JP2004052059A

JP2004052059A - Substrate holder and plating equipment

Info

Publication number: JP2004052059A
Application number: JP2002213208A
Authority: JP
Inventors: Masaru Morigami; 森上　賢; Yokou Kaku; 郭　誉綱; Kuniaki Horie; 堀江　邦明
Original assignee: Ebara Corp
Current assignee: Ebara Corp
Priority date: 2002-07-22
Filing date: 2002-07-22
Publication date: 2004-02-19
Anticipated expiration: 2022-07-22
Also published as: JP4162440B2; JP2008190044A; JP4669020B2; JP4722955B2; JP2008190043A

Abstract

<P>PROBLEM TO BE SOLVED: To make perfectability of sealing by a sealing material higher and to easily and surely take out a substrate. <P>SOLUTION: A substrate holder is arranged to hold the substrate by interposing the substrate between a stationary holding member 54 and a moving holding member 58 mounted with the sealing member and by pressing the member 58 toward the member 54, in which the member 54 is mounted with suction pads 94 for sucking the rear surface side of the substrate held by the member 54 and the member 58. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、例えば基板の被めっき面にめっきを施すめっき装置、特に半導体ウエハ等の表面に設けられた微細な配線用溝やホール、レジスト開口部にめっき膜を形成したり、半導体ウエハの表面にパッケージの電極等と電気的に接続するバンプ（突起状電極）を形成したりするめっき装置等に使用される基板ホルダ、及び係る基板ホルダを備えためっき装置に関する。
【０００２】
【従来の技術】
例えば、ＴＡＢ（Ｔａｐｅ　Ａｕｔｏｍａｔｅｄ　Ｂｏｎｄｉｎｇ）やフリップチップにおいては、配線が形成された半導体チップの表面の所定箇所（電極）に金、銅、はんだ、或いはニッケル、更にはこれらを多層に積層した突起状接続電極（バンプ）を形成し、このバンプを介してパッケージの電極やＴＡＢ電極と電気的に接続することが広く行われている。このバンプの形成方法としては、電解めっき法、蒸着法、印刷法、ボールバンプ法といった種々の手法があるが、半導体チップのＩ／Ｏ数の増加、細ピッチ化に伴い、微細化が可能で性能が比較的安定している電解めっき法が多く用いられるようになってきている。
【０００３】
ここで、電解めっき法は、半導体ウエハ等の基板の被めっき面を下向き（フェースダウン）にして水平に置き、めっき液を下から噴き上げてめっきを施す噴流式またはカップ式と、めっき槽の中に基板を垂直に立て、めっき液をめっき槽の下から注入しオーバーフローさせつつめっきを施すディップ式に大別される。ディップ方式を採用した電解めっき法は、めっきの品質に悪影響を与える泡の抜けが良く、フットプリントが小さいという利点を有しており、このため、めっき穴の寸法が比較的大きく、めっきにかなりの時間を要するバンプめっきに適していると考えられる。
【０００４】
従来のディップ方式を採用した電解めっき装置にあっては、半導体ウエハ等の基板をその端面と裏面をシールし表面（被めっき面）を露出させて着脱自在に保持する基板ホルダを備え、この基板ホルダを基板ごとめっき液中に浸漬させて基板の表面にめっきを施すようにしており、気泡が抜けやすくできる利点を有している。
【０００５】
基板ホルダは、めっき液中に浸漬させて使用するため、この基板ホルダで基板を保持した時に、基板の裏面（反被めっき面）側へめっき液が周り込まないよう、基板の外周部を確実にシールする必要がある。このため、例えば、一対のサポート（保持部材）で基板を着脱自在に保持するようにした基板ホルダにあっては、一方のサポートにシール部材を取付け、このシール部材を他方のサポートに載置保持した基板の周縁部に圧接させることで、基板の外周部をシールするようにしている。
【０００６】
【発明が解決しようとする課題】
従来のこの種の基板ホルダにあっては、シール部材の形状や固定方法等を最適化したり、定期的（毎葉を含む）にシール部材を洗浄したり、定期的にシール部材を交換したり、更には、基板の前処理（シード層やフォトレジスト膜の生成）の精度を向上させたり、基板の基板ホルダへのセッティング誤差の最小化を図るとともに、定期的な再調整を行ったりして、めっき液等の漏れをなくすようにしている。
【０００７】
しかし、シール部材の劣化等により、シールの完全性を図ることはかなり困難である。特に、めっきを施して、微細な凹部の内部にめっき膜を埋め込むようにする時には、微細な凹部内にめっき液が容易かつ確実に浸入するようにするため、一般に浸透性の良好なめっき液が使用されており、このため、完全なシールを施すことは更に困難となる。また、めっき液等の漏れを検出することも一般に困難であった。そして、一旦めっき液の漏れが発生すると、基板ホルダの内部に漏れためっき液が基板の裏面に付着し、基板搬送機器に乗り移って装置全体をめっき液で汚してしまうばかりでなく、漏れためっき液が接点を腐食させて通電を妨げてしまう。
【０００８】
更に、前述のように、一方のサポートにシール部材を取付け、このシール部材を他方のサポートに載置保持した基板の周縁部に圧接させることで、基板の外周部をシールするようにしているため、めっき終了後に、シール部材を取付けたサポートを開いて基板を基板ホルダから取出す際に、基板がシール部材にくっついたままサポートが開き、基板が脱落してしまうことがあり、この弊害防止のための何らかの対策を施す必要がある。
【０００９】
本発明は上記事情に鑑みて為されたもので、シール部材によるシールのより完全性を図るとともに、基板を容易かつ確実に取出すことができるようにした基板ホルダ及び該基板ホルダを備えためっき装置を提供することを目的とする。
【００１０】
【課題を解決するための手段】
請求項１に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダにおいて、前記固定保持部材に、該固定保持部材と前記可動保持部材で保持した基板の裏面側を吸着する吸着パッドを取付けたことを特徴とする基板ホルダである。
【００１１】
これにより、めっき終了後、可動保持部材を移動させ基板の保持を解いて、基板を基板ホルダから取出す際に、吸着パッドで基板の裏面側を吸着することで、基板がシール部材にひっついたまま該シール部材と一緒に移動することを防止することができる。しかも、自動搬送装置を用いて自動運転する場合に、基板が持ち上がったりすることがないので、常に安定して基板を基板ホルダから取出すことができる。
【００１２】
請求項２に記載の発明は、前記吸着パッドは、可撓性材料からなるカップ部で囲まれた減圧部を有し、このカップ部の開口部に基板を押付けて内部気体を外部に押出すことにより内部を減圧し減圧部内の圧力を減じることで基板を吸着するように構成されていることを特徴とする請求項１記載の基板ホルダである。
【００１３】
この吸着パッドは、いわゆる吸盤であり、この吸着力は、前述のように、基板を基板ホルダから取出す際に、基板を吸着面から吸着面に平行に移動し、吸着面と基板面を解離させることで真空を破壊させることができ、基板をシール部材から容易に分離でき、かつロボットとの間で基板の受渡しが行える大きさに設定される。即ち、吸着パッドは吸着面に垂直方向には強い密着性を有し、基板を保持することに有効であるが、平行方向には容易にずれ、分離を容易にすることが可能である。ここで、可動保持部材をヒンジを介して開閉自在に構成した場合には、吸着パッドを固定保持部材と可動保持部材で保持した基板の中心を挟んだヒンジの反対側の基板周縁部に対応する位置に設けることが好ましく、これにより、ヒンジを介して可動保持部材を開く際に、シール部材に付着して最初に持ち上がろうとする箇所の持ち上がりを吸着パッドで防止して、基板をシール部材から効果的に分離することができる。
【００１４】
請求項３に記載の発明は、前記吸着パッドは、真空ラインに接続され、この真空ラインを介して真空引きすることで、基板を吸着するように構成されていることを特徴とする請求項１記載の基板ホルダである。これにより、真空ラインを真空引きすることで基板を容易且つ確実に保持し、この真空引きを解除することで、基板の保持を解くことができる。
【００１５】
請求項４に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダにおいて、基板の周縁部をシールするシール部材を、該シール部材を保持する保持部材に一体的に取付けたことを特徴とする基板ホルダである。
これにより、めっき終了後、可動保持部材を移動させ基板の保持を解いて、基板を基板ホルダから取出す際に、基板の周縁部をシールするシール部材のシール部が基板に付着して該シール部材が保持部材から捲れてしまうことを防止して、シール部材と基板との剥離性を向上させることができる。
【００１６】
請求項５に記載の発明は、前記シール部材として、少なくとも２つのループ状シール部を有する多重シール構造体を使用したことを特徴とする請求項４記載の基板ホルダである。これにより、基板の周縁部を多重シール構造体からなるシール部材で多重にシールし、シール幅を実質的に広くして、基板のセンタリングが完全でなくても、ここでのシール性のより完全性を図ることができる。
【００１７】
請求項６に記載の発明は、前記多重シール構造体からなる外側シール部材の円周方向に沿った所定の位置に、幅方向に延びる仕切りシール部を設けたことを特徴とする請求項５記載の基板ホルダである。これにより、仕切りシール部でシール部材の円周方向に沿った所定箇所を幅方向にシールすることで、シール部材がダメージを受けても、シール性が問題とならないようにすることができる。
【００１８】
請求項７に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダにおいて、前記可動保持部材と前記固定保持部材との間をシールするシール部材として、幅方向に押圧すると潰れ、この押圧力を解くと弾性力で復帰する、横断面Ｗ字状のものを使用したことを特徴とする基板ホルダである。
【００１９】
これにより、可動保持部材と固定保持部材との間をシールするシール部材の、例えば蟻溝形状のシール溝内への装着を容易に行うとともに、このシール部材のシール溝からの脱出を確実に防止することができる。また、蟻溝を形成する時に生じる工具取出し用の切欠によって、蟻溝内にめっき液が浸入して変質或いは固化し、これによって、シール部材のシール性が悪化してしまうが、本構造により上記薬液の浸入を防止することができ、シールの確実性の向上及びシール材の耐久性の向上も可能となる。
【００２０】
請求項８に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダにおいて、前記可動保持部材に、前記可動保持部材と前記固定保持部材での基板の保持を解く際に、基板を前記固定保持部材に向けて付勢する板状のばね部材を取付けたことを特徴とする基板ホルダである。
【００２１】
これにより、めっき終了後、可動保持部材を移動させ基板の保持を解いて、基板を基板ホルダから取出す際に、板状のばね部材で基板の動きを規制して、可動保持部材に取付けたシール部材を基板から引き離すことで、基板がシール部材にひっついたまま該シール部材と一緒に移動してしまうことを防止することができる。
【００２２】
請求項９に記載の発明は、前記板ばね部材は、板ばね形状の２枚以上の板体を重ね合わせた重ね板ばねからなることを特徴とする請求項８記載の基板ホルダである。これにより、かなり狭い設置スペースであっても、ばねの塑性変形を起こすことなく、長いストロークを確保することができる板ばね部材（重ね板ばね）の設置が可能となる。
【００２３】
請求項１０に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダにおいて、前記可動保持部材と前記固定保持部材で基板を保持した時に板ばね部材が基板の外周部に弾性的に接触するように構成されていることを特徴とする基板ホルダである。
これにより、基板ホルダで基板を保持する過程で、ばね性を有する板ばね部材の弾性力で基板を内方に付勢することで、この板ばね部材を介して、基板の基板ホルダに対する位置決め（センタリング）を行うことができる。
【００２４】
請求項１１に記載の発明は、前記可動保持部材が、前記シール部材に対する基板の位置決め機能を有していることを特徴とする請求項１０記載の基板ホルダである。
【００２５】
請求項１２に記載の発明は、前記板ばね部材は、基板に接触して通電する電気接点を兼用していることを特徴とする請求項１０または１１記載の基板ホルダである。これにより、板ばね部材を別途設ける必要をなくして、構造の簡素化を図ることができる。
【００２６】
請求項１３に記載の発明は、前記可動保持部材が、前記シール部材と前記電気接点に対する基板の位置決め機能を有することを特徴とする請求項１２記載の基板ホルダである。
【００２７】
このように、可動保持部材に基板のシール部材、（基板への給電のための電気接点）及び基板のセンタリング機構を設けることで、予め基板の可動保持部材と基板のシール部材（及び基板への給電のための電気接点）の中心を合わせて製作しておき、その基板の可動保持部材が基板のセンタリング機能を有することで、可動保持部材が基板の載置された固定保持部材と係合されるときに上記基板のセンタリング機能で基板を可動保持部材中心とほぼ合致させた位置に移動させて係合することが可能となる。これにより、基板と基板のシール部材（及び基板への給電のための電気接点）との中心を、可動保持部材が固定保持部材に係合される時に自動的に合致させることができる。
【００２８】
基板の有効使用エリアが時代と共に基板の外周側へ移行しいわゆる基板のエッジ・エクスクルージョン（Ｅｄｇｅ　ｅｘｃｌｕｓｉｏｎ）領域が非常に狭い状況においても、その狭い領域内で確実に基板のシールと基板への給電を実施することが可能となる。
【００２９】
請求項１４に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダにおいて、前記固定保持部材には、前記可動保持部材と前記固定保持部材で保持した基板の裏面側にめっき液が漏れたとき、この漏れためっき液を介して短絡する液漏れ検知用の少なくとも一対の導電体が設けられていることを特徴とする基板ホルダである。
【００３０】
これにより、液漏れが発生して、一対の導電体間がめっき液を介して短絡すると、一対の導電体間に電流が流れて電気抵抗が変化する（無限大でなくなる）ため、この電気抵抗を測定するといった、比較的簡単な操作で、液漏れが発生したか否かを迅速かつ確実に検知することができる。
【００３１】
請求項１５に記載の発明は、前記一対の導電体は、漏れためっき液が溜まる固定保持部材の下部に設けられていることを特徴とする請求項１４記載の基板ホルダである。これにより、液漏れが発生した時に、この漏れためっき液が固定保持部材の下部に溜まることを利用し、導電体を局部的に配置することで、基板ホルダの全域に亘る液漏れの検知することができる。
請求項１６に記載の発明は、前記一対の導電体は、前記シール部材の内部にループ状に全周に亘って位置していることを特徴とする請求項１４記載の基板ホルダである。
【００３２】
請求項１７に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダであって、前記固定保持部材に、該固定保持部材と前記可動保持部材で保持した基板の裏面側を吸着する吸着パッドを取付けた基板ホルダを用いることを特徴とするめっき装置である。
【００３３】
請求項１８に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダであって、前記可動保持部材と前記固定保持部材との間をシールするシール部材として、幅方向に押圧すると潰れ、この押圧力を解くと弾性力で復帰する、横断面Ｗ字状のものを使用した基板ホルダを用いることを特徴とするめっき装置である。
【００３４】
請求項１９に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダであって、前記可動保持部材に、前記可動保持部材と前記固定保持部材での基板の保持を解く際に、基板を前記固定保持部材に向けて付勢する板ばね形状の板ばね部材を取付けた基板ホルダを用いることを特徴とするめっき装置である。
【００３５】
請求項２０に記載の発明は、固定保持部材とシール部材を取付けた可動保持部材との間に基板を介在させ、前記可動保持部材を前記固定保持部材に向けて押圧して基板を保持するようにした基板ホルダであって、前記固定保持部材には、前記可動保持部材と前記固定保持部材で保持した基板の裏面側にめっき液が漏れたとき、この漏れためっき液を介して短絡する液漏れ検知用の少なくとも一対の導電体が設けられている基板ホルダを用いることを特徴とするめっき装置である。
【００３６】
【発明の実施の形態】
以下、本発明の実施の形態を図面を参照して説明する。
図１は、本発明の実施の形態の基板ホルダを備えためっき装置の全体配置図を示す。図１に示すように、このめっき装置には、半導体ウエハ等の基板Ｗを収納したカセット１０を搭載する２台のカセットテーブル１２と、基板Ｗのオリフラやノッチなどの位置を所定の方向に合わせるアライナ１４と、めっき処理後の基板Ｗを高速回転させて乾燥させるスピンドライヤ１６が備えられている。更に、この近くには、基板を着脱自在に保持する基板ホルダ１８を載置して基板Ｗの該基板ホルダ１８との着脱を行う基板着脱部２０が設けられ、これらのユニットの中央には、これらの間で基板Ｗを搬送する搬送用ロボットからなる基板搬送装置２２が配置されている。
【００３７】
そして、基板着脱部２０側から順に、基板ホルダ１８の保管及び一時仮置きを行うストッカ２４、基板Ｗを純水に浸漬させるプリウェット槽２６、基板Ｗの表面に形成したシード層５００（図１７参照）表面の酸化膜をエッチング除去するプリソーク槽２８、基板Ｗの表面を純水で水洗する第１の水洗槽３０ａ、洗浄後の基板Ｗの水切りを行うブロー槽３２、第２の水洗槽３０ｂ及びめっき槽３４が順に配置されている。このめっき槽３４は、オーバーフロー槽３６の内部に複数の銅めっきユニット３８を収納して構成され、各銅めっきユニット３８は、内部に１個の基板Ｗを収納して、銅めっき等のめっきを施すようになっている。なお、この例では、銅めっきについて説明するが、ニッケルやはんだ、銀、更には金めっきにおいても同様であることは勿論である。
【００３８】
更に、これらの各機器の側方に位置して、これらの各機器の間で基板ホルダ１８を基板Ｗとともに搬送する、例えばリニアモータ方式を採用した基板ホルダ搬送装置４０が備えられている。この基板ホルダ搬送装置４０は、基板着脱部２０とストッカ２４との間で基板Ｗを搬送する第１のトランスポータ４２と、ストッカ２４、プリウェット槽２６、プリソーク槽２８、水洗槽３０ａ，３０ｂ、ブロー槽３２及びめっき槽３４との間で基板Ｗを搬送する第２のトランスポータ４４を有している。なお、第２のトランスポータ４４を備えることなく、第１のトランスポータ４２のみを備えるようにしてもよい。
【００３９】
また、この基板ホルダ搬送装置４０のオーバーフロー槽３６を挟んだ反対側には、各銅めっきユニット３８の内部に位置してめっき液を攪拌する掻き混ぜ棒としてのパドル（図示せず）を駆動するパドル駆動装置４６が配置されている。
【００４０】
基板着脱部２０は、レール５０に沿って横方向にスライド自在な平板状の載置プレート５２を備えており、この載置プレート５２に２個の基板ホルダ１８を水平状態で並列に載置して、この一方の基板ホルダ１８と基板搬送装置２２との間で基板Ｗの受渡しを行った後、載置プレート５２を横方向にスライドさせて、他方の基板ホルダ１８と基板搬送装置２２との間で基板Ｗの受渡しを行うようになっている。
【００４１】
前記基板ホルダ１８は、図２乃至図７に示すように、例えば塩化ビニル製で矩形平板状の固定保持部材５４と、この固定保持部材５４にヒンジ５６を介して開閉自在に取付けた可動保持部材５８とを有している。なお、この例では、可動保持部材５８を、ヒンジ５６を介して開閉自在に構成した例を示しているが、例えば可動保持部材５８を固定保持部材５４に対峙した位置に配置し、この可動保持部材５８を固定保持部材５４に向けて前進させて開閉するようにしてもよい。
【００４２】
この可動保持部材５８は、基部５８ａと、この例ではリング状の支持部５８ｂとを有し、例えば塩化ビニル製で、下記の押えリング６０との滑りを良くしており、その支持部５８ｂの固定保持部材５４と反対側の表面には、基板Ｗの周縁部に圧接してここをシールするシール部材（以下、内側シール部材という）６２がボルト６４（図６参照）を介して内方に突出して取付けられている。一方、固定保持部材５４側の表面には、蟻溝状のシール溝６６が設けられ、このシール溝６６の内部に、固定保持部材５４と可動保持部材５８とをシールするシール部材（同じく外側シール部材）６８が装着されている。
【００４３】
内側シール部材６２は、基板ホルダ１８で基板Ｗを保持した時、基板Ｗの表面（被めっき面）の周縁部に圧接して、ここをシールするためのものであり、内周端に、尖塔状に可動保持部材５８側に突出して基板Ｗの周縁部と線状に接触するシール部６２ａが設けられている。そして、この内側シール部材６２は、これを保持する、例えばチタン製の保持部材７０に一体的に取付けられている。つまり、内側シール部材６２は、保持部材７０のほぼ全表面を被覆した状態で該保持部材７０に貼着されて、保持部材７０から剥離したり脱落したりしないようになっている。
【００４４】
このように、内側シール部材６２を保持する保持部材７０に内側シール部材６２を一体的に取付けることで、めっき終了後、可動保持部材５８を移動させ基板Ｗの保持を解いて、基板Ｗを基板ホルダ１８から取出す際に、内側シール部材６２のシール部６２ａが基板Ｗに付着して内側シール部材６２が保持部材７０から捲れてしまうことを防止して、内側シール部材６２と基板Ｗとの剥離性を向上させることができる。しかも、シール部６２ａを介して、内側シール部材６２が基板Ｗと線状に接触するようにすることで、低締付け圧で確実にシールするとともに、基板Ｗのパターン形成領域として有効に利用できる面積を広めることができる。
【００４５】
一方、外側シール部材６８は、基板ホルダ１８で基板Ｗを保持した時、内側シール部材６２の外周において、固定保持部材５４の可動保持部材５８側表面に圧接して、ここをシールするためのものであり、この例では、外側シール部材６８として、幅方向にほぼ中央の上下面にシール部６８ａ，６８ｂを有し、シール溝６６の底部方向に向けて末広がりで、ここを幅方向に押圧すると容易に潰れて幅が狭まり、この押圧力を解くと弾性力で外方に復帰する、横断面Ｗ字状のものが使用されている。これにより、外側シール部材６８を蟻溝形状のシール溝６６へ装着する際に、外側シール部材６８の装着側端部を幅方向に潰すことで、外側シール部材６８のシール溝６６内への装着を容易に行うとともに、装着後の外側シール部材６８をその弾性力で外方に拡がらせることで、外側シール部材６８のシール溝６６からの脱出を確実に防止することができる。
【００４６】
また、シール溝６６の側壁面に外側シール部材６８の側面が一定の弾性力を持って接触するようにすることで、図７に示すように、蟻溝状のシール溝６６を形成する時に生じる工具取出し用の切欠６６ａによって、シール溝６６内にめっき液が浸入して変質あるいは固化し、これによって、外側シール部材６８のシール性が悪化してしまうが、本構造により上記薬液の浸入を防止することができ、シールの確実性の向上及びシール材の耐久性の向上も可能となる。
【００４７】
可動保持部材５８の外周部には、段部が設けられ、この段部に、押えリング６０が押え板７２を介して脱出不能かつ回転自在に装着されている。この押えリング６０は、酸化性環境に対して耐食性に優れ、十分な剛性を有する、例えばチタンから構成されている。
【００４８】
押えリング６０の外側方に位置して、固定保持部材５４には、内方に突出する突出部を有する逆Ｌ字状のクランパ７４が円周方向に沿って等間隔で立設されている。そして、押えリング６０の表面及び該表面を覆うように位置するクランパ７４の内方突出部の下面は、回転方向に沿って互いに逆方向に傾斜するテーパ面となっている。更に、押えリング６０の円周方向に沿った複数箇所（例えば４カ所）には、下記のように、内部に回転ピン１１２を挿入し、この回転ピン１１２を回転させることで、押えリング６０を回転させる長孔６０ａが設けられている。
【００４９】
これにより、可動保持部材５８を開いた状態で、固定保持部材５４の中央部に基板Ｗを挿入し、ヒンジ５６を介して可動保持部材５８を閉じ、押えリング６０を時計回りに回転させて、押えリング６０の外周部をクランパ７４の内方突出部の内部に滑り込ませることで、押えリング６０とクランパ７４にそれそれぞれ設けたテーパ面を介して、固定保持部材５４と可動保持部材５８とを互いに締付けてロックし、押えリング６０を反時計回りに回転させて逆Ｌ字状のクランパ７４の突出部から引き抜くことで、このロックを解くようになっている。そして、このようにして可動保持部材５８をロックした時、内側シール部材６２のシール部６２ａが基板Ｗの表面に、外側シール部材６８にあっては、そのシール部６８ａが固定保持部材５４の表面に、シール部６８ｂがシール溝６６の底面にそれぞれ圧接し、シール部材６２，６８を均一に押圧して、ここを確実にシールするようになっている。
【００５０】
固定保持部材５４の中央部には、基板Ｗの大きさに合わせてリング状に突出し、表面が基板Ｗの周縁部に当接して該基板Ｗを支持する支持面８０となる突条部８２が設けられており、この突条部８２の円周方向に沿った所定位置に凹部８４が設けられている。
【００５１】
そして、図２及び図５に示すように、この各凹部８４内に、下記のハンド１２０に設けた外部接点から延びる複数の配線にそれぞれ接続した複数（図示では１２個）の導電体（電気接点）８６が配置されて、固定保持部材５４の支持面８０上に基板Ｗを載置した際、この導電体８６の端部が基板Ｗの側方で固定保持部材５４の表面にばね性を有した状態で露出するようになっている。
【００５２】
一方、可動保持部材５８の支持部５８ｂの導電体８６に対向した位置に、電気接点８８の脚部８８ａが固着されている。この電気接点８８は、板ばね形状に形成され、更に基板Ｗの位置決め（センタリング）機能と、めっき後の基板Ｗを基板ホルダ１８から取出す際に、基板Ｗが内側シール部材６２のシール部６２ａにひっついて、基板Ｗと共に持ち上がることを防止する機能を有している。つまり、この電気接点８８は、内側シール部材６２の外方に位置して、内方に板ばね状に突出する接点部８８ｂを有しており、この接点部８８ｂにおいて、その弾性力によるばね性を有して容易に屈曲し、しかも固定保持部材５４と可動保持部材５８で基板Ｗを保持した時に、電気接点８８の接点部８８ｂが、固定保持部材５４の支持面８０上に支持された基板Ｗの外周面に弾性的に接触するように構成されている。
【００５３】
そして、図５（ａ）に示すように、固定保持部材５４の支持面８０上に基板Ｗを載置し、更に図５（ｂ）〜図５（ｃ）に示すように、可動保持部材５８を固定保持部材５４の方向に移動させロックして基板Ｗを保持した時、導電体８６の露出部が電気接点８８の脚部８８ａの下面に導電体８６の露出部の弾性力を介して弾性的に接触して電気的に接続され、基板Ｗが電気接点８８の接点部８８ｂに該接点部８８ｂの弾性力を介して弾性的に接触する。これによって、基板Ｗをシール部材６２，６８でシールして基板ホルダ１８で保持した状態で、電気接点８８を介して基板Ｗに給電が行えるようになっている。
【００５４】
このように、電気接点８８を板ばね形状に形成し、この電気接点８８自体の弾性力を介して電気接点８８の接点部８８ｂの先端が基板Ｗに接触するようにすることで、接点不良を減少させ、しかも、電気接点８８が基板Ｗのより外周部で該基板Ｗと接触するようにして、基板Ｗのパターン形成領域として有効に利用できる面積を広めることができる。更に、基板ホルダ１８で基板Ｗを保持する際に、基板Ｗを板ばね形状の電気接点８８の接点部８８ｂの弾性力で内方に付勢することで、この電気接点８８を介して、基板Ｗの基板ホルダ１８に対する位置決め（センタリング）を行うことができる。しかも、可動保持部材５８にシール部材６２と電気接点８８を設け、この電気接点８８を介して基板Ｗの基板ホルダ１８に対する位置決めを行うことで、基板Ｗを基板ホルダ１８で保持した時に、基板Ｗ、シール部材６２及び電気接点８８の位置関係が常に一定となるようにすることができる。
【００５５】
そして、一連の処理を終了して、基板ホルダ１８で保持した基板Ｗを取出す時には、可動保持部材５８を固定保持部材５４から離れる方向に移動させるのであるが、この時、上記とは逆に、図５（ｃ）〜図５（ｂ）に示すように、電気接点８８の接点部８８ｂが基板Ｗの外周部に圧接して、基板Ｗを固定保持部材５４側に付勢しているため、この電気接点８８によって、基板Ｗの動きが規制される。このため、例えシール部材６２に基板Ｗがひっついていたとしても、シール部材６２と可動保持部材５８のみが上昇して、基板Ｗがシール部材６２から強制的に切り離される。そして、可動保持部材５８が更に上昇すると、電気接点８８の接点部８８ｂは基板Ｗから離れて、図５（ａ）に示す元の状態に復帰する。
【００５６】
これにより、めっき終了後、可動保持部材５８を移動させ基板Ｗの保持を解いて、基板Ｗを基板ホルダ１８から取出す際に、基板Ｗがシール部材６２にひっついたまま該シール部材６２と一緒に移動してしまうことを防止することができる。
なお、導電体８６の表面の、少なくとも電気接点８８との当接面に、例えば金または白金めっきを施して被覆することが好ましい。
【００５７】
また、図６に示すように、固定保持部材５４の突条部８２の一部には、尖塔状のテーパ面を有するテーパ部８２ａが設けられ、また、可動保持部材５８の支持部５８ｂの内周面の該テーパ部８２ａと対向する位置には、該テーパ部８２ａのテーパ面と逆テーパ面で、固定保持部材５４と可動保持部材５８とで基板Ｗを保持した時に互いに係合して両者５４，５８の中心に対する位置決めを行うテーパ部９０が設けられている。つまり、図６（ａ）に示すように、固定保持部材５４の支持面８０上に基板Ｗを載置し、更に図６（ｂ）〜図６（ｃ）に示すように、可動保持部材５８を固定保持部材５４の方向に移動させロックして基板Ｗを保持する際、テーパ部８２ａ，９０が互いに案内となって、可動保持部材５８の固定保持部材５４に対する（またはその逆の）位置決めが行われるようになっている。
【００５８】
このように、固定保持部材５４の突条部８２と可動保持部材５８の支持部５８ｂに互いに係合するテーパ部８２ａ，９０を設けることにより、固定保持部材５４と可動保持部材５８が離れた位置では両者５４，５８の位置合わせが正確でなくとも、基板Ｗを固定保持部材５４と可動保持部材５８で保持する過程で、互いに係合するテーパ部８２ａ，９０を介して、両者５４，５８の中心に対する位置決めを自動的に行うことができる。
【００５９】
これにより、前述のようにして、基板Ｗを固定保持部材５４と可動保持部材５８で保持する過程で、両者５４，５８の中心に対する位置決めを行い、更に板ばね形状の電気接点８８を介して、基板Ｗの基板ホルダ１８、ひいては内側シール部材６２に対する位置決め（センタリング）を同時に行うことができる。
【００６０】
