JP2015151577A - Plating jig for substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating jig applicable to a square-shaped substrate, uniformly applying a surface pressure to a seal packing, and achieving easy sealing operation at the same time.SOLUTION: The plating jig includes: a substrate holder 1 having a substrate accommodation part 14 for accommodating a square-shaped substrate on the top face, and a plurality of claw parts 15 around the substrate accommodation part; a substrate holder cover 2 which holds the substrate between itself and the substrate holder 1 and has an angular opening 25 for exposing a surface to be plated in a state to hold the substrate, with a conductive member and a seal packing 6 for covering a peripheral part of the substrate; and a clamp ring 3 rotatably fixed to the top face of the substrate holder cover, having an angular opening for exposing the surface to be plated, with a plurality of engaging projections 341. The claw parts 15 disposed on a plurality of concentric circles having a center point at approximately the center of the substrate accommodation part include concave grooves. When the clamp ring is rotated, the engaging projections are accommodated in the corresponding concave grooves, respectively.

Description

  The present invention relates to a plating jig for holding a square substrate when electrolytic plating is performed.

  When electrolytic plating is performed on a substrate, a plating jig for holding the substrate is configured such that the energizing pins are in contact with the conductive film of the substrate while holding the substrate. Then, with the substrate held on the plating jig, the substrate is immersed together with the jig in an electrolytic plating solution in a plating bath, and current is passed through the energizing pins to perform electrolytic plating.

  In the conventional plating jig, the current-carrying pins are not sealed, and there is a problem that the plating solution adheres or precipitates. Therefore, in order to protect the current-carrying pins from the plating solution, the substrate surface and the substrate are held to hold the substrate. A method is used in which seal packing is applied across both members, and the seal packing is tightened with a plurality of bolts so as to apply a uniform surface pressure for sealing.

  However, in the case of such a sealing method for tightening a plurality of bolts, workability is poor, and when the tightening force of the bolts is not uniform, the plating solution may permeate into the seal packing.

  Therefore, in Patent Document 1, in order to solve such a problem, the second holding member can be tightened by the tightening ring and the first holding member, and the surface pressure is evenly applied to the seal packing, and the sealing performance is improved. A plating jig that can be easily sealed is disclosed.

  However, this is to rotate and tighten the clamping ring by a predetermined amount to clamp and seal the substrate, and is applied to a circular substrate to the last, and cannot be applied to a rectangular substrate.

JP-A-11-204459

  Therefore, the present invention overcomes the disadvantages of the conventional substrate plating jig, and can be applied to a rectangular substrate. The surface pressure is evenly applied to the seal packing, and the sealing performance is improved. It is an object of the present invention to provide a substrate plating jig that is easy to handle.

  The present invention solves the above-mentioned problem, and has a substrate holder for accommodating a rectangular substrate on the upper surface, and a substrate holder provided with a plurality of claw portions around the substrate accommodating portion, The substrate is sandwiched and held with the substrate holder, and has a rectangular opening that exposes the surface to be plated of the substrate in a state where the substrate is held, and covers the energization member and the peripheral edge of the substrate provided around the substrate housing portion. A substrate holder cover provided with a seal packing, and a rectangular opening that is rotatably attached to the upper surface of the substrate holder cover within a predetermined range and exposes a surface to be plated of the substrate while holding the substrate, and an outer peripheral edge thereof A substrate plating jig provided with a clamp ring in which a plurality of locking projections project from the claw, wherein the claw portion is formed on a plurality of concentric circles with the approximate center of the substrate housing portion as a center point A substrate plating jig, wherein a groove is provided and a concave groove facing the substrate direction is provided, and when the clamp ring is rotated by a predetermined range, the locking protrusion is accommodated in the corresponding groove. is there.

  The substrate plating jig according to the present invention is sealed when the locking projection of the clamp ring is received in the concave groove of the claw portion of the substrate holder cover, and the claw portion is provided on a plurality of concentric circles. Thus, the clamp ring can be tightened at a portion closer to the peripheral edge portion of the substrate to press the seal packing. As a result, the surface pressure is evenly applied to the seal packing even on the rectangular substrate, and the sealing performance is further improved.

Front view of substrate plating jig according to the present invention Partial enlarged sectional view of a substrate plating jig according to the present invention The exploded perspective view of the substrate plating jig concerning the present invention (A) Front view of substrate holder of plating jig according to the present invention, (B) Side view, (C) Perspective view (A) Front view of substrate holder cover of plating jig according to the present invention, (B) Side view, (C) Perspective view, (D) Enlarged sectional view of the same part (A) Front view of substrate holder cover of different embodiment, (B) Side view, (C) Enlarged sectional view of the same part (A) Front view of clamp ring of plating jig according to the present invention, (B) Side view, (C) Perspective view (A) Front view of rotating plate of plating jig according to the present invention, (B) Side view, (C) Perspective view (A) Front view showing the state before clamping the clamp ring of the substrate plating jig according to the present invention, (B) Front view showing the state after clamping the clamp ring of the substrate plating jig according to the present invention

  Hereinafter, embodiments of the substrate plating jig of the present invention will be specifically described with reference to the drawings. Note that the present invention is not limited to these embodiments.

  FIG. 1 is a front view of a substrate plating jig of the present invention, FIG. 2 is a partially enlarged sectional view of the plating jig of the present invention, and FIG. 3 is an exploded perspective view showing the configuration of the plating jig of the present invention. The plating jig of the present invention includes a substrate holder 1 having a substrate accommodating portion 14 on the upper surface, a substrate holder cover 2 attached to the substrate holder 1 and sandwiching and holding the substrate together with the substrate holder 1, and the substrate holder 2 The clamp ring 3 is rotatably mounted in a predetermined range on the upper side, and in addition, an opening / closing plate 4 and a handle 5 are provided for fastening the clamp ring 3. Hereinafter, each member will be described.

  4A is a front view, FIG. 4B is a side view, and FIG. 4C is a perspective view of the substrate holder 1 of the plating jig according to the present invention. As shown in the figure, the substrate holder 1 includes a main body portion 11 formed in an octagonal plate shape, an arm portion 12 extending upward from the upper end of the main body portion 11, and a horizontal state at the upper end of the arm portion 12. The hanger part 13 attached to. On the upper surface of the main body 11, an accommodation portion 14 for accommodating a quadrangular substrate is formed in a table shape that protrudes one step from the main body 11.

  The substrate accommodating portion 14 of this embodiment is formed in a substantially square shape, and a plurality of claw portions 15 are formed so as to surround the outer peripheral edge thereof. The claw portion 15 is formed in a substantially U shape in a side view having a concave groove 151 at the center thereof, and is arranged so that the concave groove 151 faces the substrate direction. The plurality of claw portions 15 are provided on two concentric circles (indicated by a one-dot chain line in FIG. 4) centered on the approximate center of the substrate housing portion 14, and on the concentric circles further away from the center point. In the vicinity of the 14 corners, eight claw portions 15a are provided. Further, four claw portions 15 b are provided on the concentric circles closer to the center point and near the center of the side portion of the accommodating portion 14. Thus, by providing the plurality of claw portions 15 on a plurality of concentric circles having different sizes, it is possible to dispose the claw portions 15 closer to the substrate than when they are provided on the same concentric circle. In addition, about the place where the nail | claw part 15 arrange | positions, you may arrange | position on the 3 or more concentric circle centering on the approximate center of the board | substrate accommodating part 14. FIG. Further, four first energizing members 16 are provided around the accommodating portion 14 in an area sealed by a seal packing 6 of the substrate holder cover 2 described later, and a conductor that communicates with the external electrode is connected. Yes.

  A hole 17 is formed in the vicinity of the boundary between the main body 11 and the arm 12 of the substrate holder 1, and a hinge 18 for attaching the substrate holder cover 2 is provided on the upper portion of the arm 12. The hanger portion 13 is formed so as to protrude from the main body portion 11 to the left and right so that both end portions thereof can be hooked to the wall surface of the plating tank, and an external electrode terminal is provided on a part thereof. The external electrode terminal is connected to a conductor that leads from the hanger portion 13 to the first energizing member 16 through the arm portion 12 and the main body portion 11.

  5A is a front view, FIG. 5B is a side view, FIG. 5C is a perspective view, and FIG. 5D is a partially enlarged sectional view of the substrate holder cover 2 of the plating jig according to the present invention. As shown in the figure, the substrate holder cover 2 is formed in a substantially square shape, and includes a frame portion 21 having a square opening 23 that exposes a surface to be plated of the substrate, and an arm that extends upward from the upper end of the frame portion 21. Part 22. The frame portion 21 has an inner dimension (opening dimension) smaller than the outer dimension of the substrate so that the periphery of the substrate is covered when the substrate is held, and the outer dimension of the frame portion 21 is the outer dimension of the substrate. It is formed to be larger. An L-shaped locking portion 24 for holding the clamp ring 3 is attached to the outer surface of the frame portion 21.

  The substrate holder cover 2 is rotatably attached to the hinge portion 18 of the substrate holder 1 at the attachment portion 26 at the upper end of the arm portion 22. Then, by closing the substrate holder cover 2 and overlapping the substrate holder 1, the substrate can be sandwiched and held. Further, an opening 25 for allowing the claw portion 15 b of the substrate holder 1 to appear when the substrate holder cover 2 is closed is penetrated near the boundary between the frame portion 21 and the arm portion 22.

  As shown in FIG. 2 and FIG. 5D, the frame portion 21 is formed in a substantially L-shaped cross section, and the seal packing 6 formed in a substantially U-shaped cross section is formed on the back surface of the frame portion 21. It is provided over the circumference. The seal packing 6 is formed so as to cover and seal the peripheral edge portion of the substrate and the first energizing member 16 when the substrate is held by the substrate holder 1 and the substrate holder cover 2. Furthermore, a second energization member 7 is provided on the lower surface of the seal packing 6 over the entire circumference of the seal packing 6. An electrode contact 71 projects from an arbitrary portion of the second energizing member 7 so as to come into contact with the substrate surface when the substrate is held.

  In addition, about the seal packing attached to a board | substrate holder cover, you may use sealing members, such as a general O-ring, instead of the shaping | molding packing of the aspect of FIG. For example, in the case of the substrate holder cover of the embodiment shown in FIG. 6, the groove portion 27 a and the groove portion 27 b are respectively provided on the outer peripheral edge side and the inner peripheral edge side of the back surface of the frame portion 21 of the substrate holder cover 2. An O-ring made of an elastic material is attached to the grooves 27a and 27b so that a part of the O-ring is exposed to the outside of the groove, and the current-carrying member can be reliably sealed from the plating solution by the O-ring. The elastic material inserted into the grooves 27a and 27b is not limited to the O-ring, and other elastic materials can be used as appropriate.

  7A is a front view, FIG. 7B is a side view, and FIG. 7C is a perspective view of the clamp ring 3 of the plating jig according to the present invention. As shown in the figure, the clamp ring 3 includes a square opening 32 that exposes the surface to be plated of the substrate, and an outer peripheral edge 33 formed in the vicinity of the corner of the square opening 32 and the square opening 32. It consists of a frame part 31 whose outer peripheral edge part is constituted by an outer peripheral edge 34 formed near the center of the side part. The outer peripheral edge 33 and the outer peripheral edge 34 are each formed by two concentric circular arcs having different sizes with the approximate center of the substrate housing portion 14 as a center point, and the outer peripheral edge 33 having a larger diameter of the concentric circle protrudes outward. It has become. Note that the outer peripheral edge of the clamp ring 3 may be formed by three or more concentric circular arcs with the approximate center of the substrate housing portion 14 as the center point.

  On one outer peripheral edge 33, two locking protrusions 331 are provided to protrude outward on the left and right sides. In addition, one locking projection 341 protrudes outward from one outer peripheral edge 34. The plurality of locking projections 331 and 341 project radially outward, and are provided at positions corresponding to the claw portions 15a and 15b, respectively, when the clamp ring 3 is tightened. In this embodiment, the locking protrusion 341 is not formed on the protruding piece that protrudes independently like the locking protrusion 331, and the tip end of the protruding locking protrusion 341 continues as it is. The outer peripheral edge 342 is formed, but this may be an independent protrusion piece such as the locking protrusion 331. In this case, the left and right sides of the locking protrusion 341 are constituted by the outer peripheral edge 34 having the same diameter. A bolt hole 35 for attaching the opening / closing plate 4 is formed in an arbitrary portion of the frame portion 31.

  Next, the overall configuration of the plating jig according to the present invention will be described. As shown in FIG. 1, in the plating jig according to the present invention, the substrate holder cover 2 is pivotally connected to the substrate holder 1 by a hinge 18 so that the substrate can be attached to and detached from the substrate holder 1. In this case, the substrate holder cover 2 is rotated by the hinge portion 18 and raised upward to completely expose the substrate housing portion 14. When the substrate is fixed, the substrate holder cover 2 is rotated by the hinge portion 18 so as to overlap the substrate holder 1, and the substrate is sandwiched from above and below by the substrate holder 1 and the substrate holder cover 2. On the substrate holder cover 2, the clamp ring 3 is engaged and held by a locking portion 24. The locking portion 24 is formed in a substantially L shape, and is held so that the clamp ring 3 does not fall off the substrate holder cover 2 by engaging with the outer peripheral edge 34a portion of the frame portion 31. The movement of the clamp ring 3 in the rotational direction is not restricted, and is allowed to rotate within a predetermined range. In a state where the clamp ring 3 is tightened, the surface to be plated of the substrate installed in the accommodating portion 14 of the substrate holder 1 passes through the square opening 23 of the substrate holder cover 2 and the square opening 32 of the clamp ring 3. Exposed.

  9A shows a state before the substrate holder cover 2 is closed and the clamp ring 3 is tightened, and FIG. 9B shows a state after the clamp ring 3 is tightened. The clamp ring 3 is in a state where the opening 35 of the clamp ring 3 is inclined with respect to the opening 23 of the substrate holder cover 2 in a state (A) before tightening. The locking projections 331 and 341 are not accommodated in the concave groove 151 of the claw portion 15 of the substrate holder 1 and are exposed.

  To clamp the clamp ring 3, the clamp ring 3 is rotated within a predetermined range in the direction of the arrow in FIG. 9A, the angle of the opening 32 of the clamp ring 3 coincides with the opening 23 of the substrate holder cover 2, and The surface area of the substrate W is exposed from the opening 32. Then, as shown in FIG. 9B, when the locking projections 331 and 341 move to the corresponding claw portions 15a and 15b, the locking projections 331 and 341 are slid into the concave groove 151 and accommodated. When the locking protrusions 331 and 341 are thus received in the concave groove 151, the clamp ring 3 is pressed against the substrate holder cover 2.

  Since the substrate holder cover 2 is pressed against the substrate holder 1 by pressing from the clamp ring 3, the side of the seal packing 6 having a substantially U-shaped cross section attached to the back surface of the substrate holder cover 2 as shown in FIG. The tip of the part 61 abuts on the surface of the substrate W, and the tip of the side part 62 abuts on the upper surface of the main body 11 of the substrate holder 1. As a result, the periphery of the substrate W covered by the seal packing 6 can be reliably sealed from the plating solution while the substrate W is firmly held on the substrate holder 1. In addition, what is necessary is just to rotate the clamp ring 3 in the predetermined range in the reverse direction to the arrow direction of FIG. As a result, the locking protrusions 331 and 341 are released from the concave groove 151, and the clamp ring 3 and the substrate holder cover 2 are released from the pressing force against the substrate holder 1.

  As described above, in the plating jig according to the present invention, the sealing protrusions 331 and 341 are sealed by being accommodated in the concave grooves 151 of the corresponding claw portions 15a and 15b, but the claw portions 15a and 15b Since the locking projections 331 and 341 that are provided on a plurality of concentric circles and that engage with the claw portion 15 are also provided at positions corresponding to the claw portion, the clamp ring 3 is disposed at a portion closer to the peripheral edge portion of the substrate. It is possible to apply an average pressure by tightening, and as a result, it is possible to obtain higher sealing performance even with a rectangular substrate.

  Next, a method for energizing the substrate to be plated in the plating jig of the present invention will be described. First, power is supplied from the external power source to the first energizing member 16 through the conductors disposed on the hanger part 13, the arm part 12, and the main body part 11 of the substrate holder 1. When the substrate holder cover 2 is closed while holding the substrate W, the electrode contact 161 of the first energizing member 16 is in contact with the second energizing member 7, and power is supplied to the second energizing member 7. Here, since the electrode contact 71 of the second energizing member 7 is in contact with the surface of the substrate W, power can be supplied to the substrate W.

