JP2004043936A - Substrate holder and plating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the wear of a component member by rotating a retaining member with low frictional force while preventing the dislocation of a support. <P>SOLUTION: In the substrate holder in which a substrate W is arranged between a fixed holding member 54 and a movable holding member 58 fitted with sealing members 62 and 68, a retaining member 60 is moved, and the movable holding member 58 is tightened on the fixed holding member 54 to hold the substrate W. In this case, the retaining member 60 is moved in a state where the movable holding member 58 is pressed against the fixed holding member 54 and the sealing members 62 and 68 are crushed to hold the substrate W. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides, for example, a plating apparatus for plating a surface to be plated of a substrate, particularly, a fine wiring groove or hole provided on a surface of a semiconductor wafer or the like, a plating film formed on a resist opening, or a surface of a semiconductor wafer. The present invention relates to a substrate holder used for a plating apparatus or the like for forming a bump (protruding electrode) electrically connected to a package electrode or the like, and a plating apparatus provided with the substrate holder.
[0002]
[Prior art]
For example, in a TAB (Tape Automated Bonding) or a flip chip, gold, copper, solder, or nickel, or a protruding connection in which these are stacked in a multilayer at predetermined positions (electrodes) on the surface of a semiconductor chip on which wiring is formed. 2. Description of the Related Art It is widely practiced to form electrodes (bumps) and electrically connect to electrodes of a package or TAB electrodes via the bumps. As a method for forming the bump, there are various methods such as an electrolytic plating method, a vapor deposition method, a printing method, and a ball bump method. However, with the increase in the number of I / Os and the fine pitch of the semiconductor chip, miniaturization is possible. Electroplating methods, which have relatively stable performance, have come to be used frequently.
[0003]
Here, the electrolytic plating method is a jet type or a cup type in which the surface to be plated of a substrate such as a semiconductor wafer is placed horizontally with the surface to be plated facing downward (face down), and a plating solution is blown up from below to perform plating. The substrate is set up vertically, and the plating solution is roughly divided into a dip type in which a plating solution is poured from below the plating tank and plating is performed while overflowing. The electroplating method using the dip method has the advantages that the bubbles that adversely affect the plating quality are well removed and the footprint is small, so the dimensions of the plating holes are relatively large and It is considered that it is suitable for bump plating which requires time.
[0004]
In a conventional electrolytic plating apparatus employing a dipping method, a substrate holder such as a semiconductor wafer or the like, which is provided with a substrate holder that seals an end surface and a back surface, exposes a surface (plated surface), and detachably holds the substrate, is provided. The holder is immersed in the plating solution together with the substrate to apply plating to the surface of the substrate, which has an advantage that bubbles can be easily removed.
[0005]
Since the substrate holder is used by immersing it in the plating solution, when the substrate is held by this substrate holder, make sure that the outer periphery of the substrate does not enter the plating solution to the back surface (anti-plating surface) side of the substrate. Need to be sealed. Therefore, for example, in a substrate holder in which a substrate is detachably held by a pair of supports (holding members), a seal member is attached to one support, and the seal member is placed and held on the other support. The outer peripheral portion of the substrate is sealed by being pressed against the peripheral portion of the substrate.
[0006]
Here, in order to hold the substrate with one touch, a holding member is rotatably and irremovably attached to one support, and the holding member is rotated in one direction to press the support toward the other support. By tightening, the substrate is held.
[0007]
[Problems to be solved by the invention]
In a conventional substrate holder in which a holding member of this type is rotated in one direction to hold a substrate, generally, the holding member and a tightening member such as a clamper, etc. The holding member and the support are configured to be in sliding contact with each other. For this reason, the frictional resistance of the sliding contact portion is considerably large, and a considerably large force is required to rotate the holding member. Large wear occurs on the member. In addition, the support on which the holding member is attached rotates together with the holding member, causing a positional shift, thereby affecting the centering of the substrate, and the sealing member is twisted to deteriorate the sealing performance. There was a problem that there was.
[0008]
The present invention has been made in view of the above circumstances, and a substrate holder capable of rotating a holding member with low frictional force while preventing displacement of a support to reduce wear of a component member. An object is to provide a plating apparatus provided with the substrate holder.
[0009]
[Means for Solving the Problems]
According to the first aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and a holding member is moved to hold the substrate by tightening the movable holding member to the fixed holding member. In the substrate holder, the movable holding member is pressed toward the fixed holding member, and the holding member is moved in a state where the seal member is crushed to hold the substrate. It is a substrate holder.
[0010]
Thereby, for example, in a substrate holder in which the holding member is rotated to hold the substrate, the movable holding member is prevented from rotating with the rotation of the holding member, thereby preventing displacement of the movable holding member. In addition, the vertical load acting between the holding member and another sliding member is reduced, and the holding member can be rotated with low friction. The same applies to a substrate holder that holds a substrate by moving a pressing member in a horizontal direction.
[0011]
The invention described in claim 2 is characterized in that the pressing of the movable holding member toward the fixed holding member is performed in a spot shape at a predetermined position along the outer periphery of the movable holding member. Item 2. A substrate holder according to item 1.
