JPS6094487U - Wafer adsorption device - Google Patents

Wafer adsorption device

Info

Publication number
JPS6094487U
JPS6094487U JP18549183U JP18549183U JPS6094487U JP S6094487 U JPS6094487 U JP S6094487U JP 18549183 U JP18549183 U JP 18549183U JP 18549183 U JP18549183 U JP 18549183U JP S6094487 U JPS6094487 U JP S6094487U
Authority
JP
Japan
Prior art keywords
wafer chuck
wafer
guide
support
adsorption device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18549183U
Other languages
Japanese (ja)
Inventor
康夫 杉浦
吉三 小宮山
伸夫 柏木
後藤　泰山
Original Assignee
東芝機械株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝機械株式会社 filed Critical 東芝機械株式会社
Priority to JP18549183U priority Critical patent/JPS6094487U/en
Publication of JPS6094487U publication Critical patent/JPS6094487U/en
Pending legal-status Critical Current

Links

Landscapes

  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２図はウェ
ハチャックの下面図である。 １・・・支持部１，２・・・ガイド、４・・・ウェハチ
ャック本体、５・・・傾動部、８・・・圧縮コイルバネ
、１１・・・・流路１．１５・・・ウエハチャツ入　１
６・・・吸引口、Ｗｅ番、争ウェハ。FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a bottom view of a wafer chuck. DESCRIPTION OF SYMBOLS 1... Support part 1, 2... Guide, 4... Wafer chuck main body, 5... Tilting part, 8... Compression coil spring, 11... Channel 1.15... Wafer chuck Enter 1
6... Suction port, We number, competing wafer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 、　真空吸着力によりウェハを吸着するウェハチャック
を備えたウェハ吸着装置において、前記ウェハチャック
をその支持部に対して出入可能に係合するガイドと、前
記ウェハチャックをその支持部に対して傾動可能に支持
すべくウェハチャックとガイドまたはガイドと前記支持
部の間に設けられた傾動部と、前記ウェハチャックに所
定の押付は力が作用するまで該ウェハチャックを繰出位
置に保持する弾発部材とを具備することを特徴とするウ
ェハ吸着装置。, a wafer suction device equipped with a wafer chuck that suctions a wafer using vacuum suction force, comprising: a guide that engages the wafer chuck in a manner that allows the wafer chuck to move in and out of its support; and a guide that allows the wafer chuck to tilt with respect to its support. a tilting part provided between the wafer chuck and the guide or the guide and the support part to support the wafer chuck; and a resilient member that holds the wafer chuck in the feeding position until a predetermined force is applied to the wafer chuck. A wafer suction device comprising:
JP18549183U 1983-11-30 1983-11-30 Wafer adsorption device Pending JPS6094487U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18549183U JPS6094487U (en) 1983-11-30 1983-11-30 Wafer adsorption device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18549183U JPS6094487U (en) 1983-11-30 1983-11-30 Wafer adsorption device

Publications (1)

Publication Number Publication Date
JPS6094487U true JPS6094487U (en) 1985-06-27

Family

ID=30400905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18549183U Pending JPS6094487U (en) 1983-11-30 1983-11-30 Wafer adsorption device

Country Status (1)

Country Link
JP (1) JPS6094487U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0447988U (en) * 1990-08-28 1992-04-23
WO2004100254A1 (en) * 2003-05-06 2004-11-18 Olympus Corporation Substrate suction device
JP2007157867A (en) * 2005-12-02 2007-06-21 Olympus Corp Substrate suction mechanism and substrate inspection device
CN100362643C (en) * 2003-05-06 2008-01-16 奥林巴斯株式会社 Substrate suction device
WO2020003979A1 (en) * 2018-06-28 2020-01-02 平田機工株式会社 Robot hand equipped with pad member

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0447988U (en) * 1990-08-28 1992-04-23
WO2004100254A1 (en) * 2003-05-06 2004-11-18 Olympus Corporation Substrate suction device
JPWO2004100254A1 (en) * 2003-05-06 2006-07-13 オリンパス株式会社 Substrate adsorption device
CN100362643C (en) * 2003-05-06 2008-01-16 奥林巴斯株式会社 Substrate suction device
JP4553841B2 (en) * 2003-05-06 2010-09-29 オリンパス株式会社 Substrate adsorption device
JP2007157867A (en) * 2005-12-02 2007-06-21 Olympus Corp Substrate suction mechanism and substrate inspection device
WO2020003979A1 (en) * 2018-06-28 2020-01-02 平田機工株式会社 Robot hand equipped with pad member

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