JPS5840341U

JPS5840341U - Wafer adsorption device

Info

Publication number: JPS5840341U
Application number: JP13434381U
Authority: JP
Inventors: 高志佐野
Original assignee: 日立精工株式会社
Priority date: 1981-09-11
Filing date: 1981-09-11
Publication date: 1983-03-16

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図はウェハ搬送装置における撮出部全体図。第２図はウェハ搬送装置における搬入郡全体図。第３図は第１図におけるＡ矢視図であり第２図における
Ｂ矢視図である。第４図は本考案にょるウェハ吸着前の
ウェハと吸盤及び固定ピースの相対位置を示す断面図。第５図は第４図に対するウェハ吸着後のウェハと吸盤及
び固定ピースの相対位置を示す断面図。第６図は従来の
吸盤の構成を断面した図である。１・・・テーブル、２・・・吸着チェック、３ａ、　　
３ｂ゛　・・・ウェハ、４ａ、　　４ｂ・・・ウェハカ
セット、６ａ。６ｂ・・・アーム旋回及び上下装置、３ａ、　　８ｂ・
・・吸盤１．１０ａ、１０ｂ・・・アーム、１３・・・
吸盤、１４・・・固、　定ピース。FIG. 1 is an overall view of the photographing section in the wafer transport device. FIG. 2 is an overall view of the loading group in the wafer transfer device. 3 is a view taken along arrow A in FIG. 1 and a view taken along arrow B in FIG. 2. FIG. FIG. 4 is a sectional view showing the relative positions of the wafer, suction cup, and fixing piece before the wafer is suctioned according to the present invention. FIG. 5 is a cross-sectional view showing the relative positions of the wafer, the suction cup, and the fixing piece after the wafer is sucked with respect to FIG. 4; FIG. 6 is a cross-sectional view of the structure of a conventional suction cup. 1...Table, 2...Adsorption check, 3a,
3b゛...Wafer, 4a, 4b...Wafer cassette, 6a. 6b...Arm rotation and up/down device, 3a, 8b.
...Sucker 1.10a, 10b...Arm, 13...
Suction cup, 14...solid, fixed piece.

Claims

[Scope of utility model registration request]

In a wafer transport device that automatically takes out wafers from a wafer cassette using at least three or more suction cups, transports them to a processing position, and stores the processed wafers back into the wafer cassette, a body that holds the suction cups is provided. A plurality of fixing pieces are provided, and suction cups are provided on the outer circumferential surface of the fixing pieces so that the lower ends protrude, and the suction cups spread outward during vacuum suction to attract the wafer to the lower end surfaces of the fixing pieces. A wafer suction device featuring: