JPH0429662U - - Google Patents
Info
- Publication number
- JPH0429662U JPH0429662U JP6806390U JP6806390U JPH0429662U JP H0429662 U JPH0429662 U JP H0429662U JP 6806390 U JP6806390 U JP 6806390U JP 6806390 U JP6806390 U JP 6806390U JP H0429662 U JPH0429662 U JP H0429662U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- support frame
- pin
- thin plate
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Description
第1図は本考案保持具の実施例における斜視図
、第2図は本考案保持具の実施例における開閉接
続部を説明する側面図、第3図は本考案保持具に
薄板の基板を取付ける状態の側面図、第4図は薄
板基板の斜視図、第5図は本考案における支持枠
体の他の実施例の側断面図、第6図は本考案保持
具を用いてメツキ処理する場合を説明する概要正
面図である。
1……支持枠体、2……押さえ枠体、3……接
続部、4……取付けピン、5……ピン孔、6……
ピン孔、7……取付けピン、8……閉止部、9…
…回動軸、10……蝶番、11……ステー、12
……突起部、13……ラツク、14,15……ス
テー、16……メツキ装置。
Figure 1 is a perspective view of an embodiment of the holder of the present invention, Figure 2 is a side view illustrating the opening/closing connection part of the holder of the present invention, and Figure 3 is for attaching a thin board to the holder of the present invention. 4 is a perspective view of a thin plate substrate, FIG. 5 is a sectional side view of another embodiment of the support frame according to the present invention, and FIG. 6 is a case in which plating is performed using the holder of the present invention. It is a schematic front view explaining. DESCRIPTION OF SYMBOLS 1... Support frame body, 2... Holding frame body, 3... Connection part, 4... Mounting pin, 5... Pin hole, 6...
Pin hole, 7...Mounting pin, 8...Closing part, 9...
...Rotation axis, 10...Hinge, 11...Stay, 12
... protrusion, 13 ... rack, 14, 15 ... stay, 16 ... plating device.
Claims (1)
2とからなる液内処理用薄板の保持具において、
支持枠体1と押さえ枠体2との上端部を開閉可能
にして接続する接続部3を前記支持枠体1と押さ
え枠体2とのそれぞれ下端部に設け、該支持枠体
1と押さえ枠体2の上端部を閉止する閉止部8,
9を設け、前記支持枠体1の上部に薄板aを取り
付ける取付けピン4を、前記押さえ枠体2に前記
取付けピン4を嵌合するピン孔5をそれぞれ設け
、前記押さえ枠体2の下部に薄板取付けピン6を
、前記支持枠体1に前記取付けピン6を嵌合する
ピン孔7を設けたことを特徴とする液内処理用薄
板の保持具。 In a holder for a thin plate for submerged processing consisting of a support frame 1 and a holding frame 2 superimposed on the frame,
Connecting portions 3 for opening and closing the upper ends of the support frame 1 and the presser frame 2 are provided at the lower ends of the support frame 1 and the presser frame 2, respectively. A closing part 8 that closes the upper end of the body 2;
9, a mounting pin 4 for attaching the thin plate a to the upper part of the support frame 1, a pin hole 5 for fitting the mounting pin 4 to the holding frame 2, and a pin hole 5 for fitting the mounting pin 4 to the lower part of the holding frame 2. A holder for a thin plate for submerged processing, characterized in that a thin plate attachment pin 6 is provided in the support frame 1 with a pin hole 7 into which the attachment pin 6 is fitted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6806390U JPH0429662U (en) | 1990-06-27 | 1990-06-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6806390U JPH0429662U (en) | 1990-06-27 | 1990-06-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0429662U true JPH0429662U (en) | 1992-03-10 |
Family
ID=31602184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6806390U Pending JPH0429662U (en) | 1990-06-27 | 1990-06-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0429662U (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010103749A1 (en) * | 2009-03-12 | 2010-09-16 | 住友ベークライト株式会社 | Jig for plating |
JP2010534945A (en) * | 2007-07-30 | 2010-11-11 | ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー | Holding means, apparatus and method for conveying a substrate, in particular a printed circuit board |
JP4730489B2 (en) * | 2000-11-22 | 2011-07-20 | 大森ハンガー工業株式会社 | Board holder with shielding plate |
KR101128615B1 (en) * | 2009-09-11 | 2012-03-26 | 삼성전기주식회사 | Jig for Electrolytic plating |
JP2013125770A (en) * | 2011-12-13 | 2013-06-24 | Kinsus Interconnect Technology Corp | Thin plate support jig |
JP2013142169A (en) * | 2012-01-11 | 2013-07-22 | Mitsubishi Electric Corp | Holder for electroplating and electroplating apparatus using the holder |
JP2015151577A (en) * | 2014-02-14 | 2015-08-24 | 株式会社Jcu | Plating jig for substrate |
JP2020084264A (en) * | 2018-11-26 | 2020-06-04 | 上村工業株式会社 | Holding tool |
-
1990
- 1990-06-27 JP JP6806390U patent/JPH0429662U/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4730489B2 (en) * | 2000-11-22 | 2011-07-20 | 大森ハンガー工業株式会社 | Board holder with shielding plate |
JP2010534945A (en) * | 2007-07-30 | 2010-11-11 | ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー | Holding means, apparatus and method for conveying a substrate, in particular a printed circuit board |
WO2010103749A1 (en) * | 2009-03-12 | 2010-09-16 | 住友ベークライト株式会社 | Jig for plating |
KR101128615B1 (en) * | 2009-09-11 | 2012-03-26 | 삼성전기주식회사 | Jig for Electrolytic plating |
JP2013125770A (en) * | 2011-12-13 | 2013-06-24 | Kinsus Interconnect Technology Corp | Thin plate support jig |
JP2013142169A (en) * | 2012-01-11 | 2013-07-22 | Mitsubishi Electric Corp | Holder for electroplating and electroplating apparatus using the holder |
JP2015151577A (en) * | 2014-02-14 | 2015-08-24 | 株式会社Jcu | Plating jig for substrate |
JP2020084264A (en) * | 2018-11-26 | 2020-06-04 | 上村工業株式会社 | Holding tool |
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