しかし、上記互いに係合するテーパ部８２ａ，９０によるセンタリングのみでは確実なセンタリングができない。それはお互いが容易に係合するためには少なくとも微小なクリアランスが両者の間に必要だからである。従って、上記互いに係合するテーパ部８２ａ，９０のみでは基板Ｗ中心と可動保持部材５８の中心がそのクリアランス分ずれてしまうことになる。そこで可動保持部材５８に、下記のように、複数個の板ばね部材１４０を基板Ｗ外周部に弾性的に接触するように設置することで、基板Ｗを可動保持部材５８の外周からそれぞれ同一の力で中心に向けて移動させる力を働かせ、可動保持部材５８が固定保持部材５４と係合するとき、より確実に基板Ｗのセンタを可動保持部材５８のセンタと合致するよう基板をずらすことができる。上記複数個の板ばねが、基板の外周に亘り、一つの一体構造を取っても構わないことは勿論である。
尚、可動保持部材と固定保持部材はヒンジで連結されている必要はなく、完全に分離された構造であっても構わないのは勿論である。
【００６１】
更に、図２に示すように、固定保持部材５４の突条部８２には、ヒンジ５６の反対側に位置して、やや幅広な凹部９２が、この例では２カ所に設けられ、この各凹部９２内に吸着パッド９４が収容配置されている。この吸着パッド９４は、図７に詳細に示すように、ゴム等の可撓性材料からなり、内部を減圧部とした円錐状のカップ部９６を有し、ボルト１００を介して固定保持部材５４に取付けられている。そして、基板ホルダ１８で基板Ｗを保持した時、この基板Ｗがカップ部９６の開口部を押圧し、このカップ部９６を外方に押し拡げて、内部気体を外部へ押出すことによりこの内部の減圧部の圧力を減じることで、基板Ｗの裏面側を吸着するようになっている。
【００６２】
これにより、めっき終了後、可動保持部材５８を移動させ基板Ｗの保持を解いて、基板Ｗを基板ホルダ１８から取出す際に、吸着パッド９４で基板Ｗの裏面側を吸着することで、基板Ｗが内側シール部材６２にひっついたまま該シール部材６２と一緒に移動することを防止することができる。しかも、自動搬送装置を用いて自動運転する場合に、基板Ｗが持ち上がったりすることがないので、常に安定して基板Ｗを基板ホルダ１８から取出すことができる。この吸着パッド９４の吸着力は、前述のように、基板Ｗを基板ホルダ１８から取出す際に、基板Ｗを吸着面から平行に移動し、吸着面と基板面を解離させることで真空を破壊させることができ、基板Ｗをシール部材６２から容易に分離でき、かつロボットとの間で基板の受渡しが行える大きさに設定される。即ち、吸着パッド９４は吸着面に垂直方向には強い密着性を有し、基板Ｗを保持することに有効であるが、平行方向には容易にずれ、分離を容易にすることが可能である。
【００６３】
吸着パッド９４の配置位置及び個数は、任意に設定できるが、吸着パッド９４を、基板ホルダ１８で保持した基板Ｗの中心を挟んだヒンジ５６の反対側の基板Ｗの周縁部に対応する位置に設けることで、ヒンジ５６を介して可動保持部材５８を開く際に、内側シール部材６２に付着して最初に持ち上がろうとする箇所の持ち上がりを吸着パッド９４で防止して、基板Ｗを内側シール部材６２から効果的に分離することができる。
【００６４】
なお、この吸着パッドとしては、いわゆる真空吸着タイプのものを使用しても良い。つまり、図示しないが、固定保持部材５４の内部に真空ラインを張り巡らし、基板ホルダ１８で基板を保持した時に、吸着パッドの内部と真空ラインとが互いに連通するようにして、この真空ラインを介して吸着パッドの内部を真空引きすることで、基板を吸着するようにしてもよい。これにより、真空ラインを真空引きすることで基板の容易を容易且つ確実に保持し、この真空引きを解除することで、基板の保持を解くことができる。
【００６５】
可動保持部材５８の開閉は、図示しないシリンダと可動保持部材５８の自重によって行われる。つまり、固定保持部材５４には通孔５４ａが設けられ、載置プレート５２の上に基板ホルダ１８を載置した時に該通孔５４ａに対向する位置にシリンダが設けられている。これにより、シリンダロッドを伸展させ、通孔５４ａを通じて押圧棒で可動保持部材５８の基部５８ａを上方に押上げることで可動保持部材５８を開き、シリンダロッドを収縮させることで、可動保持部材５８をその自重で閉じるようになっている。
【００６６】
この例にあっては、押えリング６０を回転させることにより、可動保持部材５８のロック・アンロックを行うようになっている。図８及び図９に、このロック・アンロック機構１１０を示す。このロック・アンロック機構１１０は、天井側に設けられており、載置プレート５２の上に載置した基板ホルダ１８内に基板Ｗを入れ、ヒンジ５６を介して可動保持部材５８を閉じた時、この中央側に位置する基板ホルダ１８の押えリング６０の各長孔６０ａに対応する位置に位置させた回転ピン１１２を有しており、この回転ピン１１２は、正逆回転可能な回転板１１４の下面に垂設されている。更に、上下動自在で、載置プレート５２の上に載置した基板ホルダ１８の可動保持部材５８の支持部５８ｂを固定保持部材５４に向けて押圧する押圧ロッド１１６が備えられ、回転板１１４の該押圧ロッド１１６に対向する位置には、円周方向に延びる長孔１１４ａが設けられている。
【００６７】
これによって、前述のようにして、基板Ｗを入れて可動保持部材５８を閉じた基板ホルダ１８を載置プレート５２とともに上昇させ、押えリング６０の長孔６０ａ内に回転ピン１１２を位置させた後、押圧ロッド１１６を下降させて、可動保持部材５８を下方に押圧し、これによって、先ずシール部材６２，６８を潰して可動保持部材５８を回転しないようにしておき、この状態で、回転ピン１１２を回転させて押えリング６０を回転させ、押えリング６０をクランパ７４内に入り込ませて、可動保持部材５８をロックするようになっている。
【００６８】
このように、先ず押圧ロッド１１６を下降させて可動保持部材５８が回転しないようにした状態で、回転ピン１１２を介して押えリング６０を回転させることで、この押えリング６０の回転を低摩擦で行うことができる。これによって、押えリング６０とクランパ７４、更には可動保持部材５８の摩耗を減らし、しかも、可動保持部材５８の押えリング６０の回転に伴う共廻りによる位置ずれを防止して、基板Ｗのセンタリングに影響を与えたり、シール部材６２，６８が捻れてこれらのシール性が悪化したりすることを防止することができる。
【００６９】
なお、回転体としてリング状のものを、また押圧ロッド１１６の代わりに、図９に斜線で示す円筒状の押圧部材１１６ａをそれぞれ使用し、これによって、この押圧部材１１６ａによって、可動保持部材５８の支持部５８ｂをその全周に亘ってより均一に押圧するようにしてもよい。
【００７０】
このロック・アンロック機構１１０は、１個備えられ、載置プレート５２の上に載置した２個の基板ホルダ１８の一方をロック（またはアンロック）した後、載置プレート５２を横方向にスライドさせて、他方の基板ホルダ１８をロック（またはアンロック）するようになっている。また、基板ホルダ１８には、基板Ｗを装着した時の該基板Ｗと接点との接触状態を確認するセンサが備えられ、このセンサからの信号がコントローラ（図示せず）に入力されるようになっている。
【００７１】
基板ホルダ１８の固定保持部材５４の端部には、基板ホルダ１８を搬送したり、吊下げ支持したりする際の支持部となる一対の略Ｔ字状のハンド１２０が連接されている。そして、ストッカ２４内においては、この周壁上面にハンド１２０の突出端部を引っ掛けることで、これを垂直に吊下げ保持し、この吊下げ保持した基板ホルダ１８のハンド１２０を基板ホルダ搬送装置４０のトランスポータ４２で把持して基板ホルダ１８を搬送するようになっている。なお、プリウェット槽２６、プリソーク槽２８、水洗槽３０ａ，３０ｂ、ブロー槽３２及びめっき槽３４内においても、基板ホルダ１８は、ハンド１２０を介してそれらの周壁に吊下げ保持される。
【００７２】
このように構成しためっき装置による一連のバンプめっき処理を説明する。先ず、図１７（ａ）に示すように、表面に給電層としてのシード層５００を成膜し、このシード層５００の表面に、例えば高さＨが２０〜１２０μｍのレジスト５０２を全面に塗布した後、このレジスト５０２の所定の位置に、例えば直径Ｄが２０〜２００μｍ程度の開口部５０２ａを設けた基板をその表面（被めっき面）を上にした状態でカセット１０に収容し、このカセット１０をカセットテーブル１２に搭載する。
【００７３】
このカセットテーブル１２に搭載したカセット１０から、基板搬送装置２２で基板を１枚取出し、アライナ１４に載せてオリフラやノッチなどの位置を所定の方向に合わせる。このアライナ１４で方向を合わせた基板を基板搬送装置２２で基板着脱部２０まで搬送する。
【００７４】
基板着脱部２０においては、ストッカ２４内に収容されていた基板ホルダ１８を基板ホルダ搬送装置４０のトランスポータ４２で２基同時に把持して、基板着脱部２０まで搬送する。そして、基板ホルダ１８を水平な状態として下降させ、これによって、２基の基板ホルダ１８を基板着脱部２０の載置プレート５２の上に同時に載置し、シリンダを作動させて基板ホルダ１８の可動保持部材５８を開いた状態にしておく。
【００７５】
この状態で、中央側に位置する基板ホルダ１８に基板搬送装置２２で搬送した基板を挿入し、シリンダを逆作動させて可動保持部材５８を閉じ、しかる後、ロック・アンロック機構で可動保持部材５８をロックする。そして、一方の基板ホルダ１８への基板の装着が完了した後、載置プレート５２を横方向にスライドさせて、同様にして、他方の基板ホルダ１８に基板を装着し、しかる後、載置プレート５２を元の位置に戻す。
【００７６】
これにより、基板Ｗは、そのめっき処理を行う面を基板ホルダ１８の開口部から露出させた状態で、周囲をシール部材６２，６８でめっき液が浸入しないようにシールされ、シールによってめっき液に触れない部分において複数の接点と電気的に導通するように固定される。ここで、接点からは基板ホルダ１８のハンド１２０まで配線が繋がっており、ハンド１２０の部分に電源を接続することにより基板のシード層５００に給電することができる。
【００７７】
次に、基板Ｗを装着した基板ホルダ１８を基板ホルダ搬送装置４０のトランスポータ４２で２基同時に把持し、ストッカ２４まで搬送する。そして、基板ホルダ１８を垂直な状態となして下降させ、これによって、２基の基板ホルダ１８をストッカ２４に吊下げ保持（仮置き）する。
【００７８】
これらの基板搬送装置２２、基板着脱部２０及び基板ホルダ搬送装置４０のトランスポータ４２においては、前記作業を順次繰り返して、ストッカ２４内に収容された基板ホルダ１８に順次基板を装着し、ストッカ２４の所定の位置に順次吊り下げ保持（仮置き）する。
なお、基板ホルダ１８に備えられていた基板と接点との接触状態を確認するセンサで、この接触状態が不良であると判断した時には、その信号をコントローラ（図示せず）に入力する。
【００７９】
一方、基板ホルダ搬送装置４０の他方のトランスポータ４４にあっては、基板を装着しストッカ２４に仮置きした基板ホルダ１８を２基同時に把持し、プリウェット槽２６まで搬送して下降させ、これによって、２基の基板ホルダ１８をプリウェット槽２６内に入れる。
【００８０】
なお、この時、基板ホルダ１８に備えられていた基板と接点との接触状態を確認するセンサで、この接触状態が不良であると判断した基板を収納した基板ホルダ１８は、ストッカ２４に仮置きしたままにしておく。これにより、基板ホルダ１８に基板を装着した時に該基板と接点との間に接触不良が生じても、装置を停止させることなく、めっき作業を継続することができる。この接触不良を生じた基板にはめっき処理が施されないが、この場合には、カセットを戻した後にめっき未処理の基板をカセットから排除することで、これに対処することができる。
【００８１】
次に、この基板を装着した基板ホルダ１８を、前記と同様にして、プリソーク槽２８に搬送し、プリソーク槽２８で酸化膜をエッチングし、清浄な金属面を露出させる。更に、この基板を装着した基板ホルダ１８を、前記と同様にして、水洗槽３０ａに搬送し、この水洗槽３０ａに入れた純水で基板の表面を水洗する。
【００８２】
水洗が終了した基板を装着した基板ホルダ１８を、前記と同様にして、めっき液を満たしためっき槽３４に搬送し、めっきユニット３８に吊り下げ保持する。基板ホルダ搬送装置４０のトランスポータ４４は、上記作業を順次繰り返し行って、基板を装着した基板ホルダ１８を順次めっき槽３４のめっきユニット３８に搬送して所定の位置に吊下げ保持する。
【００８３】
全ての基板ホルダ１８の吊下げ保持が完了した後、オーバーフロー槽３６のめっき液を循環させ、かつ、オーバーフローさせながら、めっき槽３４内のアノード（図示せず）と基板Ｗとの間にめっき電圧を印加し、同時にパドル駆動装置４６によりパドルを基板の表面と平行に往復移動させることで、基板の表面にめっきを施す。この時、基板ホルダ１８は、めっきユニット３８の上部でハンド１２０により吊り下げられて固定され、めっき電源から導電体８６及び電気接点８８を通して、シード層５００（図１７参照）に給電される。
【００８４】
めっきが終了した後、めっき電源の印加、めっき液の供給及びパドル往復運動を停止し、めっき後の基板Ｗを装着した基板ホルダ１８を基板ホルダ搬送装置４０のトランスポータ４４で２基同時に把持し、前述と同様にして、水洗槽３０ｂまで搬送し、この水洗槽３０ｂに入れた純水に浸漬させて基板の表面を純水洗浄する。次に、この基板Ｗを装着した基板ホルダ１８を、前記と同様にして、ブロー槽３２に搬送し、ここで、エアーの吹き付けによって基板ホルダ１８に付着した水滴を除去する。しかる後、この基板Ｗを装着した基板ホルダ１８を、前記と同様にして、ストッカ２４の所定の位置に戻して吊下げ保持する。
【００８５】
基板ホルダ搬送装置４０のトランスポータ４４は、上記作業を順次繰り返し、めっきが終了した基板を装着した基板ホルダ１８を順次ストッカ２４の所定の位置に戻して吊下げ保持する。
【００８６】
一方、基板ホルダ搬送装置４０の他方のトランスポータ４２にあっては、めっき処理後の基板Ｗを装着しストッカ２４に戻した基板ホルダ１８を２基同時に把持し、前記と同様にして、基板着脱部２０の載置プレート５２の上に載置する。この時、基板ホルダ１８に備えられていた基板と接点との接触状態を確認するセンサで、この接触状態が不良であると判断した基板を装着しストッカ２４に仮置きしたままの基板ホルダ１８も同時に搬送して載置プレート５２の上に載置する。
【００８７】
そして、中央側に位置する基板ホルダ１８の可動保持部材５８のロックを、ロック・アンロック機構を介して解き、シリンダを作動させて可動保持部材５８を開く。この時、前述のように、基板Ｗが可動保持部材５８にくっついたまま可動保持部材５８が開くことが防止される。この状態で、基板ホルダ１８内のめっき処理後の基板Ｗを基板搬送装置２２で取出して、スピンドライヤ１６に運び、このスピンドライヤ１６の高速回転によってスピンドライ（水切り）した基板を基板搬送装置２２でカセット１０に戻す。
【００８８】
そして、一方の基板ホルダ１８に装着した基板をカセット１０に戻した後、或いはこれと並行して、載置プレート５２を横方向にスライドさせて、同様にして、他方の基板ホルダ１８に装着した基板をスピンドライしてカセット１０に戻す。
【００８９】
載置プレート５２を元の状態に戻した後、基板を取出した基板ホルダ１８を基板ホルダ搬送装置４０のトランスポータ４２で２基同時に把持し、前記と同様にして、これをストッカ２４の所定の場所に戻す。しかる後、めっき処理後の基板を装着しストッカ２４に戻した基板ホルダ１８を基板ホルダ搬送装置４０で２基同時に把持し、前記と同様にして、基板着脱部２０の載置プレート５２の上に載置して、前記と同様な作業を繰り返す。
【００９０】
そして、めっき処理後の基板を装着しストッカ２４に戻した基板ホルダ１８から全ての基板を取出し、スピンドライしてカセット１０に戻して作業を完了する。これにより、図１７（ｂ）に示すように、レジスト５０２に設けた開口部５０２ａ内にめっき膜５０４を成長させた基板Ｗが得られる。
次に、前述のようにしてスピンドライした基板Ｗを、例えば温度が５０〜６０℃のアセトン等の溶剤に浸漬させて、図１７（ｃ）に示すように、基板Ｗ上のレジスト５０２を剥離除去する。そして、図１７（ｄ）に示すように、めっき後の外部に露出する不要となったシード層５００を除去して、めっき膜５０４からなるバンプを形成する。
【００９１】
なお、この例では、基板着脱部２０と銅めっきユニット３８との間に基板ホルダ１８を縦置きで収納するストッカ２４を配置し、基板着脱部２０とストッカ２４との間での基板ホルダ１８の搬送を基板ホルダ搬送装置４０の第１のトランスポータ４２で、ストッカ２４と銅めっきユニット３８との間での基板ホルダ１８の搬送を第２のトランスポータ４４でそれぞれ行うことで、不使用時の基板ホルダ１８をストッカ２４に保管しておき、またストッカ２４を挟んだ前後における基板ホルダ１８の搬送をスムーズに行ってスループットを向上させるようにしている。１つのトランスポータで全ての搬送を行うようにしても良いことは勿論である。
【００９２】
また、基板搬送装置２２として、ドライハンドとウェットハンドを有するロボットを使用し、基板ホルダ１８からめっき後の基板を取出す時にのみウェットハンドを使用し、他はドライハンドを使用するようにしている。基板ホルダ１８のシールによって基板の裏面はめっき液に接触しないように保たれており、原則的にはウェットハンドとすることは必ずしも必要ではないが、このようにハンドを使い分けることで、リンス水の回り込みやシール不良によるめっき液汚染が生じ、この汚染が新しい基板の裏面を汚染することを防止することができる。
【００９３】
なお、上記の例では、電気接点８８として、基板Ｗの位置決め（センタリング）機能と、めっき後の基板Ｗを基板ホルダ１８から取出す際に、基板Ｗが内側シール部材６２のシール部６２ａにひっついて、基板Ｗと共に持ち上がることを防止する機能を備えたものを使用して、構造的に簡素化した例を示している。図１０に示すように、基板Ｗの位置決め（センタリング）機能と、めっき後の基板Ｗを基板ホルダ１８から取出す際に、基板Ｗが内側シール部材６２のシール部６２ａにひっついて、基板Ｗと共に持ち上がることを防止する機能を備えた、ばね性を有する板ばね部材１４０を、電気接点とは別に、可動保持部材５８に設けるようにしても良い。この板ばね部材１４０は、例えば電気接点に挟まれた位置に配置される。この板ばね部材１４０の作用は、前述の図５に示す電気接点８８とほぼ同様であるので、ここではその説明を省略する。
【００９４】
これにより、基板ホルダ１８で基板Ｗを保持する過程で、ばね性を有する板ばね部材１４０の弾性力で基板Ｗを内方に付勢することで、この板ばね部材１４０を介して、基板Ｗの基板ホルダ１８に対する位置決め（センタリング）を行い、しかも、可動保持部材５８にシール部材６２、電気接点及び板ばね部材１４０を設け、この板ばね部材１４０を介して基板Ｗの位置決めを行うことで、基板Ｗを基板ホルダ１８で保持した時に、板ばね部材１４０を介して、基板Ｗ、シール部材６２及び電気接点の位置関係が常に一定となるようにすることができる。
【００９５】
つまり、上記互いに係合するテーパ部８２ａ，９０によるセンタリングのみではまた確実なセンタリングができない。それはお互いが容易に係合するためには少なくとも微小なクリアランスが両者の間に必要だからである。従って、上記互いに係合するテーパ部８２ａ，９０のみでは基板中心と可動保持部材の中心がそのクリアランス分ずれてしまうことになる。そこで可動保持部材５８に複数個の板ばね部材１４０を基板Ｗ外周部に弾性的に接触するように設置することで、基板Ｗを可動保持部材５８の外周からそれぞれ同一の力で中心に向けて移動させる力を働かせ、可動保持部材５８が固定保持部材５４と係合するとき、より確実に基板Ｗのセンタを可動保持部材５８のセンタと合致するよう基板をずらすことができる。
【００９６】
上記の例では、板ばね部材１４０を１枚の板ばね形状に形成された板体で構成した例を示しているが、図１１に示すように、板ばね形状の２枚以上の板体１２２ａ，１２２ｂを重ね合わせた重ね板ばね１２４で板ばね部材１４０を構成するよにしてもよい。
【００９７】
これにより、設置スペースがかなり狭い場所であっても、ばねの塑性変形を起こすことなく、長いストロークを確保することができる板ばね部材１４０（重ね板ばね１２４）を設置し、この板ばね部材１４０（重ね板ばね１２４）を介して、基板ホルダ１８で基板Ｗを保持する過程で、基板Ｗの基板ホルダ１８に対する位置決め（センタリング）を行うとともに、めっき後の基板Ｗを基板ホルダ１８から取出す際に、基板Ｗが内側シール部材６２のシール部６２ａにひっついて、基板Ｗと共に持ち上がることを防止することができる。
【００９８】
また、図１２乃至図１４に示すように、内側シール部材６２として、幅方向の両側に２個のリング状シール部１２６ａ，１２６ｂを有し、更に、円周方向に沿った所定の位置に、幅方向に延びる仕切りシール部１２６ｃを設けた多重シール構造体１２８を使用してもよい。これにより、基板Ｗの周縁部を多重シール構造体１２８からなるシール部材６２で多重にシールし、シール幅を実質的に広くして、基板のセンタリングが完全でなくても、ここでのシール性のより完全性を図るとともに、仕切りシール部１２６ｃで内側シール部材６２の円周方向に沿った所定箇所を幅方向にシールすることで、内側シール部材６２がダメージを受けても、シール性が問題とならないようにすることができる。
【００９９】
つまり、例えば図１３（ａ），１３（ｂ）に示すように、基板Ｗのセンタリングにずれが生じ、例えば基板の表面の段差を有するレジストラインＲ上に内側に位置するシール部１２６ｂが跨ったり（図１３（ａ））、外側に位置するシール部１２６ａが跨ったり（図１３（ｂ））しても、図１３（ａ），１３（ｂ）に斜線で示すように、この跨っている箇所を除いた、少なくとも一方のシール部１２６ａ，１２６ｂがシールラインとなり、この跨った部分で液漏れが生じても、確実にシールすることができる。しかも、例えば図１３（ｂ）において、リング状シール部１２６ａ，１２６ｂの互いに仕切りシール部１２６ｃを挟んで隣接するＸ_１部とＸ_２部にダメージを受けても、このダメージを受けたＸ_１部とＸ_２部との間に位置する仕切りシール部１２６ｃでシール性を維持することができる。
【０１００】
図１５は、本発明の他の実施の形態の基板ホルダを示す。この例の前述の基板ホルダと異なる点は、固定保持部材５４の可動保持部材５８側表面に、可動保持部材５８と固定保持部材５４で保持した基板Ｗの裏面側にめっき液が漏れたとき、この漏れためっき液を介して短絡する液漏れ検知用の一対の導電線（導電体）１３０を、基板Ｗの裏面周縁部に対応する円周方向に沿ったほぼ全周に亘って連続して設けている点である。この導電線１３０は、一端で開放され、他端は電気抵抗測定器１３２に接続されている。その他の構成は、前述のものと同様である。
【０１０１】
この例によれば、電気抵抗測定器１３２を介して一対の導電線１３０間の電気抵抗を測定することで、液漏れが発生したか否かを迅速かつ確実に検知することができる。つまり、この一対の導電線１３０は、一端に開放されているため、ここに電流を流しても電流が流れないが、液漏れが発生すると、めっき液は導電体であるため、このめっき液が一対の導電線１３０を短絡した形となって、すなわち、図１５の仮想線で示すように、一対の導電線１３０間が、あたかもめっき液による抵抗Ｒで短絡した形となって、導電線１３０に電流が流れる。そこで、この電流を介して電気抵抗を測定することで、液漏れが発生したか否かを検知することができる。
【０１０２】
なお、この例では、一対の導電線（導電体）を基板の周縁部の全周に亘って連続して設けた例を示している。このように外周シール部の直近の内側に一対の導電線を配置することにより、どこからリークが発生しても直ちにリークを検知することができる。また、この例とは別に、例えば漏れた液がたまりやすい任意の箇所に設けたり、また複数対の導電線を並列的に設けたりしても良い。
【０１０３】
例えば、図１６に示すように、液漏れが発生した時に、めっき液が溜まる固定保持部材５４の下部に、一対の電極にそれぞれ接続させた一対の導電板（導電体）１４２を所定間隔離間させて互いに対峙させて配置し、液漏れが発生して、めっき液が固定保持部材５４の下部に溜まった時に、このめっき液を介して導電板１４２が互いに通電するようにしてもよい。この例によれば、導電板１４２を固定保持部材５４の下部といった、局部的に配置することで、基板ホルダ１８の全域に亘る液漏れの検知することができる。
【０１０４】
以上説明したように、このめっき装置によれば、基板を収納したカセットをカセットテーブルにセットして装置を始動することで、ディップ方式を採用した電解めっきを全自動で行って、基板の表面にバンプ等に適した金属めっき膜を自動的に形成することができる。
【０１０５】
【発明の効果】
以上説明したように、本発明によれば、固定保持部材に、該固定保持部材と可動保持部材で保持した基板の裏面側を吸着する吸着パッドを取付けることで、めっき終了後、可動保持部材を移動させ基板の保持を解いて、基板を基板ホルダから取出す際に、基板がシール部材にひっついたまま該シール部材と一緒に移動することを防止して、常に安定して基板を基板ホルダから取出すことができる。
【０１０６】
また、基板の周縁部をシールするシール部材（内側シール部材）を、該シール部材を保持する保持部材に一体的に取付けることで、めっき終了後、可動保持部材を移動させ基板の保持を解いて、基板を基板ホルダから取出す際に、内側シール部材のシール部が基板に付着して内側シール部材が保持部材から捲れてしまうことを防止して、内側シール部材と基板との剥離性を向上させることができる。
【０１０７】
また、可動保持部材と固定保持部材との間をシールするシール部材（外側シール部材）として、幅方向に押圧すると潰れ、この押圧力を解くと弾性力で復帰する、横断面Ｗ字状のものを使用することで、可動保持部材と固定保持部材との間をシールするシール部材の、例えば蟻溝形状のシール溝内への装着を容易に行うとともに、このシール部材のシール溝からの脱出を確実に防止することができる。
【０１０８】
更に、可動保持部材に、可動保持部材と固定保持部材での基板の保持を解く際に、基板を固定保持部材に向けて付勢する板ばね形状の板ばね部材を取付けることで、めっき終了後、可動保持部材を移動させ基板の保持を解いて、基板を基板ホルダから取出す際に、板ばね形状の板ばね部材で基板の動きを規制して、可動保持部材に取付けたシール部材を基板から引き離し、これによって、基板がシール部材にひっついたまま該シール部材と一緒に移動してしまうことを防止することができる。
【０１０９】
また、固定保持部材に、可動保持部材と固定保持部材で保持した基板の裏面側にめっき液が漏れたとき、この漏れためっき液を介して短絡する液漏れ検知用の少なくとも一対の導電体を設けることで、液漏れが発生したことを素早く検知して対処することができ、これによって、その後のめっきの品質や装置に影響を与えることを防止することができる。
【図面の簡単な説明】
【図１】本発明の実施の形態の基板ホルダを備えためっき装置の全体配置図である。
【図２】図１に示す基板ホルダの平面図である。
【図３】図１に示す基板ホルダの右側面図である。
【図４】図１に示す基板ホルダの縦断正面図である。
【図５】図１に示す基板ホルダで基板を保持する時の導電体、電気接点及び基板との関係を工程順に示す断面図である。
【図６】図１に示す基板ホルダで基板を保持する時の固定保持部材のテーパ部と可動保持部材のテーパ部の関係を工程順に示す断面図である。
【図７】図１に示す基板ホルダにおける吸着パッドの装着部の断面図である。
【図８】ロック・アンロック機構で基板ホルダをロックする時の状態を示す断面図である。
【図９】ロック・アンロック機構の平面図である。
【図１０】板ばね部材の一例の、基板を保持する時の該板ばね部材と基板との関係を工程順に示す断面図である。
【図１１】板ばね部材を重ね板ばねで構成した例を示す断面図である。
【図１２】内側シール部材の他の例を示す平面図である。
【図１３】図１２のＡ部拡大図である。
【図１４】図１２の横断面図である。
【図１５】本発明の他の実施の形態の基板ホルダを示す平面図である。
【図１６】本発明の更に他の実施の形態の基板ホルダを示す平面図である。
【図１７】基板上にバンプ（突起状電極）を形成する過程を工程順に示す断面図である。
【符号の説明】
１０　カセット
１２　カセットテーブル
１４　アライナ
１６　スピンドライヤ
１８　基板ホルダ
２０　基板着脱部
２２　基板搬送装置
２４　ストッカ
２６　プリウェット槽
２８　プリソーク槽
３０ａ，３０ｂ　水洗槽
３２　ブロー槽
３４　めっき槽
３６　オーバーフロー槽
３８　めっきユニット
４０　基板ホルダ搬送装置
４２，４４　トランスポータ
４６　パドル駆動装置
５４　固定保持部材
５６　ヒンジ
５８　可動保持部材
５８ａ　基部
５８ｂ　支持部
６０　押えリング
６２　内側シール部材
６６　シール溝
６８　外側シール部材
７０　保持部材
７４　クランパ
８０　支持面
８２　突条部
８２ａ　テーパ部
８６　導電体
８８　電気接点
９０　テーパ部
９４　吸着パッド
９６　カップ部
９８　真空部
１１０　ロック・アンロック機構
１１２　回転ピン
１１４　回転板
１１６　押圧ロッド
１２２ａ，１２２ｂ　板体
１２４　重ね板ばね
１２８　多重シール構造体
１３０　導電線（導電体）
１３２　電気抵抗測定器
１４０　板ばね部材
１４２　導電板（導電体）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides, for example, a plating apparatus for plating a surface to be plated of a substrate, particularly, a fine wiring groove or hole provided on a surface of a semiconductor wafer or the like, a plating film formed on a resist opening, or a surface of a semiconductor wafer. The present invention relates to a substrate holder used for a plating apparatus or the like for forming a bump (protruding electrode) electrically connected to a package electrode or the like, and a plating apparatus provided with the substrate holder.
[0002]
[Prior art]
For example, in a TAB (Tape Automated Bonding) or a flip chip, gold, copper, solder, or nickel, or a protruding connection in which these are stacked in a multilayer at predetermined positions (electrodes) on the surface of a semiconductor chip on which wiring is formed. 2. Description of the Related Art It is widely practiced to form electrodes (bumps) and electrically connect to electrodes of a package or TAB electrodes via the bumps. As a method for forming the bump, there are various methods such as an electrolytic plating method, a vapor deposition method, a printing method, and a ball bump method. However, with the increase in the number of I / Os and the fine pitch of the semiconductor chip, miniaturization is possible. Electroplating methods, which have relatively stable performance, have come to be used frequently.
