JPS6117742U

JPS6117742U - semiconductor manufacturing equipment

Info

Publication number: JPS6117742U
Application number: JP10339784U
Authority: JP
Inventors: 幹生毛利
Original assignee: 関西日本電気株式会社
Priority date: 1984-07-09
Filing date: 1984-07-09
Publication date: 1986-02-01
Also published as: JPH019162Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例の半導体製造装置（ＣＶＤ装
置）を示す側面図、第２図は第１図の装置の要部概略斜
視図、第３図乃至第６図は第１図の装置の動作を説明す
るための各動作時の部分拡大側断面図、第７図及び第８
図は第５図のＡ−Ａ線及び第６図のＢ−Ｂ線からの平面
図である。第９図及び第１０図は半導体製造装置（ＣＶＤ装置）の
一例を示す概略側面図及びＣ−ｄ線に沿う断面図、第１
１図は第９図の装置のトレー拡大斜視図、第１２図は従
来のウエーハ取出し装置の側断面図である。１・・・・・・搬送体、３′・・・・・・トレー、１３
・・・・・・半導体ウエーハ、１７・・・・・・ピン、
１８・・・・・・ピン駆動機構、１９・・・・・・アー
ム、２０・・・・・・アーム駆動機構、２１・・・・・
・貫通穴。FIG. 1 is a side view showing a semiconductor manufacturing device (CVD device) according to an embodiment of the present invention, FIG. 2 is a schematic perspective view of the main parts of the device shown in FIG. 1, and FIGS. 3 to 6 are the same as those shown in FIG. 7 and 8 are partially enlarged side sectional views during each operation to explain the operation of the device.
The figure is a plan view taken along line AA in FIG. 5 and line BB in FIG. 6. 9 and 10 are a schematic side view and a cross-sectional view taken along line C-d showing an example of a semiconductor manufacturing device (CVD device);
1 is an enlarged perspective view of the tray of the apparatus shown in FIG. 9, and FIG. 12 is a side sectional view of a conventional wafer unloading apparatus. 1...Carrier, 3'...Tray, 13
... Semiconductor wafer, 17 ... Pin,
18...Pin drive mechanism, 19...Arm, 20...Arm drive mechanism, 21...
・Through hole.

Claims

[Scope of utility model registration request]

This is a device that takes out semiconductor wafers placed on a tray that is continuously fed in one direction by a carrier, and is placed below the tray, and when the tray is in a fixed position, it is inserted into the through hole of the tray from below. A semiconductor wafer on a tray is pushed up and held a certain distance above the tray, and the semiconductor wafer held up by the pins is moved a certain distance with the tray and then removed from the tray. A semiconductor manufacturing device comprising an arm that is held in place of a pin and taken out to the outside, and a drive mechanism for the arm.