  The operation of tightening the clamp ring 3 may be either manual or automatic, but when tightening manually, a tightening instrument can be used. As an example of such an instrument, an opening / closing plate 4 formed detachably on the clamp ring 3 as shown in FIG. The opening / closing plate 4 has a handle mounting portion 42 projecting at the center, and bolt holes are formed at the four corners. When the clamp ring 3 is tightened, the clamp ring 3 is clamped by bolts 44 inserted into the bolt holes 42 as shown in FIG. The clamp ring 3 can be tightened by attaching the handle 5 to the bolt hole 35, attaching the handle 5 to the handle attaching portion 42, and manually rotating the handle 5.

  Furthermore, in the plating jig according to the present invention, the opening / closing operation of the substrate holder cover 2 may be automatic instead of manual. In that case, a rod-like member is automatically provided through the hole 17 provided in the substrate holder 1 so that the rod-like member can be automatically moved in and out, and when the substrate holder cover 2 is opened, the rod-like member is raised to the back of the substrate holder cover 2 It can be opened by bringing the substrate holder cover 2 into contact with the substrate holder 2 as it is.

DESCRIPTION OF SYMBOLS 1 ...... Substrate holder 2 ...... Substrate holder cover 3 ...... Clamp ring 4 ...... Opening / closing plate 5 ...... Handle 6 ...... Seal packing 7 ...... Second energization member 11 ...... Body part
DESCRIPTION OF SYMBOLS 12 ...... Arm part 13 ... Hanger part 14 ...... Board | substrate accommodating part 15a ...... Claw part 15b ...... Claw part 16 ...... 1st electricity supply member
17…… Hole 18…… Hinge 21…… Frame
22 ... ... Arm part 23 ... ... Square opening 24 ... ... Locking part 25 ... ... Opening 26 ... ... Mounting part 27a ... ... Groove part 27b ... ... Groove part 31 ... ... Frame part 32 ... ... Square opening 33 ... ... Outer periphery 34 ... Outer rim 35 ... Bolt hole 41 ... Body part
42 ... ... Handle mounting part 43 ... ... Bolt hole 61 ... ... Side part 62 ... ... Side part 71 ... ... Electrode contact 151 ... ... Recessed part 161 ... ... Electrode contact 331 ... ... Locking protrusion 341 ... ... Locking protrusion 342 ... ... Outer peripheral edge W…… Substrate

Claims (4)

  The upper surface includes a substrate accommodating portion for accommodating a rectangular substrate, a substrate holder having a plurality of claw portions around the substrate accommodating portion, and the substrate holder is sandwiched and held together with the substrate holder. A substrate holder cover having a square opening that exposes the surface to be plated of the substrate in the held state, and an energizing member provided around the substrate housing portion and a seal packing that covers the periphery of the substrate, and the substrate holder A clamp ring that is rotatably attached to the upper surface of the cover within a predetermined range and has a square opening that exposes the surface to be plated of the substrate while holding the substrate, and a plurality of locking projections projecting from the outer peripheral edge The substrate plating jig is provided, wherein the claw portion is provided on a plurality of concentric circles having a substantially center of the substrate housing portion as a center point, and a concave groove facing the substrate direction is provided. Vignetting, when the clamping ring is rotated a predetermined range, the substrate plating jig, characterized in that said locking projection is received in a corresponding recess in the groove.   The clamp ring includes an outer peripheral edge formed near the corner of the square opening and an outer peripheral edge formed near the center of the side of the square opening, and the outer peripheral edge is substantially at the center of the substrate housing portion. The center point is formed by a plurality of concentric circular arcs, and one or a plurality of locking projections project radially outward from each outer peripheral edge. The substrate plating jig described.   The seal packing attached to the back surface of the substrate holder cover is formed in a substantially U-shaped cross section, the tip of one side abuts the substrate, and the tip of the other side is the main body of the substrate holder. The substrate plating jig according to claim 1, wherein the substrate plating jig is in contact with an upper surface. The seal packing attached to the back surface of the substrate holder cover is an elastic member attached to a groove portion recessed in the outer peripheral side and the inner peripheral side of the rear surface of the frame portion of the substrate holder cover. The substrate plating jig of any one of 1 or 2.

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