[0003]
Here, the electrolytic plating method is a jet type or a cup type in which the surface to be plated of a substrate such as a semiconductor wafer is placed horizontally with the surface to be plated facing downward (face down), and a plating solution is blown up from below to perform plating. The substrate is set up vertically, and the plating solution is roughly divided into a dip type in which a plating solution is poured from below the plating tank and plating is performed while overflowing. The electroplating method using the dip method has the advantages that the bubbles that adversely affect the plating quality are well removed and the footprint is small, so the dimensions of the plating holes are relatively large and It is considered that it is suitable for bump plating which requires time.
[0004]
In a conventional electrolytic plating apparatus employing a dipping method, a substrate holder such as a semiconductor wafer or the like, which is provided with a substrate holder that seals an end surface and a back surface, exposes a surface (plated surface), and detachably holds the substrate, is provided. The holder is immersed in the plating solution together with the substrate to apply plating to the surface of the substrate, which has an advantage that bubbles can be easily removed.
[0005]
Since the substrate holder is used by immersing it in the plating solution, when the substrate is held by this substrate holder, make sure that the outer periphery of the substrate does not enter the plating solution to the back surface (anti-plating surface) side of the substrate. Need to be sealed. Therefore, for example, in a substrate holder in which a substrate is detachably held by a pair of supports (holding members), a seal member is attached to one support, and the seal member is placed and held on the other support. The outer peripheral portion of the substrate is sealed by being pressed against the peripheral portion of the substrate.
[0006]
[Problems to be solved by the invention]
In this type of conventional substrate holder, the shape and fixing method of the sealing member are optimized, the sealing member is periodically cleaned (including every leaf), and the sealing member is periodically replaced. In addition, the precision of the pretreatment of the substrate (generation of the seed layer and the photoresist film) is improved, the setting error of the substrate in the substrate holder is minimized, and periodic readjustment is performed. , To prevent leakage of plating solution and the like.
[0007]
However, it is very difficult to achieve the integrity of the seal due to deterioration of the seal member and the like. In particular, when plating and embedding the plating film inside the fine concave portions, a plating solution having good permeability is generally used so that the plating solution can easily and surely enter the fine concave portions. Used, which makes it more difficult to achieve a perfect seal. Also, it has been generally difficult to detect leakage of a plating solution or the like. Once the plating solution leaks, the plating solution that has leaked into the substrate holder adheres to the back surface of the substrate, transfers to the substrate transfer equipment, and contaminates the entire apparatus with the plating solution. The liquid will corrode the contacts and prevent energization.
[0008]
Further, as described above, the seal member is attached to one support, and the seal member is pressed against the peripheral portion of the substrate placed and held on the other support, thereby sealing the outer peripheral portion of the substrate. When the support with the seal member is opened and the substrate is removed from the substrate holder after plating, the support may be opened while the substrate is stuck to the seal member and the substrate may fall off. It is necessary to take some measures.
[0009]
The present invention has been made in view of the above circumstances, and aims at more complete sealing by a sealing member, and a substrate holder capable of easily and reliably taking out a substrate, and a plating apparatus including the substrate holder. The purpose is to provide.
[0010]
[Means for Solving the Problems]
According to the first aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. The substrate holder according to claim 1, wherein the fixed holding member is provided with a suction pad for sucking a back surface of the substrate held by the fixed holding member and the movable holding member.
[0011]
With this, after the plating is completed, the movable holding member is moved to release the holding of the substrate, and when the substrate is taken out from the substrate holder, the back surface side of the substrate is sucked by the suction pad so that the substrate is stuck to the sealing member. It can be prevented from moving together with the seal member. In addition, when the automatic operation is performed using the automatic transfer device, the substrate is not lifted, so that the substrate can always be stably taken out from the substrate holder.
[0012]
According to a second aspect of the present invention, the suction pad has a decompression section surrounded by a cup section made of a flexible material, and presses the substrate against an opening of the cup section to push out an internal gas to the outside. 2. The substrate holder according to claim 1, wherein the substrate is sucked by reducing the pressure inside the pressure reducing unit to reduce the pressure in the pressure reducing unit.
[0013]
This suction pad is a so-called suction cup. As described above, when the substrate is taken out of the substrate holder, the suction force moves the substrate from the suction surface in parallel to the suction surface and dissociates the suction surface from the substrate surface. Thus, the size is set so that the vacuum can be broken, the substrate can be easily separated from the sealing member, and the substrate can be transferred to and from the robot. That is, the suction pad has a strong adhesiveness in the direction perpendicular to the suction surface and is effective for holding the substrate, but can be easily displaced in the parallel direction to facilitate separation. Here, when the movable holding member is configured to be openable and closable via a hinge, the suction pad corresponds to a substrate peripheral portion opposite to the hinge with respect to the center of the substrate held by the fixed holding member and the movable holding member. Preferably, when the movable holding member is opened via the hinge, the substrate is prevented from being lifted up by the suction pad at the portion which is first attached to the seal member and is likely to be lifted, and the substrate is sealed with the seal member. Can be effectively separated.
[0014]
The invention according to claim 3 is characterized in that the suction pad is connected to a vacuum line, and is configured to suction the substrate by evacuating through the vacuum line. It is a substrate holder of description. Thereby, the substrate can be easily and reliably held by evacuating the vacuum line, and the holding of the substrate can be released by releasing the evacuation.
[0015]
The invention according to claim 4 is such that a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. 3. A substrate holder according to claim 1, wherein a sealing member for sealing a peripheral portion of the substrate is integrally attached to a holding member for holding the sealing member.
Thereby, after the plating is completed, the movable holding member is moved to release the holding of the substrate, and when the substrate is taken out from the substrate holder, the sealing portion of the sealing member for sealing the peripheral portion of the substrate adheres to the substrate and the sealing member Can be prevented from being turned up from the holding member, and the releasability between the sealing member and the substrate can be improved.
[0016]
The invention according to claim 5 is the substrate holder according to claim 4, wherein a multiple seal structure having at least two loop-shaped seal portions is used as the seal member. Thereby, the periphery of the substrate is multiple-sealed with the sealing member composed of the multiple sealing structures, the sealing width is substantially widened, and even if the centering of the substrate is not perfect, the sealing performance here is more complete. Nature can be achieved.
[0017]
The invention according to claim 6 is characterized in that a partition seal extending in the width direction is provided at a predetermined position along the circumferential direction of the outer seal member made of the multiple seal structure. Substrate holder. Thus, by sealing the predetermined portion along the circumferential direction of the seal member in the width direction with the partition seal portion, even if the seal member is damaged, it is possible to prevent the problem of the sealing performance.
[0018]
According to a seventh aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. In the substrate holder described above, as a sealing member for sealing between the movable holding member and the fixed holding member, the sealing member is crushed when pressed in the width direction, and is restored by an elastic force when the pressing force is released. What is used is a substrate holder.
[0019]
This makes it easy to mount the seal member that seals between the movable holding member and the fixed holding member into, for example, a dovetail-shaped seal groove, and reliably prevents the seal member from coming out of the seal groove. can do. Also, the notch for taking out the tool, which is generated when forming the dovetail groove, causes the plating solution to enter the dovetail groove and deteriorate or solidify, thereby deteriorating the sealing property of the seal member. It is possible to prevent the intrusion of the chemical solution, and it is possible to improve the reliability of the seal and the durability of the seal material.
[0020]
The invention according to claim 8 is such that a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. In the substrate holder, a plate-shaped spring member for urging the substrate toward the fixed holding member when releasing the holding of the substrate by the movable holding member and the fixed holding member is attached to the movable holding member. A substrate holder characterized in that:
[0021]
Thereby, after the plating, the movable holding member is moved to release the holding of the substrate, and when the substrate is taken out from the substrate holder, the movement of the substrate is regulated by the plate-shaped spring member, and the seal attached to the movable holding member is controlled. By separating the member from the substrate, it is possible to prevent the substrate from moving together with the seal member while being stuck to the seal member.
[0022]
The invention according to claim 9 is the substrate holder according to claim 8, wherein the leaf spring member is formed by a leaf spring formed by laminating two or more leaf spring-shaped leaf bodies. This makes it possible to install a leaf spring member (laminated leaf spring) that can secure a long stroke without causing plastic deformation of the spring even in a considerably narrow installation space.
[0023]
According to a tenth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. Wherein the leaf spring member is configured to elastically contact an outer peripheral portion of the substrate when the substrate is held by the movable holding member and the fixed holding member. .
Thus, in the process of holding the substrate by the substrate holder, the substrate is biased inward by the elastic force of the leaf spring member having spring properties, and the positioning of the substrate with respect to the substrate holder via the leaf spring member ( Centering) can be performed.
[0024]
The invention according to claim 11 is the substrate holder according to claim 10, wherein the movable holding member has a function of positioning the substrate with respect to the seal member.
[0025]
According to a twelfth aspect of the present invention, in the substrate holder according to the tenth or eleventh aspect, the leaf spring member also serves as an electrical contact that is in contact with and energizes the substrate. This eliminates the need to separately provide a leaf spring member, and can simplify the structure.
[0026]
The invention according to claim 13 is the substrate holder according to claim 12, wherein the movable holding member has a function of positioning the substrate with respect to the seal member and the electrical contact.
[0027]
In this manner, by providing the movable holding member with the substrate sealing member, (electrical contacts for supplying power to the substrate), and the substrate centering mechanism, the movable holding member of the substrate and the sealing member of the substrate (and the substrate The movable holding member of the substrate has a centering function of the substrate so that the movable holding member is engaged with the fixed holding member on which the substrate is placed. When the substrate is centered, the substrate can be moved to and engaged with a position substantially coincident with the center of the movable holding member. Thereby, the center of the substrate and the sealing member of the substrate (and the electric contact for supplying power to the substrate) can be automatically matched when the movable holding member is engaged with the fixed holding member.
[0028]
Even in a situation where the effective use area of the substrate shifts to the outer peripheral side of the substrate with the times and the so-called edge exclusion area of the substrate is very narrow, the sealing of the substrate and the adhesion to the substrate are surely performed within the narrow area. Power supply can be performed.
[0029]