[0012]
The invention described in claim 3 is characterized in that the pressing of the movable holding member toward the fixed holding member is performed at a position over the entire circumference along the outer circumference of the movable holding member. 1. The substrate holder according to 1. Thereby, the sealing member can be uniformly crushed so that the pressing force acts more uniformly over the entire periphery along the outer periphery of the sealing member.
[0013]
According to a fourth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and a holding member is moved to hold the substrate by tightening the movable holding member to the fixed holding member. In doing so, there is provided a method for tightening a substrate holder, wherein the movable holding member is pressed toward the fixed holding member and the holding member is moved in a state where the seal member is crushed.
[0014]
According to a fifth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, a pressing member is moved, and the movable holding member is fastened to the fixed holding member to hold the substrate. A substrate holder configured to hold the substrate by pressing the movable holding member toward the fixed holding member and moving the pressing member in a state where the seal member is crushed. It is a plating apparatus characterized by having.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows an overall layout of a plating apparatus provided with a substrate holder according to an embodiment of the present invention. As shown in FIG. 1, in this plating apparatus, two cassette tables 12 on which a cassette 10 containing a substrate W such as a semiconductor wafer is mounted, and a position such as an orientation flat or a notch of the substrate W are aligned in a predetermined direction. An aligner 14 and a spin dryer 16 for rotating the substrate W after the plating process at a high speed and drying the substrate W are provided. Further, near this, there is provided a substrate attaching / detaching portion 20 for mounting the substrate holder 18 and attaching / detaching the substrate W to / from the substrate holder 18, and in the center of these units, the substrate W is placed between them. A substrate transfer device 22 including a transfer robot for transferring is provided.
[0016]
Then, in order from the substrate attaching / detaching portion 20, the stocker 24 for storing and temporarily placing the substrate holder 18, the pre-wet bath 26 for immersing the substrate W in pure water, and the seed layer 500 formed on the surface of the substrate W (FIG. Reference) A presoak tank 28 for etching and removing an oxide film on the surface, a first washing tank 30a for washing the surface of the substrate W with pure water, a blow tank 32 for draining the washed substrate W, and a second washing tank 30b. And a plating tank 34 are arranged in this order. The plating tank 34 is configured by housing a plurality of copper plating units 38 inside an overflow tank 36, and each copper plating unit 38 houses one substrate W inside and performs plating such as copper plating. To be applied. In this example, copper plating will be described, but it goes without saying that the same applies to nickel, solder, silver, and even gold plating.
[0017]
Further, there is provided a substrate holder transfer device 40 which is located at a side of each of these devices and which transfers the substrate holder 18 together with the substrate W between the respective devices, for example, adopts a linear motor system. The substrate holder transport device 40 includes a first transporter 42 that transports a substrate W between the substrate attaching / detaching portion 20 and the stocker 24, a stocker 24, a pre-wet tank 26, a pre-soak tank 28, a washing tank 30a, 30b, A second transporter 44 for transporting the substrate W between the blow tank 32 and the copper plating tank 34 is provided. Note that the second transporter 44 may not be provided, and only the first transporter 42 may be provided.
[0018]
A paddle (not shown) serving as a stirring rod for stirring the plating solution, which is located inside each copper plating unit 38, is driven on the opposite side of the overflow holder 36 of the substrate holder transporting device 40. A paddle driving device 46 is provided.
[0019]
The substrate attaching / detaching portion 20 includes a flat mounting plate 52 that is slidable along the rail 50 in the horizontal direction, and the two substrate holders 18 are mounted on the mounting plate 52 in a horizontal state in parallel. After the transfer of the substrate W between the one substrate holder 18 and the substrate transfer device 22, the mounting plate 52 is slid in the horizontal direction, and the transfer between the other substrate holder 18 and the substrate transfer device 22 is performed. The transfer of the substrate W is performed between them.
[0020]
As shown in FIGS. 2 to 7, the substrate holder 18 is, for example, a rectangular flat plate-shaped fixed holding member 54 made of vinyl chloride, and a movable holding member which is attached to the fixed holding member 54 via a hinge 56 so as to be freely opened and closed. 58. The movable holding member 58 has a base portion 58a and a ring-shaped portion 58b, and is made of, for example, vinyl chloride to improve sliding with a pressing member 60 described below. On the opposite surface, an inner seal member 62 is attached by protruding inward via bolts 64 (see FIG. 6), and on the surface on the fixed holding member 54 side, a dovetail-shaped seal groove 66 is provided. An outer seal member 68 is mounted inside the seal groove 66.
[0021]
When the substrate W is held by the substrate holder 18, the inner seal member 62 presses against the peripheral edge of the surface (plated surface) of the substrate W to seal the peripheral edge thereof. A sealing portion 62a is provided which protrudes toward the movable holding member 58 side and linearly contacts the peripheral portion of the substrate W. The inner seal member 62 is formed integrally with the holding member 70 by holding substantially the entire surface of the holding member 70 made of, for example, titanium.
