JPS593541U - Semiconductor substrate transport mechanism - Google Patents

Semiconductor substrate transport mechanism

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Publication number
JPS593541U
JPS593541U JP9886982U JP9886982U JPS593541U JP S593541 U JPS593541 U JP S593541U JP 9886982 U JP9886982 U JP 9886982U JP 9886982 U JP9886982 U JP 9886982U JP S593541 U JPS593541 U JP S593541U
Authority
JP
Japan
Prior art keywords
semiconductor substrate
transport mechanism
substrate transport
abstract
coil spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9886982U
Other languages
Japanese (ja)
Inventor
長島　正泰
雅史 鈴木
力也 佐藤
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP9886982U priority Critical patent/JPS593541U/en
Publication of JPS593541U publication Critical patent/JPS593541U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る搬送装置の側面図、第２゛図は正
面図また第３図は斜視図である。 図において、１は密着型コイルスプリング、２゜３はプ
ーリー、４はウェハ。FIG. 1 is a side view of a conveying device according to the present invention, FIG. 2 is a front view, and FIG. 3 is a perspective view. In the figure, 1 is a close-contact coil spring, 2°3 is a pulley, and 4 is a wafer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体集積回路の製造装置において真空下で行われる半
導体基板の搬送が回転体と連動する金属製のコイルスプ
リングよりなるベルトにより行われることを特徴とする
半導体基板の搬送機構。1. A semiconductor substrate transport mechanism, characterized in that the semiconductor substrate is transported under vacuum in a semiconductor integrated circuit manufacturing apparatus using a belt made of a metal coil spring interlocking with a rotating body.
JP9886982U 1982-06-30 1982-06-30 Semiconductor substrate transport mechanism Pending JPS593541U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9886982U JPS593541U (en) 1982-06-30 1982-06-30 Semiconductor substrate transport mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9886982U JPS593541U (en) 1982-06-30 1982-06-30 Semiconductor substrate transport mechanism

Publications (1)

Publication Number Publication Date
JPS593541U true JPS593541U (en) 1984-01-11

Family

ID=30234550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9886982U Pending JPS593541U (en) 1982-06-30 1982-06-30 Semiconductor substrate transport mechanism

Country Status (1)

Country Link
JP (1) JPS593541U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5583241A (en) * 1978-12-20 1980-06-23 Toshiba Corp Semiconductor wafer transferring machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5583241A (en) * 1978-12-20 1980-06-23 Toshiba Corp Semiconductor wafer transferring machine

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