According to a fourteenth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. In the above substrate holder, when the plating solution leaks to the back side of the substrate held by the movable holding member and the fixed holding member, the fixed holding member detects a liquid leak that short-circuits through the leaked plating solution. A substrate holder provided with at least a pair of conductors.
[0030]
As a result, when a liquid leak occurs and a short circuit occurs between the pair of conductors via the plating solution, a current flows between the pair of conductors and the electric resistance changes (not to be infinite). It is possible to quickly and reliably detect whether or not a liquid leak has occurred by a relatively simple operation, such as measuring the liquid leakage.
[0031]
The invention according to claim 15 is the substrate holder according to claim 14, wherein the pair of conductors is provided below a fixed holding member in which the leaked plating solution is stored. Thus, when a liquid leakage occurs, the leakage of the plating solution is collected in a lower portion of the fixed holding member, and the conductor is locally arranged, thereby detecting the liquid leakage over the entire area of the substrate holder. be able to.
The invention according to claim 16 is the substrate holder according to claim 14, wherein the pair of conductors are located in a loop shape over the entire circumference inside the seal member.
[0032]
The invention according to claim 17 is such that a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. A plating holder, wherein the fixed holding member is provided with a suction pad for sucking a back side of a substrate held by the fixed holding member and the movable holding member. is there.
[0033]
The invention according to claim 18 is such that a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. A substrate holder, wherein the sealing member seals between the movable holding member and the fixed holding member. The sealing member is crushed when pressed in the width direction, and is restored by an elastic force when the pressing force is released. A plating apparatus characterized by using a substrate holder using a substrate.
[0034]
The invention according to claim 19 is such that a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. A plate spring-shaped plate that urges the movable holding member toward the fixed holding member when releasing the holding of the substrate by the movable holding member and the fixed holding member. A plating apparatus using a substrate holder to which a spring member is attached.
[0035]
According to a twentieth aspect of the present invention, a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate. A liquid that short-circuits through the leaked plating solution when the plating solution leaks to the back side of the substrate held by the movable holding member and the fixed holding member. A plating apparatus using a substrate holder provided with at least a pair of conductors for detecting leakage.
[0036]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows an overall layout of a plating apparatus provided with a substrate holder according to an embodiment of the present invention. As shown in FIG. 1, in this plating apparatus, two cassette tables 12 on which a cassette 10 containing a substrate W such as a semiconductor wafer is mounted, and a position such as an orientation flat or a notch of the substrate W are aligned in a predetermined direction. An aligner 14 and a spin dryer 16 for rotating the substrate W after the plating process at a high speed and drying the substrate W are provided. Further, near this, a substrate attaching / detaching portion 20 for mounting a substrate holder 18 for detachably holding a substrate and attaching / detaching the substrate W to / from the substrate holder 18 is provided. In the center of these units, A substrate transfer device 22 composed of a transfer robot that transfers the substrate W between them is arranged.
[0037]
Then, in order from the substrate attaching / detaching portion 20, the stocker 24 for storing and temporarily placing the substrate holder 18, the pre-wet bath 26 for immersing the substrate W in pure water, and the seed layer 500 formed on the surface of the substrate W (FIG. Reference) A presoak tank 28 for etching and removing an oxide film on the surface, a first washing tank 30a for washing the surface of the substrate W with pure water, a blow tank 32 for draining the washed substrate W, and a second washing tank 30b. And a plating tank 34 are arranged in this order. The plating tank 34 is configured by housing a plurality of copper plating units 38 inside an overflow tank 36, and each copper plating unit 38 houses one substrate W inside and performs plating such as copper plating. To be applied. In this example, copper plating will be described, but it goes without saying that the same applies to nickel, solder, silver, and even gold plating.
[0038]
Further, there is provided a substrate holder transfer device 40 which is located at a side of each of these devices and which transfers the substrate holder 18 together with the substrate W between the respective devices, for example, adopts a linear motor system. The substrate holder transport device 40 includes a first transporter 42 that transports a substrate W between the substrate attaching / detaching portion 20 and the stocker 24, a stocker 24, a pre-wet tank 26, a pre-soak tank 28, a washing tank 30a, 30b, A second transporter 44 that transports the substrate W between the blow tank 32 and the plating tank 34 is provided. Note that the second transporter 44 may not be provided, and only the first transporter 42 may be provided.
[0039]
A paddle (not shown) serving as a stirring rod for stirring the plating solution, which is located inside each copper plating unit 38, is driven on the opposite side of the overflow holder 36 of the substrate holder transporting device 40. A paddle driving device 46 is provided.
[0040]
The substrate attaching / detaching portion 20 includes a flat mounting plate 52 that is slidable along the rail 50 in the horizontal direction, and the two substrate holders 18 are mounted on the mounting plate 52 in a horizontal state in parallel. After the transfer of the substrate W between the one substrate holder 18 and the substrate transfer device 22, the mounting plate 52 is slid in the horizontal direction, and the transfer between the other substrate holder 18 and the substrate transfer device 22 is performed. The transfer of the substrate W is performed between them.
[0041]
As shown in FIGS. 2 to 7, the substrate holder 18 is, for example, a rectangular flat plate-shaped fixed holding member 54 made of vinyl chloride, and a movable holding member which is attached to the fixed holding member 54 via a hinge 56 so as to be freely opened and closed. 58. In this example, the movable holding member 58 is configured to be openable and closable via the hinge 56. However, for example, the movable holding member 58 is disposed at a position facing the fixed holding member 54, and the movable holding member 58 The member 58 may be advanced toward the fixed holding member 54 to open and close.
[0042]
The movable holding member 58 has a base portion 58a and a ring-shaped support portion 58b in this example. The movable holding member 58 is made of, for example, vinyl chloride to improve sliding with a holding ring 60 described below. On the surface opposite to the fixed holding member 54, a sealing member (hereinafter, referred to as an inner sealing member) 62 that presses against the peripheral portion of the substrate W to seal the peripheral portion of the substrate W inward via a bolt 64 (see FIG. 6). Mounted protruding. On the other hand, a dovetail-shaped seal groove 66 is provided on the surface on the fixed holding member 54 side, and a seal member (also an outer seal) for sealing the fixed holding member 54 and the movable holding member 58 is provided inside the seal groove 66. (Member) 68 is mounted.
[0043]
When the substrate W is held by the substrate holder 18, the inner seal member 62 presses against the peripheral edge of the surface (plated surface) of the substrate W to seal the peripheral edge thereof. A sealing portion 62a is provided which protrudes toward the movable holding member 58 side and linearly contacts the peripheral portion of the substrate W. The inner seal member 62 is integrally attached to a holding member 70 made of, for example, titanium for holding the inner seal member 62. That is, the inner seal member 62 is adhered to the holding member 70 while covering almost the entire surface of the holding member 70, so that the inner seal member 62 does not peel off or fall off the holding member 70.
[0044]
As described above, by integrally attaching the inner seal member 62 to the holding member 70 for holding the inner seal member 62, the movable holding member 58 is moved to release the holding of the substrate W after plating, and When the inner seal member 62 is removed from the holder 18, the seal portion 62 a of the inner seal member 62 is prevented from adhering to the substrate W and the inner seal member 62 is prevented from rolling up from the holding member 70, and the inner seal member 62 is separated from the substrate W. Performance can be improved. Moreover, by making the inner seal member 62 linearly contact the substrate W via the seal portion 62a, the inner seal member 62 is reliably sealed with a low tightening pressure, and an area that can be effectively used as a pattern formation region of the substrate W. Can be spread.
[0045]
On the other hand, when the substrate W is held by the substrate holder 18, the outer seal member 68 presses the outer surface of the inner seal member 62 against the surface of the fixed holding member 54 on the side of the movable holding member 58 to seal it. In this example, the outer seal member 68 has seal portions 68a and 68b on the upper and lower surfaces substantially at the center in the width direction, and diverges toward the bottom of the seal groove 66, and is pressed in the width direction. A W-shaped cross section is used, which is easily crushed and narrowed, and returns outward by elastic force when the pressing force is released. Accordingly, when the outer seal member 68 is mounted in the dovetail-shaped seal groove 66, the mounting side end of the outer seal member 68 is crushed in the width direction, so that the outer seal member 68 is mounted in the seal groove 66. Is easily performed, and the outer seal member 68 after being attached is expanded outward by its elastic force, whereby the escape of the outer seal member 68 from the seal groove 66 can be reliably prevented.
[0046]
Further, by making the side surface of the outer seal member 68 contact with the side wall surface of the seal groove 66 with a constant elastic force, as shown in FIG. 7, this occurs when the dovetail-shaped seal groove 66 is formed. The plating solution penetrates into the seal groove 66 due to the notch 66a for taking out the tool, and the plating solution is deteriorated or solidified, thereby deteriorating the sealing property of the outer seal member 68. However, the present structure prevents the penetration of the chemical solution. It is also possible to improve the reliability of the seal and the durability of the seal material.
[0047]
A step portion is provided on the outer peripheral portion of the movable holding member 58, and a pressing ring 60 is mounted on the step portion via a pressing plate 72 so as not to escape and to be rotatable. The holding ring 60 has excellent corrosion resistance to an oxidizing environment and has sufficient rigidity, for example, is made of titanium.
[0048]
An inverted L-shaped clamper 74 having a protruding portion protruding inward is provided on the fixed holding member 54 at an equal interval along the circumferential direction, located outside the press ring 60. The lower surface of the surface of the press ring 60 and the lower surface of the inwardly protruding portion of the clamper 74 located so as to cover the surface are tapered surfaces inclined in opposite directions along the rotation direction. Further, at a plurality of locations (for example, four locations) along the circumferential direction of the holding ring 60, a rotating pin 112 is inserted thereinto as described below, and the rotating pin 112 is rotated, thereby holding the holding ring 60. An elongated hole 60a to be rotated is provided.
[0049]
Thus, with the movable holding member 58 opened, the substrate W is inserted into the central portion of the fixed holding member 54, the movable holding member 58 is closed via the hinge 56, and the pressing ring 60 is rotated clockwise, By sliding the outer periphery of the holding ring 60 into the inwardly protruding portion of the clamper 74, the fixed holding member 54 and the movable holding member 58 are connected via the tapered surfaces respectively provided on the holding ring 60 and the clamper 74. The lock is released by tightening and locking each other, and rotating the presser ring 60 counterclockwise and pulling it out of the protrusion of the inverted L-shaped clamper 74. When the movable holding member 58 is locked in this way, the sealing portion 62a of the inner sealing member 62 is on the surface of the substrate W, and the sealing portion 68a is on the surface of the fixed holding member 54 for the outer sealing member 68. In addition, the seal portion 68b is pressed against the bottom surface of the seal groove 66, and uniformly presses the seal members 62, 68 to reliably seal the seal members.
[0050]
At the center of the fixed holding member 54, a ridge 82 that projects in a ring shape according to the size of the substrate W, and whose surface comes into contact with the peripheral edge of the substrate W to become a support surface 80 that supports the substrate W is provided. A concave portion 84 is provided at a predetermined position along the circumferential direction of the ridge portion 82.
[0051]