[0022]
In this way, by forming the inner seal member 62 and the holding member 70 holding the inner seal member 62 into an integral structure, the movable holding member 58 is moved to release the holding of the substrate W after plating, and the substrate W When removing the inner seal member 62 from the substrate holder 18, the seal portion 62 a of the inner seal member 62 is prevented from attaching to the substrate W and the inner seal member 62 is prevented from rolling up from the holding member 70, and the inner seal member 62 and the substrate W Can be improved. Moreover, by making the inner seal member 62 linearly contact the substrate W via the seal portion 62a, the inner seal member 62 is reliably sealed with a low tightening pressure, and an area that can be effectively used as a pattern formation region of the substrate W. Can be spread.
[0023]
On the other hand, when the substrate W is held by the substrate holder 18, the outer seal member 68 presses the outer surface of the inner seal member 62 against the surface of the fixed holding member 54 on the side of the movable holding member 58 to seal it. In this example, a multiple seal structure having two ring-shaped seal portions 68a and 68b projecting downward and another seal portion 68c at the center thereof is used as the outer seal member 68.
[0024]
As described above, by using the multiple seal structure as the outer seal member 68, the multiple seal structure is formed between the movable holding member 58 and the fixed holding member 54 to which the outer seal member 68 attached to the movable holding member 58 contacts. Multiple sealing is performed by the outer sealing member 68 made of a structure, so that the sealing performance here can be more complete.
[0025]
Further, in this example, the outer seal member 68 diverges toward the opposite side of the seal portions 68a, 68b, 68c, and when pressed in the width direction, easily collapses to reduce the width. A W-shaped cross section that returns outward by force is used. Accordingly, when the outer seal member 68 is mounted in the dovetail-shaped seal groove 66, the mounting side end of the outer seal member 68 is crushed in the width direction, so that the outer seal member 68 is mounted in the seal groove 66. Is easily performed, and the outer seal member 68 after being attached is expanded outward by its elastic force, whereby the escape of the outer seal member 68 from the seal groove 66 can be reliably prevented. Further, by making the side surface of the outer seal member 68 contact the side wall surface of the seal groove 66 with a certain elastic force, it is possible to prevent the liquid from accumulating in the contact portion.
[0026]
A step is provided on the outer peripheral portion of the movable holding member 58, and a pressing member 60 is mounted on the step via a pressing plate 72 so as not to escape and to be rotatable. The holding member 60 has excellent corrosion resistance to an oxidizing environment and has sufficient rigidity, for example, is made of titanium.
[0027]
An inverted L-shaped clamper 74 having a protruding portion protruding inward is provided on the fixed holding member 54 at equal intervals along the circumferential direction, located outside the pressing member 60. The lower surface of the surface of the presser member 60 and the lower surface of the inwardly protruding portion of the clamper 74 located so as to cover the surface are tapered surfaces inclined in opposite directions along the rotation direction. Further, as described below, the rotating pin 112 is inserted into a plurality of locations (for example, four places) along the circumferential direction of the holding member 60, and the holding member 60 is rotated by rotating the rotating pin 112. An elongated hole 60a to be rotated is provided.
[0028]
Thus, with the movable holding member 58 opened, the substrate W is inserted into the center of the fixed holding member 54, the movable holding member 58 is closed via the hinge 56, and the pressing member 60 is rotated clockwise. By sliding the outer peripheral portion of the holding member 60 into the inwardly protruding portion of the clamper 74, the fixed holding member 54 and the movable holding member 58 are connected via the tapered surfaces respectively provided on the holding member 60 and the clamper 74. The lock is released by tightening and locking each other, rotating the presser member 60 counterclockwise and pulling it out of the protrusion of the inverted L-shaped clamper 74. When the movable holding member 58 is locked in this manner, the sealing portion 62a of the inner sealing member 62 is on the surface of the substrate W, and the sealing portions 68a, 68b, 68c of the outer sealing member 68 are on the surface of the fixed holding member 54. The respective members are pressed against each other to uniformly press the seal members 62 and 68 so as to securely seal them.
[0029]
At the center of the fixed holding member 54, a ridge 82 that projects in a ring shape according to the size of the substrate W, and whose surface comes into contact with the peripheral edge of the substrate W to become a support surface 80 that supports the substrate W is provided. A concave portion 84 is provided at a predetermined position along the circumferential direction of the ridge portion 82.
[0030]
As shown in FIG. 5, in each of the concave portions 84, a plurality (12 in the figure) of conductors (electric contacts) 86 connected to a plurality of wirings extending from external contacts provided on the hand 120 described below, respectively. When the substrate W is placed and placed on the support surface 80 of the fixed holding member 54, the end of the conductor 86 has a spring property on the surface of the fixed holding member 54 on the side of the substrate W. It is exposed.
