JPH03104986U - - Google Patents

Info

Publication number
JPH03104986U
JPH03104986U JP1428390U JP1428390U JPH03104986U JP H03104986 U JPH03104986 U JP H03104986U JP 1428390 U JP1428390 U JP 1428390U JP 1428390 U JP1428390 U JP 1428390U JP H03104986 U JPH03104986 U JP H03104986U
Authority
JP
Japan
Prior art keywords
contact
socket
lid
semiconductor device
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1428390U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1428390U priority Critical patent/JPH03104986U/ja
Publication of JPH03104986U publication Critical patent/JPH03104986U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第3図は本考案の一実施例のソケ
ツトに半導体装置の装着を説明する断面図、第4
図は従来の半導体装置用ソケツトに半導体装置を
装着する途中状態を示す断面図である。 1……ソケツト本体、1a……ソケツト絶縁体
、2……接触子、3,13……蓋、4……ばね、
5……リード押さえ、6……ガイド穴、7……ガ
イドピン、11……半導体素子、12……リード
1 to 3 are cross-sectional views illustrating mounting of a semiconductor device to a socket according to an embodiment of the present invention, and FIG.
The figure is a sectional view showing a state in which a semiconductor device is being mounted in a conventional semiconductor device socket. 1... Socket body, 1a... Socket insulator, 2... Contact, 3, 13... Lid, 4... Spring,
5... Lead holder, 6... Guide hole, 7... Guide pin, 11... Semiconductor element, 12... Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ソケツト絶縁体の上部凹所に設けられた接触子
を有し、この接触子に装着する半導体装置のリー
ドが重ねるように載置され、蓋を閉めることによ
り前記リードと接触子との密着接触がなされる半
導体装置用ソケツトにおいて、前記蓋には、ばね
により傾きをもたせて取付けられているリード押
さえを有することを特徴とする半導体装置用ソケ
ツト。
The socket has a contact provided in the upper recess of the socket insulator, and the leads of the semiconductor device to be attached to the contact are placed so as to be overlapped, and when the lid is closed, the leads and the contact are brought into close contact. 1. A socket for a semiconductor device according to the present invention, wherein the lid has a lead holder attached to the lid so as to be tilted by a spring.
JP1428390U 1990-02-16 1990-02-16 Pending JPH03104986U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1428390U JPH03104986U (en) 1990-02-16 1990-02-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1428390U JPH03104986U (en) 1990-02-16 1990-02-16

Publications (1)

Publication Number Publication Date
JPH03104986U true JPH03104986U (en) 1991-10-30

Family

ID=31517652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1428390U Pending JPH03104986U (en) 1990-02-16 1990-02-16

Country Status (1)

Country Link
JP (1) JPH03104986U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251025A (en) * 1998-02-27 1999-09-17 Enplas Corp Ic socket
JP2003100409A (en) * 2001-09-21 2003-04-04 Enplas Corp Socket for the electric parts
JP2020087785A (en) * 2018-11-28 2020-06-04 株式会社エンプラス socket

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251025A (en) * 1998-02-27 1999-09-17 Enplas Corp Ic socket
JP2003100409A (en) * 2001-09-21 2003-04-04 Enplas Corp Socket for the electric parts
JP4658415B2 (en) * 2001-09-21 2011-03-23 株式会社エンプラス Socket for electrical parts
JP2020087785A (en) * 2018-11-28 2020-06-04 株式会社エンプラス socket

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