JPS6028991U - Laser processing equipment - Google Patents
Laser processing equipmentInfo
- Publication number
- JPS6028991U JPS6028991U JP12039783U JP12039783U JPS6028991U JP S6028991 U JPS6028991 U JP S6028991U JP 12039783 U JP12039783 U JP 12039783U JP 12039783 U JP12039783 U JP 12039783U JP S6028991 U JPS6028991 U JP S6028991U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- laser processing
- processing equipment
- pellet
- part corresponding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示すウェハー固定治具の平
面図、第２図はそのＡ−Ａ切断線による断面図である。
１・・・・・・ウェハー固定治具、２・・・・・・半導
体ウェハー、３・・・・・・レーザ加工装置移動台、４
・・曲真空吸引部、５，８・・・・・・吸着穴、６・・
曲ペレット、７・・・・・・ペレット対応固定部、９・
・・・・・抜穀部、１０・・・・・・抜殻対応固定部、
１１・・・パルス発振レーザ光、１２・・・ニゲ溝、１
３・・・・・・ペレット切断パターン、１４・・・・・
・真空源。FIG. 1 is a plan view of a wafer fixing jig showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line A--A. 1... Wafer fixing jig, 2... Semiconductor wafer, 3... Laser processing device moving table, 4
...Curved vacuum suction part, 5, 8...Suction hole, 6...
Curved pellet, 7...Pellet compatible fixing part, 9.
... Grain threshing section, 10... Fixed part for shelling,
11...Pulse oscillation laser beam, 12...Nigge groove, 1
3... Pellet cutting pattern, 14...
・Vacuum source.
Claims (1)
定して該ウェハーを複数のペレットに切断するレーザ加
工装置において、前記ウェハーの切断後の個々のペレッ
トに対応する固定機能部と、切断後の抜穀部に対応する
固定機能部とを前記ウェハー固定治具は有することを特
徴とするレーザ加工装置。In a laser processing device that fixes a semiconductor wafer on a moving table using a wafer fixing jig and cuts the wafer into a plurality of pellets, a fixing function part corresponding to each pellet after cutting the wafer, and a fixing function part corresponding to each pellet after cutting the wafer; A laser processing apparatus characterized in that the wafer fixing jig has a fixing function part corresponding to a threshing part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12039783U JPS6028991U (en) | 1983-08-02 | 1983-08-02 | Laser processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12039783U JPS6028991U (en) | 1983-08-02 | 1983-08-02 | Laser processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6028991U true JPS6028991U (en) | 1985-02-27 |
Family
ID=30275954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12039783U Pending JPS6028991U (en) | 1983-08-02 | 1983-08-02 | Laser processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028991U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0489999U (en) * | 1991-01-18 | 1992-08-05 | ||
| JP2003124154A (en) * | 2001-10-15 | 2003-04-25 | Shinko Electric Ind Co Ltd | Hole formation method of silicon substrate |
| JP2006517730A (en) * | 2003-01-22 | 2006-07-27 | フィーコ ビー．ブイ． | Carrier, holder, laser cutting device, and method for separating semiconductor product using laser beam |
-
1983
- 1983-08-02 JP JP12039783U patent/JPS6028991U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0489999U (en) * | 1991-01-18 | 1992-08-05 | ||
| JP2003124154A (en) * | 2001-10-15 | 2003-04-25 | Shinko Electric Ind Co Ltd | Hole formation method of silicon substrate |
| JP2006517730A (en) * | 2003-01-22 | 2006-07-27 | フィーコ ビー．ブイ． | Carrier, holder, laser cutting device, and method for separating semiconductor product using laser beam |
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