JPS58426U - dicing equipment - Google Patents

dicing equipment

Info

Publication number
JPS58426U
JPS58426U JP9496481U JP9496481U JPS58426U JP S58426 U JPS58426 U JP S58426U JP 9496481 U JP9496481 U JP 9496481U JP 9496481 U JP9496481 U JP 9496481U JP S58426 U JPS58426 U JP S58426U
Authority
JP
Japan
Prior art keywords
dicing
nozzle
rotating blade
dicing equipment
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9496481U
Other languages
Japanese (ja)
Other versions
JPS6331927Y2 (en
Inventor
飛田　清文
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP9496481U priority Critical patent/JPS58426U/en
Publication of JPS58426U publication Critical patent/JPS58426U/en
Application granted granted Critical
Publication of JPS6331927Y2 publication Critical patent/JPS6331927Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は半導体ウェーハの平面図、第２図はダイシング
装置によるダイシング加工時の正面図、第３図および第
４図は異なるダイシング加工法を説明するための半導体
ウェーハの平面図、第５図　　　′および第６図は従来
のダイシング装置によるダイシング加工時の側面図、第
７図および第８図はこの考案の一実施例のダイシング装
置によるダイン、ング加工時の側面図である。 １・・・・・・被加工物（半導体ウェーノリ、３．４・
・・・・・溝、６・・・・・・回転ブレード、７ａ、　
　７ｂ・・・・・・ノズル、ｇａ、　　３ｂ・・・・・
・純水。Fig. 1 is a plan view of a semiconductor wafer, Fig. 2 is a front view during dicing processing using a dicing device, Figs. 3 and 4 are plan views of the semiconductor wafer for explaining different dicing processing methods, and Fig. 5 ' and FIG. 6 are side views during dicing processing using a conventional dicing device, and FIGS. 7 and 8 are side views during dicing processing using a dicing device according to an embodiment of the present invention. 1... Workpiece (semiconductor wafer, 3.4.
... Groove, 6 ... Rotating blade, 7a,
7b... Nozzle, ga, 3b...
·Pure water.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回転ブレードと、この回転ブレードのダイシング加工部
近傍に液を噴射するノズルとを備えるダイシング装置に
おいて、前記ノズルを回転ブレードの前後に譚けて、ダ
イシング加工の進行方向によって前記ノズルを切り換え
使用するようにしたことを特徴とするダイシング装置。In a dicing device equipped with a rotating blade and a nozzle that injects liquid near the dicing part of the rotating blade, the nozzle is placed before and after the rotating blade, and the nozzle is switched and used depending on the direction of progress of the dicing process. A dicing device characterized by:
JP9496481U 1981-06-25 1981-06-25 dicing equipment Granted JPS58426U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9496481U JPS58426U (en) 1981-06-25 1981-06-25 dicing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9496481U JPS58426U (en) 1981-06-25 1981-06-25 dicing equipment

Publications (2)

Publication Number Publication Date
JPS58426U true JPS58426U (en) 1983-01-05
JPS6331927Y2 JPS6331927Y2 (en) 1988-08-25

Family

ID=29889886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9496481U Granted JPS58426U (en) 1981-06-25 1981-06-25 dicing equipment

Country Status (1)

Country Link
JP (1) JPS58426U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008192682A (en) * 2007-02-01 2008-08-21 Nec Electronics Corp Dicing method and dicing apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145691U (en) * 1974-10-02 1976-04-03
JPS55112761A (en) * 1979-02-20 1980-08-30 Disco Abrasive Sys Ltd Dry type cutting method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145691B2 (en) * 1973-08-02 1976-12-04

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145691U (en) * 1974-10-02 1976-04-03
JPS55112761A (en) * 1979-02-20 1980-08-30 Disco Abrasive Sys Ltd Dry type cutting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008192682A (en) * 2007-02-01 2008-08-21 Nec Electronics Corp Dicing method and dicing apparatus

Also Published As

Publication number Publication date
JPS6331927Y2 (en) 1988-08-25

Similar Documents

Publication Publication Date Title
JPS58426U (en) dicing equipment
JPS60130010U (en) Semiconductor wafer cutting equipment
JPS62118443U (en)
JPS58159743U (en) Semiconductor pelletizing equipment
JPS6313642U (en)
JPS61201345U (en)
JPS6122348U (en) dicing equipment
JPS58128980U (en) Surface treatment mask
JPS5997825U (en) Wire surface shaving processing equipment
JPS6397454U (en)
JPS5821411U (en) dicing saw
JPS5858340U (en) Semiconductor wafer scriber
JPS58183474U (en) condenser water sprinkler system
JPS63754U (en)
JPS5942042U (en) Substrate processing equipment
JPS60133631U (en) Infrared heat treatment equipment
JPS5849437U (en) Substrate surface treatment equipment
JPS5885418U (en) Holding device for step bending mold
JPS59184952U (en) Nozzle for resin molding of semiconductor chips
JPS5840301U (en) Tube bevel processing equipment
JPS6263928U (en)
JPS62153048U (en)
JPS60194334U (en) Semiconductor wafer cleaning equipment
JPS5846442U (en) Plane positioning device
JPS59103441U (en) semiconductor integrated circuit