JPH01110438U - - Google Patents
Info
- Publication number
- JPH01110438U JPH01110438U JP625388U JP625388U JPH01110438U JP H01110438 U JPH01110438 U JP H01110438U JP 625388 U JP625388 U JP 625388U JP 625388 U JP625388 U JP 625388U JP H01110438 U JPH01110438 U JP H01110438U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- conductive material
- top cover
- leads
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000012811 non-conductive material Substances 0.000 claims 1
Landscapes
- Connecting Device With Holders (AREA)
Description
第１図ａは本考案の一実施例の上蓋を開いた状
態の斜視図、同図ｂは同図ａのＡ部分の部分斜視
図、同図ｃは同図ａのソケツトにＩＣを装着した
状態の部分断面図である。
１……ソケツト本体、２……接触電極、３……
軟質導電材、４……上蓋、５……凸部、６……止
め具、７……ソケツトピン、８……ＩＣ、９……
ＩＣリード。
Figure 1a is a perspective view of an embodiment of the present invention with the top cover open, Figure 1b is a partial perspective view of part A in Figure 1a, and Figure 1c is an IC mounted in the socket in Figure 1A. It is a partial sectional view of a state. 1...Socket body, 2...Contact electrode, 3...
Soft conductive material, 4...Top lid, 5...Protrusion, 6...Stopper, 7...Socket pin, 8...IC, 9...
IC lead.
Claims (1)
置のリードを載せて半導体装置をセツトし、上蓋
をかぶせてこの上蓋裏面の押さえ凸部で前記半導
体装置のリードを前記接触電極に押し付け装着す
る半導体装置用ソケツトにおいて、前記接触電極
上には軟質導電材が設けられ、かつ、前記押さえ
凸部は軟質非導電材で形成されていることを特徴
とする半導体装置用ソケツト。 For semiconductor devices, the leads of the semiconductor device to be attached are placed on the contact electrodes on the socket main body, the semiconductor device is set, the top cover is covered, and the leads of the semiconductor device are pressed against the contact electrodes using the pressing protrusion on the back of the top cover. 1. A socket for a semiconductor device, wherein a soft conductive material is provided on the contact electrode, and the holding convex portion is formed of a soft non-conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP625388U JPH01110438U (en) | 1988-01-20 | 1988-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP625388U JPH01110438U (en) | 1988-01-20 | 1988-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01110438U true JPH01110438U (en) | 1989-07-26 |
Family
ID=31210327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP625388U Pending JPH01110438U (en) | 1988-01-20 | 1988-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01110438U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002075570A (en) * | 2000-08-28 | 2002-03-15 | Nec Kyushu Ltd | Ic socket |
-
1988
- 1988-01-20 JP JP625388U patent/JPH01110438U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002075570A (en) * | 2000-08-28 | 2002-03-15 | Nec Kyushu Ltd | Ic socket |
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