross arm (57) can slide and extend or retract (move left and right) in the X-axis direction. Of course, the upper end of the spray disc (15) is in sliding connection with the cross arm (57) by adopting a worm gear, the cross arm (57) is arranged on the worm, and the spray disc is driven by the worm gear to extend or retract (move leftwards and rightwards) in the X-axis direction. Similarly, the other end of the cross arm (57) is in sliding connection with the transverse guide rail (201) by adopting a sliding guide rail or a worm gear, so that the cross arm (57) can move back and forth along the Y-axis direction relative to the transverse guide rail (201) as a whole. Similarly, the fixed frame (200) is slidably connected with the support rod (301) by adopting a sliding guide rail or a worm gear and a structure, so that the fixed frame (200) moves up and down in the Z-axis direction relative to the support rod (301). Therefore, the connecting end of the cross arm (57) and the spray disc (15) can move in the X, Y, Z axis direction by adopting the relative movement in the X, Y, Z axis direction, so that the spray disc (15) can also move in the X, Y, Z axis direction. The X, Y, Z shaft can be moved manually or by a motor.
Referring again to fig. 1, the ceramic plate (13) is fixed to the rail (131), and the rail (131) is rested on the clamping grooves (151) of the front and rear side walls (210) of the plating tank (300) and fixed.
Referring to fig. 3, in order to achieve the automatic control of the movement of the X, Y, Z shaft, an embodiment of the present utility model further includes a controller (500), the controller (500) being connected to the first connecting member (52), the second connecting member (55), and the third connecting member (56), such that the controller (500) adjusts the distance between the spray disk (15) and the opposite ceramic plate (13) by controlling the sliding of the upper end of the spray disk (15) with respect to the cross arm (57) by controlling the first connecting member (52), adjusts the area of the spray of the liquid medicine between the other end of the cross arm (57) with respect to the lateral rail (201) by controlling the sliding of the second connecting member (55) with respect to the opposite surface of the ceramic plate (13), and adjusts the area of the spray of the liquid medicine between the upper end of the spray disk (15) and the opposite surface of the ceramic plate (13) by controlling the third connecting member (56) to slide the fixed frame (200) with respect to the support bar (301). In this way, the user can automatically adjust the mutual positions of the spraying disc (15) and the ceramic plate (13) through the controller (500) according to the size, thickness and other dimensional parameters of the ceramic plate (13). The controller (500) adopts a Programmable Logic Controller (PLC) or a central control unit (CPU).
From the above description, it can be known that, in the three-dimensional linkage jet copper plating device for improving the electroplating uniformity of ceramic plates provided by the utility model, due to the horizontal arrangement of the cross arm (57) and the actions of the first connecting component (52), the second connecting component (55) and the third connecting component (56), the cross arm (57) moves in the three-dimensional directions of the X axis, the Y axis and the Z axis, so that the distance and the relative position between the surface of the spraying disc (15) and the surface of the ceramic plate (13) which is fixedly arranged can be adjusted and moved in the three-dimensional direction, the spraying disc (15) can spray ceramic plates (13) with different sizes better, the electroplating uniformity of the ceramic plates is greatly improved, and the ceramic plates (13) after being electroplated have no holes.
While specific embodiments of the utility model have been described above, it will be appreciated by those skilled in the art that these are by way of example only, and the scope of the utility model is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the principles and spirit of the utility model, but such changes and modifications fall within the scope of the utility model.
