JPS62107447U - - Google Patents
Info
- Publication number
- JPS62107447U JPS62107447U JP19745785U JP19745785U JPS62107447U JP S62107447 U JPS62107447 U JP S62107447U JP 19745785 U JP19745785 U JP 19745785U JP 19745785 U JP19745785 U JP 19745785U JP S62107447 U JPS62107447 U JP S62107447U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- platen
- fixed
- clamp
- clamp member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Landscapes
- Jigs For Machine Tools (AREA)
Description
第１図は本案装置を備えた真空処理室の１例を
示すもので、ａはその一部を截除した平面図、ｂ
はその一部を截除した側面図、第２図はその要部
の拡大断面図、第３図はその上面図である。
１……プラテン、６……ウエハ、７……クラン
プ部材、７ａ……クランプ本体、７ｂ，７ｂ……
電極。
Figure 1 shows an example of a vacuum processing chamber equipped with the device of the present invention, in which a is a partially cutaway plan view and b is a partially cutaway plan view.
2 is an enlarged sectional view of the main part, and FIG. 3 is a top view thereof. 1...Platen, 6...Wafer, 7...Clamp member, 7a...Clamp body, 7b, 7b...
electrode.
Claims (1)
その他のウエハを載置して、これをクランプ部材
により固定自在とする式のものにおいて、該クラ
ンプ部材を、該プラテン上に固定されて該ウエハ
をその下面から支承すべき絶縁材製の台座状のク
ランプ本体と、該本体内に埋設される比較的高電
位の少なくとも正負１対の静電発生用電極とから
成る静電型クランプに構成させると共に、プラテ
ンおよびクランプ本体を貫通し、一端がウエハ裏
面に接触するように少なくとも１本のエゼクタピ
ンを設けて成るプラテン装置。 In a type in which a silicon wafer or other wafer is placed on a platen in a vacuum processing chamber and can be fixed with a clamp member, the clamp member is fixed on the platen and the wafer is fixed on the bottom surface of the wafer. The electrostatic clamp is constructed of a pedestal-shaped clamp body made of an insulating material to be supported from the platen, and at least one pair of positive and negative electrostatic charge generating electrodes of relatively high potential embedded in the body. and a platen device comprising at least one ejector pin that passes through the clamp body and has one end in contact with the back surface of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985197457U JPH0249719Y2 (en) | 1985-12-24 | 1985-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985197457U JPH0249719Y2 (en) | 1985-12-24 | 1985-12-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62107447U true JPS62107447U (en) | 1987-07-09 |
| JPH0249719Y2 JPH0249719Y2 (en) | 1990-12-27 |
Family
ID=31157212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985197457U Expired JPH0249719Y2 (en) | 1985-12-24 | 1985-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249719Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06314735A (en) * | 1993-04-28 | 1994-11-08 | Kyocera Corp | Electrostatic chuck |
| JP2013101898A (en) * | 2011-10-17 | 2013-05-23 | Nissin Ion Equipment Co Ltd | Energy beam irradiation device and workpiece transfer mechanism |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848434A (en) * | 1981-09-17 | 1983-03-22 | Toshiba Corp | Electrostatic chuck device |
| JPS5968931A (en) * | 1982-10-12 | 1984-04-19 | Mitsubishi Electric Corp | Handling tool of semiconductor wafer |
-
1985
- 1985-12-24 JP JP1985197457U patent/JPH0249719Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848434A (en) * | 1981-09-17 | 1983-03-22 | Toshiba Corp | Electrostatic chuck device |
| JPS5968931A (en) * | 1982-10-12 | 1984-04-19 | Mitsubishi Electric Corp | Handling tool of semiconductor wafer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06314735A (en) * | 1993-04-28 | 1994-11-08 | Kyocera Corp | Electrostatic chuck |
| JP2013101898A (en) * | 2011-10-17 | 2013-05-23 | Nissin Ion Equipment Co Ltd | Energy beam irradiation device and workpiece transfer mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0249719Y2 (en) | 1990-12-27 |