JPS6064926U - Wafer transfer device - Google Patents

Wafer transfer device

Info

Publication number
JPS6064926U
JPS6064926U JP15591283U JP15591283U JPS6064926U JP S6064926 U JPS6064926 U JP S6064926U JP 15591283 U JP15591283 U JP 15591283U JP 15591283 U JP15591283 U JP 15591283U JP S6064926 U JPS6064926 U JP S6064926U
Authority
JP
Japan
Prior art keywords
transfer device
wafer transfer
vacuum
wafer
claws
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15591283U
Other languages
Japanese (ja)
Inventor
隆 松本
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP15591283U priority Critical patent/JPS6064926U/en
Publication of JPS6064926U publication Critical patent/JPS6064926U/en
Pending legal-status Critical Current

Links

Landscapes

  • Warehouses Or Storage Devices (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はウェハホルダの構成図でＡは正面、Ｂは側面図
、第２図は真空吸着治具の構成図でＡは断面図、Ｂは平
面図、第３図は本考案に係るウェハ搬送装置の斜視図ま
た第４図は真空吸着機構の断面図である。 図において、１はウェハホルダ、２はシリコンウェハ、
３は爪、４は真空吸着治具、５は吸着　孔、７は吸着部
、８はパイプ部、９はスプリング。Figure 1 is a configuration diagram of a wafer holder, with A being a front view and B being a side view; Figure 2 being a configuration diagram of a vacuum suction jig with A being a sectional view and B being a plan view; Figure 3 being a wafer transfer according to the present invention. FIG. 4 is a perspective view of the apparatus and a sectional view of the vacuum suction mechanism. In the figure, 1 is a wafer holder, 2 is a silicon wafer,
3 is a claw, 4 is a vacuum suction jig, 5 is a suction hole, 7 is a suction part, 8 is a pipe part, and 9 is a spring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウェハホルダに譚けられている爪により垂直方向に保持
されている複数個のウェハを水平方向から順次真空吸着
し所定位置に運搬する装置が柔軟な吸着孔を先端に持つ
と共に伸縮が可能な２個以上の真空吸着治具を備えて構
成されていることを特徴とするウェハ搬送装置。The device, which is similar to a wafer holder, vacuum suctions multiple wafers held vertically by claws in order from the horizontal direction and transports them to a predetermined position.It has two flexible suction holes at the tip and is expandable. A wafer transfer device comprising the vacuum suction jig described above.
JP15591283U 1983-10-07 1983-10-07 Wafer transfer device Pending JPS6064926U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15591283U JPS6064926U (en) 1983-10-07 1983-10-07 Wafer transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15591283U JPS6064926U (en) 1983-10-07 1983-10-07 Wafer transfer device

Publications (1)

Publication Number Publication Date
JPS6064926U true JPS6064926U (en) 1985-05-08

Family

ID=30344197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15591283U Pending JPS6064926U (en) 1983-10-07 1983-10-07 Wafer transfer device

Country Status (1)

Country Link
JP (1) JPS6064926U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283511A (en) * 1992-03-31 1993-10-29 Nippon Telegr & Teleph Corp <Ntt> Vacuum suction device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283511A (en) * 1992-03-31 1993-10-29 Nippon Telegr & Teleph Corp <Ntt> Vacuum suction device

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