JPS5821411U - dicing saw - Google Patents

dicing saw

Info

Publication number
JPS5821411U
JPS5821411U JP11634581U JP11634581U JPS5821411U JP S5821411 U JPS5821411 U JP S5821411U JP 11634581 U JP11634581 U JP 11634581U JP 11634581 U JP11634581 U JP 11634581U JP S5821411 U JPS5821411 U JP S5821411U
Authority
JP
Japan
Prior art keywords
dicing
dicing saw
chip removal
cutting blade
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11634581U
Other languages
Japanese (ja)
Inventor
大施戸　治郎
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP11634581U priority Critical patent/JPS5821411U/en
Publication of JPS5821411U publication Critical patent/JPS5821411U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のグイシングツ−を示す概略構成図、第２
図はこの考案の一実施例を示すグイシングツ−の概略構
成図、第３図は第２図の動作を説明するための部分拡大
斜視図である。 図中、１はフランジ、２はブレード、３はチャックテー
ブル、４はウェハ、５はノズル、６は切粉除去用ノズル
、７はダイシングライン、８は切削溝である。なお、図
中の同一符号は同一または相当部分を示す。Figure 1 is a schematic configuration diagram showing a conventional guiding tool;
The figure is a schematic configuration diagram of a guiding tool showing an embodiment of the invention, and FIG. 3 is a partially enlarged perspective view for explaining the operation of FIG. 2. In the figure, 1 is a flange, 2 is a blade, 3 is a chuck table, 4 is a wafer, 5 is a nozzle, 6 is a nozzle for removing chips, 7 is a dicing line, and 8 is a cutting groove. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウェハ等をダイシングラインに沿ってダイシング
するグイシングツ−において、カッティングブレードと
同（上の所要個所に切粉除去のための水を噴出せしめる
切粉除去用ノズルを設けたことを特徴とするグイシング
ツ−０A dicing tool for dicing semiconductor wafers, etc. along a dicing line is characterized in that it is equipped with a chip removal nozzle that sprays water for chip removal at the same location as the cutting blade. 0
JP11634581U 1981-08-03 1981-08-03 dicing saw Pending JPS5821411U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11634581U JPS5821411U (en) 1981-08-03 1981-08-03 dicing saw

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11634581U JPS5821411U (en) 1981-08-03 1981-08-03 dicing saw

Publications (1)

Publication Number Publication Date
JPS5821411U true JPS5821411U (en) 1983-02-09

Family

ID=29910571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11634581U Pending JPS5821411U (en) 1981-08-03 1981-08-03 dicing saw

Country Status (1)

Country Link
JP (1) JPS5821411U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122962A (en) * 1985-11-22 1987-06-04 東洋アルミニウム株式会社 Sealed vessel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122962A (en) * 1985-11-22 1987-06-04 東洋アルミニウム株式会社 Sealed vessel

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