As shown in FIGS. 2 and 5, in each of the recesses 84, a plurality (12 in the figure) of conductors (electric contacts) respectively connected to a plurality of wires extending from external contacts provided on the hand 120 described below. When the substrate W is placed on the support surface 80 of the fixed holding member 54 with the 86 disposed, the end of the conductor 86 has a spring property on the surface of the fixed holding member 54 on the side of the substrate W. It is designed to be exposed in the state where it was done.
[0052]
On the other hand, a leg 88a of an electric contact 88 is fixed to a position of the support 58b of the movable holding member 58 facing the conductor 86. The electric contact 88 is formed in a leaf spring shape. Further, when the substrate W after plating is removed from the substrate holder 18, the substrate W is attached to the seal portion 62 a of the inner seal member 62. It has a function of preventing it from being lifted together with the substrate W. That is, the electric contact 88 has a contact portion 88b located outside of the inner seal member 62 and protruding inward in a leaf spring shape. When the substrate W is easily bent by holding the substrate W with the fixed holding member 54 and the movable holding member 58, the contact portion 88b of the electric contact 88 is supported on the support surface 80 of the fixed holding member 54. It is configured to elastically contact the outer peripheral surface of W.
[0053]
Then, as shown in FIG. 5A, the substrate W is placed on the support surface 80 of the fixed holding member 54, and further, as shown in FIGS. 5B to 5C, the movable holding member 58 When the substrate W is held by being moved and locked in the direction of the fixed holding member 54, the exposed portion of the conductor 86 is elastically attached to the lower surface of the leg 88 a of the electric contact 88 via the elastic force of the exposed portion of the conductor 86. Then, the substrate W is elastically contacted with the contact portion 88b of the electrical contact 88 via the elastic force of the contact portion 88b. Thus, power can be supplied to the substrate W via the electric contacts 88 while the substrate W is sealed by the seal members 62 and 68 and held by the substrate holder 18.
[0054]
As described above, the electric contact 88 is formed in a leaf spring shape, and the contact end of the contact portion 88b of the electric contact 88 is brought into contact with the substrate W through the elastic force of the electric contact 88 itself. In addition, the electrical contact 88 can be brought into contact with the substrate W at the outer peripheral portion of the substrate W, so that the area that can be effectively used as a pattern formation region of the substrate W can be increased. Further, when the substrate W is held by the substrate holder 18, the substrate W is urged inward by the elastic force of the contact portion 88 b of the electrical contact 88 in the form of a leaf spring, so that the substrate W is Positioning (centering) of the W with respect to the substrate holder 18 can be performed. Moreover, the sealing member 62 and the electric contact 88 are provided on the movable holding member 58, and the substrate W is positioned with respect to the substrate holder 18 via the electric contact 88, so that when the substrate W is held by the substrate holder 18, the substrate W , The positional relationship between the sealing member 62 and the electrical contact 88 can be kept constant at all times.
[0055]
Then, when a series of processing is completed and the substrate W held by the substrate holder 18 is to be taken out, the movable holding member 58 is moved in a direction away from the fixed holding member 54. As shown in FIGS. 5C and 5B, the contact portion 88b of the electrical contact 88 presses against the outer peripheral portion of the substrate W to urge the substrate W toward the fixed holding member 54. The movement of the substrate W is regulated by the electric contacts 88. For this reason, even if the substrate W is stuck to the seal member 62, only the seal member 62 and the movable holding member 58 rise, and the substrate W is forcibly separated from the seal member 62. When the movable holding member 58 further rises, the contact portion 88b of the electric contact 88 separates from the substrate W and returns to the original state shown in FIG.
[0056]
Thereby, after the plating, the movable holding member 58 is moved to release the holding of the substrate W, and when the substrate W is taken out from the substrate holder 18, the substrate W is stuck to the sealing member 62 together with the sealing member 62. It can be prevented from moving.
It is preferable that at least the surface of the conductor 86 that is in contact with the electric contact 88 be covered with gold or platinum plating, for example.
[0057]
As shown in FIG. 6, a tapered portion 82 a having a spire-shaped tapered surface is provided on a part of the ridge portion 82 of the fixed holding member 54. When the substrate W is held by the fixed holding member 54 and the movable holding member 58 at the position of the peripheral surface facing the tapered portion 82a, the tapered surface and the reverse tapered surface of the tapered portion 82a engage with each other. A tapered portion 90 for positioning with respect to the centers of 54 and 58 is provided. In other words, as shown in FIG. 6A, the substrate W is placed on the support surface 80 of the fixed holding member 54, and further, as shown in FIGS. 6B to 6C, the movable holding member 58 When the substrate W is moved and locked in the direction of the fixed holding member 54 to hold the substrate W, the tapered portions 82a and 90 guide each other, and the positioning of the movable holding member 58 with respect to the fixed holding member 54 (or vice versa). Is being done.
[0058]
As described above, by providing the tapered portions 82a and 90 that engage with each other on the ridge portion 82 of the fixed holding member 54 and the support portion 58b of the movable holding member 58, the fixed holding member 54 and the movable holding member 58 are separated from each other. Even if the positioning of the two members 54 and 58 is not accurate, in the process of holding the substrate W with the fixed holding member 54 and the movable holding member 58, the two members 54 and 58 are connected via the tapered portions 82 a and 90 engaged with each other. Positioning with respect to the center can be performed automatically.
[0059]
Thus, in the process of holding the substrate W with the fixed holding member 54 and the movable holding member 58 as described above, the substrate W is positioned with respect to the centers of the two members 54 and 58, and further, via the leaf-spring-shaped electric contacts 88. The positioning (centering) of the substrate W with respect to the substrate holder 18 and eventually the inner seal member 62 can be performed simultaneously.
[0060]
However, reliable centering cannot be achieved only by centering using the tapered portions 82a and 90 that engage with each other. This is because at least a small clearance is required between the two in order to easily engage with each other. Therefore, the center of the substrate W and the center of the movable holding member 58 are shifted by the clearance only in the tapered portions 82a and 90 that engage with each other. Therefore, by installing a plurality of leaf spring members 140 on the movable holding member 58 so as to elastically contact the outer peripheral portion of the substrate W as described below, the substrate W is moved from the outer periphery of the movable holding member 58 to the same position. When the movable holding member 58 engages with the fixed holding member 54, the center of the substrate W can be more securely shifted so that the center of the substrate W matches the center of the movable holding member 58 when the movable holding member 58 engages with the fixed holding member 54. it can. Needless to say, the plurality of leaf springs may take one integrated structure over the outer periphery of the substrate.
The movable holding member and the fixed holding member do not need to be connected by a hinge, and may have a completely separated structure.
[0061]
Further, as shown in FIG. 2, in the protruding portion 82 of the fixed holding member 54, slightly wide concave portions 92 are provided at two positions in this example, which are located on the opposite side of the hinge 56. A suction pad 94 is accommodated in the inside 92. As shown in detail in FIG. 7, the suction pad 94 is made of a flexible material such as rubber, has a conical cup portion 96 having an internal pressure reducing portion, and has a fixing and holding member 54 through a bolt 100. Mounted on. When the substrate W is held by the substrate holder 18, the substrate W presses the opening of the cup 96, pushes the cup 96 outward, and pushes the internal gas to the outside. By reducing the pressure of the pressure reducing section, the rear surface side of the substrate W is sucked.
[0062]
Thus, after the plating is completed, the movable holding member 58 is moved to release the holding of the substrate W, and when the substrate W is taken out from the substrate holder 18, the back surface side of the substrate W is sucked by the suction pad 94, so that the substrate W Can be prevented from moving together with the inner seal member 62 while being stuck to the inner seal member 62. In addition, when the automatic operation is performed using the automatic transfer device, the substrate W is not lifted, so that the substrate W can always be stably taken out from the substrate holder 18. As described above, when the substrate W is taken out from the substrate holder 18, the suction force of the suction pad 94 causes the substrate W to move in parallel from the suction surface and break the vacuum by dissociating the suction surface and the substrate surface. The size is set so that the substrate W can be easily separated from the seal member 62 and the substrate can be transferred to and from the robot. That is, the suction pad 94 has strong adhesion in the direction perpendicular to the suction surface and is effective in holding the substrate W, but can easily be shifted in the parallel direction and facilitate separation. .
[0063]
Although the arrangement position and the number of the suction pads 94 can be set arbitrarily, the suction pads 94 are positioned at positions corresponding to the peripheral edge of the substrate W opposite to the hinge 56 with the center of the substrate W held by the substrate holder 18 interposed therebetween. With this arrangement, when the movable holding member 58 is opened via the hinge 56, the suction pad 94 is used to prevent a portion of the substrate W to be lifted up first by attaching to the inner seal member 62, and the substrate W is sealed inside. It can be effectively separated from the member 62.
[0064]
In addition, what is called a vacuum suction type may be used as this suction pad. In other words, although not shown, a vacuum line is provided inside the fixed holding member 54, and when the substrate is held by the substrate holder 18, the inside of the suction pad and the vacuum line are communicated with each other. The inside of the suction pad may be evacuated to suck the substrate. This makes it possible to easily and surely hold the substrate by vacuuming the vacuum line, and release the vacuuming to release the substrate.
[0065]
The movable holding member 58 is opened and closed by the weight of a cylinder (not shown) and the movable holding member 58. That is, the fixed holding member 54 is provided with a through hole 54a, and a cylinder is provided at a position facing the through hole 54a when the substrate holder 18 is mounted on the mounting plate 52. Thus, the cylinder rod is extended, the movable holding member 58 is opened by pushing up the base 58a of the movable holding member 58 upward with a pressing rod through the through-hole 54a, and the movable rod 58 is contracted by contracting the cylinder rod. It is designed to close under its own weight.
[0066]
In this example, the movable holding member 58 is locked / unlocked by rotating the press ring 60. 8 and 9 show the lock / unlock mechanism 110. This lock / unlock mechanism 110 is provided on the ceiling side, and when the substrate W is put into the substrate holder 18 placed on the placing plate 52 and the movable holding member 58 is closed via the hinge 56. And a rotation pin 112 positioned at a position corresponding to each long hole 60a of the holding ring 60 of the substrate holder 18 located at the center side. Is vertically provided on the lower surface of the main body. Further, a pressing rod 116 is provided which is vertically movable and presses the support portion 58b of the movable holding member 58 of the substrate holder 18 mounted on the mounting plate 52 toward the fixed holding member 54. At a position facing the pressing rod 116, a long hole 114a extending in the circumferential direction is provided.
[0067]
As a result, as described above, the substrate holder 18 in which the substrate W is inserted and the movable holding member 58 is closed is raised together with the mounting plate 52, and after the rotation pin 112 is positioned in the long hole 60a of the holding ring 60. Then, the pressing rod 116 is lowered to press the movable holding member 58 downward, whereby the seal members 62 and 68 are first crushed so that the movable holding member 58 is not rotated. Is rotated to rotate the presser ring 60 so that the presser ring 60 enters the clamper 74 to lock the movable holding member 58.
[0068]
In this manner, by first rotating the press ring 60 via the rotating pin 112 in a state where the pressing rod 116 is lowered to prevent the movable holding member 58 from rotating, the rotation of the press ring 60 can be performed with low friction. It can be carried out. Thereby, the wear of the press ring 60 and the clamper 74, and furthermore, the movable holding member 58 is reduced, and the displacement of the movable hold member 58 due to the co-rotation caused by the rotation of the press ring 60 is prevented. It is possible to prevent the seal members 62 and 68 from being twisted and the sealing properties from being deteriorated.
