JPH0315492U - - Google Patents
Info
- Publication number
- JPH0315492U JPH0315492U JP7594589U JP7594589U JPH0315492U JP H0315492 U JPH0315492 U JP H0315492U JP 7594589 U JP7594589 U JP 7594589U JP 7594589 U JP7594589 U JP 7594589U JP H0315492 U JPH0315492 U JP H0315492U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- socket
- receiving
- receiving part
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案の実施例１を示す斜視図、第２
図は同縦断面図、第３図は実施例１におけるソケ
ツトの蓋部を示す底面図、第４図は本考案の実施
例２を示す斜視図、第５図は同縦断面図、第６図
は従来のフラツト型半導体装置用ソケツトを示す
斜視図、第７図は従来のフラツト型半導体装置を
示す縦断面図である。
１……金属部、２……ソケツトの蓋部、３……
半導体装置受け部、４……板バネを有するリード
、５……蓋止め部、６……孔、７……半導体装置
、８……外部リード、９……へこみ。
Fig. 1 is a perspective view showing Embodiment 1 of the present invention;
3 is a bottom view showing the lid of the socket in Embodiment 1, FIG. 4 is a perspective view showing Embodiment 2 of the present invention, FIG. 5 is a longitudinal sectional view of the same, and FIG. This figure is a perspective view showing a conventional socket for a flat type semiconductor device, and FIG. 7 is a longitudinal sectional view showing a conventional flat type semiconductor device. 1...Metal part, 2...Socket cover, 3...
Semiconductor device receiving part, 4... Lead having a leaf spring, 5... Lid stopper, 6... Hole, 7... Semiconductor device, 8... External lead, 9... Recess.
Claims (1)
に開閉可能に枢支され、半導体装置の外部リード
を受け部のリードに圧着するソケツトの蓋部とを
備えたフラツト型半導体装置用ソケツトにおいて
、前記ソケツトの蓋部に、前記受け部内の半導体
装置の外部リードに１対１対応で接触するととも
に、ソケツトの蓋部の上面側に露出する金属部を
有することを特徴とするフラツト型半導体装置用
ソケツト。 A flat socket for a semiconductor device, comprising a receiving part for receiving a semiconductor device, and a lid part of the socket, which is pivotably supported on the receiving part so as to be openable and closable, and for crimping external leads of the semiconductor device to the leads of the receiving part. A flat type socket for a semiconductor device, characterized in that the lid portion has a metal portion that contacts the external leads of the semiconductor device within the receiving portion in a one-to-one correspondence and is exposed on the upper surface side of the lid portion of the socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7594589U JPH0315492U (en) | 1989-06-28 | 1989-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7594589U JPH0315492U (en) | 1989-06-28 | 1989-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0315492U true JPH0315492U (en) | 1991-02-15 |
Family
ID=31616968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7594589U Pending JPH0315492U (en) | 1989-06-28 | 1989-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0315492U (en) |
-
1989
- 1989-06-28 JP JP7594589U patent/JPH0315492U/ja active Pending