[0031]
On the other hand, a leg 88a of an electric contact 88 is fixed to a position of the ring-shaped portion 58b of the movable holding member 58 facing the conductor 86. The electric contact 88 is formed in a leaf spring shape, and has a function of positioning (centering) the substrate W. That is, the electric contact 88 has a contact portion 88b located outside of the inner seal member 62 and protruding inward in a leaf spring shape. When the substrate W is easily bent by holding the substrate W with the fixed holding member 54 and the movable holding member 58, the contact portion 88b of the electric contact 88 is supported on the support surface 80 of the fixed holding member 54. It is configured to elastically contact the outer peripheral surface of W.
[0032]
Then, as shown in FIG. 5A, the substrate W is placed on the support surface 80 of the fixed holding member 54, and further, as shown in FIGS. 5B to 5C, the movable holding member 58 When the substrate W is held by being moved and locked in the direction of the fixed holding member 54, the exposed portion of the conductor 86 is elastically attached to the lower surface of the leg 88 a of the electric contact 88 via the elastic force of the exposed portion of the conductor 86. Then, the substrate W is elastically contacted with the contact portion 88b of the electrical contact 88 via the elastic force of the contact portion 88b. Thus, power can be supplied to the substrate W via the electric contacts 88 while the substrate W is sealed by the seal members 62 and 68 and held by the substrate holder 18.
[0033]
As described above, the electric contact 88 is formed in a leaf spring shape, and the contact end of the contact portion 88b of the electric contact 88 is brought into contact with the substrate W through the elastic force of the electric contact 88 itself. In addition, the electrical contact 88 can be brought into contact with the substrate W at the outer peripheral portion of the substrate W, so that the area that can be effectively used as a pattern formation region of the substrate W can be increased. Further, when the substrate W is held by the substrate holder 18, the substrate W is urged inward by the elastic force of the contact portion 88 b of the electrical contact 88 in the form of a leaf spring, so that the substrate W is Positioning (centering) of the W with respect to the substrate holder 18 can be performed.
It is preferable that at least the surface of the conductor 86 that is in contact with the electric contact 88 be covered with gold or platinum plating, for example.
[0034]
As shown in FIG. 6, a tapered portion 82 a having a spire-shaped tapered surface is provided on a part of the ridge portion 82 of the fixed holding member 54, and a ring-shaped portion 58 b of the movable holding member 58 is provided. When the substrate W is held by the fixed holding member 54 and the movable holding member 58 at positions on the inner peripheral surface facing the tapered portion 82a, the tapered surface and the reverse tapered surface of the tapered portion 82a engage with each other. A tapered portion 90 is provided for positioning with respect to the center of both 54 and 58. In other words, as shown in FIG. 6A, the substrate W is placed on the support surface 80 of the fixed holding member 54, and further, as shown in FIGS. 6B to 6C, the movable holding member 58 When the substrate W is moved and locked in the direction of the fixed holding member 54 to hold the substrate W, the tapered portions 82a and 90 guide each other, and the positioning of the movable holding member 58 with respect to the fixed holding member 54 (or vice versa). Is being done.
[0035]
As described above, by providing the tapered portions 82a and 90 that are engaged with the protrusions 82 of the fixed holding member 54 and the ring-shaped portion 58b of the movable holding member 58, the fixed holding member 54 and the movable holding member 58 are separated. Even if the positioning of the two members 54 and 58 is not accurate at the position, the two members 54 and 58 are formed via the tapered portions 82 a and 90 engaged with each other in the process of holding the substrate W with the fixed holding member 54 and the movable holding member 58. Can be automatically positioned with respect to the center.
[0036]
Thus, in the process of holding the substrate W with the fixed holding member 54 and the movable holding member 58 as described above, the substrate W is positioned with respect to the centers of the two members 54 and 58, and further, via the leaf-spring-shaped electric contacts 88. The positioning (centering) of the substrate W with respect to the substrate holder 18 and eventually the inner seal member 62 can be performed simultaneously.
[0037]
Further, as shown in FIG. 2, the protrusions 82 of the fixed holding member 54 are provided with slightly wide recesses 92 at 22 places in this example, which are located on the opposite side of the hinge 56. A suction pad 94 is accommodated in the inside 92. As shown in detail in FIG. 7, the suction pad 94 is made of a flexible material such as rubber, has a conical cup portion 96 having a vacuum inside, and holds the fixed holding member 54 through a bolt 100. Mounted on. Then, when the substrate W is held by the substrate holder 18, the substrate W presses the cup portion 96, and the cup portion 96 is pushed outward, so that the back surface of the substrate is passed through the vacuum portion in the cup portion 96. It is designed to adsorb the side.
[0038]
Thus, after the plating is completed, the movable holding member 58 is moved to release the holding of the substrate W, and when the substrate W is taken out from the substrate holder 18, the back surface side of the substrate W is sucked by the suction pad 94, so that the substrate W Can be prevented from moving together with the inner seal member 62 while being stuck to the inner seal member 62. In addition, when the automatic operation is performed using the automatic transfer device, the substrate W is not lifted, so that the substrate W can always be stably taken out from the substrate holder 18. As described above, when the substrate W is taken out from the substrate holder 18, the suction force of the suction pad 94 is large enough to easily separate the substrate W from the inner seal member 62 and to transfer the substrate to and from the robot. Is set to
[0039]
In addition, by providing the suction pad 94 at a position corresponding to the peripheral portion of the substrate W opposite to the hinge 56 with the center of the substrate W held by the substrate holder 18 therebetween, the movable holding member 58 can be moved via the hinge 56. At the time of opening, the suction pad 94 prevents lifting of a portion which is attached to the inner seal member 62 and is first lifted, so that the substrate W can be effectively separated from the inner seal member 62.
