JPS58426U - dicing equipment - Google Patents
dicing equipmentInfo
- Publication number
- JPS58426U JPS58426U JP9496481U JP9496481U JPS58426U JP S58426 U JPS58426 U JP S58426U JP 9496481 U JP9496481 U JP 9496481U JP 9496481 U JP9496481 U JP 9496481U JP S58426 U JPS58426 U JP S58426U
- Authority
- JP
- Japan
- Prior art keywords
- dicing
- nozzle
- rotating blade
- dicing equipment
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Details Of Cutting Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は半導体ウェーハの平面図、第2図はダイシング
装置によるダイシング加工時の正面図、第3図および第
4図は異なるダイシング加工法を説明するための半導体
ウェーハの平面図、第5図 ′および第6図は従来
のダイシング装置によるダイシング加工時の側面図、第
7図および第8図はこの考案の一実施例のダイシング装
置によるダイン、ング加工時の側面図である。
1・・・・・・被加工物(半導体ウェーノリ、3.4・
・・・・・溝、6・・・・・・回転ブレード、7a、
7b・・・・・・ノズル、ga、 3b・・・・・
・純水。Fig. 1 is a plan view of a semiconductor wafer, Fig. 2 is a front view during dicing processing using a dicing device, Figs. 3 and 4 are plan views of the semiconductor wafer for explaining different dicing processing methods, and Fig. 5 ' and FIG. 6 are side views during dicing processing using a conventional dicing device, and FIGS. 7 and 8 are side views during dicing processing using a dicing device according to an embodiment of the present invention. 1... Workpiece (semiconductor wafer, 3.4.
... Groove, 6 ... Rotating blade, 7a,
7b... Nozzle, ga, 3b...
·Pure water.
Claims (1)
近傍に液を噴射するノズルとを備えるダイシング装置に
おいて、前記ノズルを回転ブレードの前後に譚けて、ダ
イシング加工の進行方向によって前記ノズルを切り換え
使用するようにしたことを特徴とするダイシング装置。In a dicing device equipped with a rotating blade and a nozzle that injects liquid near the dicing part of the rotating blade, the nozzle is placed before and after the rotating blade, and the nozzle is switched and used depending on the direction of progress of the dicing process. A dicing device characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9496481U JPS58426U (en) | 1981-06-25 | 1981-06-25 | dicing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9496481U JPS58426U (en) | 1981-06-25 | 1981-06-25 | dicing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58426U true JPS58426U (en) | 1983-01-05 |
JPS6331927Y2 JPS6331927Y2 (en) | 1988-08-25 |
Family
ID=29889886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9496481U Granted JPS58426U (en) | 1981-06-25 | 1981-06-25 | dicing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58426U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008192682A (en) * | 2007-02-01 | 2008-08-21 | Nec Electronics Corp | Dicing method and dicing apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5145691U (en) * | 1974-10-02 | 1976-04-03 | ||
JPS55112761A (en) * | 1979-02-20 | 1980-08-30 | Disco Abrasive Sys Ltd | Dry type cutting method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5145691B2 (en) * | 1973-08-02 | 1976-12-04 |
-
1981
- 1981-06-25 JP JP9496481U patent/JPS58426U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5145691U (en) * | 1974-10-02 | 1976-04-03 | ||
JPS55112761A (en) * | 1979-02-20 | 1980-08-30 | Disco Abrasive Sys Ltd | Dry type cutting method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008192682A (en) * | 2007-02-01 | 2008-08-21 | Nec Electronics Corp | Dicing method and dicing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6331927Y2 (en) | 1988-08-25 |
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