JPH0165860U - - Google Patents

Info

Publication number
JPH0165860U
JPH0165860U JP1987161946U JP16194687U JPH0165860U JP H0165860 U JPH0165860 U JP H0165860U JP 1987161946 U JP1987161946 U JP 1987161946U JP 16194687 U JP16194687 U JP 16194687U JP H0165860 U JPH0165860 U JP H0165860U
Authority
JP
Japan
Prior art keywords
wafer
plating
cup
shaped
plating tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987161946U
Other languages
Japanese (ja)
Other versions
JPH0730687Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987161946U priority Critical patent/JPH0730687Y2/en
Publication of JPH0165860U publication Critical patent/JPH0165860U/ja
Application granted granted Critical
Publication of JPH0730687Y2 publication Critical patent/JPH0730687Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のウエハの固定構造を示す平面
図、第２図はその部分断面図、第３図は従来のウ
エハの固定構造を示す部分断面図、第４図は本考
案で用いる電極治具の概略平面図である。 Fig. 1 is a plan view showing the wafer fixing structure of the present invention, Fig. 2 is a partial sectional view thereof, Fig. 3 is a partial sectional view showing the conventional wafer fixing structure, and Fig. 4 is the electrode used in the present invention. FIG. 3 is a schematic plan view of the jig.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] めつき槽がカツプ状で、めつき液を下部より供
給し、上部よりオーバーフローさせる形式で、陽
極をカツプ状めつき槽下部に配置し、ウエハをめ
つき液がオーバーフローする液面部で三点式電極
治具で固定し、電気的接続をカツプ状めつき槽の
外縁部に形成した電極端子部に上部より接点ピン
を接続して取る構造のウエハ上のＩＣ電極上への
バンプめつき装置において、上記ウエハ固定用電
極治具がバネ性を有する材料で形成され、その構
成としてウエハ外周を下部より支える部位、ウエ
ハ側面より電気的接続を可能にする部位、ウエハ
をカツプ状めつき槽中心方向にバネ力で押さえこ
むための部位およびカツプ状めつき槽外縁部にネ
ジ固定可能な電極端子部で構成され、かつ電気的
接続部以外を耐めつき性のマスキングがなされた
治具でウエハを固定することを特徴とするバンプ
めつき装置。 The plating tank is cup-shaped, and the plating solution is supplied from the bottom and overflows from the top.The anode is placed at the bottom of the cup-shaped plating tank, and a three-point electrode is placed on the wafer at the liquid level where the plating solution overflows. In an apparatus for plating bumps onto IC electrodes on a wafer, the bumps are fixed with a jig and the electrical connection is made by connecting contact pins from above to electrode terminals formed on the outer edge of a cup-shaped plating tank. The electrode jig for fixing the wafer is made of a material with spring properties, and its structure includes a part that supports the outer periphery of the wafer from the bottom, a part that enables electrical connection from the side of the wafer, and a part that supports the wafer in the direction of the center of the cup-shaped plating tank. The wafer is fixed using a jig that consists of a part for holding down with spring force and an electrode terminal part that can be screwed to the outer edge of the cup-shaped plating tank, and is masked to resist plating except for the electrical connection part. A bump plating device characterized by:
JP1987161946U 1987-10-22 1987-10-22 Bump plating machine Expired - Lifetime JPH0730687Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987161946U JPH0730687Y2 (en) 1987-10-22 1987-10-22 Bump plating machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987161946U JPH0730687Y2 (en) 1987-10-22 1987-10-22 Bump plating machine

Publications (2)

Publication Number Publication Date
JPH0165860U true JPH0165860U (en) 1989-04-27
JPH0730687Y2 JPH0730687Y2 (en) 1995-07-12

Family

ID=31445327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987161946U Expired - Lifetime JPH0730687Y2 (en) 1987-10-22 1987-10-22 Bump plating machine

Country Status (1)

Country Link
JP (1) JPH0730687Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003326419A (en) * 2002-05-09 2003-11-18 Sony Corp Plating method, plating device, and polishing method, polishing device, and method for manufacturing semiconductor device
JP2016108601A (en) * 2014-12-04 2016-06-20 株式会社オジックテクノロジーズ Jig and jig production method
CN106471162A (en) * 2014-06-26 2017-03-01 株式会社村田制作所 Clamp for electric plating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003326419A (en) * 2002-05-09 2003-11-18 Sony Corp Plating method, plating device, and polishing method, polishing device, and method for manufacturing semiconductor device
CN106471162A (en) * 2014-06-26 2017-03-01 株式会社村田制作所 Clamp for electric plating
JP2016108601A (en) * 2014-12-04 2016-06-20 株式会社オジックテクノロジーズ Jig and jig production method

Also Published As

Publication number Publication date
JPH0730687Y2 (en) 1995-07-12

Similar Documents

Publication Publication Date Title
JPH0165860U (en)
JPS63119678U (en)
JPS6314570U (en)
JPS6373939U (en)
JPS6179536U (en)
JPS6255348U (en)
JPS6236529U (en)
JPH02122067U (en)
JPS62107447U (en)
JPS60152131U (en) Liquid crystal cell connection rubber support structure
JPS61153344U (en)
JPS59134172U (en) Support structure of liquid crystal cell
JPS63115770U (en)
JPS59169042U (en) Liquid processing equipment
JPS6389974U (en)
JPH01122982U (en)
JPS6298242U (en)
JPS62147338U (en)
JPS5895040U (en) Semiconductor device manufacturing equipment
JPS6318849U (en)
JPH0238472U (en)
JPH02122068U (en)
JPS6214388U (en)
JPS6441131U (en)
JPS62162676U (en)