[0040]
The movable holding member 58 is opened and closed by the weight of a cylinder (not shown) and the movable holding member 58. That is, the fixed holding member 54 is provided with a through hole 54a, and a cylinder is provided at a position facing the through hole 54a when the substrate holder 18 is mounted on the mounting plate 52. Thus, the cylinder rod is extended, the movable holding member 58 is opened by pushing up the base 58a of the movable holding member 58 upward with a pressing rod through the through-hole 54a, and the movable rod 58 is contracted by contracting the cylinder rod. It is designed to close under its own weight.
[0041]
In this example, the movable holding member 58 is locked / unlocked by rotating the holding member 60. 8 and 9 show the lock / unlock mechanism 110. This lock / unlock mechanism 110 is provided on the ceiling side, and when the substrate W is put into the substrate holder 18 placed on the placing plate 52 and the movable holding member 58 is closed via the hinge 56. A rotating pin 112 located at a position corresponding to each elongated hole 60a of the holding member 60 of the substrate holder 18 located at the center side. Is vertically provided on the lower surface of the main body. Further, a pressing rod 116 is provided which is vertically movable and presses the ring-shaped portion 58b of the movable holding member 58 of the substrate holder 18 mounted on the mounting plate 52 toward the fixed holding member 54. A long hole 114 a extending in the circumferential direction is provided at a position facing the pressing rod 116.
[0042]
Thereby, as described above, the substrate holder 18 in which the substrate W is inserted and the movable holding member 58 is closed is raised together with the mounting plate 52, and after the rotation pin 112 is positioned in the long hole 60a of the holding member 60. Then, the pressing rod 116 is lowered to press the movable holding member 58 downward, whereby the seal members 62 and 68 are first crushed so that the movable holding member 58 is not rotated. Is rotated to rotate the holding member 60, and the holding member 60 is inserted into the clamper 74 to lock the movable holding member 58.
[0043]
As described above, by first rotating the pressing member 60 via the rotating pin 112 in a state where the movable holding member 58 is prevented from rotating by lowering the pressing rod 116, the rotation of the pressing member 60 can be performed with low friction. It can be carried out. Thereby, the wear of the pressing member 60, the clamper 74, and the movable holding member 58 is reduced, and the displacement of the movable holding member 58 due to the co-rotation caused by the rotation of the pressing member 60 is prevented. It is possible to prevent the seal members 62 and 68 from being twisted and the sealing properties from being deteriorated.
[0044]
In addition, a ring-shaped thing is used as a rotating body, and instead of the pressing rod 116, a cylindrical pressing member 116 a shown by oblique lines in FIG. 9 is used, whereby the movable holding member 58 is moved by the pressing member 116 a. You may make it press the ring-shaped part 58b more uniformly over the perimeter.
[0045]
This lock / unlock mechanism 110 is provided, locks (or unlocks) one of the two substrate holders 18 placed on the mounting plate 52, and then moves the mounting plate 52 in the horizontal direction. By sliding, the other substrate holder 18 is locked (or unlocked). The substrate holder 18 is provided with a sensor for confirming a contact state between the substrate W and the contact when the substrate W is mounted, and a signal from this sensor is input to a controller (not shown). Has become.
[0046]
A pair of substantially T-shaped hands 120 serving as support portions for transporting and suspending and supporting the substrate holder 18 are connected to an end of the fixed holding member 54 of the substrate holder 18. Then, in the stocker 24, the protruding end of the hand 120 is hooked on the upper surface of the peripheral wall to suspend it vertically, and the hand 120 of the suspended substrate holder 18 is moved to the The substrate holder 18 is transported while being held by the transporter 42. In the pre-wet tank 26, the pre-soak tank 28, the rinsing tanks 30a and 30b, the blow tank 32, and the copper plating tank 34, the substrate holder 18 is also suspended from the peripheral wall via the hand 120 and held.
[0047]
A series of bump plating processes performed by the plating apparatus configured as described above will be described. First, as shown in FIG. 14A, a seed layer 500 as a power supply layer was formed on the surface, and a resist 502 having a height H of, for example, 20 to 120 μm was applied to the entire surface of the seed layer 500. Thereafter, a substrate provided with an opening 502a having a diameter D of, for example, about 20 to 200 μm at a predetermined position of the resist 502 is accommodated in the cassette 10 with its surface (plated surface) facing upward. Is mounted on the cassette table 12.
[0048]
One substrate is taken out from the cassette 10 mounted on the cassette table 12 by the substrate transfer device 22, placed on the aligner 14, and the orientation of the orientation flat or notch is adjusted in a predetermined direction. The substrate aligned by the aligner 14 is transported to the substrate attaching / detaching portion 20 by the substrate transporting device 22.