[0069]
In addition, a ring-shaped thing is used as a rotating body, and instead of the pressing rod 116, a cylindrical pressing member 116 a shown by oblique lines in FIG. 9 is used, whereby the movable holding member 58 is moved by the pressing member 116 a. The support portion 58b may be pressed more uniformly over the entire circumference.
[0070]
This lock / unlock mechanism 110 is provided, locks (or unlocks) one of the two substrate holders 18 placed on the mounting plate 52, and then moves the mounting plate 52 in the horizontal direction. By sliding, the other substrate holder 18 is locked (or unlocked). The substrate holder 18 is provided with a sensor for confirming a contact state between the substrate W and the contact when the substrate W is mounted, and a signal from this sensor is input to a controller (not shown). Has become.
[0071]
A pair of substantially T-shaped hands 120 serving as support portions for transporting and suspending and supporting the substrate holder 18 are connected to an end of the fixed holding member 54 of the substrate holder 18. Then, in the stocker 24, the protruding end of the hand 120 is hooked on the upper surface of the peripheral wall to suspend it vertically, and the hand 120 of the suspended substrate holder 18 is moved to the The substrate holder 18 is transported while being held by the transporter 42. In the pre-wet tank 26, the pre-soak tank 28, the rinsing tanks 30a and 30b, the blow tank 32, and the plating tank 34, the substrate holder 18 is also suspended and held by the peripheral wall via the hand 120.
[0072]
A series of bump plating processes performed by the plating apparatus configured as described above will be described. First, as shown in FIG. 17A, a seed layer 500 as a power supply layer is formed on the surface, and a resist 502 having a height H of, for example, 20 to 120 μm is applied to the entire surface of the seed layer 500. Thereafter, a substrate provided with an opening 502a having a diameter D of, for example, about 20 to 200 μm at a predetermined position of the resist 502 is accommodated in the cassette 10 with its surface (plated surface) facing upward. Is mounted on the cassette table 12.
[0073]
One substrate is taken out from the cassette 10 mounted on the cassette table 12 by the substrate transfer device 22, placed on the aligner 14, and the orientation of the orientation flat or notch is adjusted in a predetermined direction. The substrate aligned by the aligner 14 is transported to the substrate attaching / detaching portion 20 by the substrate transporting device 22.
[0074]
In the substrate attaching / detaching section 20, two substrate holders 18 accommodated in the stocker 24 are simultaneously held by the transporters 42 of the substrate holder transporting device 40, and are transported to the substrate attaching / detaching section 20. Then, the substrate holder 18 is lowered in a horizontal state, whereby the two substrate holders 18 are simultaneously mounted on the mounting plate 52 of the substrate attaching / detaching portion 20, and the cylinder is operated to move the substrate holder 18. The holding member 58 is kept open.
[0075]
In this state, the substrate transferred by the substrate transfer device 22 is inserted into the substrate holder 18 located on the center side, the cylinder is reversely operated to close the movable holding member 58, and then the movable holding member 58 is locked and unlocked by the lock / unlock mechanism. Lock 58. After the mounting of the substrate on one of the substrate holders 18 is completed, the mounting plate 52 is slid in the lateral direction, and the substrate is mounted on the other substrate holder 18 in the same manner. Return 52 to its original position.
[0076]
Thereby, the substrate W is sealed with the sealing members 62 and 68 so that the plating solution does not enter, with the surface on which the plating process is performed exposed from the opening of the substrate holder 18, and the substrate W is sealed with the plating solution by the seal. It is fixed so as to be electrically connected to a plurality of contacts at a portion that does not touch. Here, wiring is connected from the contact point to the hand 120 of the substrate holder 18, and power can be supplied to the seed layer 500 of the substrate by connecting a power source to the hand 120.
[0077]
Next, the two substrate holders 18 on which the substrates W are mounted are simultaneously held by the transporters 42 of the substrate holder transport device 40 and transported to the stocker 24. Then, the substrate holder 18 is lowered in a vertical state, whereby the two substrate holders 18 are suspended and held (temporarily placed) on the stocker 24.
[0078]
In the substrate transporter 22, the substrate attaching / detaching unit 20, and the transporter 42 of the substrate holder transporter 40, the above-described operation is sequentially repeated, and the substrates are sequentially mounted on the substrate holders 18 accommodated in the stocker 24. At a predetermined position (temporary placement).
A sensor provided on the substrate holder 18 for checking the contact state between the substrate and the contact. When it is determined that the contact state is defective, a signal is input to a controller (not shown).
[0079]
On the other hand, in the other transporter 44 of the substrate holder transport device 40, the two substrate holders 18 on which the substrates are mounted and temporarily placed on the stocker 24 are simultaneously grasped, transported to the pre-wet tank 26 and lowered. Thereby, the two substrate holders 18 are put into the pre-wet bath 26.
[0080]
At this time, the sensor for checking the contact state between the substrate and the contact provided on the substrate holder 18, and the substrate holder 18 containing the substrate determined to have a bad contact state is temporarily placed in the stocker 24. And leave. Thus, even if a contact failure occurs between the substrate and the contact when the substrate is mounted on the substrate holder 18, the plating operation can be continued without stopping the apparatus. The substrate having the poor contact is not subjected to the plating treatment. In this case, it is possible to cope with this by removing the unplated substrate from the cassette after returning the cassette.
[0081]
Next, the substrate holder 18 on which the substrate is mounted is transferred to the presoak tank 28 in the same manner as described above, and the oxide film is etched in the presoak tank 28 to expose a clean metal surface. Further, the substrate holder 18 on which the substrate is mounted is transported to the washing tank 30a in the same manner as described above, and the surface of the substrate is washed with pure water in the washing tank 30a.
[0082]
The substrate holder 18 on which the rinsed substrate is mounted is transported to the plating bath 34 filled with the plating solution and suspended and held by the plating unit 38 in the same manner as described above. The transporter 44 of the substrate holder transport device 40 sequentially repeats the above-described operations, sequentially transports the substrate holders 18 on which the substrates are mounted to the plating unit 38 of the plating tank 34, and suspends the substrate holders 18 at predetermined positions.
[0083]
After the suspension of all the substrate holders 18 is completed, the plating solution in the overflow tank 36 is circulated, and the plating voltage is applied between the anode (not shown) in the plating tank 34 and the substrate W while overflowing. Is applied, and at the same time, the paddle is reciprocated by the paddle driving device 46 in parallel with the surface of the substrate, thereby plating the surface of the substrate. At this time, the substrate holder 18 is suspended and fixed by the hand 120 above the plating unit 38, and is supplied with power from the plating power supply to the seed layer 500 (see FIG. 17) through the conductor 86 and the electrical contact 88.
[0084]
After the plating is completed, the application of the plating power supply, the supply of the plating solution, and the reciprocating motion of the paddle are stopped. In the same manner as described above, the substrate is conveyed to the washing tank 30b, and is immersed in pure water in the washing tank 30b to wash the surface of the substrate with pure water. Next, the substrate holder 18 on which the substrate W is mounted is transported to the blow tank 32 in the same manner as described above, where water droplets attached to the substrate holder 18 are removed by blowing air. Thereafter, the substrate holder 18 on which the substrate W is mounted is returned to a predetermined position of the stocker 24 and suspended and held in the same manner as described above.
[0085]
The transporter 44 of the substrate holder transport device 40 sequentially repeats the above operation, and returns the substrate holder 18 on which the plated substrate is mounted to the predetermined position of the stocker 24 in sequence, and suspends and holds the substrate holder 18.
[0086]
On the other hand, in the other transporter 42 of the substrate holder transport device 40, the two substrate holders 18 having the plated substrates W mounted thereon and returned to the stocker 24 are simultaneously grasped, and the substrate is removed and attached in the same manner as described above. It is mounted on the mounting plate 52 of the unit 20. At this time, the sensor provided on the substrate holder 18 for checking the contact state between the substrate and the contact point is mounted on the substrate holder 18 which is determined to have a bad contact state and is temporarily placed in the stocker 24. At the same time, they are transported and placed on the placement plate 52.
[0087]
Then, the lock of the movable holding member 58 of the substrate holder 18 located at the center side is released via the lock / unlock mechanism, and the movable holding member 58 is opened by operating the cylinder. At this time, as described above, the movable holding member 58 is prevented from being opened while the substrate W is attached to the movable holding member 58. In this state, the substrate W after the plating process in the substrate holder 18 is taken out by the substrate transport device 22 and transported to the spin dryer 16, and the spin-dried (water drained) substrate is rotated by the high speed rotation of the spin dryer 16. To return to the cassette 10.
[0088]
Then, after the substrate mounted on one substrate holder 18 was returned to the cassette 10 or in parallel with this, the mounting plate 52 was slid in the horizontal direction, and similarly mounted on the other substrate holder 18. The substrate is spin-dried and returned to the cassette 10.
[0089]
After the mounting plate 52 is returned to the original state, the two substrate holders 18 from which the substrates have been taken out are simultaneously held by the transporters 42 of the substrate holder transporting device 40, and in the same manner as described above, this is Return to place. Thereafter, the two substrate holders 18 on which the plated substrates have been mounted and returned to the stocker 24 are simultaneously held by the substrate holder transport device 40, and placed on the mounting plate 52 of the substrate attaching / detaching portion 20 in the same manner as described above. Place it and repeat the same operation as above.
[0090]
Then, all the substrates are taken out from the substrate holder 18 having the plated substrate mounted thereon and returned to the stocker 24, spin-dried and returned to the cassette 10 to complete the operation. As a result, as shown in FIG. 17B, a substrate W in which the plating film 504 is grown in the opening 502a provided in the resist 502 is obtained.
Next, the substrate W spin-dried as described above is immersed in a solvent such as acetone at a temperature of, for example, 50 to 60 ° C., and the resist 502 on the substrate W is peeled off as shown in FIG. Remove. Then, as shown in FIG. 17D, the unnecessary seed layer 500 exposed to the outside after plating is removed, and a bump made of the plating film 504 is formed.
[0091]
In this example, a stocker 24 for vertically storing the substrate holder 18 is disposed between the substrate attaching / detaching portion 20 and the copper plating unit 38, and the substrate holder 18 between the substrate attaching / detaching portion 20 and the stocker 24 is disposed. The first transporter 42 of the substrate holder transport device 40 transports the substrate holder 18 between the stocker 24 and the copper plating unit 38 by the second transporter 44, so that the transport when not in use is performed. The substrate holder 18 is stored in the stocker 24, and the transfer of the substrate holder 18 before and after sandwiching the stocker 24 is performed smoothly to improve the throughput. Needless to say, all transports may be performed by one transporter.
[0092]
In addition, a robot having a dry hand and a wet hand is used as the substrate transfer device 22, a wet hand is used only when the substrate after plating is taken out from the substrate holder 18, and a dry hand is used in other cases. The back surface of the substrate is kept out of contact with the plating solution by the seal of the substrate holder 18, and in principle, it is not always necessary to use a wet hand. Plating solution contamination due to wraparound or poor sealing occurs, and this contamination can be prevented from contaminating the back surface of a new substrate.
[0093]
