JPS6314570U - - Google Patents

Info

Publication number
JPS6314570U
JPS6314570U JP10634486U JP10634486U JPS6314570U JP S6314570 U JPS6314570 U JP S6314570U JP 10634486 U JP10634486 U JP 10634486U JP 10634486 U JP10634486 U JP 10634486U JP S6314570 U JPS6314570 U JP S6314570U
Authority
JP
Japan
Prior art keywords
wafer
support stand
semiconductor wafer
cathode electrode
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10634486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10634486U priority Critical patent/JPS6314570U/ja
Publication of JPS6314570U publication Critical patent/JPS6314570U/ja
Pending legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示し、aは要部断
面図、bはウエハ部平面図、第2図は従来のめつ
き装置を示し、aは要部平面図、bはウエハ部平
面図である。 1:ウエハ、2:カソード電極、3:アノード
ネツト、4:めつき液、5:めつき槽底部、6:
蓋体、7:めつき液流出口。
FIG. 1 shows an embodiment of the present invention, in which a is a sectional view of the main part, b is a plan view of the wafer part, and FIG. 2 is a conventional plating apparatus, in which a is a plan view of the main part, and b is a plan view of the wafer part. FIG. 1: Wafer, 2: Cathode electrode, 3: Anode net, 4: Plating solution, 5: Bottom of plating tank, 6:
Lid body, 7: Plating liquid outlet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエハ側面に接触するカソード電極を備えたウ
エハ支持台と該支持台の上方に配置される蓋体と
を有し、該蓋体に支持台に向かうめつき液流出口
と該流出口の下側に張られたアノードネツトとを
備えたことを特徴とする半導体ウエハのめつき装
置。
It has a wafer support stand equipped with a cathode electrode that contacts the side surface of the wafer, and a lid disposed above the support stand. 1. A semiconductor wafer plating apparatus characterized by comprising: an anode net stretched over a semiconductor wafer;
JP10634486U 1986-07-11 1986-07-11 Pending JPS6314570U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10634486U JPS6314570U (en) 1986-07-11 1986-07-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10634486U JPS6314570U (en) 1986-07-11 1986-07-11

Publications (1)

Publication Number Publication Date
JPS6314570U true JPS6314570U (en) 1988-01-30

Family

ID=30981612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10634486U Pending JPS6314570U (en) 1986-07-11 1986-07-11

Country Status (1)

Country Link
JP (1) JPS6314570U (en)

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