[0049]
In the substrate attaching / detaching section 20, two substrate holders 18 accommodated in the stocker 24 are simultaneously held by the transporters 42 of the substrate holder transporting device 40, and are transported to the substrate attaching / detaching section 20. Then, the substrate holder 18 is lowered in a horizontal state, whereby the two substrate holders 18 are simultaneously mounted on the mounting plate 52 of the substrate attaching / detaching portion 20, and the cylinder is operated to move the substrate holder 18. The holding member 58 is kept open.
[0050]
In this state, the substrate transferred by the substrate transfer device 22 is inserted into the substrate holder 18 located on the center side, the cylinder is reversely operated to close the movable holding member 58, and then the movable holding member 58 is locked and unlocked by the lock / unlock mechanism. Lock 58. After the mounting of the substrate on one of the substrate holders 18 is completed, the mounting plate 52 is slid in the lateral direction, and the substrate is mounted on the other substrate holder 18 in the same manner. Return 52 to its original position.
[0051]
Thereby, the substrate W is sealed with the sealing members 62 and 68 so that the plating solution does not enter, with the surface on which the plating process is performed exposed from the opening of the substrate holder 18, and the substrate W is sealed with the plating solution by the seal. It is fixed so as to be electrically connected to a plurality of contacts at a portion that does not touch. Here, wiring is connected from the contact point to the hand 120 of the substrate holder 18, and power can be supplied to the seed layer 500 of the substrate by connecting a power source to the hand 120.
[0052]
Next, the two substrate holders 18 on which the substrates W are mounted are simultaneously held by the transporters 42 of the substrate holder transport device 40 and transported to the stocker 24. Then, the substrate holder 18 is lowered in a vertical state, whereby the two substrate holders 18 are suspended and held (temporarily placed) on the stocker 24.
[0053]
In the substrate transporter 22, the substrate attaching / detaching unit 20, and the transporter 42 of the substrate holder transporter 40, the above-described operation is sequentially repeated, and the substrates are sequentially mounted on the substrate holders 18 accommodated in the stocker 24. At a predetermined position (temporary placement).
A sensor provided on the substrate holder 18 for checking the contact state between the substrate and the contact. When it is determined that the contact state is defective, a signal is input to a controller (not shown).
[0054]
On the other hand, in the other transporter 44 of the substrate holder transport device 40, the two substrate holders 18 on which the substrates are mounted and temporarily placed on the stocker 24 are simultaneously grasped, transported to the pre-wet tank 26 and lowered. Thereby, the two substrate holders 18 are put into the pre-wet bath 26.
[0055]
At this time, the sensor for checking the contact state between the substrate and the contact provided on the substrate holder 18, and the substrate holder 18 containing the substrate determined to have a bad contact state is temporarily placed in the stocker 24. And leave. Thus, even if a contact failure occurs between the substrate and the contact when the substrate is mounted on the substrate holder 18, the plating operation can be continued without stopping the apparatus. The substrate having the poor contact is not subjected to the plating treatment. In this case, it is possible to cope with this by removing the unplated substrate from the cassette after returning the cassette.
[0056]
Next, the substrate holder 18 on which the substrate is mounted is transferred to the presoak tank 28 in the same manner as described above, and the oxide film is etched in the presoak tank 28 to expose a clean metal surface. Further, the substrate holder 18 on which the substrate is mounted is transported to the washing tank 30a in the same manner as described above, and the surface of the substrate is washed with pure water in the washing tank 30a.
[0057]
The substrate holder 18 on which the rinsed substrate is mounted is transported to the plating bath 34 filled with the plating solution and suspended and held by the plating unit 38 in the same manner as described above. The transporter 44 of the substrate holder transport device 40 sequentially repeats the above-described operations, sequentially transports the substrate holders 18 on which the substrates are mounted to the plating unit 38 of the plating tank 34, and suspends the substrate holders 18 at predetermined positions.
[0058]
After the suspension of all the substrate holders 18 is completed, the plating solution in the overflow tank 36 is circulated, and the plating voltage is applied between the anode (not shown) in the plating tank 34 and the substrate W while overflowing. Is applied, and at the same time, the paddle is reciprocated by the paddle driving device 46 in parallel with the surface of the substrate, thereby plating the surface of the substrate. At this time, the substrate holder 18 is suspended and fixed by the hand 120 above the plating unit 38, and is supplied with power from the plating power supply to the seed layer 500 (see FIG. 14) through the conductor 86 and the electrical contacts 88.
[0059]
After the plating is completed, the application of the plating power supply, the supply of the plating solution, and the reciprocating motion of the paddle are stopped. In the same manner as described above, the substrate is conveyed to the washing tank 30b, and is immersed in pure water in the washing tank 30b to wash the surface of the substrate with pure water. Next, the substrate holder 18 on which the substrate W is mounted is transported to the blow tank 32 in the same manner as described above, where water droplets attached to the substrate holder 18 are removed by blowing air. Thereafter, the substrate holder 18 on which the substrate W is mounted is returned to a predetermined position of the stocker 24 and suspended and held in the same manner as described above.