In the above example, the electric contact 88 serves as a positioning (centering) function of the substrate W, and when the substrate W after plating is removed from the substrate holder 18, the substrate W is stuck to the seal portion 62 a of the inner seal member 62. The figure shows an example in which a device having a function of preventing lifting together with the substrate W is used to simplify the structure. As shown in FIG. 10, when the substrate W after plating is removed from the substrate holder 18, the substrate W is attached to the seal portion 62 a of the inner seal member 62 and lifted together with the substrate W when the substrate W is plated. A leaf spring member 140 having a spring function and having a function of preventing this may be provided on the movable holding member 58 separately from the electrical contacts. The leaf spring member 140 is arranged, for example, at a position sandwiched between electrical contacts. The operation of the leaf spring member 140 is substantially the same as that of the electric contact 88 shown in FIG. 5 described above, and a description thereof will not be repeated.
[0094]
Accordingly, in the process of holding the substrate W by the substrate holder 18, the substrate W is urged inward by the elastic force of the leaf spring member 140 having a spring property. (Centering) with respect to the substrate holder 18, and furthermore, the movable holding member 58 is provided with the seal member 62, the electric contact and the plate spring member 140, and the substrate W is positioned via the plate spring member 140. When the substrate W is held by the substrate holder 18, the positional relationship among the substrate W, the seal member 62, and the electrical contacts can be always constant via the leaf spring member 140.
[0095]
That is, reliable centering cannot be performed only by centering with the tapered portions 82a and 90 that engage with each other. This is because at least a small clearance is required between the two in order to easily engage with each other. Therefore, the center of the substrate and the center of the movable holding member are shifted by the clearance only in the tapered portions 82a and 90 that engage with each other. Therefore, by installing a plurality of leaf spring members 140 on the movable holding member 58 so as to elastically contact the outer periphery of the substrate W, the substrate W is directed toward the center from the outer periphery of the movable holding member 58 with the same force. When the movable holding member 58 engages with the fixed holding member 54 by exerting the moving force, the substrate can be shifted so that the center of the substrate W is more reliably aligned with the center of the movable holding member 58.
[0096]
In the above example, an example is shown in which the leaf spring member 140 is formed of a single leaf spring-shaped plate body, but as shown in FIG. 11, two or more leaf spring-shaped plate bodies 122a are formed. , 122b are overlapped to form the leaf spring member 140.
[0097]
Accordingly, the leaf spring member 140 (laminated leaf spring 124) capable of securing a long stroke without causing plastic deformation of the spring even in a place where the installation space is considerably narrow is installed. In the process of holding the substrate W by the substrate holder 18 via the (laminated leaf spring 124), the substrate W is positioned (centered) with respect to the substrate holder 18 and when the plated substrate W is taken out from the substrate holder 18. In addition, it is possible to prevent the substrate W from being stuck to the seal portion 62a of the inner seal member 62 and being lifted together with the substrate W.
[0098]
Further, as shown in FIGS. 12 to 14, the inner seal member 62 has two ring-shaped seal portions 126a and 126b on both sides in the width direction, and further, at a predetermined position along the circumferential direction. A multiple seal structure 128 provided with a partition seal portion 126c extending in the width direction may be used. Thereby, the peripheral portion of the substrate W is multiple-sealed by the sealing member 62 including the multiple sealing structure 128, and the seal width is substantially widened. In addition, by sealing the predetermined portion along the circumferential direction of the inner seal member 62 in the width direction with the partition seal portion 126c, even if the inner seal member 62 is damaged, the sealing property is problematic. Can be avoided.
[0099]
That is, as shown in, for example, FIGS. 13A and 13B, the centering of the substrate W is shifted, and for example, the seal portion 126b located inside on the resist line R having a step on the surface of the substrate is straddled. (FIG. 13 (a)), even if the seal portion 126a located outside is straddled (FIG. 13 (b)), the seal portion 126a is straddled as shown by oblique lines in FIGS. 13 (a) and 13 (b). At least one of the seal portions 126a and 126b excluding the portion serves as a seal line, and even if a liquid leak occurs at a portion across the seal line, the seal can be reliably performed. In addition, for example, in FIG. 13B, Xs adjacent to each other across the partition seal portion 126c of the ring-shaped seal portions 126a and 126b. ₁ Division and X ₂ Even if the part is damaged, this damaged X ₁ Division and X ₂ The sealability can be maintained by the partition seal portion 126c located between the first and second portions.
[0100]
FIG. 15 shows a substrate holder according to another embodiment of the present invention. The difference from the above-described substrate holder of this example is that when the plating solution leaks to the surface of the fixed holding member 54 on the movable holding member 58 side, the back surface of the substrate W held by the movable holding member 58 and the fixed holding member 54, A pair of conductive wires (conductors) 130 for detecting liquid leakage that are short-circuited through the leaked plating solution are continuously formed over substantially the entire circumference along the circumferential direction corresponding to the peripheral portion of the rear surface of the substrate W. It is a point provided. The conductive wire 130 is open at one end and the other end is connected to an electric resistance measuring device 132. Other configurations are the same as those described above.
[0101]
According to this example, by measuring the electrical resistance between the pair of conductive wires 130 via the electrical resistance measuring device 132, it is possible to quickly and reliably detect whether or not a liquid leak has occurred. That is, since the pair of conductive wires 130 is open at one end, no current flows even if a current flows therethrough. However, when a liquid leak occurs, the plating solution is a conductor, and thus the plating solution is The pair of conductive lines 130 is short-circuited, that is, as shown by the imaginary line in FIG. 15, the pair of conductive lines 130 is short-circuited as if by a resistance R by a plating solution. Current flows through Thus, by measuring the electric resistance via this current, it is possible to detect whether or not a liquid leak has occurred.
[0102]
In this example, an example is shown in which a pair of conductive wires (conductors) are provided continuously over the entire periphery of the peripheral portion of the substrate. By arranging the pair of conductive wires immediately inside the outer peripheral seal portion as described above, it is possible to detect the leak immediately regardless of where the leak occurs. Further, apart from this example, for example, it may be provided at an arbitrary location where the leaked liquid is likely to accumulate, or a plurality of pairs of conductive wires may be provided in parallel.
[0103]
For example, as shown in FIG. 16, when a liquid leak occurs, a pair of conductive plates (conductors) 142 respectively connected to a pair of electrodes are separated from each other by a predetermined distance below a fixed holding member 54 in which a plating solution is stored. When the plating solution accumulates in the lower portion of the fixed holding member 54 due to a liquid leakage, the conductive plates 142 may be electrically connected to each other through the plating solution. According to this example, by arranging the conductive plate 142 locally, such as below the fixed holding member 54, it is possible to detect liquid leakage over the entire area of the substrate holder 18.
[0104]
As described above, according to this plating apparatus, by setting the cassette containing the substrate on the cassette table and starting the apparatus, the electroplating employing the dipping method is performed fully automatically, and the plating is performed on the surface of the substrate. A metal plating film suitable for a bump or the like can be formed automatically.
[0105]
【The invention's effect】
As described above, according to the present invention, after the plating is completed, the movable holding member is attached to the fixed holding member by attaching the suction pad for sucking the back side of the substrate held by the fixed holding member and the movable holding member. When the substrate is moved to release the holding of the substrate and the substrate is taken out of the substrate holder, the substrate is prevented from moving together with the sealing member while being stuck to the sealing member, and the substrate is always stably taken out of the substrate holder. be able to.
[0106]
Further, by attaching a seal member (inner seal member) for sealing the peripheral portion of the substrate to a holding member for holding the seal member, the movable holding member is moved after plating to release the holding of the substrate. When removing the substrate from the substrate holder, it is possible to prevent the sealing portion of the inner seal member from adhering to the substrate and to prevent the inner seal member from being rolled up from the holding member, thereby improving the releasability between the inner seal member and the substrate. be able to.
[0107]
Further, as a seal member (outer seal member) for sealing between the movable holding member and the fixed holding member, a W-shaped cross section, which is crushed when pressed in the width direction and returns by elastic force when the pressing force is released. By using the seal member, the seal member for sealing between the movable holding member and the fixed holding member can be easily mounted in, for example, a dovetail-shaped seal groove, and escape of the seal member from the seal groove can be achieved. It can be reliably prevented.
[0108]
Further, when the holding of the substrate by the movable holding member and the fixed holding member is released, a leaf spring member having a leaf spring shape that urges the substrate toward the fixed holding member is attached to the movable holding member. When the movable holding member is moved to release the holding of the substrate and the substrate is taken out of the substrate holder, the movement of the substrate is regulated by a leaf spring member having a leaf spring shape, and the sealing member attached to the movable holding member is removed from the substrate. This can prevent the substrate from moving together with the seal member while being stuck to the seal member.
[0109]
Further, when the plating solution leaks to the fixed holding member on the back side of the substrate held by the movable holding member and the fixed holding member, at least one pair of conductors for detecting a liquid leak that short-circuits through the leaked plating solution. By providing, it is possible to quickly detect the occurrence of the liquid leakage and to cope with it, thereby preventing the quality of the subsequent plating and the apparatus from being affected.
[Brief description of the drawings]
FIG. 1 is an overall layout view of a plating apparatus including a substrate holder according to an embodiment of the present invention.
FIG. 2 is a plan view of the substrate holder shown in FIG.
FIG. 3 is a right side view of the substrate holder shown in FIG.
FIG. 4 is a vertical sectional front view of the substrate holder shown in FIG. 1;
FIG. 5 is a cross-sectional view showing a relationship among conductors, electrical contacts, and the substrate when the substrate is held by the substrate holder shown in FIG.
6 is a cross-sectional view illustrating a relationship between a tapered portion of a fixed holding member and a tapered portion of a movable holding member when the substrate is held by the substrate holder illustrated in FIG.
FIG. 7 is a cross-sectional view of a mounting portion of a suction pad in the substrate holder shown in FIG.
FIG. 8 is a cross-sectional view showing a state where the substrate holder is locked by the lock / unlock mechanism.
FIG. 9 is a plan view of a lock / unlock mechanism.
FIG. 10 is a cross-sectional view showing the relationship between the leaf spring member and the substrate when the substrate is held, in the order of steps, of an example of the leaf spring member.
FIG. 11 is a cross-sectional view showing an example in which a leaf spring member is constituted by a leaf spring.
FIG. 12 is a plan view showing another example of the inner seal member.
FIG. 13 is an enlarged view of a portion A in FIG.
FIG. 14 is a cross-sectional view of FIG.
FIG. 15 is a plan view showing a substrate holder according to another embodiment of the present invention.
FIG. 16 is a plan view showing a substrate holder according to still another embodiment of the present invention.
FIG. 17 is a cross-sectional view showing a step of forming a bump (protruding electrode) on a substrate in the order of steps.
[Explanation of symbols]
10 cassettes
12 cassette table
14 Aligner
16 Spin dryer
18 Substrate holder
20 Board detachable part
22 Substrate transfer device
24 Stocker
26 Pre-wet tank
28 presoak tank
30a, 30b Rinse tank
32 blow tank
34 Plating tank
36 Overflow tank
38 Plating unit
40 Substrate holder transfer device
42,44 Transporter
46 paddle drive
54 Fixed holding member
56 Hinge
58 Movable holding member
58a base
58b support
60 Presser ring
62 Inner seal member
66 Seal groove
68 Outer seal member
70 Holding member
74 Clamper
80 Support surface
82 ridge
82a taper part
86 conductor
88 electrical contacts
90 Taper
94 Suction pad
96 cups
98 vacuum section
110 Lock / Unlock mechanism
112 Rotating pin
114 rotating plate
116 Push rod
122a, 122b plate
124 leaf spring
128 multiple seal structure
130 conductive wire (conductor)
132 Electric resistance measuring instrument
140 leaf spring member
142 conductive plate (conductor)

