JPS604357U - cutting equipment - Google Patents
cutting equipmentInfo
- Publication number
- JPS604357U JPS604357U JP9535783U JP9535783U JPS604357U JP S604357 U JPS604357 U JP S604357U JP 9535783 U JP9535783 U JP 9535783U JP 9535783 U JP9535783 U JP 9535783U JP S604357 U JPS604357 U JP S604357U
- Authority
- JP
- Japan
- Prior art keywords
- cutting equipment
- cutting
- cutting blade
- workpiece
- conveyor table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の切削装置の切削ブレードを除いた平面図
である。第２図は第１図の切削装置の要部拡大断面図で
ある。第３図は従来の切削ブレードの要部拡大断面図で
ある。第４図は従来の切削ブレードを用いて半導体ウェ
ーハを切削している状態を示す要部拡大断面図である。
第５図は従来の切削ブレードの切削後の状態を示す要部
拡大断面図である。第６図はこの考案の一実施例の切削
ブレードの断面図である。第７図は第６図の切削ブレー
ドの要部拡大断面図である。第８図は第６図の切削ブレ
ードにより半導体ウェハーを切削している状態を示す要
部拡大断面図である。
１・・・・・・搬送台（ターンテーブル）、２・・・・
・・被切削物（半導体ウェーハ）、３０・・・・・・切
削ブレード、３１・・・・・・外面、３２・・・・・・
刃先部分。FIG. 1 is a plan view of a conventional cutting device with the cutting blade removed. FIG. 2 is an enlarged sectional view of a main part of the cutting device shown in FIG. 1. FIG. 3 is an enlarged sectional view of the main part of a conventional cutting blade. FIG. 4 is an enlarged sectional view of a main part showing a semiconductor wafer being cut using a conventional cutting blade. FIG. 5 is an enlarged cross-sectional view of a main part of a conventional cutting blade after cutting. FIG. 6 is a sectional view of a cutting blade according to an embodiment of this invention. FIG. 7 is an enlarged sectional view of a main part of the cutting blade shown in FIG. 6. FIG. 8 is an enlarged sectional view of a main part showing a semiconductor wafer being cut by the cutting blade of FIG. 6. FIG. 1...Transfer platform (turntable), 2...
... Cutting object (semiconductor wafer), 30 ... Cutting blade, 31 ... Outer surface, 32 ...
The cutting edge part.
Claims (1)
定高さに保持され高速回転によって前記被切削物を切削
する切削ブレードとを備えた切削装置において、 前記切削ブレードの刃先部分を鈍角に形成したことを特
徴とする切削装置。[Claims for Utility Model Registration] A cutting device equipped with a conveyor table on which a workpiece is placed and fixed, and a cutting blade that is held at a predetermined height from the upper surface of the conveyor table and cuts the workpiece by rotating at high speed. . A cutting device, characterized in that the cutting blade has an obtuse cutting edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9535783U JPS604357U (en) | 1983-06-20 | 1983-06-20 | cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9535783U JPS604357U (en) | 1983-06-20 | 1983-06-20 | cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS604357U true JPS604357U (en) | 1985-01-12 |
Family
ID=30227759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9535783U Pending JPS604357U (en) | 1983-06-20 | 1983-06-20 | cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS604357U (en) |
-
1983
- 1983-06-20 JP JP9535783U patent/JPS604357U/en active Pending
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