Claims (10)
1. A three-dimensional linkage jet device for improving the electroplating uniformity of ceramic plates, which is mounted on an electroplating bath (300), characterized in that it comprises:
a bracket (100);
The fixed frame (200) is arranged on the bracket (100), the fixed frame (200) is provided with two transverse guide rails (201) which are mutually parallel in the Y-axis direction, and the fixed frame (200) is in sliding connection with a plurality of support rods (301) which are vertically arranged on the bracket (100) through a third connecting part (56);
an anode (11) connected to the copper block for copper plating;
a cathode (12) connected to a ceramic plate (13) to be plated with copper;
A pair of cross arms (57, 58) provided on the fixed frame (200) and arranged oppositely in the X-axis direction, the cross arms (57) being located above the plating cell (300);
two spray trays (15) are oppositely arranged at the end part of one end of the cross arm (57) along the vertical Z-axis direction, the spray trays (15) are vertically arranged, the upper ends of the spray trays (15) are slidably connected with the cross arms (57, 58) through first connecting parts (52) so that the spray trays (15) move left and right along the X-axis direction to adjust the distance between the spray trays (15) and the opposite ceramic plate (13), and the ceramic plate (13) is arranged between the two spray trays (15) so that the two spray trays (15) can spray electroplating liquid medicine of an electroplating pool (300) on two surfaces of the ceramic plate (13); the other end of the cross arm (57) is slidably connected with the transverse guide rail (201) through a second connecting part (55), so that the cross arm (57) moves left and right along the Y-axis direction to adjust the spraying area of the spraying disc (15) to directly spray liquid medicine between the front surface and the rear surface of the ceramic plate (13); the fixed frame (200) is in sliding connection with the supporting rod (301) through a third connecting part (56), so that the fixed frame (200) moves up and down along the Z-axis direction, and the cross arm (57) drives the spray disc (15) to move up and down, so that the spray area of the spray disc (15) directly spraying the liquid medicine between the opposite surfaces of the ceramic plate (13) in the up-down direction is adjusted.
2. A three-dimensional linked jet for improving the electroplating uniformity of ceramic plates according to claim 1, characterized in that the sliding connection of the upper end of the jet disc (15) with the cross arm (57) adopts a sliding guide rail.
3. A three-dimensional linkage jet device for improving the electroplating uniformity of ceramic plates according to claim 1, characterized in that the sliding connection of the upper end of the jet disc (15) and the cross arm (57) adopts a worm gear.
4. A three-dimensional linked jet for improving the plating uniformity of ceramic slabs according to claim 1, characterized in that the sliding connection of the other end of the cross arm (57) with the transversal rail (201) adopts a sliding rail.
5. A three-dimensional linked jet for improving the electroplating uniformity of ceramic plates according to claim 1, characterized in that the sliding connection of the other end of the cross arm (57) and the transverse guide rail (201) adopts a worm gear.
6. The three-dimensional linkage jet device for improving the electroplating uniformity of the ceramic plate according to claim 1, wherein the fixed frame (200) is slidingly connected with the supporting rod (301) by adopting a sliding guide rail.
7. The three-dimensional linkage jet device for improving the electroplating uniformity of the ceramic plate according to claim 1, wherein the fixed frame (200) is slidably connected with the supporting rod (301) by adopting a worm gear.
8. The three-dimensional linkage spray device for improving the plating uniformity of ceramic plates according to any one of claims 1 to 7, further comprising a controller (500), wherein the controller (500) is connected to the first connecting member (52), the second connecting member (55) and the third connecting member (56), such that the controller (500) adjusts the distance between the spray plate (15) and the opposite ceramic plate (13) by controlling the sliding of the upper end of the spray plate (15) with respect to the cross arm (57) by controlling the first connecting member (52), adjusts the liquid medicine spraying area between the opposite end of the cross arm (57) with respect to the lateral rail (201) by controlling the sliding of the second connecting member (55) to thereby adjust the liquid medicine spraying area between the front and rear of the opposite surface of the spray plate (13) directly by the spray plate (15), and adjusts the opposite surface of the spray plate (13) directly between the upper and lower surfaces of the spray plate (13) by controlling the third connecting member (56) to thereby slide the fixed frame (200) with respect to the support bar (301).
9. The three-dimensional linked jet for improving the plating uniformity of ceramic plates according to claim 8, wherein said controller (500) is a programmable logic controller.
10. The three-dimensional linked jet for improving the plating uniformity of ceramic plates according to claim 8, wherein said controller (500) employs a central control unit.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221254744U true CN221254744U (en) | 2024-07-02 |
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