[0060]
The transporter 44 of the substrate holder transport device 40 sequentially repeats the above operation, and returns the substrate holder 18 on which the plated substrate is mounted to the predetermined position of the stocker 24 in sequence, and suspends and holds the substrate holder 18.
[0061]
On the other hand, in the other transporter 42 of the substrate holder transport device 40, the two substrate holders 18 having the plated substrates W mounted thereon and returned to the stocker 24 are simultaneously grasped, and the substrate is removed and attached in the same manner as described above. It is mounted on the mounting plate 52 of the unit 20. At this time, the sensor provided on the substrate holder 18 for checking the contact state between the substrate and the contact point is mounted on the substrate holder 18 which is determined to have a bad contact state and is temporarily placed in the stocker 24. At the same time, they are transported and placed on the placement plate 52.
[0062]
Then, the lock of the movable holding member 58 of the substrate holder 18 located at the center side is released via the lock / unlock mechanism, and the movable holding member 58 is opened by operating the cylinder. At this time, as described above, the movable holding member 58 is prevented from being opened while the substrate W is attached to the movable holding member 58. In this state, the substrate W after the plating process in the substrate holder 18 is taken out by the substrate transport device 22 and transported to the spin dryer 16, and the spin-dried (water drained) substrate is rotated by the high speed rotation of the spin dryer 16. To return to the cassette 10.
[0063]
Then, after the substrate mounted on one substrate holder 18 was returned to the cassette 10 or in parallel with this, the mounting plate 52 was slid in the horizontal direction, and similarly mounted on the other substrate holder 18. The substrate is spin-dried and returned to the cassette 10.
[0064]
After the mounting plate 52 is returned to the original state, the two substrate holders 18 from which the substrates have been taken out are simultaneously held by the transporters 42 of the substrate holder transporting device 40, and in the same manner as described above, this is Return to place. Thereafter, the two substrate holders 18 on which the plated substrates have been mounted and returned to the stocker 24 are simultaneously held by the substrate holder transport device 40, and placed on the mounting plate 52 of the substrate attaching / detaching portion 20 in the same manner as described above. Place it and repeat the same operation as above.
[0065]
Then, all the substrates are taken out from the substrate holder 18 having the plated substrate mounted thereon and returned to the stocker 24, spin-dried and returned to the cassette 10 to complete the operation. Thus, as shown in FIG. 14B, a substrate W in which the plating film 504 is grown in the opening 502a provided in the resist 502 is obtained.
[0066]
Next, the substrate W spin-dried as described above is immersed in a solvent such as acetone at a temperature of, for example, 50 to 60 ° C., and the resist 502 on the substrate W is peeled off as shown in FIG. Remove. Then, as shown in FIG. 14D, the unnecessary seed layer 500 exposed to the outside after the plating is removed, and a bump made of the plating film 504 is formed.
[0067]
In this example, a stocker 24 for vertically storing the substrate holder 18 is disposed between the substrate attaching / detaching portion 20 and the copper plating unit 38, and the substrate holder 18 between the substrate attaching / detaching portion 20 and the stocker 24 is disposed. The first transporter 42 of the substrate holder transport device 40 transports the substrate holder 18 between the stocker 24 and the copper plating unit 38 by the second transporter 44, so that the transport when not in use is performed. The substrate holder 18 is stored in the stocker 24, and the transfer of the substrate holder 18 before and after sandwiching the stocker 24 is performed smoothly to improve the throughput. Needless to say, all transports may be performed by one transporter.
[0068]
In addition, a robot having a dry hand and a wet hand is used as the substrate transfer device 22, a wet hand is used only when the substrate after plating is taken out from the substrate holder 18, and a dry hand is used in other cases. The back surface of the substrate is kept out of contact with the plating solution by the seal of the substrate holder 18, and in principle, it is not always necessary to use a wet hand. Plating solution contamination due to wraparound or poor sealing occurs, and this contamination can be prevented from contaminating the back surface of a new substrate.
[0069]
Note that, in the above example, the electrical contact 88 is configured by a single plate-shaped plate having a leaf spring shape. However, as shown in FIG. 10, two or more plate spring-shaped plate members are formed. The electrical contact 88 may be constituted by a leaf spring 124 in which the 122a and 122b are overlapped.
[0070]
Thus, even in a place where the installation space is considerably narrow, the electric contact 88 (laminated leaf spring 124) capable of securing a long stroke without causing plastic deformation is installed. 124), the substrate W can be positioned (centered) with respect to the substrate holder 18 and energized to the substrate W in the process of holding the substrate W with the substrate holder 18.
[0071]
In this example, the leaf spring 124 also serves as the electric contact 88, so that it is not necessary to separately provide a dedicated leaf spring solely for positioning (centering) the substrate. Although a simplification has been made, a dedicated leaf spring may be provided separately only for the purpose of positioning (centering) the substrate.
