JPS6072211U - Semiconductor wafer scribing equipment - Google Patents
Semiconductor wafer scribing equipmentInfo
- Publication number
- JPS6072211U JPS6072211U JP16479783U JP16479783U JPS6072211U JP S6072211 U JPS6072211 U JP S6072211U JP 16479783 U JP16479783 U JP 16479783U JP 16479783 U JP16479783 U JP 16479783U JP S6072211 U JPS6072211 U JP S6072211U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wafer scribing
- scribing equipment
- cutting edge
- scribing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案装置の概略構成図、第２図は同刃先の移
動軌跡を示す図、第３図は従来における刃先の移動軌跡
を示す図、第４図は他の実施例である。FIG. 1 is a schematic configuration diagram of the device of the present invention, FIG. 2 is a diagram showing the locus of movement of the cutting edge, FIG. 3 is a diagram showing the locus of movement of the conventional cutting edge, and FIG. 4 is another embodiment.
Claims (1)
先にてスクライブする装置に於て、前記刃先とウェハの
一方を他方に対して移動させるためのカム機構を設け、
刃先の下降動作とスクライブ動作をカムに沿って連動さ
せることを特徴とする半導体ウェハのスクライブ装置。In an apparatus for scribing a wafer surface with a needle-like cutting edge in order to divide a semiconductor wafer, a cam mechanism is provided for moving one of the cutting edge and the wafer relative to the other,
A scribing device for semiconductor wafers, characterized in that the lowering operation of the cutting edge and the scribing operation are linked along a cam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16479783U JPS6072211U (en) | 1983-10-24 | 1983-10-24 | Semiconductor wafer scribing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16479783U JPS6072211U (en) | 1983-10-24 | 1983-10-24 | Semiconductor wafer scribing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6072211U true JPS6072211U (en) | 1985-05-21 |
Family
ID=30361206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16479783U Pending JPS6072211U (en) | 1983-10-24 | 1983-10-24 | Semiconductor wafer scribing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6072211U (en) |
-
1983
- 1983-10-24 JP JP16479783U patent/JPS6072211U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6072211U (en) | Semiconductor wafer scribing equipment | |
| JPS6051015U (en) | Wafer scribing equipment | |
| JPS59137012U (en) | Semiconductor pelletizing equipment | |
| JPS6067842U (en) | Wafer polishing equipment | |
| JPS5858340U (en) | Semiconductor wafer scriber | |
| JPS6117742U (en) | semiconductor manufacturing equipment | |
| JPS594635U (en) | bonding equipment | |
| JPS58159742U (en) | Semiconductor pelletizing equipment | |
| JPS59143190U (en) | Speaker diaphragm cutting device | |
| JPS591598U (en) | Magnetic recording media manufacturing equipment | |
| JPS58181534U (en) | thermal transfer device | |
| JPS59178090U (en) | Inari sushi fried skin folding device | |
| JPS59169042U (en) | Liquid processing equipment | |
| JPS6068635U (en) | semiconductor manufacturing equipment | |
| JPS58159743U (en) | Semiconductor pelletizing equipment | |
| JPS59180424U (en) | Jig for semiconductor substrate | |
| JPS6067828U (en) | Workpiece holder | |
| JPS58117733U (en) | glass plate cutting equipment | |
| JPS5958573U (en) | Plasma arc cutting equipment | |
| JPS58191903U (en) | turning equipment | |
| JPS6011095U (en) | XY stage | |
| JPS5883149U (en) | semiconductor equipment | |
| JPS60105160U (en) | Static elimination mechanism in recording devices | |
| JPS6031996U (en) | Shape projection device for determining material removal | |
| JPS60118238U (en) | Facet aligner fine adjustment device |