JPS61144636U - - Google Patents

Info

Publication number
JPS61144636U
JPS61144636U JP2851885U JP2851885U JPS61144636U JP S61144636 U JPS61144636 U JP S61144636U JP 2851885 U JP2851885 U JP 2851885U JP 2851885 U JP2851885 U JP 2851885U JP S61144636 U JPS61144636 U JP S61144636U
Authority
JP
Japan
Prior art keywords
wafer
wafer surface
nozzle
susceptor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2851885U
Other languages
Japanese (ja)
Other versions
JPH0528758Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985028518U priority Critical patent/JPH0528758Y2/ja
Publication of JPS61144636U publication Critical patent/JPS61144636U/ja
Application granted granted Critical
Publication of JPH0528758Y2 publication Critical patent/JPH0528758Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例の断面図、第２図ａとｂ
はそれぞれ第１図の装置のノズルとウエハを示す
平面図、第３図は前処理をなす前のウエハの部分
的拡大断面図である。 図中、１１はウエハ、１２はサセプタ、１３は
ノズル、１４はカツプ、１５はサセプタの凹部、
１６はジエツト流、１７は排水管、１８は水の回
収部、１９は再処理部、２０はポンプ、をそれぞ
れ示す。 Figure 1 is a sectional view of the embodiment of the present invention, Figure 2 a and b
1 is a plan view showing the nozzle and wafer of the apparatus shown in FIG. 1, and FIG. 3 is a partially enlarged sectional view of the wafer before pretreatment. In the figure, 11 is a wafer, 12 is a susceptor, 13 is a nozzle, 14 is a cup, 15 is a recess in the susceptor,
16 is a jet flow, 17 is a drain pipe, 18 is a water recovery section, 19 is a reprocessing section, and 20 is a pump.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエハの前処理においてサセプタ内に表
面が突出するよう配置された該ウエハに対しほぼ
同一平面にノズルを配置し、該ノズルから前記ウ
エハに向け水のジエツト流をウエハ表面にほぼ平
行に加えてウエハ表面を削る構成としたことを特
徴とする半導体ウエハ表面処理装置。 In the pre-processing of semiconductor wafers, a nozzle is arranged substantially on the same plane as the wafer, which is arranged so that its surface protrudes into the susceptor, and a jet flow of water is applied from the nozzle toward the wafer substantially parallel to the wafer surface. A semiconductor wafer surface processing apparatus characterized by being configured to scrape the wafer surface.
JP1985028518U 1985-02-28 1985-02-28 Expired - Lifetime JPH0528758Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985028518U JPH0528758Y2 (en) 1985-02-28 1985-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985028518U JPH0528758Y2 (en) 1985-02-28 1985-02-28

Publications (2)

Publication Number Publication Date
JPS61144636U true JPS61144636U (en) 1986-09-06
JPH0528758Y2 JPH0528758Y2 (en) 1993-07-23

Family

ID=30526465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985028518U Expired - Lifetime JPH0528758Y2 (en) 1985-02-28 1985-02-28

Country Status (1)

Country Link
JP (1) JPH0528758Y2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999480A (en) * 1973-01-02 1974-09-19
JPS5493972A (en) * 1978-01-06 1979-07-25 Mitsubishi Electric Corp Etching unit of semiconductor element
JPS5580319A (en) * 1978-12-12 1980-06-17 Nec Corp Manufacture of semiconductor device
JPS5844838U (en) * 1981-09-21 1983-03-25 三菱電機株式会社 Wafer cleaning and drying equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844838B2 (en) * 1979-08-06 1983-10-05 鈴木シヤツタ−工業株式会社 Manual operation box for shutting down the shutter at any time

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999480A (en) * 1973-01-02 1974-09-19
JPS5493972A (en) * 1978-01-06 1979-07-25 Mitsubishi Electric Corp Etching unit of semiconductor element
JPS5580319A (en) * 1978-12-12 1980-06-17 Nec Corp Manufacture of semiconductor device
JPS5844838U (en) * 1981-09-21 1983-03-25 三菱電機株式会社 Wafer cleaning and drying equipment

Also Published As

Publication number Publication date
JPH0528758Y2 (en) 1993-07-23

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