[0072]
As shown in FIGS. 11 to 13, the outer seal member 68 has two ring-shaped seal portions 126 a and 126 b on both sides in the width direction, and is further provided at a predetermined position along the circumferential direction. A multiple seal structure 128 provided with a partition seal portion 126c extending in the width direction may be used. This also achieves more complete sealing, and, for example, in FIG. 12, X adjacent to the ring-shaped seal portions 126a and 126b with the partition seal portion 126c interposed therebetween. ₁ Division and X ₂ Even if the part is damaged, this damaged X ₁ Division and X ₂ The sealability can be maintained by the partition seal portion 126c located between the first and second portions.
[0073]
As described above, according to this plating apparatus, by setting the cassette containing the substrate on the cassette table and starting the apparatus, the electroplating employing the dipping method is performed fully automatically, and the plating is performed on the surface of the substrate. A metal plating film suitable for a bump or the like can be formed automatically.
In the above example, an example is shown in which the holding member is rotated and the substrate is held by rotating the holding member. However, the holding member is moved in parallel in one direction to hold the substrate. Needless to say, the present invention can be applied to the substrate holder configured as described above.
[0074]
【The invention's effect】
As described above, according to the present invention, for example, the movable holding member is prevented from rotating with the rotation of the holding member of the substrate holder configured to hold the substrate by rotating the holding member. The displacement of the members can be prevented, thereby preventing the centering of the substrate from being affected and the sealing member from being twisted to deteriorate the sealing performance. In addition, the vertical load acting between the holding member and other sliding members can be reduced, and the holding member can be rotated with low friction, thereby reducing wear and dust generation of the constituent members. it can.
[Brief description of the drawings]
FIG. 1 is an overall layout view of a plating apparatus provided with a substrate holder according to an embodiment of the present invention.
FIG. 2 is a plan view of the substrate holder shown in FIG.
FIG. 3 is a right side view of the substrate holder shown in FIG.
FIG. 4 is a vertical sectional front view of the substrate holder shown in FIG. 1;
FIG. 5 is a cross-sectional view showing a relationship between a conductor and an electric contact when the substrate is held by the substrate holder shown in FIG.
6 is a cross-sectional view illustrating a relationship between a tapered portion of a fixed holding member and a tapered portion of a movable holding member when the substrate is held by the substrate holder illustrated in FIG.
FIG. 7 is a cross-sectional view of a mounting portion of a suction pad in the substrate holder shown in FIG.
FIG. 8 is a cross-sectional view showing a state where the substrate holder is locked by the lock / unlock mechanism.
FIG. 9 is a plan view of a lock / unlock mechanism.
FIG. 10 is a cross-sectional view showing an example in which the electric contact is constituted by a leaf spring.
FIG. 11 is a plan view showing another example of the outer seal member.
FIG. 12 is an enlarged view of a portion A in FIG. 11;
FIG. 13 is a cross-sectional view of FIG.
FIG. 14 is a cross-sectional view showing a process of forming a bump (protruding electrode) on a substrate in the order of steps.
[Explanation of symbols]
10 cassettes
12 cassette table
14 Aligner
16 Spin dryer
18 Substrate holder
20 Board detachable part
22 Substrate transfer device
24 Stocker
26 Pre-wet tank
28 presoak tank
30a, 30b Rinse tank
32 blow tank
34 Plating tank
36 Overflow tank
38 Plating unit
40 Substrate holder transfer device
42,44 Transporter
46 paddle drive
54 Fixed holding member
56 Hinge
58 Movable holding member
58a base
58b ring-shaped part
60 Holding member
62 Inner seal member
66 Seal groove
68 Outer seal member
74 Clamper
80 Support surface
82 ridge
86 conductor
88 electrical contacts
94 Suction pad
96 cups
98 vacuum section
110 Lock / Unlock mechanism
112 Rotating pin
114 rotating plate
116 Push rod
122a, 122b plate
124 leaf spring
128 multiple seal structure

Claims (5)

In a substrate holder in which a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, a holding member is moved, and the movable holding member is fastened to the fixed holding member to hold the substrate.
A substrate holder, wherein the movable holding member is pressed toward the fixed holding member to move the pressing member in a state where the seal member is crushed, thereby holding the substrate. The substrate holder according to claim 1, wherein the movable holding member is pressed toward the fixed holding member in a spot shape at a predetermined position along an outer periphery of the movable holding member. 2. The substrate holder according to claim 1, wherein the movable holding member is pressed toward the fixed holding member at a position over the entire circumference along the outer circumference of the movable holding member. In interposing the substrate between the fixed holding member and the movable holding member to which the seal member is attached, and moving the pressing member to fasten the movable holding member to the fixed holding member to hold the substrate,
A method for tightening a substrate holder, wherein the movable holding member is pressed toward the fixed holding member, and the pressing member is moved in a state where the seal member is crushed. A substrate holder, wherein a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, a holding member is moved, and the movable holding member is fastened to the fixed holding member to hold the substrate. ,
A plating apparatus comprising: a substrate holder configured to press the movable holding member toward the fixed holding member and move the pressing member in a state where the seal member is crushed to hold the substrate.

Images