Claims

In a substrate holder in which a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate.
A substrate holder, wherein a suction pad for sucking a back surface of a substrate held by the fixed holding member and the movable holding member is attached to the fixed holding member.

The suction pad has a decompression portion surrounded by a cup portion made of a flexible material, and the pressure in the decompression portion is reduced by pressing a substrate against an opening of the cup portion and extruding an internal gas to the outside. The substrate holder according to claim 1, wherein the substrate is configured to be sucked by the substrate.

2. The substrate holder according to claim 1, wherein the suction pad is connected to a vacuum line, and is configured to suck the substrate by evacuating through the vacuum line. 3.

In a substrate holder in which a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate.
A substrate holder, wherein a seal member for sealing a peripheral portion of the substrate is integrally attached to a holding member for holding the seal member.

The substrate holder according to claim 4, wherein a multi-seal structure having at least two loop-shaped seal portions is used as the seal member.

6. The substrate holder according to claim 5, wherein a partition seal extending in a width direction is provided at a predetermined position along a circumferential direction of the outer seal member made of the multiple seal structure.

In a substrate holder in which a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate.
As a sealing member that seals between the movable holding member and the fixed holding member, a sealing member that is crushed when pressed in the width direction and returned by an elastic force when the pressing force is released, and that has a W-shaped cross section is used. Characteristic substrate holder.

In a substrate holder in which a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate.
When releasing the holding of the substrate by the movable holding member and the fixed holding member, a plate-shaped spring member for urging the substrate toward the fixed holding member is attached to the movable holding member. Substrate holder.

9. The substrate holder according to claim 8, wherein the spring member comprises a leaf spring in which two or more leaf spring-shaped leaf bodies are laminated.

In a substrate holder in which a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate.
A substrate holder, wherein a leaf spring member elastically contacts an outer peripheral portion of the substrate when the substrate is held by the movable holding member and the fixed holding member.

The substrate holder according to claim 10, wherein the movable holding member has a function of positioning the substrate with respect to the seal member.

The substrate holder according to claim 10, wherein the leaf spring member also serves as an electrical contact that contacts and energizes the substrate.

13. The substrate holder according to claim 12, wherein the movable holding member has a function of positioning the substrate with respect to the seal member and the electrical contact.

In a substrate holder in which a substrate is interposed between a fixed holding member and a movable holding member to which a seal member is attached, and the movable holding member is pressed toward the fixed holding member to hold the substrate.
The fixed holding member has at least one pair of conductive members for detecting a liquid leak that short-circuits through the leaked plating solution when the plating solution leaks to the back side of the substrate held by the movable holding member and the fixed holding member. A substrate holder provided with a body.

The substrate holder according to claim 14, wherein the pair of conductors is provided below a fixed holding member in which the leaked plating solution is stored.

The substrate holder according to claim 14, wherein the pair of conductors are positioned in a loop around the entire circumference inside the seal member.

A substrate holder having a substrate interposed between a fixed holding member and a movable holding member to which a seal member is attached, and holding the substrate by pressing the movable holding member toward the fixed holding member,
A plating apparatus, wherein a substrate holder having a suction pad for adsorbing a back surface of a substrate held by the fixed holding member and the movable holding member is used as the fixed holding member.

A substrate holder having a substrate interposed between a fixed holding member and a movable holding member to which a seal member is attached, and holding the substrate by pressing the movable holding member toward the fixed holding member,
As a sealing member for sealing between the movable holding member and the fixed holding member, a substrate holder using a W-shaped cross section, which is crushed when pressed in the width direction and is restored by an elastic force when the pressing force is released. A plating apparatus characterized by using:

A substrate holder having a substrate interposed between a fixed holding member and a movable holding member to which a seal member is attached, and holding the substrate by pressing the movable holding member toward the fixed holding member,
A substrate holder having a leaf spring-shaped leaf spring member for urging the substrate toward the fixed holding member when releasing the holding of the substrate by the movable holding member and the fixed holding member, to the movable holding member. A plating apparatus characterized by being used.

A substrate holder having a substrate interposed between a fixed holding member and a movable holding member to which a seal member is attached, and holding the substrate by pressing the movable holding member toward the fixed holding member,
The fixed holding member includes at least one pair of conductive members for detecting a liquid leak that short-circuits through the leaked plating solution when the plating solution leaks to the back side of the substrate held by the movable holding member and the fixed holding member. A plating apparatus using a substrate holder provided with a body.