JPS6430844U - - Google Patents
Info
- Publication number
- JPS6430844U JPS6430844U JP12679687U JP12679687U JPS6430844U JP S6430844 U JPS6430844 U JP S6430844U JP 12679687 U JP12679687 U JP 12679687U JP 12679687 U JP12679687 U JP 12679687U JP S6430844 U JPS6430844 U JP S6430844U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- cylinder
- processing
- semiconductor wafer
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 description 3
Landscapes
- Electrodes Of Semiconductors (AREA)
- Electroplating Methods And Accessories (AREA)
Description
第１図は本考案装置の実施例を示す要部縦断側
面図、第２図は従来装置の要部縦断側面図、第３
図は半導体ウエーハの縦断側面図である。
２０……処理筒（メツキ筒）、２３……上部電
極、２４……連通管、２６……電極筒、２７……
下部電極、２９……処理液（メツキ液）、３０…
…処理液（メツキ液）流入口、Ａ……半導体ウエ
ーハ。
Fig. 1 is a longitudinal sectional side view of the main part showing an embodiment of the device of the present invention, Fig. 2 is a longitudinal sectional side view of the main part of the conventional device, and Fig. 3
The figure is a longitudinal side view of a semiconductor wafer. 20... Processing tube (plating tube), 23... Upper electrode, 24... Communication tube, 26... Electrode tube, 27...
Lower electrode, 29... Processing liquid (plating liquid), 30...
...Processing liquid (plating liquid) inlet, A...Semiconductor wafer.
Claims (1)
ハ上面に上部電極を配設した処理筒と、下部電極
を内挿し、底部に処理液流入口を具えた電極筒と
、上記両筒を下部で連結する連通管とからなり、
処理液を、下部電極を浸漬した電極筒より連通管
を介して処理筒上部に露呈した半導体ウエーハ下
面へ噴流させるように構成したことを特徴とする
噴流式液処理装置。 A processing cylinder in which a semiconductor wafer is arranged on the upper part and an upper electrode arranged on the upper surface of the semiconductor wafer, an electrode cylinder in which a lower electrode is inserted and a processing liquid inlet at the bottom, and a communication connecting the two cylinders at the lower part. It consists of a tube,
1. A jet-type liquid processing apparatus characterized in that a processing liquid is jetted from an electrode cylinder in which a lower electrode is immersed, through a communication pipe, onto the lower surface of a semiconductor wafer exposed at the upper part of the processing cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12679687U JPS6430844U (en) | 1987-08-19 | 1987-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12679687U JPS6430844U (en) | 1987-08-19 | 1987-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430844U true JPS6430844U (en) | 1989-02-27 |
Family
ID=31378638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12679687U Pending JPS6430844U (en) | 1987-08-19 | 1987-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430844U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01128547A (en) * | 1987-11-13 | 1989-05-22 | Fujitsu Ltd | Fine pattern gold plating apparatus |
-
1987
- 1987-08-19 JP JP12679687U patent/JPS6430844U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01128547A (en) * | 1987-11-13 | 1989-05-22 | Fujitsu Ltd | Fine pattern gold plating apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6430844U (en) | ||
| JPH0231236U (en) | ||
| JPS6314570U (en) | ||
| JPS60183437U (en) | Semiconductor wafer etching tools | |
| JPS6370144U (en) | ||
| JPS62180941U (en) | ||
| JPH0299970U (en) | ||
| JPS63143577U (en) | ||
| JPS6240830U (en) | ||
| JPH0394979U (en) | ||
| JPH0420225U (en) | ||
| JPS60190747U (en) | Adsorption holding device | |
| JPS63162528U (en) | ||
| JPS62153374U (en) | ||
| JPS61144636U (en) | ||
| JPH02122067U (en) | ||
| JPS5986260U (en) | Muddy dust discharge device in cyclone dust collector | |
| JPS6153781U (en) | ||
| JPS59162162U (en) | Jet solder dip equipment | |
| JPH0367069U (en) | ||
| JPS63142536U (en) | ||
| JPH0474454U (en) | ||
| JPH0225587U (en) | ||
| JPS61151924U (en) | ||
| JPH0193724U (en) |